JP3083563U - Solid-state imaging device - Google Patents

Abstract

(57) [Problem] To provide a structure that can be assembled without using an adhesive so that an optical component is not adversely affected when an optical component such as a solid-state imaging device or a converging lens is mounted on a circuit board. SOLUTION: A lower case 11 on which a circuit board 1 on which a solid-state image pickup device 3 is mounted face-down is mounted, an inner case 4 which holds the converging lens 6 and is engaged with the lower case 11, and is incorporated in a form to cover the inner case. And a holding member 10 for fixing them, and the centers of the solid-state imaging device 3 and the converging lens 6 are determined by the positioning of the circuit board 1 and the inner case 4. The packing 7 and the packing 8 are arranged between the outer case 9 and the converging lens 6 and between the outer case 9 and the circuit board 1, and the inner case 4 and the converging lens 6 are fixed.

Description

[Detailed description of the invention]

[0001]

TECHNICAL FIELD The present invention relates to a small solid-state imaging device used for mobile devices such as mobile phones and digital cameras, video cameras, and the like.

[0002]

2. Description of the Related Art FIG. 3 shows an example of a conventional solid-state imaging device. In this solid-state imaging device, a plurality of electronic components 2 and a solid-state imaging device 3 are mounted at predetermined positions on a circuit board 1, and a lower case 12 to which a glass 11 for IR / UV cut is attached forms the solid-state imaging device 3. The solid-state image sensor has a structure in which the upper case 13 to which the converging lens 6 is adhered is screwed into the opening of the lower case 12 to adjust the focus of the image and to prevent loosening. To prevent dust, the gap between the joints of the components is filled with an adhesive.

In such a solid-state imaging device, light incident from an opening 13 a of an upper case 13 is condensed by a converging lens 6 and focused on a light-receiving surface 3 a of the solid-state imaging device 3 to form a light-receiving device (see FIG. (Not shown) receives the light, converts it into an electric signal, converts it into an image signal by the electronic component 2 mounted on the circuit board 1, and outputs the image signal to the outside.

[0004]

[Problems to be Solved by the Invention] However, the conventional solid-state imaging device has the following disadvantages. That is, in the above-described conventional solid-state imaging device, the circuit board 1 on which the solid-state imaging device is mounted and the lower case 112 are assembled, the converging lens 6 and the upper case 13 are assembled, and the space formed by the circuit board 1 and the converging lens 6 is sealed. Since the adhesive is used to prevent the screw portion of the upper case 13 from being loosened, the light receiving surface 3a of the solid-state imaging device 3 and the surface of the converging lens 6 are stained with the adhesive during the operation, and the image quality deteriorates. There is. In addition, since such adhesives are used to join the gangs, it is extremely uneconomical because it is not possible to regenerate defective products generated on the production line or to disassemble and reuse expensive members. In addition, as is well known, the curing process of the adhesive requires aging and heating in a batch-type drying furnace, and the stagnation in the process after the input of the work of assembling parts, etc. becomes long, and a large number of parts are stored or large work areas (Such as a clean room) and a product storage area.

In addition, a screw structure has been often used for adjusting the focal length of an image in an optical device because of its simple structure and easy handling, and it has been widely used in solid-state imaging devices. There is a limit to the demand for smaller and thinner solid-state imaging devices because there is no space for adopting the screw structure, and adjustment of the focal length of the image is screwed or loosened while judging the image quality with the sense of the operator. The complicated work that takes place in the solid-state imaging device occupies the largest number of man-hours in the assembly process, resulting in poor quality and productivity and high cost. It is an issue.

Accordingly, an object of the present invention is to adjust the focal length of a video without deteriorating the functions and characteristics of a conventional solid-state imaging device, using a thin, adhesive structure for an assembly structure or a closed structure. An object of the present invention is to provide a small-sized solid-state imaging device capable of eliminating work.

[0007]

Means for Solving the Problems Therefore, in order to achieve the above object, the present invention employs the following technical means. The solid-state imaging device of the present invention includes a lower case having a circuit board on which a solid-state imaging device is mounted face down with a positioning portion opposing a lower case having a positioning portion of a circuit board and a perforated portion for mounting the solid-state imaging device. It has a three-piece structure consisting of an inner case that holds the converging lens and is engaged with the lower case, and an outer case that is incorporated so as to cover the inner case. The light receiving surface of the element and the center of the converging lens are determined by joining the positioning part of the circuit board and the positioning part of the inner case, and an appropriate spacer is inserted between the inner case and the converging lens to adjust the focal length of the image I do. An elastic packing or sealing material is placed between the contact area between the outer case and the convergent lens and between the contact area between the outer case and the circuit board to fix the inner case and the convergent lens, and to fix the inner case and the convergent lens. And the space formed by the circuit board is sealed.

[0008]

Hereinafter, embodiments of the solid-state imaging device according to the present invention will be described with reference to the drawings. 1 and 2, the solid-state imaging device 3 is mounted face down on the lower case 11 having a positioning portion of the circuit board 1 and a perforated portion for mounting the solid-state imaging device 3. A plurality of electronic components 2 and a solid-state image sensor 3 are mounted at a plurality of reference holes 1a (four locations in the present invention) at positions, and a plurality of positioning bosses 4a provided in the inner case 4 (four locations in the present invention). ), The surface of the circuit board 1 and the bearing surface 4b of the inner case 4 are brought into close contact with each other, so that the light receiving surface 3a of the solid-state imaging device 3 and the center position of the intaglio portion of the inner case 4 match. Next, the spacer 5, the converging lens 6 and the packing 7 are mounted on the inlay portion of the inner case 4 in a superposed manner, and further, the outer case 9 in which the packing 8 is loaded in the inlay portion of the inner case 4 is put on the outside thereof, and the holding metal 10 The substrate 1 is fixed in a sandwiched state. At this time, the packing 7 and the packing 8 are suppressed and deformed between the circuit board 1 and the outer case 9, and the inner case 4, the spacer 5 and the converging lens 6 are positioned and fixed while determining the center, and The focal length of the image is determined with respect to the light receiving surface 3a, the center of the converging lens 6, and the solid-state imaging device in which the solid-state imaging device 3 is sealed in the space defined by the inner case 4, the converging lens 6, and the circuit board 1. Since the functions and characteristics of the present invention are the same as those of the conventional solid-state imaging device, description thereof will be omitted.

Since the circuit board 1 of the thin solid-state imaging device needs to have a thickness as small as possible, it is impossible to form the reference hole 1a with a closed hole, and it is inevitable to use a through hole. A dust-proof problem occurs as a function of. Therefore, in the present invention, three dustproof portions are provided as shown in the inner case 4, that is, the fitting portion of the reference hole 1a and the positioning boss 4a, the hole peripheral portion of the reference hole 1a, and the inner case 4 are provided. In addition, at the surface contact portion of the holding member 10, the surface contact portion is brought into close contact with the narrow clearance of the fitting portion and the fixing force of the holding member 10, and exhibits a good dustproof effect. For this reason, in order to prevent dust, the reference hole 1a of the circuit board 1 and the vicinity of the hole and the supporting portion should be in close contact with each other without any obstacles such as scratches and dirt that impede dust protection. In addition, when the conductive wiring pattern and the coating are not provided, the degree of freedom of the patterning of the circuit board 1 is increased, and the standard of the assembling configuration in the non-adjustment of the focal length of an image is also required. Becomes Further, as other forms of dust prevention of the reference hole 1a, a similar effect can be obtained by attaching a plastic or metal film to the corresponding portion of the circuit board 1 or filling the reference hole 1a with a sealing material. The difference between the required characteristics and the expected value of the actual product can be combined with the height of the inner case 4 to determine the focal length of the image and eliminate focus adjustment.

[0010] By the way, in recent years, mobile devices and the like have been reduced in size and weight, and solid-state imaging devices have been demanded to be smaller and thinner. Since the solid-state imaging device is almost the same as the conventional one, a solid-state imaging device having a convergent lens with a short focal length and a wide angle of view is required. However, as the intrinsic characteristic of the lens, as the focal length becomes shorter, the depth of focus becomes shallower, so that it becomes relatively difficult to adjust the focus of an image, and the current height of the inner case 4 alone is not sufficient. Therefore, the present invention is to adjust the focal length of an image by inserting a spacer 5 having an intended thickness T between the inner case 4 and the converging lens 6, thereby eliminating the focus adjustment during the assembly work. Is

Next, the spacer 5 shown in FIG. 1 and FIG. 2 is made of, for example, a synthetic resin or metal and has a rectangular ring shape in cross section. And a flat surface that comes into contact with the converging lens 6 and has a matte dark color to prevent a flare phenomenon due to light reflection. In addition, the thickness of the component is estimated by ascertaining the process capability of each component lot before assembling, estimating the expected value and variance of the interval, and the difference between the reference value of the focal length of the image and the expected value of the interval F is positive. In this case, the difference may be reduced, and when the difference is negative, the difference may be increased.

Next, the packing 7 and the packing 8 shown in FIGS. 1 and 2 are made of, for example, a rubber-based synthetic resin, and have a circular or rectangular cross section, and a planar shape having a circular sealing length of the sealing portion. The ring has a circular shape or a ring shape having the same projection shape as the sealed portion. The surface is matte black to prevent a flare phenomenon due to light reflection.

[0013]

[Effects of the Invention] As described above, according to the first and sixth aspects of the present invention, the components are mounted on the circuit board and fixed by the holding brackets. In addition, the reduction in the number of work steps and the reuse of parts are possible by eliminating the need for bonding work, and it is also possible to reduce stagnation and in-process inventory of components related to the curing of the adhesive. it can.

Further, according to the invention of claim 2, claim 3 and claim 4, since the positioning and the guide are performed by the components, the positioning accuracy of the assembly is improved, and the assembly jig is used. This is unnecessary, reducing the number of assembly steps and preventing work errors.

Further, according to the invention of claim 5, focus adjustment of an image is eliminated, product quality is improved, work steps are reduced, and the solid-state imaging device can be made thin.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a solid-state imaging device according to the present invention.

FIG. 2 is an exploded perspective view showing an embodiment of the solid-state imaging device according to the present invention.

FIG. 3 is a cross-sectional view showing a conventional example of a solid-state imaging device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit board 2 Electronic component 3 Solid-state image sensor 4 Inner case 5 Spacer 6 Convergent lens 7 Packing 8 Packing 9 Outer case 10 Holder 11 Lower case

Claims (6)

[Utility model registration claims] 1. A case having a built-in solid-state image pickup device and a converging lens, etc., is incorporated in a lower case on which a circuit board is mounted, an inner case which holds the converging lens and is engaged with the lower case, and covers the inner case. A solid-state imaging device having a three-piece structure of an outer case and a holding bracket for fixing the three cases. 2. The circuit board according to claim 1, wherein the solid-state imaging device is mounted face down on the lower case having a positioning portion of the circuit board and a perforated portion for mounting the solid-state imaging device. 2. The solid-state imaging device according to claim 1, wherein the solid-state imaging device and the circuit board are fixed and sealed together. 3. The solid-state imaging device according to claim 1, wherein the perforated portion for mounting the solid-state imaging device is drilled at a height equal to or less than a mounting height of a circuit board of the solid-state imaging device. Imaging device. 4. The solid-state imaging device according to claim 1, wherein the light-receiving surface of the solid-state imaging device and the center of the converging lens are determined in agreement with a positioning portion of the lower case and a positioning portion of the inner case. 5. The solid-state imaging device according to claim 1, wherein a focusing is performed by inserting a spacer between the inner case and the converging lens. 6. An outer case and a converging lens, and a resilient packing attached to a joint portion between the outer case and the circuit board to fix the inner case and the converging lens and to seal a space formed by the inner case, the converging lens and the circuit board. 2. The fixing device according to claim 1, wherein the lower case and the outer case are fixed to the lower case.
3. The solid-state imaging device according to item 1.