JP3083366B2 - Lead frame transfer device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame conveying device for supporting a lead frame and supplying the lead frame to a processing machine such as a mold device which moves up and down.

[0002]

2. Description of the Related Art In a conventional lead frame transfer device, when there is only one mold device, a fixed feed rail for carrying a lead frame supplied from a lead frame supply device into the mold device is provided. A guide support for feeding a lead frame on a press die inside a mold device at a fixed size, a feed plate that moves up and down in conjunction with a press operation, and a flapper that connects the feed rail and the feed plate. It is composed of In addition, in order to continuously process the lead frame, the lead frame transfer device in the case of arranging a plurality of mold devices in parallel, in addition to the above configuration, an intermediate rail connecting the feed plates of each mold device. Used.

At this time, a plurality of mold apparatuses are synchronized so as to move up and down at the same timing so that the lead frame can be easily transported. However, since the time required to move up and down by each mold apparatus varies. Each feed plate driven by the mold clamping plate of each mold apparatus also repeats vertical movement at slightly different timings. Therefore, when there is one mold device, a flapper is provided between a fixed feeding rail for feeding the lead frame into the mold device and a feed plate of the mold device. In addition, an intermediate rail connecting the feed plate of each mold apparatus and the feed plate of the adjacent mold apparatus swings and supports the lead frame for conveyance.

[0004]

However, the above-mentioned conventional lead frame transport apparatus has the following problems. First, the feed rail and the transfer device in each mold device are connected, and the flapper supporting the lead frame and the intermediate rail are oscillating, so that the lead frame passing therethrough repeats bending and elongation. For this reason, stress is applied to the lead frame itself, and the lead frame is damaged or a feeding error occurs. In addition, each time the type of lead frame is changed, it is necessary to replace not only the die device and the feed rail, but also the feed rail, the flapper connecting the die devices, and the plurality of intermediate rails, and make further adjustments. There is.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to provide a mold apparatus which moves up and down with a long guide rail for transporting a lead frame, and the guide rail is provided. By driving up and down in synchronization with the up and down movement of the mold device, the flapper, intermediate rail and feed rail can be omitted, the lead frame can be supplied to the mold device without bending without bending, and the width of the guide rail can be reduced. It is an object of the present invention to provide a lead frame transport device in which the type of the lead frame can be easily changed by making the change possible.

[0006]

The present invention has the following arrangement to achieve the above object. That is, in the lead frame transfer device for carrying the lead frame into a mold device for processing the lead frame, supporting the lead frame during press working, and unloading the lead frame after the press working, A guide rail that guides and supports the lead frame is installed, and installed at both ends of the guide rail, and a width adjustment unit that adjusts a width interval of the guide rail and the guide rail are supported,
A vertical movement unit for vertically moving between an upper position for transporting the lead frame and a lower position for processing the lead frame in accordance with the pressing operation of the die apparatus is provided.

[0007]

The lead frame supplied from the lead frame supply device and placed on the other end of the guide rail is supplied to the mold device by the transfer device for transferring the lead frame while being supported by the guide rail. Then, the mold apparatus starts the pressing operation, and the mold clamping plate moves downward for processing. At this time, the vertical movement unit drives the guide rail downward, and sets the lead frame supported by the guide rail in the lower mold of the mold apparatus. The mold device processes the lead frame, and the mold clamping plate moves upward again. When the mold clamping plate is lifted upward and the mold apparatus is in a state before the start of the press operation, the vertical movement unit moves the guide rail upward again to return the state in which the lead frame can be transferred.

By repeating the above operation, the die apparatus can process the lead frame. Also, when changing the type of lead frame, pull out the mold device from the guide rail, and further operate the width adjustment unit,
The width interval of the guide rail is set for a new product type, and a mold device for the new product is mounted at a predetermined position.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a partially cutaway top view showing the entire configuration of a lead frame transport device according to the present invention. FIG. 2 is a cross-sectional view of FIG. 1, and FIG.
-A sectional view, (b) is a BB sectional view, (c) is a C-
C shows a sectional view. First, the configuration will be described with reference to FIGS. The lead frame transfer device is roughly divided into guide rails 16 for supporting the lead frame 10 and supplying the lead frame 10 to the first and second mold devices 12 and 14, and provided at both ends thereof. It comprises vertical movement units 18 and 18 for supporting the guide rail 16 and width adjustment units 20 and 20 for adjusting the width interval of the guide rail 16. Reference numeral 22 denotes a mold driving device, which is a press head 24 formed in a plate shape.
And a plate-shaped top plate 26 disposed above the press head 24 by posts erected at four corners of the press head 24, and placed vertically on the upper surface of the top plate 26 along its longitudinal direction. A first mold driving source 28;
And a second mold driving source 30. First, second
The mold driving sources 28 and 30 of the top plate 2
6 has a slidable movable shaft 34 having a free shank 32 formed at the end thereof.

More specifically, the first and second mold apparatuses 12, 1
4 is a shank holder 36 on the upper surface and an upper die 38 on the lower surface.
Is attached and has a mold clamping plate 40 movable up and down, and a lower mold 44 fixed on a die head 42.
By pressing the upper die 38 attached to the lower surface of the die to the lower die 44 fixed on the die head 42,
The lead frame 10 supported and conveyed by the guide rail 16 is processed. The guide rail 16
It is composed of two long and parallel rails, and a groove for guiding and supporting the lead frame 10 is formed in the inner wall portion at the upper end thereof, and a groove is provided on the right end side from a lead frame supply device (not shown). An input port into which the inserted lead frame 10 is input is formed. Lead frame 1 supplied from a lead frame supply device (not shown)
Numeral 0 is supported by a lead frame transfer device (not shown) provided below the guide rail 16 so as to be transferable to the left.

The vertical movement unit 18 includes a guide rail 16
A slide mechanism 46 for supporting one end of each of the two rails so as to be slidable in a direction perpendicular to the rail, and a vertical drive unit 48 provided below the slide mechanism 46 and driving the slide mechanism 46 up and down. I have. Therefore, the up-down movement unit 18 can operate the up-down drive unit 48 in conjunction with the press operation of the mold apparatus, and can drive the guide rail 16 supported by the slide mechanism 46 up and down.

The width adjustment unit 20 is formed in a rectangular parallelepiped shape with a fixed base 50 formed on a plate, and grooves are provided in the longitudinal direction of the upper surface to abut against and lock both side surfaces of the guide rail 16. Two guide locking portions 52a, 52b provided with a through hole having a threaded inner wall surface and vertically penetrating between opposing flat surfaces along the longitudinal direction, and guide locking portions 52a, 52b. And a variable mechanism 54 for driving the. More specifically, the variable mechanism 54 includes a fixed base 50.
Bearings 56,5 arranged at approximately equal intervals on the upper surface of the
6, 56 and the bearings 56, 56, 56 are rotatably supported, and the outer surfaces of the two parts divided by the bearings 56, 56, 56 are threaded in opposite directions at the same pitch. Output shaft 58, and to drive the output shaft 58,
A motor 60 is attached to one end of the output shaft 58. Two guide locking portions 52a and 52b are screwed in parallel to two portions of the output shaft 58 divided by bearings 56, 56 and 56. . By operating the motor 60 and rotating the output shaft 58 with the above configuration, the guide locking portions 52a and 52b move in opposite directions along the output shaft while being parallel to each other, and the two guide locking portions 52a , 5
The interval of 2b can be changed. Further, the guide rail 16 locked by the grooves of the two guide locking portions 52a and 52b moves along the grooves of the guide locking portions 52a and 52b.
It can be slid up and down with a constant interval.

The vertical movement units 18, 18 and the width adjustment units 20, 20 support both ends of the guide rail 16 on the upper surface of the press head 24, and the supported guide rail 16 coincides with the longitudinal direction of the press head 24. It is fixed as follows. Also, the first and second mold devices 12, 14
Are fixed on the upper surface of the press head 24 so as to be located immediately below the first and second mold driving sources 28 and 30, respectively, and the shank holders of the first and second mold devices 12 and 14 are respectively provided. 36 is connected to each free shank 32 of the first and second mold driving sources 28 and 30. Therefore, the mold clamping plates of the first and second mold devices 12 and 14 are driven up and down by the first and second mold driving sources 28 and 30, respectively.
Pressing to zero is possible.

Next, the operation will be described. Although the first and second mold devices 12 and 14 perform the pressing operation in synchronization with each other, the time required for the mold plate 40 in each mold device to move up and down depends on the operating speed of each mold drive source. Slightly different due to variation. In the present embodiment, the first mold device 12 requires less time to move up and down than the second mold device 14. First, in a state where the mold clamping plates of the first and second mold devices 12 and 14 are at the highest position, the guide rail 16 supporting the lead frame 10 is also positioned at the highest position of the vertical movement section. The frame 10 can be transported. The lead frame 10 fed from the leading end of the guide rail 16 by the lead frame supply device is sent by a fixed length on the guide rail 16 by the lead frame transfer device, and reaches the processing position of each of the mold devices 12 and 14. Will be transferred.

The lead frame 10 is connected to each of the mold units 12, 1
After being transferred to the processing position of No. 4, each mold apparatus starts the pressing operation in synchronization. At the same time, the guide rail 16
The vertical movement units 18, 18 for supporting the vertical movement unit 18 are also activated, and the vertical drive unit 22 of the vertical movement unit 18 drives the slide mechanism 46 downward, and accordingly, the guide rail 16 supported by the slide mechanism 46 also keeps the horizontal level. Move downward at the same speed. The driving speed of the vertical movement unit 18 is
The speed is set faster than the lowering and rising speed of the mold clamping plate of each mold apparatus. Therefore, the upper mold 38 attached to the mold clamping plate 40 of the first mold apparatus 12 having a high vertical movement speed because it is started simultaneously contacts the fixed lower mold 44 to perform the pressing operation. Previously, the guide rail 16 supported by the vertical movement unit 18 and moving downward while being horizontal.
Has already finished disposing the lead frame 10 on each of the lower dies of the first and second mold apparatuses 12, 14, and the vertical movement unit 18 has stopped while maintaining that state.

In this state, first, the first mold device 12 performs a pressing operation on the lead frame 10, and after a short delay, the second molding device 14 performs a pressing operation. 40 moves from the descending operation to the ascending operation, moves to the uppermost position of each mold apparatus, and stops. The mold clamping plate 40 of the second mold apparatus 14, which moves with a delay, reaches its uppermost position and stops. Thereafter, the guide rails 16 in which the lead frames 10 are arranged in the lower dies of the two mold apparatuses 12 and 14 move upward as the vertical movement unit 18 is started again and the ascending operation is started. Frame 1
After moving to the uppermost position of the vertical movement section where 0 can be conveyed, it stops.

By repeating the above-described operation, in the first and second mold devices 12 and 14 arranged side by side, the lead frame 10 is
It moves without bending and stretching on the top, and is continuously pressed. Further, when the type of the lead frame 10 is exchanged, first, the old mold apparatus is pulled out from the guide rail 16 of the lead frame transfer device, and is taken out from the press head 24. Next, the width adjustment units 20 and 2 which are arranged at both ends of the guide rail 16 and engage with the side surface of the guide rail 16 are provided.
By operating the motor 60 within 0 and rotating the output shaft 58, the guide locking portions 52a and 52b locked with the guide rail 16 are moved. At this time, the guide rail 16
Is slidably supported by the slide mechanism 46 of the vertical movement units 18, 18, so that the guide rail 16
Can be moved in parallel, and the interval between the guide rails 16 can be changed to the width of the new lead frame. Finally, a new mold device may be placed on the press head 24 and mounted on the guide rail 16.

Although the preferred embodiment has been described above as a lead frame transporting device, the present invention is not limited to the above-described embodiment. Instead of one, one may be used. Further, by extending the mold driving device and the guide rail, and increasing the number of mold driving sources of the mold driving device, three or more mold devices may be arranged side by side. Of course, modifications can be made.

[0019]

According to the lead frame transfer apparatus of the present invention, the mold apparatus which moves up and down almost horizontally in synchronization with the die apparatus which repeats up and down movements in order to perform processing on the lead frame. Since the lead frame can be supplied from the guide rails that are almost horizontal, unnecessary stress is not applied to the lead frame, and there is no feeding error, so that product defects can be prevented. Go up. In addition, the interval between the guide rails can be changed by operating a motor in the width adjustment unit, so that one transport device can support a plurality of lead frames. As a result, there is no need to replace components in the transfer device when changing the type of lead frame, and the remarkable effect is achieved such that the type changing operation is facilitated.

[Brief description of the drawings]

FIG. 1 is a partially cutaway top view showing the entire configuration of a lead frame transport device.

FIGS. 2A and 2B are cross-sectional views of FIG. 1, wherein FIG. 2A is a cross-sectional view taken along line AA, FIG. 2B is a cross-sectional view taken along line BB, and FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Lead frame 12, 14 Die apparatus 16 Guide rail 18 Vertical movement unit 20 Width adjustment unit

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-5-47804 (JP, A) JP-A-4-5837 (JP, A) JP-A-61-164230 (JP, A) JP-A-59-164 79535 (JP, A) JP-A-56-78247 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/50

Claims (1)

(57) [Claims] 1. A lead frame transport device for loading a lead frame into a die apparatus for processing a lead frame, supporting the lead frame during press working, and unloading the lead frame after the press working, A guide rail that guides and supports a lead frame is installed in the mold apparatus so as to penetrate therethrough. At both ends of the guide rail, a width adjustment unit that adjusts the width of the guide rail and the guide rail are supported, and the mold is supported. An apparatus for transporting a lead frame, comprising a vertical movement unit for vertically moving between an upper position for transporting the lead frame in accordance with a pressing operation of the mold device and a lower position for processing the lead frame.