JP3076793B2 - Disc substrate bonding method and apparatus therefor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technology for laminating disk substrates,
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for laminating two disk substrates together and an apparatus for achieving the method, and an apparatus for laminating an adhesive sheet body to a disk substrate.

[0002]

2. Description of the Related Art In recent years, computers, especially personal computers, etc., have become remarkably widespread, and storage media used for them, particularly storage disks, have been increasing in density and type. As the storage disk, for example, a magnetic disk, an optical disk (for example, CD-RO
M), a magneto-optical disk (for example, MO) and the like. Among them, the demand for optical disks has recently been increasing.

[0003] In the case of an optical disk called a DVD as an example, it is standardized that a single disk substrate constituting the DVD has a thickness of 0.6 mm, an outer diameter of 120 mm, and an inner diameter of a center hole of 15 mm. In such a thin disk substrate, disk substrates having the same thickness (0.6 mm) are combined and bonded in view of low mechanical strength and easy deformation and storage capacity. As described above, in general, high-density optical disks, including DVDs, are often used not as a single plate but as a plywood structure as described above. Of course is necessary.

[0004] In order to form an integrated optical disk by laminating single plates, the following series of steps are performed (see FIG. 22). (1) Step of mounting lower disk substrate D1 on mounting table 2A (2) Step of applying adhesive R made of ultraviolet curable resin to lower disk substrate D1 (3) Upper disk substrate D2 on lower disk substrate D1 (4) Rotating the mounting table 2A to rotate both disk substrates D1 and D
(5) A step of irradiating ultraviolet rays to the spread adhesive R made of an ultraviolet curable resin to cure the adhesive R interposed therebetween. Disk substrates D
1 and D2 are bonded to each other to form a single integrated optical disk.

[0005] By the way, such a bonding method is as follows.
Since the adhesive is spread over a wide area by rotating the mounting table, the adhesive is scattered outward by centrifugal force. For this reason, the surroundings are contaminated by the scattering, and the adhesive is dissipated, thereby lowering the effective use rate. Further, the thickness of the spread adhesive layer may not always be uniform. Further, since a step of irradiating ultraviolet rays is required to cure the adhesive, the number of manufacturing steps is increased and the manufacturing cost is increased. Therefore, a bonding method that does not require the adhesive spreading step as described above, that is, a bonding method using an adhesive is being studied.

In this bonding method using an adhesive, an adhesive is attached to one of two disk substrates to be bonded, and then the other disk substrate is overlaid and bonded. . Generally, the pressure-sensitive adhesive is used in a state of being attached to a sheet serving as a base material. In this case, the sheet-shaped pressure-sensitive adhesive applied to the sheet base material is peeled off one by one by hand, and the lower disk is removed. Reattaching (transferring) onto the substrate is extremely inefficient in bonding the disk substrates.

In addition, manual air bubbles tend to enter manually between the adhesive and the lower disk substrate. Furthermore, the work of attaching an adhesive to the surface of such a disk substrate is incorporated into the bonding line of the disk substrate, and the adhesive bonding operation is performed in order to configure a series of bonding lines that are sequence-controlled as a whole. Must be automated. That is, in order to form a continuous bonding line, it is an essential condition to automate the operation of attaching the adhesive to the disk substrate.

[0008]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems. That is, an object of the present invention is to provide an extremely efficient continuous bonding method in which the application of an adhesive on a disk substrate is automated, and an apparatus therefor. Still another object is to provide a bonding method in which air is not mixed when applying such an adhesive, and an apparatus therefor.

[0009]

Means for Solving the Problems The present inventors have conducted intensive studies on such problems, and as a result,
Peeling off the release paper from the pressure-sensitive adhesive sheet body, it has been found that the pressure-sensitive adhesive can be continuously applied by pressing against the lower disk substrate with the pressure-sensitive adhesive attached downward,
Based on this finding, the present invention has been completed.

[0010]

That is, the present invention provides (1) the following 1) to
6) A method for laminating disk substrates, comprising the step of: 1) a step of peeling release paper from the adhesive sheet body; 2) a step of positioning the adhesive portion of the adhesive sheet body above the lower disk substrate using a positioning member; 3) a bonding member from one end of the lower disk substrate. A step of pressing the pressure-sensitive adhesive sheet body from which the release paper has been peeled off to cause the pressure-sensitive adhesive on the lower surface to adhere (transfer) to the surface of the lower disk substrate by moving to the other end; 4) a lower disk using a peeling member; 5) a step of placing the upper disk substrate on the lower disk substrate, 6) pressing the upper disk substrate against the lower disk substrate, and integrating the two. Process of pasting on

(2) The method of ( 1 ), wherein the method further comprises the step of collecting the release paper.

(3) The method of the above ( 2 ), wherein the recovery of the release paper is performed using an adhesive and an adhesive tape having an adhesive force to the release paper which is larger than the adhesive force of the release paper. Exists.

(4) In the above (1) , the step 2 is a method of laminating a disk substrate performed in a state where a low tension is applied to the pressure-sensitive adhesive sheet.

[0015] and also in (5) above (1), step 2, the disk substrate of the above (1) to be performed by inserting the tip of the centering shaft is positioning member into the hole of the adhesive sheet body It depends on the bonding method.

[0016] (6) In the above (1) , the present invention resides in a method of laminating a disk substrate in which the pressure-sensitive adhesive sheet is slightly inclined with respect to the lower disk substrate in step 2.

(7) In the above (1) , the present invention resides in the method of laminating a disk substrate, wherein the laminating member in step 3 is a laminating roller which rolls.

(8) In the above (1) , the step 4 is a method of laminating a disk substrate, wherein the peeling is performed by a peeling member which moves transversely above the lower disk substrate.

(9) The adhesive sheet is peeled off by a peeling member while supporting the pressure-sensitive adhesive sheet with a slight gap in a state of not contacting the disk substrate.
The method (8) includes a method of attaching a disk substrate.

(10) The method for laminating a disk substrate according to the above (8) , wherein the peeling member has a bifurcated support and the adhesive sheet is stretched between the two support rods. Exist.

(11) The peeling member is the method of laminating a disk substrate according to the above (8) , wherein the adhesive sheet is peeled off at an acute guide angle with respect to the lower disk substrate.

(11) The following 1) to 6)
In the method of laminating the disk substrates. 1) a step of peeling the release paper from the adhesive sheet body; 2) a step of positioning the adhesive portion of the adhesive sheet body above the lower disk substrate by inserting the tip of a positioning member into a hole of the adhesive sheet body; By moving the moving laminating roller from one end of the lower disk substrate to the other end, the pressure-sensitive adhesive sheet body from which the release paper has been peeled is pressed, and the adhesive on the lower surface is attached (transferred) to the surface of the lower disk substrate. 4) The peeling member supports the pressure-sensitive adhesive sheet body with a slight gap in a state where the pressure-sensitive adhesive sheet body is not in contact with the disk substrate, and moves transversely to peel off the pressure-sensitive adhesive sheet body and adheres to the lower disk substrate. 5) a step of placing the upper disk substrate on the lower disk substrate, 6) pressing the upper disk substrate against the lower disk substrate, and Step of attaching to,

(13) The lower disk substrate D
1, a supporting member (tension roller) 5A, 5B for stretching the adhesive sheet S at a predetermined distance above the receiving table, and a centering shaft 3 for positioning the adhesive sheet S. A laminating roller 1 for pressing the pressure-sensitive adhesive sheet S against the lower disk substrate D1 while moving the adhesive sheet body S from one end to the other end of the lower disk substrate D1 placed on the receiving table 2, and a lower disk substrate The adhesive sheet S attached to D1 is peeled off from the lower disk substrate.

Also, (14) the centering shaft 3
Are the second small diameter portion 32 inserted into the boss arrangement hole 21 of the receiving stand 2 and the first small diameter portion 31 inserted into the hole P of the adhesive sheet body.
And the large-diameter portion 33 in contact with the back surface of the pressure-sensitive adhesive sheet body.

(15) The peeling member 4
Is a pressure-sensitive adhesive sheet for the disk substrate of the above (13), which comprises a base 41 which performs lateral movement and rotation, and a leading support rod 43 and an angle control support rod 42 provided at a fixed distance from the center of the base 41. It exists in the body S bonding apparatus.

(16) The peeling member 4
The angle regulation支杆42, bonding of the adhesive sheet body S relative to the disk substrate of the (15) having an acute angle portion 42A going peeled adhesive sheet body S at an acute guiding angle α with respect to the lower disc substrate D1 Exists in the device.

[0027]

By adopting the above-mentioned bonding method, the adhesive can be continuously and automatically applied to the lower disk substrate, and efficient bonding can be performed. Also, bonding without generating bubbles can be performed.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the method of bonding an adhesive S2 according to the present invention, steps until the adhesive S2 is attached to a disk substrate will be described with reference to FIGS. First, the pressure-sensitive adhesive sheet S prepared for carrying out the present invention will be described. The pressure-sensitive adhesive sheet S has a long carrier S1 serving as a base, a pressure-sensitive adhesive S2 adhered to the carrier (made of thin synthetic resin tape such as polyethylene), and a surface of the pressure-sensitive adhesive S2. Release paper S temporarily attached
3 (see FIG. 1).

FIG. 20 (A) is a front view of the pressure-sensitive adhesive sheet S, FIG. 20 (B) is a side view, and FIG. 20 (C) is a side view with the release paper S3 removed. As will be described later, the pressure-sensitive adhesive S2 serves as an adhesion medium for joining the disk substrates together, and is in the form of an LP board (or donut) sheet (see FIG. 21A). ), A large number of them are attached to the surface of the long carrier S1 at regular intervals. Examples of the adhesive S2 include a rubber-based adhesive, an acrylic-based adhesive, a silicone-based adhesive,
A pressure-sensitive adhesive such as a vinyl adhesive is used.

The thickness of the adhesive S2 can be selected to be optimal depending on the type of optical disk to be designed. The release paper S3 is temporarily attached to the surface of the adhesive S2 to cover the surface, and has the same shape as the adhesive S2 (see FIG. 21B).

When the pressure-sensitive adhesive sheet S is manufactured, a hole P which penetrates the carrier S1, the pressure-sensitive adhesive S2, and the release paper S3 at the same time is provided. Cradle 2 using a certain centering shaft
It is used at the time of positioning with respect to. The adhesive sheet S supplied between the laminating roller 1 and the receiving table 2 is in a state where the release paper S3 has been removed from the adhesive sheet S.

Next, a series of flows in which the adhesive S2 is attached to the lower disk substrate D1 will be described. FIG. 1 shows a method of attaching the pressure-sensitive adhesive S2 and a device for bonding the pressure-sensitive adhesive sheet S. First, as shown in the figure, the pressure-sensitive adhesive sheet S is released from the supply roller 8 and fed out. After being fed out, for example, the cleaning roller 7 removes attached matter such as dust on the surface. Thereafter, the paper is sent to the tension roller 5A through the pitch feed roller 6. The pressure-sensitive adhesive sheet S that has passed through the tension roller 5A is then passed to the downstream tension roller 5B through a space between the receiving table 2 and the bonding roller 1 as a bonding member. here,
The cradle is installed on the rotary table T, and has been transferred to immediately below the centering shaft 3 in advance by the rotational movement of the rotary table.

The lower disk substrate D1 has already been placed on the receiving table 2. The pressure-sensitive adhesive sheet body S receives a pressing force between the receiving base 2 and the laminating roller 1 and, as will be described later, is supported by a tension roller 5A and a tension roller 5B which are supporting members. The adhesive S2 is applied to the surface of the lower disk substrate D1 placed on
Will be attached. After the adhesion of the adhesive S2 is completed, the adhesive sheet S is sent to the delivery roller 11 through the tension roller 5B. Delivery roller 1
1 can move the pressure-sensitive adhesive sheet S when necessary by actively driving it. The pressure-sensitive adhesive sheet S sent from the delivery roller 11 is taken up by a take-up roller 13 via a suspension roller 12.

The suspension roller 12 is suspended from the adhesive sheet S, and descends when the adhesive sheet S is sent out from the delivery roller 11. The lowered position is read by the detector 12A, and the winding roller 12 is rotated by a detection signal to wind a predetermined amount. In the flow described above, the adhesive S2 is removed from the lower disk substrate D1.
Will be adhered to.

The pressure-sensitive adhesive sheet S is supplied between the cradle 2 and the bonding roller 1 in a state where the pressure-sensitive adhesive S2 is exposed to the lower side and the release paper S3 is removed from the surface. Has already been mentioned. As described above, the adhesive tape L is used as a means for removing the release paper S3 from the adhesive sheet S. Referring to the role of the adhesive tape L, as shown in FIG. 1, the adhesive sheet S initially fed from the supply roller 8 has an adhesive S2 attached to the lower surface, and the adhesive S2 Is in a state where the release paper S3 is applied.

On the other hand, the adhesive tape L supplied from the supply roller 9 has the adhesive application surface facing the back side (ie, facing the upper surface), and
The adhesive-applied surface comes into contact with the release paper S3 of the pressure-sensitive adhesive sheet S. Thereafter, the adhesive tape L and the pressure-sensitive adhesive sheet S are pressed against each other by passing through the guide roller 81, the cleaning roller 7, the pitch feed roller 6, the tension roller 5A, and the like. As a result, the adhesive-applied surface of the adhesive tape L adheres to the release paper S3 of the pressure-sensitive adhesive sheet S.

After passing through the tension roller 5A, the release sheet S is separated from the adhesive sheet S by the adhesive force of the adhesive tape L.
3 is peeled off. Then, the adhesive tape L that has received the release paper S3 is taken up by the take-up roller 10, so that the release paper S3 is collected. Thus, the release paper S
3 is separated from the pressure-sensitive adhesive sheet S by using the adhesive tape L, and is collected by the release paper S3 and the pressure-sensitive adhesive S.
The condition is that the adhesive force between the adhesive tape L and the release paper S3 is larger than the adhesive force between the adhesive tape L and the release paper S3.

That is, the adhesive tape L needs to have an adhesive strength to the release paper that is greater than the peel strength of the release paper to the adhesive. In this manner, the adhesive sheet S supplied between the receiving table 2 and the bonding roller 1 through the tension roller 5A has the release paper S3 removed by the adhesive tape L and the adhesive S2 is exposed on the lower surface. State. Here, when the laminating roller 1 which is a laminating member having an important function in the present invention is briefly mentioned, the laminating roller 1 presses the pressure-sensitive adhesive sheet S against the lower disk substrate D1 to specifically laminate. It has a function to perform.

For this reason, the bonding roller 1 has an outer peripheral portion formed of a layer of a flexible material, and a heater is incorporated in the inside to enable overall heating adjustment. Is preferred. The width of the laminating roller 1 is designed to be somewhat wider than the lower disk substrate D1. The laminating roller 1 can translate while being rolled while being pressed on the lower disk substrate D1 by a driving device (not shown), and laminating the adhesive sheet S on the entire surface of the lower disk substrate. After the
It returns from the lower disk substrate D1 to its original position.

The pressure-sensitive adhesive sheet S has an LP on its lower surface.
In a state where the pressure-sensitive adhesive S2 in the form of a board (a donut) is exposed, the pressure-sensitive adhesive S2 is supported between the tension roller 5A and the tension roller 5B disposed upstream and downstream of the receiving table 2 and the laminating roller 1. At this time, if the lower end of the upstream tension roller 5A is slightly higher than the lower end of the downstream tension roller 5B, the lamination can be performed better as described later. This is also a technically important part. When the pressure-sensitive adhesive sheet S is transferred, the pressure-sensitive adhesive sheet S supported by the two tension rollers 5A and 5B is set.
As shown in FIG. 1, a constant tension is applied to the adhesive sheet S by the driving of the feed roller 11, and the pressure-sensitive adhesive sheet S is fed in a tensioned state. Next, when the adhesive sheet body S stops,
The tension roller 5B on the downstream side slightly moves, so that the pressure-sensitive adhesive sheet S is in a state where almost no tension is applied (initial state).

Next, as shown in FIG. 3, the centering shaft 3, which is a positioning member, is lowered, and the projecting portions (first small diameter portion 31, second small diameter portion 32) provided at the tip end thereof. The positioning of the pressure-sensitive adhesive sheet S with respect to the lower disk substrate D1 (specifically, of the pressure-sensitive adhesive portion) is performed. by the way,
At the moment when the centering shaft 3 is lowered and the protruding portion thereof enters the hole P of the pressure-sensitive adhesive sheet S, the tension roller 5A on the upstream side is slightly retracted to slightly apply tension to the pressure-sensitive adhesive sheet S. At this time, the tension roller 3B on the downstream side remains unchanged.

By applying a slight tension to the pressure-sensitive adhesive sheet S in this manner, the pressure-sensitive adhesive sheet S is stabilized without any swinging motion. Can be inserted into the hole P. To make sure, the positioning by the centering shaft 3 will be further described. First, when the centering shaft 3 is lowered, the projecting portion (the small-diameter portion 31) provided at the lower end of the large-diameter portion 33 becomes a hole of the adhesive sheet S. P, and a second small diameter portion which is a part of the protruding portion is fitted into the boss arrangement hole 21 of the receiving base 2 (see FIG. 10A). At this time, the adhesive sheet S is concentric with the lower disk substrate D1.

That is, the first end of the centering shaft 3
The small-diameter portion 31 is inserted into the hole P of the adhesive sheet S, and the second small-diameter portion 32 having a smaller diameter is further inserted into the lower disk substrate D1.
Is inserted into the center hole H and fitted into the boss arrangement hole 21. Therefore, the pressure-sensitive adhesive sheet S and the lower disk substrate D1 are positioned concentrically. At this time, since the pressure-sensitive adhesive sheet S is tensed, the first small diameter portion 31 of the protruding portion is formed.
And is in contact with the lower surface of the large diameter portion 33.

Therefore, the pressure-sensitive adhesive portion of the pressure-sensitive adhesive sheet S is accurately positioned directly above the lower disk substrate D1 without contacting the surface of the disk substrate D1. At this time, suction is performed through a small hole (not shown) provided in the receiving table 2, and the lower disk substrate D 1 is suction-held so as not to move while being positioned on the receiving table 2. The upstream tension roller 5A and the downstream tension roller 5
When the pressure-sensitive adhesive sheet body S is arranged with a slight inclination due to the vertical positional relationship with the pressure-sensitive adhesive sheet B, the first small-diameter portion 31 at the tip end of the centering shaft 3 becomes tight because the pressure-sensitive adhesive sheet body S is inclined in an inclined manner. Hole P facilitates entry.

The boss mounting hole 2 provided in the receiving table 2
In the first embodiment, a boss (not shown) is provided so as to be vertically slidable. Therefore, when the lower disk substrate D1 is placed on the receiving table 2 in a pre-process (not shown), the boss body protrudes from the mounting hole 21 on the receiving table, and the lower disk substrate D1 is placed on the receiving table. Preliminary positioning is performed. Further, after the lower disk substrate D1 is placed on the pedestal 2, the boss body is retracted into the boss arrangement hole 21 and stands by, so that the sticking operation of the adhesive sheet S on the pedestal is obstructed. I will not do it.

Next, the laminating roller 1 which has been waiting above is lowered, and the positioned lower disk substrate D1 is positioned.
(See FIG. 4). At this point, the role of the centering shaft 3 ends, so that the shaft 3 quickly ascends and returns to the original position (see FIG. 5).

Next, as shown in FIG. 6, the laminating roller 1 rolls on the lower disk substrate D1 (specifically, on the adhesive sheet S on the lower disk substrate) in the direction of the arrow in the figure. . Due to this rolling operation, the pressure-sensitive adhesive sheet S is pressed against the lower disk substrate D1, and the contact area between the two gradually increases. Finally, when the bonding roller 1 has passed the other end of the lower disk substrate D1, the adhesive sheet S
Is completely stuck on the entire surface of the lower disk substrate D1. The pressure-sensitive adhesive sheet S
Is adhered (so-called transfer) to the surface of the lower disk substrate D1 in a state where air bubbles and the like are not mixed in and a state where no wrinkles are generated.

Here, the operation of the centering shaft 3 and the bonding roller 1 will be described in more detail. FIG. 10 is a diagram illustrating the operation. As shown in FIG. 10A, in a state where the pressure-sensitive adhesive sheet S is positioned, the centering shaft 3
The protrusion (the second small-diameter portion 32) of the
The adhesive sheet body is located at the upper end of the first small diameter portion 31 of the protruding portion. That is, the pressure-sensitive adhesive sheet S comes into contact with the large-diameter portion 33 of the centering shaft 3. Also, as described above, since the adhesive sheet S is slightly tensioned, the adhesive sheet S does not come into contact with the surface of the disk substrate D1.

Next, as shown in FIG. 10B, the laminating roller 1 descends and grounds to one end of the lower disk substrate D1. At this time, a part of the pressure-sensitive adhesive sheet S is pressed against the end of the lower disk substrate D1. At this point, since the positioning by the centering shaft 3 has been completed, the function of the centering shaft 3 ends. Immediately lower disk substrate D1
Leave.

Next, as shown in FIG. 10C, the bonding roller 1 rolls on the lower disk substrate D1 while pressing the pressure-sensitive adhesive sheet against the lower disk substrate D1. Then, the LP disk type (or donut type) sheet-like adhesive S2 is attached to the lower disk substrate D1 such that the attachment area gradually increases from one end to the other end. At this time, since the pressure-sensitive adhesive sheet S is sequentially pressed so as to remove air in an inclined state, no air bubbles or the like enter between the pressure-sensitive adhesive S2 and the lower disk substrate D1, and wrinkles are not generated. Does not arise. As a result, the adhesive S2 is applied to the lower disk substrate D
1 is uniformly attached to the surface. The above is the description of the operation.

Next, returning to FIG. 7, the adhesion of the pressure-sensitive adhesive sheet S to the disk substrate D1 is completely completed, and as shown in FIG. Return to the position indicated by the dotted line). At this time, the adhesive S2
Is a state in which the adhesive S2 is attached to both the carrier S1 of the adhesive sheet S and the lower disk substrate D1 on both surfaces of the adhesive sheet S and the lower disk substrate D1. .

Next, as shown in FIG. 8, the peeling member 4, which is a peeling member located downstream of the receiving table 2,
It moves so as to cross over the lower disk substrate D1 placed on the receiving table 2. Since the adhesive force between the surface of the lower disk substrate D1 and the adhesive S2 is larger than the adhesive force between the carrier S1 and the adhesive S2, such movement of the release member 4 causes the adhesive sheet S and the adhesive S2 (in detail, Carrier S
1 and the adhesive S2) are surely peeled off.
In addition, the lower disk substrate D1 is, as described above,
, The peeling is performed accurately.

When the peeling member 4 has finished traversing, the adhesive sheet S is peeled off from the lower disk substrate D1 (specifically, the adhesive S2 on the lower disk substrate) and becomes free. The function of the peeling member 4 will be described here. The peeling member 4 includes a base 4 that rotates (rotates).
1 and two supporting rods (leading supporting rod 43 and angle restricting supporting rod 42) fixed thereto, so that reciprocating movement can be performed across the pedestal 2. ing.

Of these two supports, the angle regulating support 42
Is, for example, a rod having a substantially fan-shaped cross section, and the leading support rod 43 is a rod having a small circular cross section. Note that the fan-shaped arc does not always match the shape formed corresponding to the length of the radius portion. The leading support rod 43 and the angle regulating support rod 42 are
It is provided at a position separated by a certain distance from the center of 1. The angle regulating support rod 42 is used to move the adhesive sheet S to the lower disk substrate D.
It is supported in a state in which a slight gap is maintained without contacting the first member. The angle regulating support 42 has an acute angle portion 42A for peeling off the adhesive sheet S while maintaining a guide angle α of an acute angle (90 degrees or less) with respect to the lower disk substrate D1. The shape of the angle restricting support rod 42 is not limited as long as it has the acute angle portion 42A.

To peel off the adhesive sheet S from the lower disk substrate D1, first, as shown in FIG. 11, the adhesive sheet S is interposed between the angle regulating support rod 42 and the leading rod 43 (see FIG. 11). 11A), the peeling member 4 is rotated by about 180 degrees to form the adhesive sheet S in an inverted Z-shape (FIG. 11).
B). The leading support rod 43 may be rotated slightly over to a position where the acute angle portion 42A of the angle regulating support rod 42 can maintain the guide angle α. At this time, the pressure-sensitive adhesive sheet S is in a state of being stretched between the angle regulating support rod 42 and the leading rod 43.

Next, when the peeling member 4 is translated so as to cross over the receiving table 2, the angle regulating support rod 4 of the peeling member 4 is moved.
Reference numeral 2 denotes a support for supporting the pressure-sensitive adhesive sheet body with a slight gap in a state in which the pressure-sensitive adhesive sheet is not in contact with the lower disk substrate D1;
3 acts to pull up and move across. In this case, the adhesive sheet S is peeled off from the surface of the lower disk substrate D1 at an acute angle by the slope U of the angle regulating support rod 42 (see FIG. 11C). Here, the shape of the angle restricting support rod 42 is not limited as long as it has an acute angle portion 42A.
Shows a modified example of the angle regulating support rod 42.

FIG. 12 shows the angle regulating support rod 42 and the leading rod 43.
(A) is a simplified front view, and (B) is a simplified side view. FIG. 13 shows that the peeling member 4 rotates and the adhesive sheet S
Schematically show a state formed in an inverted Z-shape, (A) shows a simplified front view, and (B) shows a simplified side view. In this example, the angle regulating support rod 42 has an acute angle portion 42A and is formed in a triangular cross section.

Here, if the guide angle α of the pressure-sensitive adhesive sheet S is an acute angle as shown in FIG.
Is uniformly peeled off without adhering to the carrier S1 of the adhesive sheet S. For example, when the guide angle α is an obtuse angle (90 degrees or more), a part of the adhesive S2 often adheres to the carrier S1 of the adhesive sheet S together. The present inventors have confirmed through experiments that the peeling is performed extremely smoothly.

After the adhesive sheet S is peeled off from the lower disk substrate D1, the rotary table T on which the receiving table 2 is mounted is rotated, and the receiving table 2 is immediately transferred to the next station. That is, the release paper S described so far.
The second station is transferred from the first station X, which is a station to which the second station is assigned (see FIG. 14). Then, the peeling member 4
Returns to the original position, and is in the initial state as shown in FIG.
Thus, the step of applying the adhesive S2 to the lower disk substrate D1 is completed. As a result, as shown in FIG. 15, the adhesive S2 is uniformly applied on the upper disk substrate D2.

Thereafter, in the second station, another upper disk substrate D2 is placed on the lower disk substrate D1 to which the adhesive S2 has been applied (see FIG. 16).
Since the two disk substrates D1 and D2 placed one on top of the other have not yet been subjected to the pressing action, they are not firmly bonded. Therefore, it is moved to the third station Z (see FIG. 14), and the two disk substrates D1 and D2 are pressed and completely adhered.

FIG. 17 shows a state where the two disk substrates D1 and D2 placed on the pedestal 2 are pressed against each other by the pressing member 100 (in this example, the pedestal is raised). . The pressing member 100 used here is formed in a substantially hemispherical shape by a flexible material. The two disk substrates D1 and D2 thus placed one above the other
However, by receiving a pressing force between the pressing member 100 and the receiving base 2, the two disk substrates are strongly adhered to each other.

Here, the laminating roller 1 can be pressed against the upper disk substrate D2 such that the contact portion is gradually expanded outward (in the radial direction) from the center portion. For this reason, the upper disk substrate D2 gradually contacts outward (in the radial direction) from the central portion and contacts (presses) with the lower disk substrate.
Is pressed so as to expand, and no air bubbles or the like are included between the two disk substrates. Thus, the bonding of the two disk substrates is completed, and a high-quality optical disk D is completed (see FIG. 18).

FIG. 19 is a block diagram showing main laminating steps (steps 1 to 6) of a disk substrate for reference.

Although the present invention has been described above, the present invention is not limited to the embodiment, and it goes without saying that various other modifications can be made without departing from the essence of the present invention. Absent. The specific means used in the method of bonding the disk substrates according to the present invention is not limited to the illustrated one.

For example, the structure of the laminating roller used in the present invention can be applied without a heating means inside. The direction of movement of the laminating roller for pressing the pressure-sensitive adhesive sheet body against the disk substrate can be changed from right to left or left to right in FIG.
Either right or both.

[0066]

The pressure-sensitive adhesive separated from the pressure-sensitive adhesive sheet is
It is uniformly attached to the surface of the lower disk substrate without containing air bubbles or the like and without wrinkles. Unlike the case of bonding using a conventional ultraviolet curable resin, the step of spreading the adhesive and the step of irradiating ultraviolet light are not required, and the number of manufacturing steps is reduced. When the optical disc is completed only by changing the thickness of the pressure-sensitive adhesive attached to the pressure-sensitive adhesive sheet, the thickness of the intermediate layer (pressure-sensitive adhesive layer) between the two disk substrates can be easily changed. The application of the adhesive on the disk substrate was automated, and an extremely efficient continuous bonding method became possible.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a method of applying an adhesive when a disk substrate is bonded.

FIG. 2 is a diagram illustrating a method of applying an adhesive (initial state).

FIG. 3 is a diagram showing a method of applying an adhesive (at the time of positioning).

FIG. 4 is a diagram illustrating a method of applying an adhesive (when a bonding roller is grounded).

FIG. 5 is a diagram illustrating a method of applying an adhesive (when the centering roller is separated).

FIG. 6 is a diagram illustrating a method of applying an adhesive (when a laminating roller is moved).

FIG. 7 is a diagram illustrating a method of applying an adhesive (when a laminating roller is separated).

FIG. 8 is a diagram illustrating a method of applying a pressure-sensitive adhesive (at the time of starting operation of a peeling member).

FIG. 9 is a diagram illustrating a method of applying an adhesive (at the end of the operation of a peeling member).

FIG. 10 is a diagram illustrating the operation of a centering shaft and a laminating roller. (A) is for positioning, (B)
Indicates the time when the bonding roller is grounded, and (C) indicates when the bonding roller is moving.

FIG. 11 is a view showing an operation of a peeling member;
(A) shows a state before the adhesive sheet is stretched, (B) shows a state after the adhesive sheet is stretched, and (C) shows a state of being separated by the adhesive sheet.

FIG. 12 schematically shows a state in which an adhesive sheet is interposed between an angle regulating support rod and a leading rod, and FIG.
Shows a simplified front view, and (B) shows a simplified side view.

FIGS. 13A and 13B schematically show a state in which a peeling member is rotated to form an adhesive sheet body in an inverted Z-shape. FIG. 13A is a simplified front view, and FIG. 13B is a simplified side view. Is shown.

FIG. 14 is a diagram illustrating positions of respective stations.

FIGS. 15A and 15B are views showing a lower disk substrate to which an adhesive is attached, wherein FIG. 15A is a side view and FIG. 15B is a plan view.

FIG. 16 shows a method in which another lower disk substrate is placed on an upper disk substrate placed on a receiving table.

FIG. 17 shows a state where two disk substrates placed on a receiving table receive a pressing force;

FIG. 18 shows an optical disk on which two upper disk substrates are bonded.

FIG. 19 is a block diagram showing steps of a method of attaching a disk substrate.

FIG. 20 is a view showing an adhesive sheet body;
(A) is a front view, (B) is a side view, and (C) is a side view with the release paper removed.

FIG. 21A is a diagram showing a shape of an adhesive, and FIG. 21B is a diagram showing a shape of a release paper.

FIG. 22 is a process schematic diagram showing a conventional bonding method using an adhesive.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Lamination roller (positioning member) 2 ... Receiving stand 21 ... Boss arrangement hole 3 ... Centering shaft 31 ... 1st small diameter part 32 ... 2nd small diameter part 4 ... Peeling member (peeling member) 41 ... Base 42 ... Angle regulating support rod 42A ... Acute angle part 43 ... Lead support rod 5 ... Tension roller 5A ... Upstream tension roller 5B ... Upstream tension roller 5A1 ... Stopper 6 ... Pitch feed roller 7 ... Cleaning roller 8 ... Discharge roller 81 ... Guide roller Reference Signs List 9 delivery roller 10 take-up roller 11 delivery roller 12 hanging roller 12A detector 13 take-up roller 100 pressure member S pressure-sensitive adhesive sheet S1 carrier S2 pressure-sensitive adhesive S3 release paper D Optical disk D1 Lower disk substrate D2 Upper disk substrate H Central hole L Adhesive tape R Adhesive (ultraviolet curable resin) ... turntable U ... slope P ... hole 2A ... loading table

Claims (16)

(57) [Claims] 1. A method for bonding a disk substrate, comprising the following steps 1) to 6). 1) a step of peeling release paper from the adhesive sheet body; 2) a step of positioning the adhesive portion of the adhesive sheet body above the lower disk substrate using a positioning member; 3) a bonding member from one end of the lower disk substrate. A step of pressing the pressure-sensitive adhesive sheet body from which the release paper has been peeled off to cause the pressure-sensitive adhesive on the lower surface to adhere (transfer) to the surface of the lower disk substrate by moving to the other end; 4) a lower disk using a peeling member; 5) a step of placing the upper disk substrate on the lower disk substrate, 6) pressing the upper disk substrate against the lower disk substrate, and integrating the two. Process of pasting on 2. The method according to claim 1 , further comprising a step of collecting the release paper. 3. The method according to claim 2 , wherein the recovery of the release paper is performed by using an adhesive tape having an adhesive force to the release paper which is larger than the adhesive force of the adhesive and the release paper. . 4. The method according to claim 1, wherein step 2 is performed with a low tension applied to the pressure-sensitive adhesive sheet. 5. The claim 1, wherein the step 2, characterized in that it is carried out by inserting the tip of the centering shaft is positioning member into the hole of the adhesive sheet body
Item 4. The method for bonding a disk substrate according to Item 1 . 6. The method according to claim 1 , wherein the pressure-sensitive adhesive sheet is disposed at a slight inclination with respect to the lower disk substrate in Step 2. 7. The method according to claim 1, wherein the laminating member in step 3 is a rolling laminating roller. 8. The method according to claim 1, wherein the step (4) is performed by a peeling member that moves transversely above the lower disk substrate. 9. The disk substrate bonding method according to claim 8 , wherein the peeling member peels off the pressure-sensitive adhesive sheet while supporting the pressure-sensitive adhesive sheet with a slight gap in a state of not contacting the disk substrate. 10. The method according to claim 8, wherein the peeling member has two supporting rods, and the adhesive sheet is stretched between the two supporting rods. 11. The method according to claim 8, wherein the peeling member peels the adhesive sheet at an acute guide angle with respect to the lower disk substrate. 12. A method for laminating a disk substrate, comprising the following steps 1) to 6). 1) a step of peeling the release paper from the adhesive sheet body; 2) a step of positioning the adhesive portion of the adhesive sheet body above the lower disk substrate by inserting the tip of a positioning member into a hole of the adhesive sheet body; By moving the moving laminating roller from one end of the lower disk substrate to the other end, the pressure-sensitive adhesive sheet body from which the release paper has been peeled is pressed, and the adhesive on the lower surface is attached (transferred) to the surface of the lower disk substrate. 4) The peeling member supports the pressure-sensitive adhesive sheet body with a slight gap in a state where the pressure-sensitive adhesive sheet body is not in contact with the disk substrate, and moves transversely to peel off the pressure-sensitive adhesive sheet body and adheres to the lower disk substrate. 5) a step of placing the upper disk substrate on the lower disk substrate, 6) pressing the upper disk substrate against the lower disk substrate, and Step of attaching to, 13. A receiving table 2 on which the lower disk substrate D1 is placed, and supporting members (tension rollers) 5A, 5B for stretching the adhesive sheet S at a predetermined distance above the receiving table.
And a centering shaft 3 for positioning the adhesive sheet S
And a bonding roller 1 for pressing the pressure-sensitive adhesive sheet S against the lower disk substrate D1 while moving from one end to the other end of the lower disk substrate D1 placed on the receiving table 2.
And a peeling member 4 for peeling off the pressure-sensitive adhesive sheet S attached to the lower disk substrate D1 from the lower disk substrate. 14. The centering shaft 3 includes a second small-diameter portion 32 inserted into the boss arrangement hole 21 of the receiving table 2, a first small-diameter portion 31 inserted into the hole P of the pressure-sensitive adhesive sheet body, and a pressure-sensitive adhesive sheet body. 14. The apparatus for bonding an adhesive sheet S to a disk substrate according to claim 13, further comprising a large-diameter portion 33 in contact with the back surface. 15. The peeling member 4 comprises a base 41 for performing lateral movement and rotation, and a leading support rod 43 and an angle control support rod 42 provided at a fixed distance from the center of the base 41. 14. The apparatus for bonding an adhesive sheet S to a disk substrate according to claim 13, wherein: 16. The angle regulating support rod 42 of the peeling member 4.
16. The apparatus for bonding the pressure-sensitive adhesive sheet S to the disk substrate according to claim 15 , wherein the pressure-sensitive adhesive sheet S has an acute angle portion 42A for peeling off the pressure-sensitive adhesive sheet S at an acute guide angle α with respect to the lower disk substrate D1. .