JP3078516B2 - Relay board, connecting body of IC mounting board and relay board, structure consisting of IC mounting board, relay board and mounting board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC mounting substrate on which an integrated circuit chip is mounted, and more particularly, to a relay substrate interposed between an IC mounting substrate made of a resin-containing material such as a glass-epoxy resin composite material and a mounting substrate. The present invention relates to a connection body between an IC mounting board and a relay board, and a structure including an IC mounting board, a relay board, and a mounting board.

[0002]

2. Description of the Related Art Conventionally, when a pad formed on a main surface of one substrate and a pad formed on a main surface of another substrate having a different coefficient of thermal expansion are connected to each other, the distance between the two substrates is increased. In addition, there is known a device in which a relay board is interposed to reduce stress caused by a difference in thermal expansion coefficient.

[0003] For example, in a board connection structure disclosed in Japanese Patent Publication No. 2-45357, a relay board 215 as shown in FIG. 16A is disclosed. The relay substrate 215 has a copper conductor 219 formed by plating in a through hole formed in the relay substrate main body 210 made of alumina, and a solder electrode 212 made of a high-temperature solder of Pb 95% -Sn 5%. The through-hole electrode 214 is formed. This relay board 215 is interposed between a silicon board (silicon chip) 211 and a printed board 218 made of glass epoxy, as shown in FIG. The connection is prevented from being destroyed.

Such a relay board is used not only for connecting a silicon chip to a printed board made of resin, but also for example, as disclosed in Japanese Patent Application Laid-Open No. 61-3497. There is also an example in which it is interposed between a substrate and an organic printed board. That is, JP-A-61-3
No. 497 discloses a joining frame (relay substrate main body) 225 made of a polyurethane resin or the like between a ceramic substrate 222 and an organic printed board 221 as shown in FIG.
Between the pad 229 of the ceramic substrate 222 and the pad 226 of the organic printed circuit board 221.
A connection using a low melting point metal 227 such as b is disclosed. In the prior art described above, a relay board is used to reduce the difference in the coefficient of thermal expansion between a silicon chip or a wiring board and an organic printed board made of glass epoxy or the like. Were highly rigid and hardly deformed, such as a silicon chip or a ceramic wiring board.

[0005]

However, due to the recent technological progress, a wiring board using a high-performance resin or a resin and a fiber such as glass has appeared, and an integrated circuit chip (hereinafter, also simply referred to as an IC chip) has been developed. Is mounted on such a wiring board, and an IC mounting board has been used. In a wiring board using such a resin, the dielectric constant of the resin is generally smaller than that of ceramics or the like, which is convenient for transmitting a high-frequency signal, is easy to process, and does not require firing at a high temperature. There are advantages such as

Also, since the thermal expansion coefficient is almost the same as that of an organic printed circuit board made of glass epoxy or the like, even if both are connected, the stress due to the difference in the thermal expansion coefficient is very small. Does not grow. Therefore, it was considered unnecessary to interpose a relay board between such an IC mounting board and the organic printed board.

However, for example, as shown in FIG. 18A, when the wiring board main body 301 is made of a material containing a resin such as a glass-epoxy resin composite material, its upper surface (first
Since the IC chip 311 mounted on the (surface) is made of Si, the coefficient of thermal expansion is small (α = 3 to 4 × 10 ⁻⁶ / ° C.).
= 10 to several tens × 10 ⁻⁶ / ° C. It is significantly different from the coefficient of thermal expansion of a material containing a resin. Further, since a material containing a resin is softer (lower in rigidity) than a ceramic or the like, when heated, for example, as shown in FIG.
The area where the C chip 311 is mounted tends to be warped so as to be convex downward, and each solder ball 303 receives stress that expands and contracts in the vertical direction. The deformation shown in FIG. 18 (a) emphasizes the amount of deformation greatly. In practice, the eutectic solder ball 303 is hardly deformed, so the amount of deformation is very small. Therefore, the stress causing such deformation causes the solder ball 303 to fatigue.
Finally, as shown in FIG. 18B, of the solder balls 303 formed at positions corresponding to the positions where the IC chips 311 are mounted (IC chip corresponding positions), the connection pads 302 and the mounting pads It has been found that a crack K1 or K2 as shown by a broken line occurs in a portion near 322, which causes a failure to be selectively broken.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has an IC chip and an IC mounting board for mounting the IC chip between a mounting board and an IC mounting board made of a material containing resin. Due to the difference in the coefficient of thermal expansion between the IC substrate and the IC mounting substrate, warping deformation occurs, and even if the terminal is subjected to vertical expansion and contraction stress, the connection substrate is not easily broken, the connection between the IC mounting substrate and the relay substrate, and the IC mounting. An object of the present invention is to provide a structure including a board, a relay board, and a mounting board.

[0009]

Means and effects for solving the problems First, claim 1
The method according to the first aspect of the present invention includes an IC mounting substrate body having a substantially plate shape having a main surface and a back surface and made of a material containing a resin, an integrated circuit chip mounted on the main surface side, and at least the An IC mounting substrate including a connection pad formed at a position corresponding to the integrated circuit chip; a mounting substrate body; and a main surface of the mounting substrate body formed at a position corresponding to the connection pad of the IC mounting substrate. The IC mounting board and the mounting board by interposing between the connecting pad on the first surface side and connecting to the mounting pad on the second surface side. a relay board for connecting the door, made of a material including a resin, to name a substantially plate shape having the above-described first and second surfaces, the first surface side pads formed on the first surface side And the second
The first surface is located at a position corresponding to the first surface side pad on the surface side.
Second surface side pad electrically connected to side pad
And a first board side terminal formed on the first face side, and a first face side terminal at a position corresponding to the first face side terminal on the second face side. And a second surface side terminal formed by electrical connection, wherein the first surface side pad is provided.
And at least one of the second surface side pads is made of a soft metal.
And a columnar metal with a height higher than its maximum diameter
Genus body is fixed, the first face-side terminal and at least one of the second face-side terminals, made of soft metal, its height rather high than the maximum diameter, the IC expands and contracts in the thickness direction Mounting base
A relay substrate having a substantially columnar shape that follows a warp deformation of a plate .

An IC mounting substrate made of a material containing a resin includes:
The difference in thermal expansion coefficient from the mounted IC chip
Since the expansion and contraction are restricted in the C chip mounting portion, the warp deformation in the thickness direction of the substrate is attempted to change the distance between the IC mounting substrate and the mounting substrate. For this reason, a stress is applied to the connection pad, in particular, a terminal connected to the connection pad formed at a position corresponding to the integrated circuit chip. On the other hand, in the relay board of the present invention having the above configuration, the first or second surface side terminal is made of a soft metal and has a substantially columnar shape having a height higher than the maximum diameter. Then, following the warp deformation of the IC mounting substrate, the stress is relieved. For this reason, in connection from the IC mounting substrate to the mounting substrate, any portion is not easily broken.
Furthermore, since the relay board body is made of a material containing resin,
Since it is soft and does not hinder warpage, the generation of stress is also prevented from this point. It is sufficient that at least one of the first surface side terminal and the second surface side terminal is made of a soft metal and has a substantially columnar shape. It is only necessary to absorb the stress between the IC mounting board and the mounting board, so if either the first surface side terminal or the second surface side terminal is easily deformed,
This is because stress can be absorbed.

Further, the relay base of the present invention having the above structure
The board includes first and second surface side pads on the relay substrate body,
At least one of these pads has a substantially columnar gold
The first surface side pad and the second surface side
Freedom to connect with pad, easy to manufacture, medium
Select an appropriate method in consideration of the material of the connection board body, etc.
Can be. Specifically, a) a through hole is provided in the relay board body.
Through the inner periphery by plating etc. to form a through-hole conductor
And, in the vicinity of the through hole, the
1. A second surface side pad is provided. b) Through hole in relay board body
And fill the through hole with a conductor to form a filled via
In the vicinity of the through hole, the first and the second connected to the filled via are provided.
A two-side pad is provided. c) Set a through hole in the relay board body.
Fill the through hole with a conductor to form a filled via
Then, the first and second surface side pads are provided on the upper and lower ends. d)
Internal wiring and vias (staggered vias, filled vias)
Connect the first surface side pad and the second surface side pad via
And the like.

Here, as a material containing a resin constituting the IC mounting substrate main body or the relay substrate main body, a resin such as epoxy, polyimide, BT, polyurethane or a composite material of these resins is used. Examples of the composite material include a composite material of a resin represented by a glass-epoxy resin composite material and a fiber such as glass or polyethylene, and a composite material of a resin and a ceramic powder.
Further, the material of the integrated circuit chip mounted on the back side of the main surface of the IC mounting substrate main body is mostly silicon, but may be gallium arsenide or the like.

As a mounting method of the integrated circuit chip, the connection to the IC mounting substrate may be performed by a flip-chip method or by a die attach method. Furthermore, when the integrated circuit chips are connected by the flip chip method,
Thereafter, an underfill method of injecting and fixing a resin between the IC mounting substrate body and the integrated circuit chip may be performed. Further, connection pads for connecting to the mounting board are formed on the main surface of the IC mounting board main body. As an example of the arrangement of the connection pads, a lattice shape can be cited, but the connection pads need not necessarily be arranged in a lattice shape. Further, bumps may be formed by raising solder on the connection pads.

The mounting board is a board for mounting an IC mounting board, and may be a printed board such as a motherboard. The material of the mounting board body is glass
Composites of resins such as epoxy, polyimide, BT, and polyurethane with fibers such as glass and polyester, and composites of these resins with ceramic powders, such as epoxy resin composites, alumina, mullite, and aluminum nitride Ceramic. Mounting pads for mounting the IC mounting board are formed on the main surface of the mounting board body. This mounting pad is a pad provided on the mounting substrate body for electrical connection with the IC mounting substrate. A specific example of the mounting board is a printed circuit board in which mounting pads are arranged in a grid pattern. However, the mounting pads may not necessarily be arranged in a grid pattern. A plurality of mounting pad groups corresponding to the substrate may be provided. In addition, bumps may be formed by raising solder on each mounting pad.

In the present invention, the relay board body is
Of the two substantially plate-shaped surfaces, the side connected to the IC mounting substrate is referred to as a first surface, and the side connected to the mounting substrate is referred to as a second surface for convenience.

The first surface side terminal is a terminal formed on the first surface side of the relay board main body and refers to a terminal for connecting to a connection pad of the board. In addition, as a specific formation place of the first surface side terminal, a terminal formed on the first surface of the main body may be cited, but is not limited thereto. For example,
Even if it is formed on the bottom surface of the recess lower than the first surface (lower inside the relay substrate body), the first
It may be formed so as to rise over the surface. Further, the first surface side portion of the soft metal body formed by being inserted into the through hole formed in the main body may be used as the first surface side terminal.

Similarly, the second surface side terminal is a terminal formed on the second surface side of the relay board main body, and refers to a terminal for connecting to a mounting pad of the mounting board. In addition, as a specific formation place of the second surface side terminal, there is one formed on the second surface of the main body, but it is not limited to this. For example, it may be formed on the bottom surface of the concave portion lower than the second surface (lower inside the relay substrate main body), or may be formed so as to rise from such a concave portion beyond the second surface.
Further, the second surface side portion of the soft metal body formed to pass through the through hole formed in the main body may be used as the second surface side terminal. Further, the first surface side terminal and the second surface side terminal are electrically connected, and specifically, both are electrically connected by a through-hole conductor or a via formed in the relay board main body. Also, electrical connection can be made when a soft metal body is inserted into a through hole formed in the relay board main body.

The soft metal refers to a soft metal, and when it receives stress, it is easily deformed to release the stress. Specific materials include lead (Pb) and tin (S
n), zinc (Zn) and alloys containing these as main components, for example, Pb-Sn-based high-temperature solder (for example, Pb90% -S
n10% alloy, Pb95% -Sn5% alloy, etc.) and Pb-
Examples include Sn eutectic solder (Pb 36% -Sn 64% alloy), white metal, and the like. Since lead, tin and the like have a recrystallization temperature of room temperature, they recrystallize even if they undergo plastic deformation. Therefore, even if repeated stress is applied, it does not easily break (break), which is convenient.

Furthermore, the substantially columnar terminal only needs to have a substantially columnar shape having a height higher than its maximum diameter, and its outer shape may be such that its diameter varies in the height direction. For example, a barrel-like shape with a large diameter at the center,
The central portion may have a small diameter (the central portion is constricted) or a tapered shape. Further, it may have a prismatic shape such as a quadrangular prism or a triangular prism. However, in order to avoid concentration of stress at the corners, among them, those having a large number of corners such as a hexagonal prism and an octagonal prism are preferable, and a cylindrical shape is more preferable. Furthermore, it is preferable that the height of the columnar terminal be twice or more the maximum diameter, because the columnar terminal can be easily deformed. Further, the tip surface may be a hemispherical surface, but may be a flat surface or a surface having a concave portion in order to prevent a shift from occurring when connected to the mounting pad.

The substantially columnar terminal preferably has substantially the same outer diameter in the height direction except for the distal end and the proximal end. When stress is applied in the axial direction or radial direction of the substantially columnar terminal, if the outer diameter dimension is substantially the same in the axial direction (height direction), uniform bending deformation and expansion / contraction deformation will occur. This is because breakage is more difficult to occur. That is,
It is assumed that a substantially columnar terminal whose outer diameter dimension changes (cross-sectional area changes) in the height direction is used, for example, a case where a central part is a columnar terminal whose diameter is large or small. In this case, within one columnar terminal, there is a part that is easily deformed by stress and a part that is hardly deformed by stress,
The degree of deformation becomes non-uniform, and stress tends to concentrate. For this reason, there is a case where a portion that is easily broken is generated. On the other hand, according to the present invention having substantially the same outer diameter in the height direction, it is possible to make the terminal less likely to cause stress concentration and more difficult to break.

Here, the first surface side pad is a pad formed on the first surface side of the relay substrate main body, and refers to a pad for connecting to a connection pad of the substrate or fixing a columnar metal body. . In addition, as a specific formation place of the first surface side pad, there is one formed on the first surface of the relay board main body, but is not limited to this. For example, it may be formed on the bottom surface of the recess lower than the first surface. Similarly,
The second surface side pad is a pad formed on the second surface side of the relay board main body, and refers to a pad for connecting to the mounting pad of the mounting substrate or fixing the columnar metal body. In addition, as a specific formation place of the second surface side pad, a pad formed on the second surface of the relay board main body may be mentioned, but is not limited to this. For example, it may be formed on the bottom of the concave portion lower than the second surface. Further, as a method of fixing the first and second surface side pads to the columnar metal body, the columnar metal body may be fixed by directly welding the columnar metal body to these pads, or the soft metal constituting the columnar metal body may be fixed. The solder may be soldered with a solder having a lower melting point.

Furthermore, other solutions, before Symbol connecting board is provided with a through hole passing through between the first and second surfaces, the insertion-anchored soft metal bodies in the through hole ,
There is a relay board comprising the first surface side terminal and the second surface side terminal.

The relay substrate in that having a above-described structure, a through hole is formed in the connecting board, constitute a first and second surface side terminal of a soft metal bodies inserted through the inside. For this reason, the stress in the direction along the first and second surfaces due to the difference in the coefficient of thermal expansion between the IC mounting substrate and the relay substrate main body, or between the relay substrate main body and the mounting substrate, etc. Even if it is applied to the side terminal or the second surface side terminal, this stress is received as a compressive or tensile stress between the side surface of the soft metal body and the inner peripheral surface of the through hole. Therefore, when the columnar metal body is fixed to the pads formed on the first and second surfaces to form the first and second surface side terminals, such stress is generated between the pad and the columnar metal body. Compared to applying as a shear stress, it is more durable and has higher connection reliability.

As a method of fixing the soft metal body to the through hole of the relay board main body, a method of directly welding and fixing a metal layer formed by plating or the like on the inner periphery of the through hole and a soft metal body, There is a method of fixing via a solder having a lower melting point than a soft metal body.

Furthermore, other solutions, a relay substrate described above, the first surface end portion of the through hole and the second
An opening diameter of an end portion of the through hole that opens on a surface on which the substantially columnar terminal is formed is a diameter larger than the inside of the through hole. Relay board
There is.

As described above, when the soft metal body (the first and second surface side terminals) expands and contracts in the height direction (axial direction of the through hole) due to the warp deformation of the IC mounting board, Shear stress occurs between the inner peripheral surface and the soft metal body. When a shear stress is applied, a fracture is often caused by a small stress as compared with a tensile stress or a compressive stress. Therefore, a shape that avoids this as much as possible is desired. In the relay board of the present invention having the above configuration, the opening diameter of the end (for example, the first surface side end) of the through hole in which the substantially columnar terminal (for example, the first surface side terminal) is formed has an internal diameter. The diameter is larger. Therefore, in the ring-shaped portion corresponding to the difference between the cross-sectional area of the end of the through-hole and the cross-sectional area of the inside of the through-hole, the relay board main body compresses or tensiles stress in the thickness direction (axial direction of the through-hole). It will be received as stress. For this reason, the magnitude of the shear stress applied between the through hole and the soft metal body is reduced by that much, and a more reliable relay board can be obtained.

When the opening diameter of the end portion is larger than the inside of the through hole, a specific shape may be one in which the end portion is chamfered, and more specifically, R
A chamfered shape or a C-chamfered shape may be used.
In the case of a C-chamfered shape, the angle of the chamfer is preferably 30 degrees or more, more preferably 45 degrees or more, with the axis of the through hole. The larger the angle,
This is because the stress is distributed to the relay substrate body.
Further, the end portion may be formed in a step shape by spot facing or the like. Here, in particular, in the case of a chamfered shape, when a stress in a direction (radial direction) along the first surface or the second surface is applied to the substantially columnar terminal, the soft metal body (generally Concentration of stress in the vicinity of the end of the through hole of the columnar terminal) is prevented, so that a highly reliable relay substrate that is not easily broken from this point can also be obtained.

The opening diameter at the end of the through hole may be appropriately selected depending on the diameter of the inside of the through hole, the interval between the through holes, and the like.
It is better to make the opening diameter relatively large from the viewpoint of stress. On the other hand, in order to increase the opening diameter, it is necessary to increase the diameter of the terminal or reduce the diameter of the inside of the through hole. Examples of a method of processing the end of the through hole include a method in which a through hole is formed in the relay substrate main body and then chamfered with a drill or spotted with an end mill. In addition, a method of performing resin etching, plasma processing, or the like on the through-hole formed in the relay substrate main body to remove an end corner of the through-hole, or the like may be used.

[0029] Further, a solution according to a second aspect is the relay board according to the first aspect, wherein at least the first substrate is provided.
The surface side terminal is a relay board, which is made of a soft metal and has a substantially columnar shape having a height higher than its maximum diameter.

In the relay board of the present invention having the above structure, the first surface side terminal is made of a soft metal and has a substantially columnar shape. Can be reliably absorbed by the first surface side terminals formed on the first surface side where the deformation occurs. Hard to affect.

A third aspect of the present invention is the relay board according to the first or second aspect, wherein at least the first surface side terminals are connected to connection pads of the IC mounting board. A relay comprising: a first solder layer made of a first solder which can be soldered at a temperature lower than a solidus point of the soft metal; and a first solder paste layer containing the first solder. It is a substrate.

The relay board of the present invention having the above-described structure is provided with the first solder layer or the first solder paste layer at the connection portion between the first surface side terminal and the connection pad of the IC mounting board, so that the If the mounting board and the relay board are overlapped and heated, they can be connected. Therefore, there is no need to connect metal balls or form solder bumps to the connection pads on the IC mounting substrate. In addition, since the first solder is a solder that can be soldered at a temperature lower than the solidus point of the soft metal, the solder connection can be performed without melting or deforming the first surface side terminal or the second surface side terminal made of the soft metal. can do.

The connection portion of the first surface side terminal refers to a portion of the first surface side terminal which is connected to the connection pad by soldering. In the case of a substantially columnar terminal, it indicates the tip. Also, the first
When the surface-side terminal is in the form of a pad or a bump having a low height, it indicates the upper surface thereof.

The first solder may be any solder that can be soldered at a temperature lower than the solidus point of the soft metal. More specifically, the first solder is more than the solidus point of the soft metal constituting the substantially columnar terminal. It is better to lower the liquidus point of one solder. Even when the first solder is in a complete liquid phase, the soft metal can maintain a solid phase, so that good soldering is possible, and moreover,
This is because deformation of the terminal made of a soft metal can be prevented.
Further, it is preferable to select an appropriate difference between the solidus point of the soft metal and the liquidus point of the first solder.
This is because the setting and management of the temperature at which the first solder is melted becomes easy.

For example, Pb 90% -Sn is used as a soft metal.
When 10% high-temperature solder (melting point 301 ° C.) is used, the first solder is composed of Pb 36% -Sn 64% eutectic solder (melting point 183 ° C.) or a composition (Pb 20 to 50) in the vicinity thereof.
%, About 80 to 50% of Sn). Also, Pb36% -Sn6 as a soft metal
When 4% eutectic solder (melting point: 183 ° C.) is used, for example, Sn31% -Pb38% -Bi3
In%, such as 1% (solidus point 95 ° C, liquidus point 130 ° C)
It is preferable to use a material which is further reduced in melting point by adding Si or Bi. As other components, those to which an appropriate amount of Ag, Sb or the like is added may be used. In addition, Sn 48%-
Solder mainly composed of In, Bi or the like such as In 52% (melting point 117 ° C.) may be used.

Further, according to a fourth aspect of the present invention, there is provided a relay board according to any one of the first to third aspects, the IC mounting board, and a solder at a temperature lower than a solid point of the soft metal. A connecting body of the IC mounting board and the relay board, comprising a first solder that can be attached, and including a first solder layer for connecting the first surface side terminal of the relay board to the connection pad of the IC mounting board.

The connecting body of the IC mounting board and the relay board of the present invention having the above-described structure is a single wiring board (IC
Mounting board) and can be used in connection with a mounting board. Moreover, even if the IC mounting substrate is warped due to the influence of the thermal expansion coefficient of the integrated circuit chip, the deformation is absorbed by the first surface side terminal and the second surface side terminal. When connected, high connection reliability can be obtained.

[0038] Furthermore, a solution means according to claim 5 is the relay board according to any one of claims 1 to 3 , the IC mounting board, the mounting board, and the solid point of the soft metal. Consisting of the first solder that can be soldered at a lower temperature than
A first solder layer for connecting a first surface side terminal of the relay board to a connection pad of the IC mounting board, and a second solder which can be soldered at a temperature lower than a solid point of the soft metal; A structure including an IC mounting board, a relay board, and a mounting board, including a second solder layer for connecting a second surface side terminal of the board and a mounting pad of the mounting board.

The structure of the present invention having the above-described structure, comprising the IC mounting board, the relay board, and the mounting board, has the first surface even if the IC mounting board is warped due to the thermal expansion coefficient of the integrated circuit chip. This deformation is absorbed by the side terminal and the second surface side terminal, so that high connection reliability can be obtained without breakage.

Here, the first and second solders may be any solders that can be soldered at a temperature lower than the solidus point of the soft metal. It is preferable to select the first and second solders having a lower liquidus point than the phase point. Even if the first and second solders are completely liquid phases,
This is because the soft metal can keep the solid phase, so that good soldering can be performed, and furthermore, deformation of the terminal made of the soft metal can be prevented. Further, it is preferable to select an appropriate difference between the solid phase point of the soft metal and the liquidus points of the first and second solders. This is because the setting and management of the temperature at which the first and second solders are melted become easy.

For example, Pb 90% -Sn is used as a soft metal.
When 10% high-temperature solder (melting point 301 ° C.) is used, the first and second solders are composed of Pb 36% -Sn 64% eutectic solder (melting point 183 ° C.) or a composition (Pb 20 to
Pb-Sn alloy (50%, Sn 80 to 50%) may be used. Also, Pb 36% -S as a soft metal
When n64% eutectic solder (melting point 183 ° C.) is used, for example, Sn31% -Pb3
It is preferable to use a material such as 8% -Bi 31% (solidus point 95 ° C., liquidus point 130 ° C.) to which In and Bi are added to further lower the melting point. Further, as other components, Ag,
What added Sb etc. in an appropriate amount may be used. Others
I as in the case of Sn 48% -In 52% (melting point 117 ° C.)
Solder mainly composed of n, Bi or the like may be used. Further, as the first solder and the second solder, solder having the same composition may be used, or solder having different compositions may be selectively used.

Further, the solution means according to claim 6 is mainly
It has a substantially plate shape with a front and a back, and is made of a material containing resin.
IC mounting substrate body and integrated circuit mounted on the main surface
Path chip and at least the integrated circuit on the back side
Connection pads formed at positions corresponding to the chip.
IC mounting board, IC mounting board, and mounting board
Of the IC mounting board on the main surface of the mounting board main body.
A mounting pad formed at a position corresponding to the connection pad,
Between the mounting board and the first surface side.
Connected to the connection pad and connected to the mounting pad on the second side
By doing so, the IC mounting board and the mounting board
A relay board for connection, made of a material containing resin
And has a substantially plate shape having the first surface and the second surface.
A relay board main body and a first surface side end formed on the first surface side
And a position corresponding to the first surface side terminal of the second surface side
A second surface formed by being electrically connected to the first surface side terminal.
And a first terminal and a second terminal.
At least one of which is made of a soft metal,
Higher than the diameter, expands and contracts in the thickness direction and mounts the above IC
Substrate that has a substantially columnar shape that follows the warpage of the substrate
Can be soldered at a temperature lower than the solid point of the soft metal
The first surface side terminal of the relay board
First solder for connecting to the connection pad of the IC mounting board
And a connection body between the IC mounting board and the relay board having
You.

The IC mounting board of the present invention having the above configuration
The connection body of the relay board is a single wiring board (IC
Can be handled in the same way as the
Can be used subsequently. Moreover, integrated circuit chips
Warpage of the IC mounting board due to the thermal expansion coefficient of
However, this deformation is caused by the first surface side terminal and the second surface side terminal.
When this connector is connected to the mounting board
In this case, high connection reliability can be obtained.

[0044] Furthermore, the solution means according to claim 7 is a
A connection body between the IC mounting board and the relay board according to claim 6.
And the relay board body penetrates between the first surface and the second surface.
With a through hole that is inserted into and fixed to the through hole
The first surface side terminal and the second surface side terminal are composed of a metal body.
IC mounting board and relay board
Connected.

An IC mounting substrate of the present invention having the above-described structure,
In the connection body of the relay board, the relay board
A through-hole is formed in the body, and a soft metal body
Thus, the first and second surface side terminals are configured. others
Between the IC mounting board and the relay board body, or
Due to differences in the coefficient of thermal expansion between the spliced board body and the mounting board, etc.
Therefore, the stress in the direction along the first and second surfaces is not applied to the first surface side terminal.
Or if the stress is applied to the second side terminal,
Compressive and tensile stress between the side of the body and the inner peripheral surface of the through hole
I can. Therefore, the columnar gold is applied to the pads formed on the first and second surfaces.
When the first and second surface side terminals are formed by fixing
Is the stress between the pad and the columnar metal body.
It is more durable and has a higher
Connection reliability is obtained.

The through hole of the relay board main body and the soft metal body
Is fixed by plating the inner periphery of the through hole.
Welded metal layer and soft metal body by direct welding
Or through a solder that has a lower melting point than the soft metal body
There is a method of fixing.

Further, the solving means according to claim 8 is a contract
A connection body between the IC mounting board and the relay board according to claim 7.
The end of the first surface side and the end of the second surface side of the through hole.
That is, an opening is formed on the surface on which the substantially columnar terminal is formed.
The opening diameter at the end of the through hole is larger than the inside diameter of the through hole.
IC mounting board and relay base characterized by being large
It is a connected body of plates.

As described above, warpage deformation of the IC mounting board
The soft metal body (the first and second surface side terminals)
Direction (axial direction of the through-hole)
A shear stress is generated between the peripheral surface and the soft metal body. Sen
When shear stress is applied, it is compared with tensile stress or compressive stress.
It is possible to break with small stress
However, a shape that avoids this is desired. Book with the above configuration
Relay base used for connecting body of IC mounting board and relay board of the present invention
In the plate, a substantially columnar terminal (for example, a first surface side terminal)
Of the end (for example, the end on the first surface side) of the through hole in which is formed
The diameter is larger than the inside. Because of this, the through hole
The difference corresponding to the difference between the cross-sectional area at the end and the cross-sectional area inside the through hole
In the ring-shaped part, the relay board main body is
In the axial direction) as compressive or tensile stress
become. For this reason, the through hole and the soft metal body
The magnitude of the interposed shear stress is reduced,
Reliable relay board, IC mounting board and relay board
It can be a connecting body of plates.

It should be noted that the opening diameter of the end portion is larger than that of the inside of the through hole.
When the diameter is also large, the specific shape is
Examples are chamfered shapes. More specifically, R
A chamfered shape or a C-chamfered shape may be used.
In the case of a C-chamfered shape, the angle of the chamfer is
The angle formed with the axis is preferably 30 degrees or more, more preferably.
More preferably, it should be 45 degrees or more. The larger the angle,
This is because the stress is distributed to the relay substrate body.
Further, the end may be formed in a step shape by spot facing or the like.
No. Here, in particular, when the shape is chamfered, the shape is substantially columnar.
Direction along the first surface or the second surface with respect to the terminal
When a (radial) stress is applied, a soft metal
Prevents stress from being concentrated near the end of the through hole
High reliability, which is difficult to break from this point.
Connection board, furthermore, the connection body of the IC mounting board and the relay board
can do.

The diameter of the opening at the end of the through hole should be within the through hole.
The diameter may be appropriately selected depending on the distance between the through holes.
It is better to make the opening diameter relatively large from the viewpoint of stress. one
To increase the opening diameter, increase the terminal diameter
Or, it is necessary to reduce the inside diameter of the through hole.
The diameter is preferably about 10 to 30% of the hole diameter. Also, through holes
As for the processing method of the end of
After beveling, chamfering with a drill or spotting with an end mill
For example. Other relay board book
Resin etching, plasma treatment, etc. for through holes formed in the body
To remove the end corners of the through-hole.
It is.

Further, the solving means according to claim 9 is mainly
It has a substantially plate shape with a front and a back, and is made of a material containing resin.
IC mounting substrate body and integrated circuit mounted on the main surface
Path chip and at least the integrated circuit on the back side
Connection pads formed at positions corresponding to the chip.
IC mounting board, mounting board body, and mounting board body
Of the main surface corresponds to the connection pad of the IC mounting board.
A mounting board comprising: a mounting pad formed at a position;
It is interposed between them and makes contact with the connection pad on the first surface side.
To be connected to the mounting pad on the second side.
Connecting the IC mounting board to the mounting board.
Relay board, made of a material containing resin,
A relay board main body having a substantially plate shape having a first surface and a second surface.
A first surface side terminal formed on the first surface side;
The first surface is located at a position corresponding to the first surface terminal of the two surfaces.
A second surface side terminal formed by being electrically connected to the side terminal;
And at least one of the first surface side terminal and the second surface side terminal
Either is made of soft metal and is higher than its maximum diameter
High, expand and contract in the thickness direction, and warp the IC mounting board
A relay substrate having a substantially columnar shape following the shape;
First solder that can be soldered at a temperature lower than the solidus point of metal
Consisting of a terminal on the first surface side of the relay board and the IC mounted thereon.
A first solder layer for connecting to a connection pad of a substrate;
Solder that can be soldered at a temperature lower than the solidus point of the porous metal
And a second side terminal of the relay board and the mounting base.
A second solder layer for connecting to a mounting pad of the plate.
A structure consisting of an IC mounting board, a relay board, and a mounting board.
You.

The IC mounting board of the present invention having the above-described structure,
The structure consisting of the relay board and the mounting board is an integrated circuit chip
Warpage of the IC mounting board due to the thermal expansion coefficient of
However, this deformation is caused by the first surface side terminal and the second surface side terminal.
Since the is absorbed, high connection Shin never a break raw Jill
You can get reliability.

Further, a solution according to claim 10 is as follows.
An IC mounting board, a relay board, and a mounting board according to claim 9.
Wherein the relay board main body has a first surface and a first surface.
A through hole penetrating between the second surface and the second surface;
The first surface side terminal and the soft metal body passed through and fixed
An IC board comprising a second surface side terminal.
This is a structure including a mounting board, a relay board, and a mounting board.

IC mounting board and relay board having the above configuration
In the structure consisting of
A through hole is formed in the joint board body, and a soft
The first and second surface side terminals are constituted by a metal body.
For this reason, between the IC mounting board and the relay board body, or
Is the difference in the coefficient of thermal expansion between the relay board body and the mounting board.
As a result, the stress in the direction along the first and second surfaces is changed to the first surface side.
This stress can be softened even if it is applied to the terminal or the second side terminal.
And tensile stress between the side surface of the porous metal body and the inner peripheral surface of the through hole
And receive. Therefore, the pads formed on the first and second surfaces
When the first and second surface side terminals are formed by fixing the columnar metal body
In such a case, such stress is generated between the pad and the columnar metal body.
Is more durable than the shear stress
Therefore, high connection reliability can be obtained.

Further, a solution according to claim 11 is as follows.
An IC mounting board, a relay board, and a mounting board according to claim 10.
And a first surface side end of the through hole and
And the substantially columnar terminal of the second side end is
The opening diameter of the end of the through hole that opens on the formed surface is
The diameter is larger than the inside of the through hole
A structure consisting of an IC mounting board, a relay board, and a mounting board.
You.

As described above, the warpage of the IC mounting substrate is deformed.
The soft metal body (the first and second surface side terminals)
Direction (axial direction of the through-hole)
A shear stress is generated between the peripheral surface and the soft metal body. Sen
When shear stress is applied, it is compared with tensile stress or compressive stress.
It is possible to break with small stress
However, a shape that avoids this is desired. Book with the above configuration
Structure comprising IC mounting board, relay board and mounting board of the invention
Of the body, in the relay board, a substantially columnar terminal (for example,
The end of the through hole (for example, the first surface side terminal) formed with the
The opening diameter at the surface side end) is larger than the inside diameter. This
Between the cross-sectional area of the end of the through-hole and the cross-sectional area inside the through-hole.
In the ring-shaped part corresponding to the difference, the thickness of the relay board body is
Direction (axial direction of the through-hole), compressive or tensile stress
And receive it. For this reason, through holes and
The magnitude of the shear stress applied to the soft metal body is small.
More reliable relay board and IC mounted
A structure consisting of a board, a relay board, and a mounting board
it can.

[0057]

(Embodiment 1) Next, an embodiment of the invention will be described with reference to the drawings. FIG.
Is a front view of the relay board 10 according to the present embodiment,
FIG. 2 is a partially enlarged cross-sectional view of the relay board 10. As shown in FIG. 1, the relay board 10 includes a substantially square flat board-shaped relay board body 1 having a thickness of 0.3 mm and a side of 45 mm. This relay board main body (hereinafter, also simply referred to as main body) 1
Consists mainly of a glass-epoxy resin composite material in which an epoxy resin is impregnated into glass fibers.

As shown in FIG. 2, the relay board main body 1 has
It has a plurality of through holes H penetrating between the first and second surfaces 1a and 1b. The through holes H having a diameter of 0.45 mm are formed in a grid pattern at a pitch of 1.27 mm, each of which has a length and width of 34.
Holes (a total of 1156 holes), and as shown in FIG. Further, a Cu plating layer 2 (thickness of about 15 μm) formed by plating and a Ni—B plating layer 3 (thickness) A metal layer 4 having a thickness of about 5 μm is formed, and a soft metal body 5 is welded to the Ni—B plating layer 3 (metal layer 4).

The soft metal member 5 is made of Pb-Sn eutectic solder (Pb 36% -Sn 64%), is inserted and fixed in the through hole H, and further, the first surface 1a of the main body 1 (the upper surface in the figure). The first terminal 6 has a first surface side terminal 6 projecting upward in the figure, and a second terminal 7 in the form of a solder bump projecting downward in the figure beyond the second surface 1b. The first surface side terminal 6
Except for the tip part, the diameter is almost constant in the height direction (axial direction, vertical direction in the figure) (diameter of the intermediate part CD = 0.65 mm)
, The tip (the upper end in the figure) is hemispherical, and the height CH from the first surface 1a is 1.5 mm. Therefore, the maximum diameter AD of the first surface side terminal 6 = the middle part diameter C.
D, and the first surface side terminal 6 has a height C higher than the maximum diameter AD.
It has a substantially columnar shape with a high H. Also, the second surface side terminal 7
Has a substantially hemispherical shape with a diameter of 0.65 mm in plan view and a height of 0.33 mm from the second surface 1b.

Next, the relay board 10 is connected to an IC mounting board and a mounting board as follows, for example.
First, an LGA type IC mounting board 20 as shown in FIG. 3A was prepared as an IC mounting board to be connected to the relay board 10. This LGA type IC mounting substrate 20 has a thickness of 1.0 m.
m, an IC mounting board main body 21 having a side of 45 mm and a substantially square shape in a plan view. The IC mounting board main body 21 is mainly made of an insulating material of the same composite material of epoxy resin and glass fiber as the relay board main body 1, and an internal wiring mainly made of Cu (not shown) is formed therein. . On the back surface (lower surface in the figure) 21b (lower surface in the figure) 21b of the IC mounting substrate body 1, in order to connect to a mounting substrate described later, and therefore to connect to the first surface side terminal 6 of the relay substrate 10,
A connection pad 22 made of Cu and having a thickness of 25 μm and a diameter MD = 700 μm is formed. This connection pad 22
Is 34 × 34 = 11 in a grid pattern with a pitch of 1.27 mm.
56 are formed so as to extend over substantially the entire lower surface 21b, including positions corresponding to regions where IC chips to be described later are mounted.

The main surface (upper surface in the figure) 21a of the IC mounting substrate body 21 is made of Cu and has a thickness of 25 μm.
m, flip chip pads 23 having a diameter of 150 μm are arranged in a matrix of 45 × 45 = 2025 at a pitch of 0.3 mm.
And therefore over a 13.2 mm square area. The IC chip 11 is mounted on the flip chip pad 23 via the solder bump 13 by flip chip connection. I implemented
The C chip 11 is made of silicon and has a size of 17 × 17 × 0.
5 mm square plate shape, lower surface 11 of IC chip 11
b between the IC connection pad 12 and the flip chip pad 23, a Pb-Sn eutectic solder (Pb36
% -Sn64%). Note that, in order to strengthen the connection between the IC chip 11 and the IC mounting substrate body 21 and prevent the solder bumps 13 from breaking, or to protect the integrated circuit on the IC chip 11, the broken lines are shown in FIG. As described above, an underfill F for injecting an epoxy resin may be provided between the IC chip 11 and the IC mounting substrate body 21.

Further, a printed circuit board 30 as shown in FIG. 3B was prepared as a mounting board to be connected to the relay board 10. This printed circuit board 30 has a thickness of 1.6 mm and a side of 8 mm.
Printed circuit board body 31 having a substantially square plate shape of 0 mm and made of a glass-epoxy resin composite material (JIS: FR-4)
Further, on the main surface (upper surface) 31 a of the printed circuit board main body 31, the connection pads 22 of the IC mounting substrate 20 are provided.
Therefore, there is provided a mounting pad 32 formed at a position corresponding to the second surface side terminal 7 of the relay board 10. The mounting pad 32 has a thickness of 25 μm and a diameter PD = 720 μm.
It is made of u (copper), and has a pitch of 1.27 mm and, like the second surface-side terminal 7, is formed in a grid pattern with 34 pieces each in the vertical and horizontal directions, for a total of 1156 pieces.

Next, the relay board 10 is connected to the IC mounting board 20 as follows, for example. First, FIG.
As shown in FIG. 1A, about 250 ° C. of a low melting point solder paste (solder composition: Sn 48% -In 52%) P having a melting point of 117 ° C. is previously placed on the connection pads 22 of the IC mounting substrate 20.
The IC mounting board 20 is set on the relay board 10 after being applied to a thickness of μm. At this time, each connection pad 22
Are located on the first surface side terminals 6 respectively. Thereafter, the IC mounting substrate 20 is lowered, and the first surface side terminals 6 are moved.
Of the IC mounting board 20 by contacting the front end (upper end) with the connection pad 22 so as to be aligned.
Place on 0. Then, these are passed through a reflow furnace at a maximum temperature of 150 ° C. and heated to melt the low melting point solder paste P on the connection pads 22 to form a first solder layer 24, as shown in FIG. 4 (b). A connecting body 40 was formed by connecting the IC mounting board 20 and the relay board 10 by soldering. In addition, depending on the heating, Pb-
The soft metal body 5 (first and second surface side terminals 6, 7) and the solder bump 13 made of Sn eutectic solder do not melt.
In this connection body 40, the first surface 1a of the relay board main body 1 is
The distance A1 between the C mounting substrate body 21 and the back surface 21b is 1.6.
8 mm.

Since the first solder layer 24 spreads over almost the entire distal end of the first surface side terminal 6, the maximum diameter of the portion where the solder spreads (soldering portion) is the diameter CD (=
0.65 mm). In addition, the maximum diameter of the soldered portion and the diameter MD (= 0.72 mm) of the connection pad are substantially equal (about 90%). For this reason, even if the position of the first surface side terminal 6 and the connection pad 22 is slightly shifted, the IC mounting so that the substantially center of the connection pad 22 and the central axis of the first surface side terminal 6 coincide. The substrate 20 moves.
Melted low melting point solder paste P (first solder layer 24)
This is because of the self-alignment effect due to the surface tension in an attempt to reduce the surface area. Therefore, even if the IC mounting board 20 is positioned on the relay board 10 with some deviation, if the low-melting solder paste P is melted, the IC mounting board 20 is autonomously adjusted so as to have a correct positional relationship by the self-alignment effect. Moves.

Next, the connecting body 40 is connected to the printed circuit board 30 as follows, for example. As shown in FIG. 5A, a low melting point solder paste having a melting point of 117 ° C. (solder composition: Sn48% -In5
2%) P is applied to a thickness of about 250 μm, and a connection body 40 is set on the printed circuit board 30. At this time, each second surface side terminal 7 is positioned on the mounting pad 32. Thereafter, the connecting body 40 is lowered, and the front end (lower end) of the second surface side terminal 7 is abutted so as to be aligned with the mounting pad 32, and the connecting body 40 is attached to the printed circuit board 3.
Place on 0. Then, these are passed through a reflow furnace at a maximum temperature of 150 ° C. and heated to melt the low melting point solder paste P on the mounting pad 32 to form a second solder layer 33, as shown in FIG. 5 (b). Thus, a structure 50 in which the connection body 40 and the printed board 20 were connected to each other, and thus the IC mounting board 20, the relay board 10, and the printed board 30 were connected by soldering was completed. In the structure 50, as described above, the distance A1 between the first surface 1a of the relay substrate main body 1 and the back surface 21b of the IC mounting substrate main body 21 is 1.68 mm.
It is. On the other hand, the distance A2 between the second surface 1b of the relay board main body 1 and the main surface 31a of the printed board main body 31 was 0.5 mm.

Since the second solder layer 33 spreads over almost the entire upper surface of the second surface side terminal 7, the maximum diameter of the portion where the solder expands (the second surface side soldered portion) is determined by the diameter of the terminal 7 (the diameter of the terminal 7). = 0.65 mm). Also, the maximum diameter of the soldering part and the diameter PD (= 0.72 mm) of the mounting pad are:
The values are almost equal (about 90%). For this reason, even if the position of the second surface side terminal 7 and the mounting pad 32 is slightly shifted, the connecting body is so arranged that the substantially center of the mounting pad 32 and the central axis of the second surface side terminal 7 coincide. 40 moves. This is due to a self-alignment effect due to surface tension that attempts to reduce the surface area of the molten low melting point solder paste P (second solder layer 33). Therefore, even if the connection body 40 is slightly shifted on the printed circuit board 30, when the low-melting solder paste P is melted, the connection body 40 moves autonomously so as to have a correct positional relationship by a self-alignment effect. I do.

Here, when the structure 50 in this embodiment is heated or cooled, the IC mounting board 2 of this embodiment is heated and cooled.
0, the IC chip 11 is mounted on the main surface 21a, and the main body 21 of the IC mounting substrate is mainly composed of a composite material of epoxy resin and glass fiber having relatively small rigidity. Small IC chip 11
The IC mounting substrate body 21 tends to be warped and deformed in the area where (2) is mounted (see FIG. 18A). For this reason, in the case of the related art in which the solder ball is directly connected to the printed circuit board without using the relay board, as shown in FIG. 18B, the solder ball at the position corresponding to the chip may be selectively broken. there were.

However, in the present embodiment, FIG.
As shown in (a), the first surface side terminals 6 of the relay board 10 expand and contract in the height direction (thickness direction of the relay board: vertical direction in the figure) (elongate in the figure) and follow the warp deformation. So that it does not break. The first surface side terminal 6 is made of a soft metal that can be easily deformed (specifically, Pb-Sn eutectic solder), and has a substantially columnar shape having a height CH higher than the maximum diameter AD (= intermediate portion diameter CD). Because it is. In addition, the relay board main body 1 made of a glass-epoxy resin composite material has low rigidity and easily deforms, so that the deformation of the IC mounting board 20 is not hindered, so that no stress is generated here.

Further, when the structure 50 is heated or cooled, deformation occurs in the direction along the first surface 1a (horizontal direction in the figure) between the relay board main body 1 and the IC mounting board main body 21 due to a difference in thermal expansion. There is. This is because the relay board body 1 and I
Although it is substantially the same material (glass-epoxy resin composite material) as the C mounting substrate body 21, it is not completely the same material.
In addition, since a wiring made of Cu is formed inside the IC mounting substrate main body 21 and the like, the wiring is affected by this. When such a difference in thermal expansion occurs, the relay substrate main body 1 and the IC mounting substrate main body 21 tend to be displaced relatively in the direction along the first surface 1a. In such a case, the conventional connection using a solder ball is difficult to deform, and a repeated shear stress is applied. Therefore, when the difference in thermal expansion becomes extremely large, the solder ball may be broken.

However, as in the present embodiment, when the first surface side terminal 6 made of a soft metal and having a substantially columnar shape is interposed between the relay substrate main body 1 and the IC mounting substrate main body 21, the connection is made. For example, as shown in FIG. 6 (b), even if the IC mounting substrate body 21 is displaced rightward in the figure, the first surface side terminal 6 is bent and deformed to absorb stress as shown by the solid line. , Does not break. This is because the first surface side terminal 6 is made of a soft metal that can be easily deformed and has a substantially columnar shape having a height CH higher than the maximum diameter AD (= intermediate portion diameter CD).

In the first embodiment, the relay board 10 is once connected to the LGA type IC mounting board 20 to connect the IC mounting board to the relay board (substrate with relay board).
Although an example is shown in which the structure 50 is further connected to the printed circuit board 30 after the formation of the structure 40, a method of manufacturing the structure 50 at once can be adopted. That is, the low melting point solder paste P is applied to the mounting pad 32 and the connection pad 22 in advance,
The printed board 30, the relay board 10, and the LGA type IC mounting board 20 are stacked in this order, reflowed, and the board 20 and the relay board 10, and the relay board 10 and the printed board 40 are connected (soldered) at a time. Is also good. Further, the relay board 10 and the printed board 30 may be connected first.

Next, a method of manufacturing the relay board 10 will be described. First, an insulating plate G made of a glass-epoxy resin composite material (JIS: FR-4) having a thickness of 0.3 mm.
A double-sided copper-clad insulating plate G0 having a copper plate F having a thickness of 12 μm adhered to both sides of is prepared. First, through holes H are formed in the double-sided copper-clad insulating plate G0 at a predetermined pitch by a drill (see FIG. 7A). Thereafter, electroless Cu plating and electrolytic Cu plating (thickness: 15 μm) are performed to form a Cu plating layer F2 also in the through hole H (see FIG. 7B). Further, a dry film serving as an etching resist is attached so as to cover the through-hole H, and exposed and developed to leave the dry films DR1 and DR2 so as to slightly cover the peripheral edge of the end of the through-hole H (FIG. 7C). reference).

Then, unnecessary copper is removed by etching, the dry films DR1 and DR2 are peeled off, and a copper plating layer 2 is formed in the through hole H and on the periphery of the through hole. The layer 3 is formed by electroless plating to form a metal layer 4 and cut into a predetermined shape (see FIG. 7D). As a result, the metal layer 4 was formed in the through holes H formed in the relay board main body 1 made of the glass-epoxy resin composite material. The Ni-B plating layer 3 is
It serves to prevent the copper plating layer 2 from being eroded by eutectic solder (soft metal body) described later.

Next, the soft metal body 5 is inserted into the through hole H and fixed to the metal layer 4. In this embodiment, the soft metal body 5 is formed using the columnar terminal forming jig N and the load jig M. That is, as shown in FIG. 8A, the upper surface N3 of the columnar terminal forming jig N made of carbon, which is heat-resistant and does not wet the molten Pb-Sn eutectic solder, is provided with the relay substrate main body 1. At a position corresponding to each of the through holes H, a diameter of 0.
7 mm deep 1.70 mm, conical recess N1 at the tip
Are formed. Also, the concave portion N of the columnar terminal forming jig N
A gas vent hole N2 having a small diameter (0.2 mm in diameter) penetrating the columnar terminal forming jig N downward is formed at the top (the lowermost portion in the figure) of each of the reference numerals 1.

First, each concave portion N of this columnar terminal forming jig N
1 is a Pb-Sn eutectic solder having a diameter of 0.5 mm (Pb36
% -Sn64%) The ball D1 is thrown in. In this example, two pieces were put into each recess. Next, the concave portion N1
A Pb—Sn eutectic solder ball D2 having a diameter of 0.95 mm is placed on the end (upper end) of the solder ball D2. At this time, it is preferable that the gap is slightly spaced so that the ball D1 and the ball D2 already placed in the concave portion N1 do not come into contact with each other and come into contact with each other when the eutectic solder described later is melted.
In this case, the ball D2 comes into close contact with the upper end edge of the concave portion N1 and does not move (or hardly moves), so that the positioning when the relay board main body 1 described later is mounted becomes easy.

Thereafter, as shown in FIG.
The relay substrate main body 1 is placed on the upper side in FIG. 2 with the first surface 1a facing down. At this time, the ball D is inserted into the through hole H.
Position so that 2 fits. Further, the load jig M is placed on the second surface 1b (upper side in the figure) of the relay board main body 1. The load jig M is also made of carbon, and a hemispherical concave portion M1 having a radius of 0.35 mm is formed on the lower surface M2 at a position corresponding to the through hole H.

Next, the maximum temperature 210
These are put into a reflow furnace at a holding temperature of 183 ° C. or more for 2 minutes to melt the eutectic solder balls D1 and D2.
Then, the molten eutectic solder D2 is pushed down in the figure by the weight of the load jig M and the relay substrate main body 1, and
It is inserted into the through hole H of the main body 1 and is welded to the metal layer 4 on the inner periphery of the through hole H. On the other hand, at the upper end of the through hole H, the eutectic solder D2 exceeds the second surface 1b (the upper surface in the figure),
It bulges in a hemispherical shape following the concave portion M1. The eutectic solder D2 is also injected into the concave portion N1 of the columnar terminal forming jig N. Then, it comes into contact with the molten eutectic solder D1, and both tend to be united by surface tension. However, since the eutectic solder D2 is welded to the metal layer 4 and is integrated with the main body 1, it cannot separate from the main body 1 and fall down. Integrate by pulling up. The main body 1 is pushed down by the load jig M to a state close to the upper surface N3 of the columnar terminal forming jig N.

The gas vent hole N2 plays a role of releasing air trapped in the concave portion N1 when melting the eutectic solder balls D1 and D2. However, since the columnar terminal forming jig N does not get wet with the solder and the gas vent hole N2 has a small diameter, the solder does not enter the gas vent hole N2.

Thereafter, the eutectic solder is solidified by cooling. As a result, as shown in FIGS. 1 and 2, on the first surface 1a (upper side in the figure) of the relay board main body 1, the side surface follows the shape of the side wall of the concave portion N1, and the front end portion becomes substantially hemispherical. Pb-S having a first surface side terminal 6 and a second surface side terminal 7 on the second surface 1b side, which is substantially hemispherical following the concave portion M1.
A soft metal body 5 made of n-eutectic solder is formed. In addition, the relay board 10 in which such a soft metal body 5 is inserted into and fixed to the through hole H is completed.

Next, a method of manufacturing the IC mounting board 20 will be described. The IC chip 11 shown in FIG. 9A has an integrated circuit formed on a silicon wafer by a well-known integrated circuit forming technique. To form a solder bump 13 of Pb-Sn eutectic solder, followed by dicing. Also, as shown in FIG.
Using a well-known resin wiring board manufacturing technology, a glass-epoxy resin composite material, an epoxy resin and a glass nonwoven fabric are used as an insulating layer, and Cu or Cu is plated or etched.
The wiring is formed to form the LGA type IC mounting board main body 21. Main surface (upper surface) 21a of this IC mounting substrate body 21
On the other hand, flip chip pads 23 for connection to the solder bumps 13 of the IC chip 11 are formed, while connection pads 22 for connection to the relay board 10 are formed on the back surface (lower surface) 21b.

The IC chip 11 and the IC mounting substrate main body 2
As shown in FIG. 9 (c), the solder bumps 13 are positioned and overlapped so that the solder bumps 13 correspond to the flip chip pads 23. Next, the two are heated to melt the solder bumps 13 and are welded to the flip chip pads 23 to form an IC.
The chip 11 is mounted on the IC mounting substrate body 21 (FIG. 3).
(a)). As shown by the broken line in FIG.
As described above, an underfill F for injecting an epoxy resin may be provided between the chip 11 and the IC mounting substrate main body 21.

Next, a method of manufacturing the printed circuit board 30 will be described. As shown in FIG. 10A, a printed board 30 is provided on one side (upper side in the figure) of an insulating material J made of 1.6 mm thick glass-epoxy resin composite material (JIS: FR-4). A single-sided copper-clad insulating plate J0 to which a foil F4 (18 μm in thickness) is attached is used. Copper foil F of this insulating plate J0
4 on the dry film DR which becomes an etching resist
3 and is exposed and developed in a predetermined pattern to leave a dry film DR3 in a portion where a mounting pad is to be formed (see FIG. 10B). Next, the exposed copper foil F4 was removed by etching, and the dry film DR3 was peeled off.
By cutting into a predetermined shape, the mounting pad 3 is attached to the main surface 31a of the printed circuit board body 31, as shown in FIG.
The printed circuit board 30 on which 2 is formed is completed.

(Embodiment 2) Next, a second embodiment will be described. In this embodiment, only the shape of the through hole formed in the relay board main body and the method of manufacturing the relay board main body are different. Therefore, similar parts are omitted, and only different parts will be described. In FIG.
FIG. 7 shows a partially enlarged cross-sectional view of a relay board 10B according to a second embodiment. The relay board 10B has a relay board body 1B made of a glass-epoxy resin composite material, as in the first embodiment. The main body 1B has a diameter HBD =
A through hole HB of 0.45 mm is formed.
B on the first surface 1Ba side has an opening diameter OBD in the first surface 1Ba.
= A large-diameter portion C having a chamfered shape of 0.6 mm is formed. As in the first embodiment, the Cu plating layer 2 having a thickness of 20 μm and the N
A metal layer 4 composed of the iB plating layer 3 is formed.

A soft metal member 5B made of Pb-Sn eutectic solder is inserted into and fixed to the through hole HB. The first surface side is connected to the first surface side terminal 6B and the second surface side. Constitutes the second surface side terminal 7B. This first surface side terminal 6B
Indicates the height direction (axial direction, vertical direction in the figure), excluding the tip
Of approximately constant diameter (intermediate part diameter CBD = 0.65)
mm), the tip (upper end in the figure) is hemispherical, and the height CBH from the first surface 1Ba = 1.5.
mm. Therefore, the maximum diameter ABD of the first surface side terminal 6 =
The first surface side terminal 6 has a maximum diameter AB.
It is a substantially columnar shape having a height CBH higher than D. Also,
The second surface side terminal 7B has a diameter of 0.55 m when viewed in plan.
m, the height from the second surface 1Bb is a substantially hemispherical shape of 0.28 mm.

The relay board 10B is connected to the IC mounting board 20 and the printed board 30 in the same manner as the relay board 10 shown in the first embodiment (see FIGS. 4 and 5) to form a structure 50B (not shown). Is formed,
The difference in the thermal expansion coefficient between the IC chip 11 and the IC mounting substrate main body 21 causes the IC mounting substrate main body 21 to be warped and deformed. In the case of the present embodiment as well, as in the first embodiment (see FIG. 6A), the first surface side terminal 6B expands and contracts to follow the deformation of the IC mounting substrate main body 21. hard.

Further, in the present embodiment, the large-diameter portion C is formed in the through hole HB formed in the relay board main body 1B. In the relay substrate main body 1 of the first embodiment, when the first surface side terminal 6 expands and contracts in the height direction due to the warp deformation of the IC mounting substrate main body 21, the inner peripheral surface of the through hole H and the soft metal body 5 In between, shear stress is applied. On the other hand, in the present embodiment, the large-diameter portion C is formed, and the through hole HB is formed.
Has a smaller diameter HBD. Therefore, in the ring-shaped portion corresponding to the difference between the opening diameter OBD of the large-diameter portion C and the diameter HBD of the through-hole HB, the relay substrate main body 1B receives stress in the height direction as compression or tensile stress. Relatively, the shear stress applied between the through hole HB and the soft metal body 5B can be reduced. Looking at various breaking strengths of materials such as eutectic solder, the shear strength is usually smaller than the compressive strength or the tensile strength.
This reduces the shear stress applied to the wire B and allows a more reliable connection.

Now, a method for manufacturing such a relay board main body 1B is as follows. That is, prior to the step of forming the metal layer 4 in the through hole H in the first embodiment, the end of the through hole is counter-sunk in a C-chamfered shape to form a large-diameter portion. That is, as shown in FIG. 12A, the through holes HB are first formed in the double-sided copper-clad insulating plate GB0 in which copper foils FB are attached to both surfaces of the insulating plate GB. Next, as shown in FIG.
Using a drill Q larger in diameter than the through hole HB,
A chamfered large diameter portion C is formed at the upper end in FIG.
(c)). Thereafter, as in the first embodiment, the through holes H
B is plated and etched to form a metal layer 4.

In the above description, the C-chamfered large-diameter portion C is formed only on the first surface 1Ba side where the first surface side terminal 6B having a substantially columnar shape is formed. As shown in FIG. 4B, the large-diameter portion C2 may be formed not only on the first surface 1Ba side but also on the end of the through hole HB on the second surface 1Bb side, that is, on both sides. Further, as shown in FIG. 13B, instead of the C-chamfered shape, an R-chamfered large-diameter portion C3 may be formed. Further, as shown in FIG. 13C, the first surface 1 of the through hole HB is formed.
A counterbore may be formed from the Ba side using an end mill to form a step-shaped large-diameter portion C4.

(Embodiment 3) Next, a relay board 70 according to a third embodiment will be described. The relay board 70 of the present embodiment is the same as that of the first and second embodiments.
Unlike the relay board of No. 2, a soft metal body is inserted into the through hole.
It was formed without being fixed. Note that the IC mounting board 20 and the printed circuit board 30 connected to the relay board 70 are the same as those in the first embodiment, and a description thereof will be omitted.

FIG. 14 shows a relay board 7 according to this embodiment.
0 shows a partially enlarged sectional view. The relay board 70 includes a main body core board 71A, a first insulating layer 71B, and a second insulating layer 71B.
C, a filling via 78, and a relay board main body 71 composed of wiring layers 79A and 79B. The main body core board 71A of the relay board main body 71 is made of a 0.3 mm thick glass-epoxy resin composite material (JIS: FR-4), and has a diameter of 0.1 mm perforated in the main body core board 71A at a pitch of 1.27 mm. The 5 mm through-hole H7 is filled with a conductive resin made of a mixture of an epoxy resin and a copper powder to form a filling via 78. Further, wiring layers 79A and 79B made of copper having a thickness of 25 μm are formed on the upper surface 71Aa and the lower surface 71Ab in the figure of the main body core substrate 71A so as to cover the upper and lower ends of the filled via 78.

Further, the upper surface 71A of the main body core substrate 71A
A first insulating layer 71B made of epoxy resin having a thickness of 40 μm is formed from above a to the wiring layer 79A while exposing a part of the wiring layer 79A as a first surface side pad 79AO (diameter 0.65 mm). I have. Similarly, from the lower surface 71Ab of the main body core substrate 71A to the wiring layer 79B, a part of the wiring layer 79B is partially replaced with the second surface pad 79BO.
(Diameter 0.65mm) while exposing to a thickness of 40μ
A second insulating layer 71C made of m epoxy resin is formed. Therefore, this relay board main body 71 has a thickness of about 0.3 mm.
It is 38 mm, and has a square shape of 45 × 45 mm.

Further, it is composed of Pb-Sn eutectic solder,
Tip is hemispherical, maximum diameter 0.65mm, height 1.5m
An approximately columnar first surface terminal 76 of m is welded to the exposed portion 79AO of the wiring layer 79A and protrudes upward in the figure beyond the first surface 71a. It is made of Pb-Sn eutectic solder, has a hemispherical shape, a diameter of 0.65 mm and a height of 0.33 mm.
Of the wiring layer 79B.
It is welded to the BO and protrudes downward in the figure beyond the second surface 71b. The first side terminal 76 and the second side terminal 77
Are formed at positions corresponding to each other and at positions corresponding to the connection pads 22 of the IC mounting board 20 and the mounting pads 32 of the printed circuit board 30.

By connecting the relay board 70 to the IC mounting board 20 and the printed board 30 described above, the structure 5
0C (not shown), the IC chip 1
Due to the difference in the coefficient of thermal expansion between the IC mounting substrate body 1 and the IC mounting substrate body 21, the IC mounting substrate body 21 tends to be warped.
Also in the case of the present embodiment, as in the case of the first embodiment (see FIG. 6A), the first surface side terminal 76 is expanded and contracted to form an IC.
Since it follows the deformation of the mounting substrate main body 21, breakage hardly occurs.

A method for manufacturing the relay board 70 will be briefly described. Glass that later becomes the main body core substrate 71A
An epoxy resin composite material is used as an insulating material, and a double-sided copper-clad insulating plate having copper foils attached to both sides is prepared, and a through hole H7 is formed. Further, a conductive resin composed of a mixture of an epoxy resin and a copper powder is filled in the through-hole H7, and is cured by heating to form a filled via 78. Thereafter, electrolytic Cu plating is performed, and a Cu plating layer is deposited on the copper foil adhered to both surfaces of the insulating layer and the upper and lower end surfaces of the filling via 78. As a result, the copper foil becomes thicker, and a Cu plating layer is formed on the upper and lower end surfaces of the filling via 78. In addition, since the filling via 78 has conductivity, direct electrolytic plating is possible.

Next, a dry film resist is attached, exposed and developed to form a predetermined pattern, unnecessary copper (copper plating layer and copper foil) is removed by etching, and the dry film is also removed. Thereby, the wiring layers 79A, 7A
9B is upper and lower surfaces 71Aa, 71Ab of the main body core substrate 71A.
Could be formed. Furthermore, the upper and lower surfaces 7 of the main body core board 71A
1Aa, 71Ab and the wiring layers 79A, 79B,
A photosensitive solder resist made of epoxy resin is applied, exposed and developed, and the first surface side pad 79AO and the second
A portion to be the surface-side pad 79BO is exposed, and then heated to cure the solder resist, thereby forming the first and second insulating layers 71B and 71C. Thus, the relay board main body 71 was formed.

Next, the first and second surface side terminals 76 and 77 are formed as follows. That is, as shown in FIG. 15A, the upper surface L3 of the columnar terminal forming jig L in the figure has a diameter of 0.
A concave portion L1 having a conical shape at the tip (lower end in the figure) of 7 mm and depth of 1.8 mm is formed. Further, a small-diameter (φ0.2 mm) gas vent hole L2 penetrating downward through the columnar terminal forming jig L is formed at the tip (the lowermost portion in the figure) of the concave portion L1 of the columnar terminal forming jig L, respectively. . The columnar terminal forming jig L is made of carbon (graphite), which is a material having heat resistance and not wettable by molten eutectic solder.

First, each concave portion L of this columnar terminal forming jig L
1 is charged with a eutectic solder ball D3 having a diameter of 0.4 mm. In this example, two pieces were put into each recess. Next, a eutectic solder ball D4 having a diameter of 0.91 mm is placed on the end (upper end) of the concave portion L1. At this time, it is preferable to provide a small gap so that the balls D3 and D4, which have already been thrown into the concave portion L1, do not come into contact with each other and come into contact with each other when the eutectic solder described later is melted. In this case, the ball D4 comes into close contact with the upper end edge of the concave portion L1 and does not move (or hardly moves), so that a displacement when the relay board main body 71 described later is placed is less likely to occur.

Thereafter, as shown in FIG. 15 (b), the relay board main body 71 is placed above the ball D4 with the first surface 71a facing down. At this time, the first surface side pad 79AO is positioned above the concave portion L1 so that
Position so that it touches 4. Further, in a step described below, the relay board main body 1 is surely lowered,
Although not shown, an appropriate load is applied on the second surface 71b,
Or put a weight. Although not shown, a eutectic solder paste is applied in advance on the second surface side pads 79BO of the relay board main body 71.

Next, in a nitrogen atmosphere, a maximum temperature of 210
These are charged into a reflow furnace having a holding time of 2 minutes at a temperature of 183 ° C. or higher to melt the eutectic solder balls D3 and D4. Then, while the molten eutectic solder D4 is welded to the first surface side pad 79AO, the molten eutectic solder D4 is pushed down in the figure by the weight and load of the relay board main body 71 and injected into the concave portion L1. Then, it comes into contact with the molten eutectic solder D3, and both tend to be united by the surface tension. However, since the eutectic solder D4 is welded to the first surface side pad 79AO and is integrated with the main body 71, the eutectic solder D4 cannot separate from the main body 71 and fall down. D3 is integrated by pulling it upward. The main body 71 is provided on the upper surface L3 of the jig L for forming a columnar terminal.
It descends until the surface 71a is almost in contact.

The gas vent hole L2 plays a role in releasing the air trapped in the recess L1 when the eutectic solder balls D3 and D4 are melted. However, since the jig L does not get wet with the solder and the gas vent hole L2 has a small diameter, the solder does not enter the gas vent hole L2. Further, on the second surface 71b side (not shown), the applied eutectic solder paste is melted and welded to the second surface side pad 79BO, and becomes hemispherical due to surface tension.

Thereafter, when the eutectic solder is solidified by cooling, the first surface side pad 79A on the first surface 71a side of the main body 71 is formed.
In O, a substantially columnar first surface side terminal 76 whose side surface follows the shape of the inner wall of the concave portion L1 and whose front end portion is substantially hemispherical is formed. Further, a second surface side terminal 77 having a substantially hemispherical shape is welded to the second surface side pad 79BO on the second surface 71b side. Thus, the wiring board 70 is completed (FIG. 14).
reference).

In each of the above embodiments, a substantially columnar first surface terminal is formed on the first surface side of the relay board, and the second surface having a height smaller than the maximum diameter is formed on the second surface side. Although the side terminal is formed, it is not limited to such a form. That is, both the first and second surface side terminals may be formed in a substantially columnar shape having a height higher than the maximum diameter. With this configuration, even in the second surface side terminal, the warpage deformation of the IC mounting board can be absorbed by the expansion and contraction deformation, so that higher connection reliability can be obtained. On the other hand, only the second surface side terminal may have a substantially columnar shape having a height higher than its maximum diameter. The relay substrate body made of a material containing a resin has low rigidity and is unlikely to inhibit the warpage of the IC mounting substrate, and thus tends to be warped and deformed following the IC mounting substrate. Therefore, even if the second surface side terminal expands and contracts, it can follow the warp deformation of the IC mounting substrate, and alleviates the stress, so that the connection is highly reliable without breaking. .

In the above, the present invention has been described with reference to the embodiments. However, it is needless to say that the present invention is not limited to the above embodiments, and can be appropriately modified and applied without departing from the scope of the invention. No.

[Brief description of the drawings]

FIG. 1 is a plan view of a relay board according to a first embodiment.

FIG. 2 is a partially enlarged cross-sectional view of the relay board according to the first embodiment.

3A is a cross-sectional view of an IC mounting board connected to a relay board, and FIG. 3B is a cross-sectional view of a mounting board.

FIG. 4A is an explanatory view showing a state in which a relay board and an IC mounting board according to the first embodiment are connected, and FIG. 4B is a cross-sectional view of a connection body connecting the two.

FIG. 5A is an explanatory view showing a state in which a connecting body is connected to a printed circuit board, and FIG. 5B is a cross-sectional view of a structure in which both are connected.

FIGS. 6A and 6B are explanatory views showing a state of deformation of a first surface side terminal when stress is applied, wherein FIG. Is the case.

FIG. 7 is an explanatory diagram showing a process until a metal layer is formed in the through hole in the method of manufacturing the relay board according to the first embodiment.

FIG. 8 is an explanatory view showing a step of inserting a soft metal body into the through hole in the method of manufacturing the relay board according to the first embodiment.

FIG. 9 is an explanatory diagram illustrating a method for manufacturing an IC mounting board.

FIG. 10 is an explanatory diagram illustrating a method for manufacturing a printed circuit board.

FIG. 11 is a partially enlarged cross-sectional view of the relay board according to the second embodiment.

FIG. 12 is an explanatory diagram showing a step of chamfering an end of a through hole according to the second embodiment.

FIG. 13 is a partially enlarged cross-sectional view showing another example of the end shape of the through hole, (a) having chamfered on both surfaces, (b) having R chamfered, and (c). Indicates a step-like shape.

FIG. 14 is a partially enlarged cross-sectional view of a relay board according to a third embodiment.

FIG. 15 is an explanatory diagram illustrating a step of forming the first surface side terminal according to the third embodiment.

16 (a) is an explanatory view showing a structure of a relay board, and FIG. 16 (b) is a view showing a state where a relay board is interposed between two boards.

FIG. 17 is an explanatory view showing a state in which another conventional relay board is interposed between two boards.

FIGS. 18A and 18B show a case where an integrated circuit chip is mounted and an IC mounting board having a wiring board main body made of a material containing a resin is connected to a printed circuit board. FIG. FIG. 3B is a schematic diagram illustrating the connection terminal, and FIG.

[Explanation of symbols]

 10, 10B, 70 Relay substrate 1, 1B, 71 Relay substrate body 1a, 1Ba, 71a First surface 1b, 1Bb, 71b Second surface 2 Cu plating layer 3 Ni-B plating layer 4 Metal layer 5, 5B Soft metal body 6, 6B, 76 First surface side terminal 7, 7B, 77 Second surface side terminal 11 IC chip 12 IC connection pad 13 Solder bump 20 IC mounting board 21 IC mounting board main body 22 Connection pad 23 Flip chip pad 24 First solder layer Reference Signs List 30 printed circuit board (mounting board) 31 printed circuit board main body 32 mounting pad 33 second solder layer 40 connecting body 50 structure H, HB, H7 through hole C, C2, C3, C4 large diameter part D1, D2, D3, D4 solder Ball M Load jig M2 Concave L, N Columnar terminal forming jig L1, N1 Concave P Solder paste

Continuation of front page (56) References JP-A-60-129393 (JP, A) JP-A-2-81447 (JP, A) JP-A-7-161866 (JP, A) JP-A-10-12989 (JP, A) , A) JP-A-10-12990 (JP, A) JP-A-11-126957 (JP, A) JP-B-5-50876 (JP, B2) (58) Fields surveyed (Int. Cl. ⁷ , DB Name) H05K 1/18 H01L 21/60 311 H01L 23/12

Claims (11)

(57) [Claims] 1. An IC mounting substrate main body made of a material containing a resin and having a substantially plate shape having a main surface and a back surface, an integrated circuit chip mounted on the main surface side, and at least the integrated circuit out of the back surface side An IC mounting board including a connection pad formed at a position corresponding to the chip, a mounting board body,
A mounting pad formed on a main surface of the mounting substrate main body at a position corresponding to the connection pad of the IC mounting substrate, and connected to the connection pad on the first surface side. A relay board for connecting the IC mounting board and the mounting board by connecting to the mounting pad on the second face side, wherein the relay board is made of a material containing resin, and the first face and the second face are name a substantially plate shape with bets, first surface side pad formed on the first surface side
And a position corresponding to the first surface side pad on the second surface side
And a first pad formed electrically connected to the first surface side pad.
A relay board main body including a second surface side pad, a first surface side terminal formed on the first surface side, and a first surface terminal in a position corresponding to the first surface side terminal on the second surface side. And a second surface side terminal electrically connected to the surface side terminal, wherein at least one of the first surface side pad and the second surface side pad is provided.
Some are made of soft metal and have a height greater than their maximum diameter.
Is fixed is higher substantially columnar columnar metal body, the first face-side terminal and at least one of the second face-side terminals, made of soft metal, rather high height than its maximum diameter,
Follows the warpage of the IC mounting board by expanding and contracting in the thickness direction
A relay board characterized by being substantially columnar. 2. The relay board according to claim 1, wherein at least the first surface side terminal is made of a soft metal and has a substantially columnar shape having a height higher than a maximum diameter thereof. Relay board. 3. A relay board according to claim 1 or claim 2, the at least first surface side terminals, the connection between the connection pads of the IC mounting substrate, the solid phase point of the soft metal A relay board, comprising: a first solder layer made of a first solder that can be soldered at a lower temperature than the first solder paste layer including the first solder. A relay substrate according to any one of claims 4] claims 1 to 3, and the IC mounting substrate comprises a first solder capable soldering at a temperature lower than the solid phase point of the soft metal, the A first solder layer for connecting a first surface side terminal of the relay substrate and a connection pad of the IC mounting substrate; and a connection body between the IC mounting substrate and the relay substrate, comprising: 5. A relay board according to any one of claims 1 to 3, wherein the IC mounting a substrate, the a mounting substrate, wherein the solderable first at a lower temperature than the solid phase point of the soft metal A first solder layer that is made of solder and connects the first surface side terminal of the relay board to the connection pad of the IC mounting board; and a second solder that can be soldered at a temperature lower than the solid point of the soft metal. And a second solder layer for connecting the second surface side terminal of the relay board to the mounting pad of the mounting board. A structure comprising an IC mounting board, a relay board, and a mounting board. 6. A resin having a substantially plate shape having a main surface and a back surface.
An IC mounting substrate body made of a material including the above, an integrated circuit chip mounted on the main surface side, and at least the integrated circuit chip on the back surface side
Mounting board provided with connection pads formed at predetermined positions, the IC mounting board, a mounting board body, and the mounting board body
Of the main surface corresponds to the connection pad of the IC mounting board.
And a mounting board having a mounting pad formed at the position.
Interposed therebetween, and connected to the connection pad on the first surface side,
By connecting to the mounting pad on the second surface side,
Relay for connecting the IC mounting board and the mounting board
A substrate, made of a material including a resin, having the first surface and the second surface.
A relay board main body having a substantially plate shape, a first surface side terminal formed on the first surface side, and a position corresponding to the first surface side terminal on the second surface side.
Second surface side end electrically connected to first surface side terminal
It has a child, and at least one of the first face-side terminal and the second face-side terminal
Is made of soft metal and has a height higher than its maximum diameter,
Follows the warpage of the IC mounting board by expanding and contracting in the thickness direction
A relay substrate having a substantially columnar shape, and a second solderable lower temperature than the solid point of the soft metal.
1 solder, the first surface side terminal of the relay board and the
First solder layer for connecting to a connection pad of an IC mounting board
And a connection body between the IC mounting board and the relay board. 7. An IC mounting board and a relay board according to claim 6.
A connection member, the connecting board is penetrating between the first surface and the second surface
With a through hole, the soft metal body inserted and fixed in the through hole,
It is characterized in that it comprises a first surface side terminal and a second surface side terminal.
A connection body between an IC mounting board and a relay board. 8. An IC mounting board and a relay board according to claim 7.
A connection body of the first surface side end and the second surface side end of the through hole,
The opening that opens on the surface on which the substantially columnar terminal is formed.
The opening diameter at the end of the through hole is larger than the inside of the through hole.
IC mounting board and relay board
Connected body. 9. A resin having a substantially plate shape having a main surface and a back surface,
An IC mounting substrate body made of a material including the above, an integrated circuit chip mounted on the main surface side, and at least the integrated circuit chip on the back surface side
A connection pad formed at a position, and the IC mounting substrate and a mounting substrate body, connecting paths of the IC mounting board of the main surface of the mounting substrate body
A mounting board provided with a mounting pad formed at a position corresponding to the pad, and interposed between the mounting board and the connection pad on the first surface side.
To be connected to the mounting pad on the second side.
Connecting the IC mounting board to the mounting board.
And a relay board made of a material including a resin and having the first surface and the second surface.
A relay board main body having a substantially plate shape, a first surface side terminal formed on the first surface side, and a position corresponding to the first surface side terminal on the second surface side.
Second surface side end electrically connected to first surface side terminal
It has a child, and at least one of the first face-side terminal and the second face-side terminal
Is Ri Do from soft metal, high height than its maximum diameter,
Follows the warpage of the IC mounting board by expanding and contracting in the thickness direction
A relay substrate having a substantially columnar shape, and a second solderable lower temperature than the solid point of the soft metal.
1 solder, the first surface side terminal of the relay board and the
First solder layer for connecting to a connection pad of an IC mounting board
And a solderable lower temperature than the solidus point of the soft metal.
2 solder, the second side terminal of the relay board and the
A second solder layer connecting the mounting pads of the mounting board; an IC mounting board including a relay board and a mounting board;
Structure. 10. An IC mounting board according to claim 9 and a relay base.
A structure comprising a plate and a mounting board, wherein the relay board main body penetrates between a first surface and a second surface.
With a through hole, the soft metal body inserted and fixed in the through hole,
It is characterized in that it comprises a first surface side terminal and a second surface side terminal.
Structure consisting of IC mounting board, relay board and mounting board
Structure. 11. An IC mounting board according to claim 10 and a relay.
A structure comprising a board and a mounting board, wherein the through hole has a first surface side end and a second surface side end,
The opening that opens on the surface on which the substantially columnar terminal is formed.
The opening diameter at the end of the through hole is larger than the inside of the through hole.
IC mounting board and relay board,
A structure consisting of a mounting board.