JP3087679B2 - Manufacturing method of chip inductor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a chip inductor used for electronic equipment, communication equipment and the like.

[0002]

2. Description of the Related Art A conventional chip inductor will be described below with reference to the drawings.

FIG. 4 is a process diagram showing a series of steps for forming a conventional chip inductor, FIG. 5 is a cross-sectional view showing a state of forming an exterior part of the chip inductor, and FIG. 6 is a perspective view of the chip inductor.

Referring to FIGS. 4 to 6, a conventional method of manufacturing a chip inductor uses a prismatic main body 21 made of an insulating material.
A first step of forming the conductor layer 22 in the first step, a second step of forming a groove in the conductor layer 22 to form a coil section 25 having a linear conductor section 23 and a groove section 24, A third step of forming an electrode section 26 at both ends with a laser 27 and a fourth step of covering the coil section 25 with an insulating resin 28 and drying to form an exterior section 29 are provided.

At this time, in a fourth step, a main body 21 having a coil portion 25 formed on a tape on which an insulating resin 28 is adhered.
While rotating in the direction (A), the insulating resin 28 is applied to the coil portion 25, and the entire circumference of the coil portion 25 is covered with the insulating resin 28.

Then, the insulating resin 28 is dried to form an exterior part 29.

[0007]

In the above conventional method,
Since the insulating resin 28 is applied to the coil portion 25 while rotating the main body 21 on which the coil portion 25 is formed on the tape on which the insulating resin 28 is attached, as shown in FIG. The insulating resin 28 has a circular outer shape while surrounding the prismatic main body 21 due to surface tension.

As a result, there has been a problem that the mounting surface of the exterior part 29 becomes round, and it is not possible to mount it properly when mounting it on a mounting board or the like.

An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide a chip inductor which has a planar mounting surface by an exterior part and can be mounted accurately.

[0010]

In order to achieve the above object, a manufacturing method according to the present invention comprises a first step of forming a conductor layer on a prismatic body made of an insulating material, and a step of forming a groove in the conductor layer. A second step of forming a coil part having a linear conductor part and a groove cut part, a third step of forming electrode parts at both ends of the coil part, and coating and drying the coil part with an insulating resin. And a fourth step of forming the exterior part by using a rectangular body.
And the fourth step is performed on one opposing side surface of the main body.
Cover the formed coil with insulating resin, dry, and
Covering the coil part formed on the other side with insulating resin,
This is a method of drying to form an exterior part .

[0011] By the manufacturing method, the coil portion formed on a side surface adjacent the body, covering the insulating resin to a coil part formed on one side surface facing the main body, after drying, opposite <br/> other Since the coil formed on the side is covered with insulating resin and dried to form the exterior, the coil on the adjacent side is cut off.
When coating the edge resin, make sure
One of them is hardened, and the other is affected by surface tension.
And the outer shape does not become circular.

As a result, the insulating resin is also covered with the prismatic body in the prismatic shape, and the prismatic exterior part is formed. Can be improved.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION
First, a conductor layer is formed on a prismatic body made of an insulating material.
A step of grooving the conductor layer to form a coil section having a linear conductor section and a grooving section, and a third step of forming electrode sections at both ends of the coil section. A fourth step of coating the coil portion with an insulating resin and drying to form an exterior portion , wherein the main body has a quadrangular prism shape, and the fourth step includes:
The coil portion made form opposed to one side surface of said body, insulation
After coating the edge resin and drying, the core formed on the other
Cover the resin part with an insulating resin and dry it to form the exterior part.
This is the method that I tried .

According to the above method, the coil portions formed on the adjacent side surface of the main body are coated with the insulating resin on the coil portions formed on one opposing side surface of the main body , dried, and formed on the other opposing side surface. coating an insulating resin to the coil portion, so to form a sheath portion was dried, insulating the coil portion of the adjacent sides trees
When coating with grease, use one of the coil
Are hardened, are not affected by the surface tension of each other, and the outer shape does not become circular.

[0015] As a result, the insulating resin is also covered with the prismatic body, so that the prismatic exterior part is formed. Therefore, the mounting surface of the exterior part has a planar shape, and the mountability to the mounting board or the like is improved. Can be improved.

Further , since the coil formed on one side of the main body and the coil formed on the other side of the main body are coated with an insulating resin and dried, a step of forming an exterior part on the main body is performed. Since the process can be performed in two steps, the manufacturing can be simplified.

The second aspect of the present invention is the first aspect.
The invention described in the above is a method including a step of coating the entire inside of the groove cutout with an insulating resin.

According to the above-mentioned method, since the entire inside of the groove is also covered with the insulating resin, no void is formed inside the groove, and the linear conductor is not corroded by air or moisture in the void. It is possible to prevent the occurrence of a short circuit between adjacent linear conductors due to a deleted conductor or dust generated at the time of groove cutting of the conductor layer.

The third aspect of the present invention provides the first aspect.
The invention described in the above is a method comprising the steps of providing a concave portion on a side surface of a main body, providing a coil portion at least in the concave portion, and providing an insulating resin in the concave portion.

According to the above method, since the insulating resin is provided in the concave portion provided on the side surface of the main body, the insulating resin surface does not become higher than both end surfaces of the concave portion, and the prismatic flat surface of the main body can be used as the mounting surface. Therefore, the mountability on a mounting board or the like can be improved.

[0021] The invention described in claim 4 of the present invention is claim 1.
A method according to the invention described above, further comprising a removing step of removing conductive dust generated when the conductive layer is grooved.

According to the above-described method, since the conductive waste generated when the conductive layer is cut off is removed, a short circuit may occur between adjacent linear conductors due to the conductive material forming the conductive waste.
It is possible to prevent the inductance value from being changed by attaching to the linear conductor, and to improve the electrical characteristics.

The invention according to claim 5 of the present invention is the invention according to claim 1.
The method according to any one of claims 1 to 3 , wherein the insulating resin is a thixotropic epoxy resin.

According to the above method, since the insulating resin is an epoxy resin having a thixotropic property, when the insulating resin is coated, the insulating resin can be cured by drying while maintaining the coated shape to form the exterior part. Thereby, the shape change during curing of the insulating resin is eliminated, and the shape of the exterior part surface can be defined,
The mountability can be improved.

The invention according to claim 6 of the present invention is characterized by claim 1
In the invention according to any one of the first to third aspects, the coating is performed by a transfer coating method.

According to the above method, the insulating resin can be applied very thinly and uniformly, so that the cross-sectional area of the main body can be maximized, and the inductance value caused by the cross-sectional area of the main body can be maximized while miniaturizing. Can be achieved.

(Embodiment) A method of manufacturing a chip inductor according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a process diagram showing a series of steps for forming a chip inductor according to an embodiment of the present invention, FIG. 2 is a sectional view showing a process of forming a package of the chip inductor, and FIG. It is a perspective view of the same chip inductor.

1 to 3, a method of manufacturing a chip inductor according to an embodiment of the present invention includes a first step of forming a conductor layer 2 on a prism-shaped main body 1 made of an insulating material; A second step of forming a coil section 5 having a linear conductor 3 and a groove section 4 by grooving with a laser 7;
The method includes a third step of forming the electrode portions 6 at both ends of the coil portion 5 and a fourth step of covering the coil portion 5 with the insulating resin 8 and drying to form the exterior portion 9.

In the second step, a removing step is provided for removing conductive dust generated when the conductive layer 2 is grooved, and an etching removing method, a sand blast removing method, or the like is used.

Further, in a fourth step, the coil portion 5 formed on the side surface adjacent to the main body 1 is coated with the insulating resin 8 on the coil portion 5 formed on one side surface 10 in the direction (A), and dried. , (B), the coil portion 5 formed on the other side surface 11 is coated with the insulating resin 8 and dried to form the exterior portion 9.

At this time, the main body 1 has a quadrangular prism shape, and a concave portion 12 is provided on all side surfaces of the main body 1.
In the fourth step, the coil portion 5 formed on one opposing side surface 10 of the main body 1 is coated with the insulating resin 8, dried, and formed on the other opposing side surface 11 in a fourth step. The coil part 5 is coated with an insulating resin 8 and dried to form an exterior part 9.
Is formed, and the insulating resin 8 is
2 so as not to protrude outside.

When the insulating resin 8 is coated, the entire inside of the grooved portion 4 is coated, and a transfer coating method using a roller is used.

The insulating resin 8 used here is an epoxy resin having a thixotropic property.

The operation of the above-described method for manufacturing a chip inductor will be described below.

The coil portion 5 formed on the adjacent side surface of the main body 1 is coated with the insulating resin 8 on the coil portion 5 formed on one side surface 10, dried, and then coated on the coil portion 5 formed on the other side surface 11. Since the exterior portion 9 is formed by coating and drying the insulating resin 8, the insulating resin 8 covering the coil portion 5 on the adjacent side surface is formed.
Since one of them has already been cured, the outer shape does not become circular due to the influence of the surface tension on each other.

As a result, the insulating resin 8 is also coated on the prismatic body 1 in a prismatic manner, and the prismatic exterior part 9 is formed. And so on can be improved.

Further, the coil portion 5 formed on one side surface 10 of the main body 1 and the coil portion 5 formed on the other side surface 11 of the main body 1 are respectively coated with the insulating resin 8 and dried. Since the step of forming the exterior part 9 in 1 can be performed in two steps, the production can be simplified.

Furthermore, since the entire inside of the grooved portion 4 is also covered with the insulating resin 8, no void is formed inside the grooved portion 4,
Adjacent linear conductors 3 due to air, moisture, etc. in the voids
In addition to preventing corrosion, short-circuit, etc. from occurring between the conductor layers, the conductor-deleted objects or dust generated when the conductor layer 2 is cut into grooves,
It is also possible to prevent a short circuit from occurring between adjacent linear conductors 3.

Further, since the insulating resin 8 is provided in the concave portion 12 provided on the side surface of the main body 1, the insulating resin surface does not become higher than the electrode portion 6 which is the both end surfaces of the concave portion 12, and the prismatic shape of the main body 1 Can be used as a mounting surface, so that mountability on a mounting board or the like can be improved.

Further, since the conductive dust generated when the conductive layer 2 is grooved is removed, a short circuit occurs between the adjacent linear conductors 3 or the linear conductors 3 As a result, it is possible to prevent the inductance value from being changed, and to improve the electrical characteristics.

Since the insulating resin 8 is an epoxy resin having a thixotropic property, when the insulating resin 8 is coated, the insulating resin 8 is cured by drying while maintaining the coated shape, so that the exterior part 9 can be formed. Thereby, the shape change during curing of the insulating resin 8 is reduced, the shape of the surface of the exterior part 9 can be defined, and the mountability can be improved.

In addition, since the insulating resin 8 is coated by the transfer coating method, the insulating resin 8 can be applied very thinly and uniformly, so that the cross-sectional area of the main body 1 can be maximized, The size can be reduced while maximizing the inductance value caused by the cross-sectional area of No. 1.

As described above, according to the embodiment of the present invention, the insulating resin 8 is also coated on the prismatic body 1 in a prismatic manner, and the prismatic exterior part 9 can be formed.
And the insulating resin 8 is provided in the concave portion 12 provided on the side surface of the main body 1.
The insulating resin surface does not become higher than the surfaces of the electrode portions 6 at both end surfaces of the second substrate 2, and the mountability on a mounting substrate or the like can be improved. In particular, since the insulating resin 8 is an epoxy resin having a thixotropic property, the shape of the surface of the exterior part 9 can be defined, and the mountability can be further improved.

Further, since the insulating resin 8 also covers the inside of the void, it is possible to prevent corrosion, short-circuit, etc. between adjacent linear conductors 3 from occurring, and to suppress deterioration in use in a high-frequency current range. Since the insulating resin 8 is coated by the transfer coating method, the insulating resin 8 can be applied very thinly and uniformly, and miniaturization can be achieved while maximizing the inductance value.

Further, since the conductive waste generated when the conductive layer 2 is grooved is removed, a short circuit may occur between the adjacent linear conductors 3 due to the conductive material forming the conductive waste, It is possible to prevent the inductance value from being changed by adhering to the substrate, and to improve the electrical characteristics.

The coil portion 5 formed on one side surface 10 of the main body 1 and the coil portion 5 formed on the opposite side surface 11 are covered with the insulating resin 8 and dried.
Since the step of forming the exterior part 9 on the main body 1 can be performed in two steps, the manufacturing can be simplified.

The method of removing the conductive dust may be other methods such as an etching removal method and a sand blast removal method.

[0049]

As described above, according to the present invention, the coil portion formed on the adjacent side surface of the main body is coated with the insulating resin on the coil portion formed on the opposite side surface of the main body. After drying, the coil portion formed on the other opposite side is coated with the insulating resin and dried to form the exterior portion, so that one of the insulating resins covering the coil portion on the adjacent side is already cured. Therefore, the outer shape does not become circular due to the mutual influence of surface tension.

As a result, the insulating resin is also covered in a prismatic shape with respect to the prismatic body, so that a prismatic exterior part is formed. Can be provided.

[Brief description of the drawings]

FIGS. 1A to 1E are perspective views showing a series of steps of forming a chip inductor according to an embodiment of the present invention.

FIGS. 2A to 2C are cross-sectional views illustrating a process of forming an exterior part, showing a state of formation of an exterior part of the chip inductor. FIGS.

FIG. 3 is a perspective view of the chip inductor.

4 (a) to 4 (d) are perspective views showing a series of steps of forming a conventional chip inductor.

FIG. 5 is a cross-sectional view showing a state of forming an exterior part of the chip inductor.

FIG. 6 is a perspective view of the chip inductor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Main body 2 Conductive layer 3 Linear conductor 4 Groove cutout 5 Coil part 6 Electrode part 7 Laser 8 Insulating resin 9 Exterior part 10 Side surface 11 Side surface 12 Recess

Continuation of front page (72) Inventor Mikio Taoka 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-7-297033 (JP, A) JP-A-8-37005 (JP) JP-A-7-307201 (JP, A) JP-A-7-297033 (JP, A) JP-A-2-224212 (JP, A) JP-A-59-208707 (JP, A) JP-A-sho 63-48809 (JP, A) JP-A-64-65830 (JP, A) JP-A-3-229407 (JP, A) JP-A 62-168602 (JP, U) JP-A 57-20014 (JP, A) U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01G 1/00-13/06 H01F 17/00 H01F 41/04 H01F 41/12 F26B 1/00-25/22

Claims (6)

(57) [Claims] 1. A first step of forming a conductor layer on a prismatic body made of an insulating material, and forming a groove in the conductor layer to form a coil having a linear conductor and a groove. A second step, a third step of forming electrode sections at both ends of the coil section, and a fourth step of coating and drying the coil section with an insulating resin to form an exterior section, wherein the main body has a rectangular column shape. Shape and
The fourth step is formed on one side of the body opposite to the body.
Coated with insulating resin, dried, and then opposed
Cover the coil part formed on the other side with insulating resin and dry
And a method of manufacturing a chip inductor in which an exterior part is formed . 2. The method of manufacturing a chip inductor according to claim 1, further comprising the step of covering the entire inside of the groove cutout with an insulating resin. 3. The method of manufacturing a chip inductor according to claim 1, further comprising the steps of providing a concave portion on a side surface of the main body, providing a coil portion in at least the concave portion, and providing an insulating resin in the concave portion. 4. The method of manufacturing a chip inductor according to claim 1, further comprising a removing step of removing conductive scraps generated when the conductive layer is grooved. 5. The method for manufacturing a chip inductor according to claim 1 , wherein the insulating resin is a thixotropic epoxy resin. 6. The method according to claim 1, wherein the coating is performed by a transfer coating method.
A method for manufacturing the chip inductor according to claim 3 .