JP3071024U - Heat sink device - Google Patents

Abstract

(57) [Problem] To reduce heat generation of a chip due to an increase in the speed of a CPU of a personal computer, there is a need for a heat-sink device having a larger cooling capacity and a small size and light weight. SOLUTION: A plurality of fins 4 in a main body 1 are arranged so that an air flow path is substantially U-shaped, and an intake port 2 and an exhaust port 3 are provided.
A heat sink device having a high heat exchange efficiency, a large cooling capacity, a small size, and a light weight. [Effect] It has succeeded in miniaturization and weight reduction while having a cooling capacity far higher than the genuine product and the conventional product, and the memory slot and the like are not blocked.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention provides an air-cooled cooling device for cooling various components constituting hardware of a personal computer, especially a central processing unit (hereinafter referred to as a CPU) mainly called a so-called CPU or processor. The present invention relates to a heat sink device having a plurality of cooling fins for removing heat from a chip surface and dissipating the heat into the air.

[0002]

[Prior art]

 The various components that make up the hardware of a personal computer, especially the central processing unit called a CPU or a processor, are being reduced in size and integrated more rapidly, and the increase in the operation speed is also accelerated. Currently, nearly 10 million elements are integrated on a 1 cm square chip, and the operation speed has reached several hundred MHz (megahertz).

However, with the progress of integration and speeding up, heat generation of CPU chips has become a serious problem. In recent high-speed CPUs, even when the above-mentioned 1 cm square chip is operated at the rated operation speed, the temperature of the chip surface is close to 100 ° C. When the temperature of the chip rises, the correct operation of the CPU is adversely affected, and in severe cases, the operation of the CPU is stopped.

For this reason, in recent CPUs which are assumed to operate at a high speed, a cooling device for cooling a chip is mounted as a genuine product on a manufacturer side in advance and assembled on a motherboard. FIGS. 10a and 10b show an example of the genuine cooling device. An intake fan 23 composed of a motor portion 23a and a blade portion 23b is mounted on the front surface of a main body 20 having substantially the same size and shape as the CPU card 14. A cooling fin board 22 having a substantially rectangular front shape and projecting nine fins 22a, 22a... Is fixed to the front surface of the rear wall body 21. The power cord of the intake fan 23 is not shown in the figure.

The rear surface of the rear wall 21 is in close contact with the chip surface 14 a of the CPU card 14, and the heat radiated from the chip surface 14 a transfers the heat from the rear wall 21 to the fin board 22, the fins 22 a, 22 a. The fins 22a, 22a..., The fin board 22 are cooled, the rear wall 21 is cooled, and the chip surface 14a is dissipated by the flow of air transmitted and blown from the intake fan 23 (arrow K in FIG. 10a). Is cooled and cooled.

When the CPU is operated at the manufacturer's rated operating speed (referred to as clock frequency and expressed in units of megahertz), the correct operation of the CPU is guaranteed by the genuine cooling device described above. However, when trying to operate the CPU at a clock frequency higher than the manufacturer's rating, the genuine cooling device does not provide sufficient cooling and the CPU chip overheats, causing inaccurate operation. Will stop.

However, since the performance of a personal computer, particularly the operation speed, largely depends on the clock frequency of the CPU (the same CPU having a higher clock frequency has a higher operation speed), the CPU must be rated at a higher rate than the manufacturer's rating. Many users have attempted to operate at clock frequencies, and measures to prevent heating of the CPU chip have been a major problem for these users.

[0008] Therefore, various types of cooling devices having a cooling effect higher than those of genuine products have been manufactured and sold in response to the demands of the users, and most of them have been used in aluminum or copper heat sink devices. It has a configuration to attach more than two fans. FIG. 11 shows an example of such a cooling device, in which two intake fans 27 and 28 are arranged in parallel to increase the amount of air to be sucked in, and constitute a plurality of fins 26 for cooling the heat sink device main body 24. Each of the fins 26a, 26a,... Has a long leg and a large width, and a large number of the fins 26a protrude from the rear wall body 25. The power cords of the intake fans 27 and 28 are not shown.

The cooling device of FIG. 11 has improved cooling performance in each stage as compared with the genuine cooling device of FIGS. 10a and 10b, but was developed with the aim of further improving the cooling performance. This is the cooling device shown in FIG. In the cooling device, a cover 35 covers a main body 30 of a heat sink device in which a plurality of individual fins 32a, 32a,. Further, a configuration is adopted in which one intake fan 33 and one exhaust fan 34 are mounted on the left and right sides of the main body 30, respectively. The power cords of the intake fan 33 and the exhaust fan 34 are not shown.

[0010]

[Problems to be solved by the invention]

 The above three types of cooling devices had the following problems to be solved. That is, in all three types, the air flow paths inside the main bodies 20, 24, 30 are fins 22a, 22a, ... (Fig. 10a), individual fins 26a, 26a, ... (Fig. 11), individual fins 32a, (FIG. 12) are substantially parallel (arrow K in FIG. 10a, arrow L in FIG. 11, arrow M in FIG. 12), and the fins 22a, 22a..., The individual fins 26a, 26a,. The area where the cooling air collides with 32a, 32a,... Is small, so that the efficiency of heat dissipation is not significantly improved. In the apparatus shown in FIGS. 11 and 12, the length of the legs of the individual fins 26a, 26a,..., And the length of the individual fins 32a, 32a,. As a result, the whole device becomes large and heavy. This is the first problem.

In addition, a space between the three types of intake fans 23, 27, 28, 33 and the fins 22a, 22a,..., A plurality of fins 26, a plurality of fins 32, or an exhaust fan 34 and a plurality of Since a space between the fin 32 and the fin 32 is hardly taken, a so-called dead zone is formed immediately behind the fan motor (for example, 23a in FIG. 10) where cooling air is not applied. This is the second problem.

Further, in the above three types of devices, as shown in the schematic diagram of FIG. 6A, each of the fins 16 a protruding from the rear wall 15 is cut in a plane parallel to the rear wall 15. Although the cross-sectional shape is the same (substantially rectangular) in all portions as seen in FIGS. 6B, 6C and 6D, in this configuration, heat conduction from the root portion 16b of each fin 16a to the tip portion 16c is performed. Efficiency does not improve much. This is the third problem.

Further, in the cooling device shown in FIG. 11, the number of intake fans 27 and 28 is two, and in the cooling device shown in FIG. 12, an intake fan 33 and an exhaust fan 34 are mounted. The length of the legs of the individual fins 26a, 26a,..., And the individual fins 32a, 32a,... In the heat sink device main bodies 24, 30 is increased and the number thereof is increased. When the CPU card 14 equipped with the cooling device is mounted on a CPU slot (not shown) of a motherboard (not shown), the connection may become unstable due to its weight (for this reason, special mounting is required). May be used).

In the apparatus shown in FIG. 11, since two intake fans 27 and 28 protrude from the front side, a part of a memory slot (not shown) may be covered and hidden depending on the type of a motherboard (not shown). This results in restricting the addition of memory cards (not shown). Alternatively, in the apparatus shown in FIG. 12, an intake fan 33 projects on the left side and an exhaust fan 34 projects on the right side. Therefore, depending on the type of motherboard (not shown), the exhaust fan 34 may be a housing (not shown). As a result, a case may occur in which installation of the device itself becomes impossible. This is the fourth issue.

[0015]

[Means for Solving the Problems]

 The present invention has been made to solve the above four problems, and the gist thereof is as follows. That is, in order to solve the first problem, the flow path of the air flowing from the intake port to the exhaust port is not linear (substantially U-shaped in the embodiment described below). A plurality of cooling fins protruding inside the main body of the heat sink device are arranged so that the area where cooling air hits each fin is dramatically increased, so that the legs are short and few in number. Provided is a heat sink device characterized by having a sufficient heat exchange efficiency even with a plurality of fins.

In order to solve the second problem, in order to prevent a so-called dead zone from being generated by the motor section of the fan, the intake port and the exhaust port, which are arranged side by side in the vertical direction with respect to the motherboard and open, are arranged vertically. In the direction of approach to the motherboard in the direction of the above, the inner diameter is reduced in a substantially funnel shape so as to reduce the size between the intake fan and the plurality of cooling fins and between the exhaust fan and the plurality of cooling fins. Provided is a heat sink device characterized in that a certain distance is provided between the heat sink devices.

In order to solve the third problem, individual fins constituting a plurality of cooling fins projecting from the front of a rear wall of a heat sink device having a rear surface in contact with a chip surface of a CPU. However, the configuration is such that the cross-sectional area of a cross section cut along a plane parallel to the rear wall decreases from the base protruding from the front of the rear wall to the front end, so that the CPU has The heat from the chip surface can be efficiently transmitted to the tip of each fin through the rear wall to dissipate heat, and the side wall, bottom wall, and upper wall surrounding the space where a plurality of fins are provided A heat sink device characterized in that the wall, the bottom wall, and the top wall have heat dissipation / cooling ability by forming the wall body integrally with the rear wall body with a material having high thermal conductivity. I do.

[0018] In order to solve the fourth problem, the intake port and the exhaust port are opened in parallel in a direction perpendicular to the plane of the motherboard where there are no various slots or cases, and the rear wall has By arranging a plurality of cooling fins protruding from the front so that the air flow path becomes non-linear, the length of each fin in the body of the heat sink device is shortened and the number of fins is reduced. Provided is a heat sink device characterized in that the main body is reduced in size and weight.

[0019]

[Embodiment of the invention]

 The present invention will be described in detail with reference to the drawings. FIGS. 8a and 8b are schematic diagrams (reference front views) of air flow paths in one example of the conventional heat sink device (FIG. 8a) and one embodiment of the heat sink device of the present invention (FIG. 8b). It is an expression. In the conventional apparatus of FIG. 8A, the flow path of the air from the intake port 18 to the exhaust port 19 is substantially straight as indicated by the arrow J, and the plurality of fins 16 are also substantially parallel to the flow path of the air (arrow J). It is arranged to be. With this configuration, the area where air collides with the individual fins 16a, 16a,... Is small, and the efficiency of heat exchange is not very good.

On the other hand, in one embodiment of the present invention in FIG. 8B, the flow path of the air from the intake port 2 (arrow G) to the exhaust port 3 (arrow H) is substantially linear. Instead, a plurality of fins 4 are arranged so as to draw a substantially U-shape as indicated by an arrow I. As a result, the area where air collides with the individual fins 4a, 4a,... Is dramatically increased, and the efficiency of heat exchange is much improved as compared with the conventional heat sink device of FIG. 8A.

FIG. 8B is a reference schematic front view of an embodiment of the invention according to claim 1 of the present application. FIG. 8B shows another example of the embodiment of the invention according to claim 1 of the present application. 9a and FIG. 9b. That is, in FIG. 9A, the air intake port 2 is provided on the left side of the main body 1a, and the intake fan 12 is mounted, and the exhaust port 3 is provided on the right side, and the exhaust fan 13 is mounted. Is an example in which a plurality of fins 4 are protruded (reference schematic front view), but a plurality of fins 4 are arranged so that an air flow path I is wavy.

FIG. 9B shows an intake fan 2 provided at a substantially central portion of the upper surface of the main body 1b and an intake fan 12 attached thereto, and exhaust fans 3 provided at both left and right side surfaces. In this example, a plurality of cooling fins 4 are provided so as to protrude from the rear wall 5, but the plurality of fins 4 are arranged so that the air flow path I has a C-shape. 8b, 9a, and 9b described above are all examples of the invention according to claim 1 of the present application in which the air flow path has a shape other than a substantially linear shape. However, there can naturally be other embodiments of the invention according to claim 1 of the present application.

Among the embodiments of the present invention schematically shown above, the embodiment schematically shown in FIG. 8B is one of the embodiments according to all of claims 1 to 5 of the present application. Therefore, the configuration will be described in more detail with reference to the drawings. 1 is an external perspective view of this embodiment, FIG. 2 is a partially cutaway front view, FIG. 3 is a plan view, FIG. 4 is a partially cutaway right side view, and FIG. 5 is a rear view. It is. In the following description, the side on which the CPU card 14 is mounted will be referred to as the back side, and the opposite side will be referred to as the front side. Therefore, the motherboard (not shown) of the personal computer is located below and parallel to the bottom wall 7 of the present embodiment.

In a personal computer, a motherboard (not shown) is positioned parallel to the direction of gravity in a vertical housing (not shown), and a horizontal housing (not shown). In this example, the motherboard (not shown) is positioned at right angles to the direction of gravity, so that the vertical relationship of the present embodiment with respect to the direction of gravity also changes in both cases. Irrespective of the type of the motherboard (not shown), the front side of the motherboard (not shown) is referred to as "up" and the rear side thereof is referred to as "down" in a direction perpendicular to the motherboard (not shown).

In FIG. 1 to FIG. 5, reference numeral 1 denotes a main body of the heat sink device of the present embodiment, and the main body 1 includes a rear wall 5, left and right side walls 6, 6, a bottom wall 7, and an upper wall 8 integrated with each other. The open front side protrudes from the front sides of the side walls 6 and 6, the front side of the bottom wall 7, and the front side of the center of the top wall 8. It is covered by a front cover 10 screwed to the flange 9.

The joint between the side walls 6, 6 and the bottom wall 7 has a smooth, substantially quarter-cylindrical shape. Accordingly, the internal space of the main body 1 is a substantially rectangular parallelepiped with a lower left end and a lower right end rounded. It is. A plurality of cooling fins 4 project from the front of the rear wall 5 in the internal space. The rear wall 5 is provided with four holes 5a for screwing the CPU card 14 therein.

Each of the fins 4 a constituting the plurality of cooling fins 4 is a flat plate having a substantially straight or substantially arcuate cross section when cut on a plane parallel to the rear wall 5. As shown in the schematic front view of FIG. 8B, the entire air passage 4 is disposed such that the air flow path I passing therethrough is substantially U-shaped. In FIG. 2, the entire arrangement of the plurality of fins 4 is viewed from the front side. However, the shape, position, and number of the individual fins 4a, 4a... Are not limited to the example shown in FIG. The shape, position, and number of the individual fins 4a, 4a,.

As shown in FIGS. 7A to 7D, the cross-sectional area of each of the fins 4a cut along a plane parallel to the rear wall 5 gradually increases in a direction away from the rear wall 5. It is configured to shrink. This configuration is the same regardless of whether each of the fins 4a has a substantially rectangular parallelepiped cross section or a substantially arcuate cross section when cut along a plane parallel to the rear wall 5.

As shown in FIGS. 4 and 5, on the rear side of the rear wall 5, a substantially square contact surface 5 b that comes into contact with the chip surface 14 a of the CPU is provided substantially in the center. It protrudes slightly backward from the remaining surface. The contact surface 5b is required to be brought into close contact with the chip surface 14a without a slight gap for the purpose of improving the thermal conductivity, and therefore is configured as smooth as possible.

The four holes 5a, 5a,... Described above are formed in the vicinity of the four corners of the contact surface 5b of the rear wall 5 other than the contact surface 5b so as to surround the contact surface 5b. Has been drilled. At the right and left ends of the rear wall 5, mounting pieces 11, 11 for mounting the main body 1 together with the CPU card 14 in a CPU slot (not shown) of a motherboard (not shown) are protruded. .

The upper surface of the main body 1 has only a very narrow central portion covered by the upper wall body 8, and the remaining portion is an open surface. The left open surface has the intake port 2, and the right open surface has the open surface. The exhaust ports 3 are fixed integrally. As shown in FIG. 3, both the intake port 2 and the exhaust port 3 have an opening having a substantially octagonal planar shape at the upper end, a square shape at the periphery by the flanges 2 a, 3 a, and a lower end at the opening. The plane shape is a square shape integrally fixed to the left and right open surfaces of the upper surface of the main body 1, respectively.

Therefore, the intake port 2 and the exhaust port 3 decrease the area of the planar shape while changing the planar shape of the opening from substantially octagonal to square as going from the upper end to the lower end. Has made. At the four corners of the flange 2a, there are four holes 2b, 2b,... For screwing the intake fan 12, and at the four corners of the flange 3a, holes for screwing the exhaust fan 13. 3b, 3b,... Are formed in four places. 2, 4, and 5 show a state in which the intake fan 12 and the exhaust fan 13 are screwed. The power cords of the intake fan 12 and the exhaust fan 13 are omitted.

As the material of the main body 1, any material can be used as long as it has good thermal conductivity, is easy to process, is robust, lightweight, and is inexpensive. Alloys, or copper or alloys thereof, are preferred. Aluminum and its alloys have the characteristics of good thermal conductivity and light weight. Copper or its alloys are inferior in weight to aluminum or their alloys, but have better thermal conductivity. Even when the main body 1 is made of metal, the front cover 10 (see FIGS. 1 and 2) may be made of a synthetic resin or the like for weight reduction.

Hereinafter, the operation of the present embodiment will be described in detail with reference to the drawings. In this embodiment, an intake fan 12 is screwed into the intake port 2 as shown in FIG. 2, and an exhaust fan 13 is screwed into the exhaust port 13 as shown in FIG. The CPU card 14 is screwed (screw not shown) to the back surface of the main body 1 so that the front surface 14a is in close contact with the CPU card of the motherboard (not shown) using the mounting pieces 11 shown in FIGS. The main body 1 is used together with the CPU card 14 in a slot (not shown).

When the switches of the intake fan 12 and the exhaust fan 13 are turned on (actually, it is generally set to automatically turn on when the personal computer is started), the front view of FIG. 2 and the schematic diagram of FIG. As shown in the front view, the rotation of the motor portion 12a of the intake fan 12 causes the blade portion 12b to rotate, and external air is sucked into the suction port 2 in the direction of arrow G. As shown in the schematic front view of FIG. 8B, the sucked air forms a substantially U-shaped flow path as indicated by an arrow I by the action of a plurality of fins 4 disposed inside the main body 1 and the exhaust port 3. It is led to.

The sucked air collides with the surfaces of the individual fins 4a, 4a,... While passing through the flow path indicated by the arrow I in FIG. 8B. The heat from the chip surface 14a of the CPU card 14 is transmitted to the individual fins 4a, 4a,... Through the contact surface 5b and the rear wall 5, as shown in FIG. The heat is dissipated by being transmitted to the air colliding with the surfaces of the fins 4a, 4a,..., And as a result, the chip surface 14a is cooled.

At this time, since the plurality of fins 4 are arranged such that the air flow path is substantially U-shaped as indicated by the arrow I in the schematic front view of FIG. 8B, the individual fins 4a, 4a, 8 is much larger than when the individual fins 16a, 16a,... Are arranged substantially parallel to the air flow path indicated by the arrow J as shown in FIG. Therefore, the heat exchange efficiency is improved accordingly.

At this time, as shown in FIGS. 7A to 7D, each fin 4 a has a cross-sectional area of a cross section cut in a plane parallel to the rear wall 5 in a direction away from the rear wall 5. Because it is configured to contract gradually, a greater amount of heat can be transferred from the rear wall 5 to the tip portion 4c as compared to the individual fins 16a of the configuration shown in FIGS. 6a-6d. That is, the shape of each fin 4a is configured to improve the heat exchange efficiency. Further, since the side wall members 6, 6, the bottom wall member 7, and the upper wall member 8 are integrally formed of the same material as the rear wall member 5, the heat of the rear wall member 5 is generated by the side wall members 6, 6, the bottom wall member. The heat is transmitted to the body 7 and the upper wall body 8 and the heat is efficiently radiated also to these parts.

An exhaust fan 13 is screwed into the exhaust port 3, the blade 13 b rotates by the rotation of the motor 13 a, and the heated air guided to the exhaust port 3 is an arrow shown in FIG. It is discharged in the direction of the mark H. Thus, one cycle of heat exchange is completed. Low-temperature air is continuously supplied from the intake port 2 by the action of the intake fan 12, and high-temperature air is continuously discharged from the exhaust port 3 by the action of the exhaust fan 13. , Heat is continuously exchanged, and as a result, the chip surface 14a is continuously cooled as long as the intake fan 12 and the exhaust fan 13 continue to operate.

Further, as shown in FIG. 2, the intake port 2 and the exhaust port 3 are formed in a substantially funnel shape that contracts downward, and are located between the intake fan 12 and the plurality of fins 4 and between the exhaust fan 13 and the plurality of fins. A gap corresponding to the height of the intake port 2 and the exhaust port 3 is provided between the fins 4, so that a so-called dead zone, in which the motor sections 12 a and 13 a become blind spots and the flow of air is blocked, extends over the plurality of fins 4. From this point, the heat exchange efficiency is better than that of the conventional structure as shown in FIG. 8A.

In order to confirm the effects of the present embodiment in which the configuration and operation are described above, a comparison experiment was performed between a genuine heat sink device of a CPU manufacturer and a heat sink device of a conventional product. In the experiment, an aluminum plate (approximately 2 mm thick) of approximately the same size and shape as the CPU chip was fixed to the tip of the soldering iron with an aluminum bar at a slight distance, and the aluminum plate was attached to the CPU of each heat sink device. Heat the soldering iron in that state, and when the temperature of the iron tip reaches the rising limit and becomes constant, turn on the fan switch of each heat sink device and turn on the fan. Rotation was continued, and when the temperature of each heat sink device became constant, the temperature of the aluminum plate and the temperature in each heat sink device were measured and recorded. Table 1 shows the results. In the experiment, when the temperature of the iron tip of the soldering iron became constant by adjusting the length of the aluminum rod without any heat sink device attached, The temperature was set to about 200 ° C., which was definitely higher than the chip surface temperature of the CPU.

[0042]

[Table 1]

As can be seen from the results in Table 1, the temperature of the aluminum plate (the temperature of the chip surface of the CPU in actual use) is 8 ° C. for the genuine product and the conventional product, and 12 ° C. for the conventional product and the present embodiment. A difference in the cooling effect of ° C. appeared. The conventional product also obtained a result of 8 ° C lower than the genuine product, but in this example, the cooling effect was 12 ° C lower than that of the conventional product. It was clearly ascertained in this experiment that the compound provided a remarkably excellent cooling effect in actual use.

In the present embodiment, the temperature in the heat sink device is not significantly decreased compared to the dramatic decrease in the temperature of the aluminum plate (only 6 ° C. lower than the conventional product). Is a proof that heat is efficiently dissipated from the aluminum plate, and the arrangement of multiple fins and the configuration in which the root of each fin is thick and the tip is thin in this example The structure in which a gap is provided below the intake port and the exhaust port cooperates to efficiently express the state in which heat is efficiently taken up from the aluminum plate and released into the heat sink device.

[0045]

[Effect of the invention]

 According to the present invention, since a plurality of cooling fins are arranged in the main body of the heat sink device so that the flow path of the air from the intake port to the exhaust port is substantially U-shaped, the plurality of fins is provided. As compared with the conventional heat sink device, which is disposed substantially parallel to the air flow path, the area of the portion where the air collides with each fin is greatly increased, resulting in a remarkable improvement in heat exchange efficiency. Cooling performance has been greatly improved.

Further, in the heat sink device of the present invention, the intake port and the exhaust port are formed in a funnel shape which is reduced downward, and are provided between the intake fan and the plurality of cooling fins and between the exhaust fan and the cooling fan. Since a gap is provided between the plurality of fins, a so-called dead zone without a wind flow generated behind the motor portion of the intake fan and the exhaust fan does not reach the plurality of cooling fins. However, compared with the conventional heat sink device not adopting the above configuration, the heat exchange efficiency was remarkably improved, and the cooling performance was greatly improved.

Further, in the heat sink device of the present invention, the individual cooling fins protruding from the front of the rear wall follow from the root protruding from the front of the rear wall to the tip. Since the cross-sectional area of the cross section cut in a plane parallel to the rear wall is reduced, the heat exchange efficiency is remarkably improved as compared with the conventional heat sink device not adopting the above configuration. Cooling performance has been greatly improved.

Further, in the heat sink device of the present invention, one or all of the side wall, the bottom wall, and the top wall surrounding the space where the plurality of fins are provided are integrated with the rear wall to form a heat conductivity. And heat dissipation and cooling capability for any or all of the side wall, bottom wall, and top wall. A remarkable improvement was seen in the exchange efficiency, and the cooling performance was greatly improved.

Further, in the heat sink device of the present invention, as described above, the arrangement configuration of the plurality of fins, the funnel-shaped configuration of the intake port and the exhaust port, and the cross-sectional configuration in which the root portion of each fin is thickened and the tip portion is thinned. As a result, the heat exchange efficiency has been greatly improved, and the length of each fin leg can be shortened and the number of fins can be reduced, thereby successfully reducing the size and weight of the entire device. As a result, the stability is increased when the CPU card is installed in the CPU slot of the motherboard together with the CPU card, and the memory slot and other slots are not blocked.

Further, in the heat sink device of the present invention, since the intake port and the exhaust port are arranged side by side above the other slot such as a memory slot or the case of a personal computer, the intake port and the exhaust port are not provided. There is no longer any concern that the intake or exhaust fan installed in the mouth will block other slots, such as the memory slot, or hit the personal computer housing itself, making it impossible to install the heat sink device itself. .

In the above, the configuration, operation, and effect of the present invention have been described mainly with respect to the embodiment of the heat sink device of the cooling device that cools the CPU. The present invention is not limited to the heat sink device of the cooling device, but has an effectiveness as a heat sink device that can be used for all of the cooling devices of other parts of the personal computer.

[Brief description of the drawings]

FIG. 1 is an external perspective view of a heat sink device according to an embodiment of the present invention, with a part thereof omitted.

FIG. 2 is a partially cut away front view of the heat sink device according to the embodiment of the present invention;

FIG. 3 is a plan view of one embodiment of the heat sink device of the present invention.

FIG. 4 is a right side view of the heat sink device according to the embodiment of the present invention, with a part thereof cut away;

FIG. 5 is a rear view of one embodiment of the heat sink device of the present invention.

FIG. 6a is a reference plan view of individual fins of one example of a conventional heat sink device. b Fig. 6a is a sectional view taken along the line AA in Fig. 6a. c is a sectional view taken along line BB of FIG. 6a. d is a sectional view taken along line CC of FIG. 6a.

FIG. 7a is a reference plan view of individual fins of one embodiment of the heat sink device of the present invention. b is a sectional view taken along line DD of FIG. 7a. c It is EE sectional drawing of FIG. 7a. d is a sectional view taken along line FF of FIG. 7a.

FIG. 8A is a reference schematic front view showing an arrangement method of a plurality of fins and an air flow path in one example of a conventional heat sink device. b is a reference schematic front view showing an arrangement method of a plurality of fins and an air flow path in one embodiment of the heat sink device of the present invention.

9A is a reference schematic front view showing a method of disposing a plurality of fins and an air flow path in one embodiment of the heat sink device of the present invention. FIG. b is a reference schematic front view showing an arrangement method of a plurality of fins and an air flow path in one embodiment of the heat sink device of the present invention.

FIG. 10A is a right side view of an example of a genuine heat sink device of a CPU maker. b is a front view of an example of a genuine heat sink device of a CPU maker.

FIG. 11 is an external perspective view of an example of a conventional heat sink device with a part thereof cut away.

FIG. 12 is an external perspective view of an example of a conventional heat sink device with a part thereof cut away.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Main body 1a Main body 1b Main body 2 Intake port 2a Flange 2b hole 3 Exhaust port 3a Flange 3b hole 4 Plural fins 4a Individual fins 4b Root portion 4c Tip portion 5 Rear wall 5a Hole 5b Contact surface 6 Side wall 7 Bottom wall Body 8 Upper wall 9 Flange 10 Front cover 11 Mounting piece 12 Intake fan 12a Motor 12b Blade 13 Exhaust fan 13a Motor 13b Blade 14 CPU card 14a Chip surface 15 Rear wall 16 Multiple fins 16a Individual Fin 16b Root 16c Tip 17 Main body 18 Inlet 19 Exhaust port 20 Main body 21 Rear wall 22 Fin board 22a Fin 23 Intake fan 23a Motor 23b Blade 24 Main body 25 Rear wall 26 Multiple fins 26a Individual fins 27 Intake fan 28 Intake fan 29 Cover 30 Main body 31 Rear wall 32 Multiple fins 32a Individual fins 33 Intake fan 34 Exhaust § down 35 cover

Claims (5)

[Utility model registration claims] 1. An air-cooled cooling device for cooling various parts of a personal computer, wherein the cooling device is provided in a cooling air flow path between one or more intake ports and one or more exhaust ports. A heat sink device, wherein a plurality of fins are arranged such that a flow path of cooling air has various shapes other than a substantially linear shape. 2. An air-cooled cooling device for cooling a CPU (Central Processing Unit) of a personal computer, wherein an air inlet for an intake fan and an air outlet for an exhaust fan are connected to the personal computer. It is juxtaposed so that it opens vertically to the motherboard,
A plurality of cooling fins projecting from the front surface of the rear wall body, the back surface of which abuts against the chip surface of the CPU, are provided with a plurality of cooling fins.
The heat sink device according to claim 1, wherein the heat sink device is arranged in a letter shape. 3. An intake port and an exhaust port, which are juxtaposed so as to open in a vertical direction with respect to a motherboard of a personal computer, are substantially reduced in size in the vertical direction toward a direction approaching the motherboard. 3. A structure having a funnel shape and having a certain distance between the intake fan and the plurality of cooling fins and between the exhaust fan and the plurality of cooling fins. A heat sink device according to claim 1. 4. The back of a personal computer CP
The individual fins constituting the plurality of cooling fins protruding from the front surface of the rear wall abutting on the chip surface of the U are moved from the root portion protruding from the front surface of the rear wall body to the tip portion. The heat sink device according to claim 2, wherein a cross-sectional area of a cross section cut along a plane parallel to the rear wall body is reduced. 5. A side wall, a bottom wall, and / or an upper wall surrounding a space in which a plurality of fins are disposed are made of a material having high thermal conductivity integrally with a rear wall. The heat sink device according to claim 2, which has a heat radiation / cooling ability.