JP3088148U - Photo reflector - Google Patents

Abstract

(57) [Summary] [PROBLEMS] In a chip-type photoreflector used for a pulse meter, an error in measured values between indoor and outdoor can be reduced by setting a measurement color to blue, but a change in a sealing frame. This realizes further improvement in accuracy. SOLUTION: A sealing frame 8 provided on an insulating substrate 1 on which a light emitting diode element 4 and a light receiving element 6 are mounted and filled with a translucent resin 7 that transmits blue light well is manufactured using a light-colored material. Thus, a sensor for a pulse monitor having high reliability against changes in the surrounding environment is provided.

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small and thin chip-type photo reflector provided for an electronic device for measuring a pulse.

[0002]

2. Description of the Related Art FIG. 1 shows a typical structure of a chip-type reflector provided in a small electronic device pursuing lightness and shortness. This chip-tip type photoreflector has two sets of lead frames formed by insert molding. An infrared light emitting diode 4a is mounted on the set of electrodes, and a light receiving element 6a such as a phototransistor or a photodiode is mounted on the other set of electrodes. In order to protect the element and the like, the device is sealed with a black transparent translucent resin 7a containing a visible light cutting agent.

[0003]

[Problem to be Solved by the Invention] However, the chip-type photoreflector having the structure according to the conventional technique has the following disadvantages. That is, since the conventional chip-type photoreflector uses the light emitting diode 4a that emits infrared light and the light receiving element 6a that cuts off the visible light region, when it is used for a pulse meter, it can be used indoors and outdoors. There was a problem that the measured values were different.

[0004] According to academic research, it is preferable to measure a pulse rate by using blue, which is closer to purple than infrared, for example, 427 nm or less in terms of wavelength. The present invention is intended to solve the above-described problems, and an object of the present invention is to provide a chip-type photoreflector having no difference in measured values indoors and outdoors.

[0005]

[Means for Solving the Problems] The chip type photoreflector of the present invention employs the following technical means to solve the above problems. That is, the chip-type photoreflector of the present invention covers a light-emitting diode that emits blue light and a light-receiving element such as a phototransistor or a photodiode having sensitivity in the blue region, which are mounted in a frame, with a resin that transmits blue light. Further, by manufacturing at least the frame on the light emitting side with a material that reflects light, a product that can perform stable measurement with no difference between indoor and outdoor measurement values can be obtained.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the chip type photoreflector according to the present invention will be described with reference to the drawings. In FIG. 2, two pairs of opposing electrodes 12, 22 and 13, 23 made of a metal pattern are formed on an insulating substrate 1 by plating or the like. The electrodes are connected to the upper electrodes 12a, 13a, 22a, 23a by lower electrodes 12c, 13c, 22c, 23c and side electrodes 12b, 13b, 22b, 23b. The diode element 4b that emits blue light is mounted by die bonding on one upper electrode 12a of a pair of electrodes facing the substrate 1, and a metal such as a gold wire is attached to the upper electrode 13a of the other electrode facing the light emitting diode element 4b. Wire bonding is performed by the thin wire 5. The light receiving element 6b such as a phototransistor or a photodiode is mounted on one upper electrode 22a of the other pair of electrodes facing the substrate 1 by die bonding, and is mounted on the upper electrode 23a of the other electrode facing the light receiving element 6b. Wire bonding is performed with a thin metal wire such as a gold wire.

In order to protect the light emitting diode element 4b, the light receiving element 6b, and the fine metal wire with the light transmitting resin 7b for protection from mechanical damage, etc., the light emitting diode element 4b is made of a light-colored material that reflects light to the substrate 1. The sealing frame 8 is bonded. The sealing frame 8 is manufactured by a molding method or the like using a light-colored material such as white or milky white in order to collect as much light upward as possible by utilizing the light of the light emitting diode by reflection. The translucent resin 7b is used for the purpose of transmitting blue light well. In this embodiment, the wire bonding method is used as the method for connecting the light emitting diode element and the light receiving element. However, other connection methods, such as the FC method, can be used.

Another embodiment of the chip type photo reflector according to the present invention will be described with reference to the drawings. In FIG. 3, the sealing frame 8 is an example in which the colors on the light emitting side and the light receiving side are changed. That is, the color of the sealing frame 8a on the light emitting element 4b side uses a light-colored material such as white or milky white to increase the reflection efficiency, and the color of the sealing frame 8b on the light receiving element 6b side increases the absorption efficiency. It is manufactured using a dark-colored material such as black or dark green, and by a molding method such as two-color molding. Note that the light emitting element and the light receiving element are omitted in the figure.

Another embodiment of the chip type photoreflector according to the present invention will be described with reference to the drawings. In FIG. 4, a method is employed in which the packaged light emitting diode element 4 'and light receiving element 6' are joined to two pairs of opposing electrodes 12, 22, and 13, 23 formed on an insulating substrate by soldering or the like. . This is the same as FIG. 2 of the embodiment except that a packaged element is used.

[0010]

[Effects of the Invention] As described above, the chip-type photoreflector of the present invention is composed of a light-emitting diode that emits blue light, a light-receiving element that has blue light-receiving sensitivity, and a translucent resin that transmits blue light. In addition, the difference between the measured values indoors and outdoors is reduced, and the reliability of the product as a pulse meter is improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a conventional surface mount photoreflector.

FIG. 2 is a perspective view showing an embodiment of the present invention.

FIG. 3 is a perspective view showing another embodiment of the present invention.

FIG. 4 is a perspective view showing another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating substrate 12, 13 electrode 4 Light emitting diode 5 Thin metal wire 6 Light receiving element 7 Translucent resin 8 Mold frame

Claims (2)

[Utility model registration claims] 1. A pair of electrodes are formed on an insulating substrate, a blue light emitting diode element is mounted on the pair of electrodes, and a light receiving element responsive to a blue region is mounted on the other pair of electrodes. In a chip-type photoreflector composed of a light-transmitting resin that transmits blue light for covering the light-emitting diode element and the light-receiving element, and a frame for containing the light-transmitting resin, a light-colored material that reflects light from the frame is provided. A chip-type photo reflector characterized by being manufactured in 2. A pair of electrodes are formed on an insulating substrate, a blue light emitting diode element is mounted on the pair of electrodes, and a light receiving element responsive to a blue region is mounted on the other pair of electrodes. In a chip-type photoreflector composed of a light-transmitting resin that transmits blue light for covering the light-emitting diode element and the light-receiving element, and a frame for containing the light-transmitting resin, the color of the light-emitting side frame reflects light. A chip-type photo reflector characterized in that the light receiving side frame is made of a dark material that absorbs light.