JP3060182B2 - Floor slab, bonding apparatus for slab, and method of laying floor slab - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a slab for automatically laying a slab in building construction, a slab bonding apparatus, and a slab laying method.

[0002]

2. Description of the Related Art At present, a method of laying a floor slab involves carrying a floor slab to a predetermined position using a crane, positioning the slab, and then setting the slab. However, the weight of the floor slab is about 2
t, which takes time and labor for work, and also poses a safety problem.

[0003]

As a result of various studies to solve the above problems, the present inventor has found that, in the case of automatic building construction, in particular, a floor slab laid on a slab and a bonding apparatus for the floor slab are used. Developed and thought that a new method of laying floor slabs was necessary.

Accordingly, the present invention firstly has a structure suitable for automatic conveyance and positioning of the floor slab, and then a device capable of automatically adhering the floor slab and moving to the place where the floor slab is to be laid. It provides a method of automatically laying a slab.

[0005]

Means for Solving the Problems The present invention has been made in order to achieve the above object, the gist upper surface of the slab, located in order to confirm the adherend portion, the position of the bonding portion
A marker that can be sensed by a sensor is provided.
Bonding mechanism gist of another bonding apparatus deck is the invention which is provided a traveling unit that moves along the ceiling rail, the adhesive portion which adheres to the adhesive portion of the new deck via a lifting means and running portion And a position sensor for checking a marker provided on the floor slab to be bonded by the bonding mechanism, a slit light transmitting unit for projecting slit light to a joint portion between the bonded floor slab and the existing floor slab, and the bonding unit. It comprises an operation adjusting means for rotating and finely moving back and forth and right and left.

Further, in the method of laying a floor slab of the present invention, a floor slab bonding apparatus is moved along a ceiling rail to a position above a material stock area of a new floor slab, and a position sensor detects a marker on the floor slab. Align the bonding device and the floor slab, lower the bonding mechanism to bond the bonded part to the bonded part of the floor slab, and raise the bonded floor slab and move it along the ceiling rail to move the floor slab. Approximately positioning above the laying place, slit light from the bonding device is projected to the joint between the new floor slab and the existing floor slab, and the slit light is taken into the imaging device to detect the three-dimensional displacement amount Then, the new slab is positioned at a predetermined position adjacent to the existing slab by finely moving the bonding device.

[0007] Since the bonded portion of the floor slab is bonded by the bonding portion of the bonding device of the floor slab, a relationship in which the two are engaged, for example, a screw connection, an electromagnet connection, or the like can be considered. It is sufficient that the position is confirmed by the position sensor of the bonding device and the bonded portion is engaged with the bonded portion. For example, the bonding position is fixed by providing one or more first and second markers.

[0008] The ceiling rail may be a permanent one built into the construction itself or a temporary one. It is conceivable that the vehicle runs on the ceiling rail by turning the vehicle.

Further, the slit light transmitting section is configured to project slit light between a newly installed floor slab and an existing floor slab to detect a three-dimensional displacement amount. It is determined at the corners of the existing floor slab that are partly projected at two locations on both corners of one side and that are positioned above and below the adjacent existing slab, that is, at an angle to the new slab. By projecting the light onto the spot, the image pickup device from directly above each of these places makes these two straight lines at the upper and lower light projecting positions, and the slit light is used to measure the height of the new floor slab. From the place where the angle from the transmitting unit is constant, the distance between the slit light of a part of the corner part of the new floor slab and the remaining slit light of the corner part of the existing slab is output on the imaging device. You can ask.

In the operation adjusting means, the bonding portion of the bonding device for the floor slab is rotated back and forth, left and right, and by a driving unit such as a motor.

[0011]

According to the present invention, a traveling section is moved along a ceiling rail, a marker of a new floor slab is checked by a position sensor, and a bonded portion of the floor slab is bonded by an adhesive section, and the new floor slab is connected to an existing floor slab. Move to a position adjacent to the slit light, and emit slit light between the existing slab, the new slab and the floor slab by combining the slit light transmitting unit and the separately prepared imaging device to detect the three-dimensional displacement amount,
The bonding portion is finely moved and laid by the operation / adjustment means.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A floor slab bonding apparatus and a floor slab according to the present invention will be described below with reference to the accompanying drawings.

1 to 3 are front views of a floor slab bonding apparatus.
FIG. 4 is a perspective view of the floor slab, and FIGS. 5 to 9 are explanatory views showing a method of laying the floor slab.

FIG. 9 is an overall view of a building showing a state in which a floor slab is laid by the apparatus according to the present invention. The temporary ceiling 1 moves the upper and lower grips 3 and 4 above and below the existing story 5 by expanding and contracting the jack 2. The lower part of the temporary ceiling 1 is laid at the place where the floor slab B is adhered by the traveling portion 7 of the floor slab bonding apparatus A, which vertically and horizontally traverses the ceiling rail 6. .

FIG. 1 shows a bonding apparatus A hanging on a ceiling rail 6.
Is a front view of the upper traveling unit 7 including a motor, wheels, and the like.
The vehicle can be driven by remote control. In the lower part of the traveling part 7, an elevating means 10 which can be expanded and contracted by hydraulic pressure with a double pipe of an outer cylinder 8 and an inner cylinder 9, a rotating part 18 rotated by a motor, and dovetail grooves 11 and 12 which operate left and right and back and forth by hydraulic pressure. The operation adjusting means 20 having the position sensors 13 and 13 'confirms the markers 14 and 14' of the floor slab B shown in FIG. And two female screws 15 provided on the floor slab B,
15 'is provided with an adhesive mechanism 17 provided with an adhesive portion composed of male screws 16 and 16' corresponding to the female screw to be screwed and rotated by a built-in motor (not shown).

On the outer periphery of the traveling section 7, two
Individual X-axis laser receiver 21 and Y-axis laser receiver 2
2 is provided, and 18 is still provided on the slope between the traveling section and the lifting / lowering means 10.
Slit light transmitting units 30 of 23 and 24 each two in the 0 degree direction
Is provided.

Hereinafter, a method of bonding the floor slab B having the above structure by the floor slab bonding apparatus A, and moving and laying the floor slab will be described.

In FIG. 5, the floor slab B carried by the truck 19 is stopped at the carry-in position, and the crane robot C having substantially the same mechanism as that of the above-mentioned bonding apparatus is lowered from the temporary ceiling 1, and is slid by a sensor or an operator. B is set, and the crane robot C is lifted and carried into a planned material stock location on the existing story 5. The crane robot C has the same bonding mechanism 17 as the bonding device A, and performs work only in the working range between the truck and the material stocking place.

Next, referring to FIG. 6, the bonding apparatus A is moved to the material stocking position and the floor slab B is bonded by screwing.
In this bonding method, the marker 14 on the floor slab B is confirmed by the position sensors 13 and 13 ', and then the bonding device is rotated by the rotating unit 18 of the operation adjusting means 2 about that point, and the remaining markers 14' or 14 Is confirmed, the two markers 14, 14 'are determined to have the same width, so that the male screw 16, 16' is aligned with the female screw 15, 15 'by lowering the raising / lowering means 10 and bonded. The male screws 16, 16 'are rotated by a motor provided in the mechanism and screwed to each other, in this case, the male screws 16, 16' as an adhesive portion.
Alternatively, the bonding apparatus A can bond the floor slab B by using electromagnetic waves and using the female screws 16, 16 'as small holes provided in an iron plate.

Further, after the bonding is completed, the floor slab B is lifted by the bonding apparatus and moves to the laying position. The bonding apparatus A previously counts the number of floor slabs B to be laid, and according to this count. The bonding apparatus A moves to the next floor slab laying place. The bonding apparatus A is a laser transmitting apparatus from the vertical and horizontal X axes and a laser transmitting from the Y axis set on the temporary ceiling 1 on the existing level 5. The laser light from the apparatus is detected by the X-axis laser light receiver 21 and the Y-axis laser light receiver 22, and the positioning is performed substantially at that location. Next, as shown in FIG. 8, the bonding device is lowered to a predetermined position by the lifting / lowering means, and a part of the slit light is transmitted from the slit light transmitting portions 24, 24 located at the 180-degree target position of the bonding device, to form a new square slab. At the same time, the light is projected at the angle θ to the corner of B, and the remainder is projected at the angle α to the adjacent existing floor slab B ′. In this case, the light is projected in the state shown in FIG. 7, that is, a part of the light is projected on the corner of the new floor slab, and the other part is projected on the extension of the new floor slab with the shadowed portion being blank.

From this state, the operation adjusting means 2 of the bonding apparatus
0 is operated to finely adjust the rotation or front / rear and left / right. First, the remaining slit light projected on the existing floor slab B 'at the upper left is fixed above the position of the dotted line with an arrow mark on the screen. Adjust to the top (measuring part). In this case, is the new floor slab B overlaid on the existing floor slab B '?
As a result, the remaining slit light at the lower left is finely moved by the control device (not shown) so as to adjust the position above the arrow, and to measure the distance m descended by the lifting / lowering means 10. The measurement is performed by adjusting the blank length of the light projected from the slit light transmitting units 24, 24 to the length l from the corner of the existing floor slab B 'to the arrow.

The floor slab B which has been finally positioned in this way is lowered by the length of m by the lifting / lowering means 10 and the floor slab is laid at a predetermined position.

After the laying operation is completed, the bonding is released by the bonding mechanism 17, and the slab is moved to the material stocking place again, and the slab laying operation is performed by repeating these operations.

Note that the actual positioning of the method of laying the floor slab is not limited to the above-described embodiment, but is described in Japanese Patent Application Laid-Open No. Hei 1
The segment positioning method in 263509 can also be applied.

[0025]

The floor slab of the present invention can be easily aligned and bonded by a bonding apparatus as a floor laying robot by providing a marker and a portion to be bonded.

The floor slab bonding apparatus includes a traveling section, a bonding mechanism, a position sensor, a slit light transmitting section, and an operation adjusting means. The position of the floor slab is confirmed by the position sensor, and the floor slab is bonded by the bonding mechanism. By moving to the place where the floor slab is laid and substantially positioning, and by projecting the slit light over the corners of the new and existing floor slabs, the three-dimensional position shift amount is detected, and the actual adjustment is performed by the operation adjusting means, Laying work of floor slabs can be performed.

[Brief description of the drawings]

FIG. 1 is a front view of a bonding apparatus according to the present invention.

FIG. 2 is a side view of FIG.

FIG. 3 is a bottom view in FIG. 1;

FIG. 4 is a perspective view of the floor slab of the present invention.

FIG. 5 is an explanatory view showing a state in which a floor slab is moved to a material stocking place as a pre-process of the present invention.

FIG. 6 is a side view of the floor slab laying method of the present invention before the bonding apparatus bonds the floor slab.

FIG. 7 is an explanatory view in a planar state showing final positioning in the floor slab laying method of the present invention.

FIG. 8 is a side view of FIG.

FIG. 9 is an overall schematic view showing a method of laying a floor slab according to the present invention.

[Explanation of symbols]

 A floor slab bonding device B floor slab 15, 15 'floor slab bonded portion 16, 16' bonding device 14, 14 ', 14 "floor slab marker 6 ceiling rail 7 running section 10 lifting means 17 bonding Mechanism 13, 13 'Position sensor 20 Operation adjusting means 30 Slit light transmitting unit

Continued on the front page (51) Int.Cl. ⁷ Identification code FI G01B 11/00 G01B 11/00 A

Claims (3)

(57) [Claims] 1. A marker that can be sensed by a position sensor on an upper surface to confirm a position of a portion to be bonded and a position of the portion to be bonded.
And a floor slab. 2. A traveling unit that moves along a ceiling rail;
An adhesive mechanism provided with an adhesive portion that adheres to the adhered portion of the new floor slab via the traveling portion and the lifting / lowering means, a position sensor for checking a marker provided on the floor slab adhered by the adhesive mechanism, and a bonded floor slab. An apparatus for bonding a floor slab, comprising: a slit light transmitting section for projecting slit light to a joint section with an existing floor slab; and an operation adjusting means for rotating and finely moving the bonding section forward, backward, left and right. 3. The bonding apparatus for a slab according to claim 2, wherein the bonding apparatus is moved along a ceiling rail above a material stocking location of a new slab, and a position sensor detects a marker on the slab. and the floor plate are aligned, a step of bonding the bonding portion by lowering the bonding mechanism on the bonded portion of the floor plate, moves along the ceiling rail and elevated adhered deck installation site of slab The slit light from the bonding device is projected onto the joint of the new floor slab and the existing floor slab, and the slit light is taken into the imaging device to detect the three-dimensional displacement amount, A method of laying a floor slab in which a new slab is positioned at a predetermined location adjacent to an existing slab by finely moving the bonding device.