JP3060101U - Heat sink combination device for CPU cartridge - Google Patents

Abstract

(57) [Problem] To provide a heat dissipation piece combination device for a non-package type board type CPU. SOLUTION: A positioning column and a fixing column having a ring portion at an upper end thereof are provided, and a cartridge having a plurality of stoppers at an upper end, and large and small perforations communicating with one side are provided. Two fixed joints, in which a stop piece having a stop hole on the side is extended, and a downwardly-depressed operating fulcrum is directed to an appropriate position of the large and small perforations, and a positioning plate is provided between the stop piece and the operating fulcrum. The cartridge is combined with one heat radiating piece, the CPU board is interposed therebetween, and the ring portion of the fixed column is fitted into the large hole of the fixing device, utilizing the principle of leverage. When the stop piece is pressed, the stop hole engages with the stop at the top of the cartridge, the fixing device moves, the positioning post moves in the direction of small drilling, and the positioning piece locks on the edge of the heat radiation piece. The fixing device is installed in the heat sink, and the heat sink bottom and CPU The chips are brought into close contact.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a type of heat dissipating piece combination device for a CPU cartridge, and more particularly, to a type in which a heat dissipating piece can be detachably combined with a non-package type CPU.

[0002]

[Prior art]

 The Pentium-series CPU has a CPU chip and an external cache provided on one board, and a PLGA package on the outside. The gold finger of the board and the slot of the motherboard are mutually connected, and the PLGA package is slotted. It is supported by the frames on both sides to form an upright insertion form. The CPU is tightly closed by the fastening of the fasteners formed on both sides of the PLGA package and the locking holes formed in the frame. To prevent the gold finger from falling off and poor contact. However, the processing steps of the PLGA package are cumbersome and time-consuming, and the form of the package increases the production cost, and the computer assembler takes time from ordering to delivery to the CPU manufacturer. And the inability to lower selling prices has reduced competitiveness and occupancy in the market, resulting in a significant reduction in business opportunities. Due to such drawbacks of the PLGA package, a non-PLGA packaged CPU, that is, a non-package board type CPU has been provided. Such a CPU does not require the processing of a PLGA package, so that the delivery time of the CPU can be greatly reduced, but it has a problem.

As described above, the PLGA package of the CPU is provided with several stopper holes, and the heat radiation piece is tightly coupled to the PLGA package using extra fixing means to achieve the heat radiation effect. ing. However, the board type CPU does not have a stop hole for attaching a heat radiating piece like a PLGA package, and when a heat radiating piece is combined with a CPU chip using a general SMD (surface mounting device) fastener, Although the goal of heat dissipation could be achieved, the value of non-packaged CPUs was significantly reduced, and the probability that consumers would accept such alternatives was relatively reduced. Therefore, there has been a demand for a simple and low-cost assembly structure of a heat radiation piece for a non-package type CPU.

[0004]

[Problems to be solved by the invention]

 SUMMARY OF THE INVENTION An object of the present invention is to provide a kind of heat radiating piece combination device of a CPU cartridge, which has a simple structure so that a heat radiating piece can be combined with a CPU board, and the appearance of the CPU is a PLGA package. In addition to this, the manufacturing cost will be reduced and the equipment will be one that can be easily accepted by consumers.

Another problem of the present invention is that the heat dissipation piece combination device of the CPU cartridge does not involve the propagation of the PLGA package by directly contacting the CPU chip with the heat dissipation piece. To be able to improve.

[0006] A further object of the present invention is to provide a heat radiation piece combination device for a CPU cartridge as described above, wherein a concave slope is provided in a stop portion of the CPU cartridge so that one gap exists between the stop piece and the cartridge. In other words, it provides a space for applying force when attaching and detaching, making it easier to attach and detach.

[0007]

[Means for Solving the Problems]

 The invention according to claim 1 is used as a cartridge 10 and is used for mounting a CPU board 20 having a concave concave space 11, and a convex portion 12 and a pair of two are provided at appropriate positions of the concave space 11. The above-described cartridge 10, in which a positioning column 13 and a fixed column 14 are provided so as to protrude so that a plurality of stoppers 15 are provided at a position facing the positioning column 13 at the upper end of the cartridge 10. The CPU board 20, which is a CPU board 20 and has perforations 23 at positions corresponding to the positioning pillars 13 and the fixed pillars 14, has one heat radiation piece 30, and has a plurality of heat radiation fin pieces 31; The above-mentioned heat-dissipating piece, which has two passages 32 in a portion of the fin piece 31 opposite to the above-mentioned stopping portion 15, and a perforation 33 is provided in a position of the passage 32 opposite to the positioning column 13 and the fixed column 14. 30 The above two fixing devices 40, which are two fixing devices 40, are laid across the passage 32, and tightly sandwich the CPU board 20 between the heat radiating piece 30 and the cartridge 10. An annular portion 141 is formed near the upper end of the fixing column 14, and the fixing column 14 passes through the corresponding perforations 23, 33 of the CPU board 20 and the heat radiation piece 30 and enters the passage 32. A large perforation 41 and a small perforation 42 are provided to protrude and communicate with each other on one side of the fixing device 40, a stop piece 43 extends on the other side, and a stop hole 431 is provided at the end of the stop piece 43. An operating fulcrum 44 that is recessed downward is formed at an appropriate position approaching the large perforation 41 and the small perforation 42, and a positioning piece 45 is formed at an appropriate position near the stop piece 43 by a stamping press. The ring portion 141 of the fixed column 14 is a large perforation of the fixing device 40 1 and the stopper piece 43 is pushed according to the principle of leverage, the stopper hole 431 engages with the stopper 15 at the upper end of the cartridge 10 to move the fixing device 40, and the positioning column 13 , The positioning piece 45 is locked to the edge of the heat radiating piece 30, the fixing device 40 is assembled in the heat radiating piece 30, and the bottom surface of the heat radiating piece 30 and the CPU chip 21 are tightly closed. The heat radiating piece combination device for a CPU cartridge having the above-described structure is configured to be joined.

According to a second aspect of the present invention, there is provided a heat dissipating piece combination device for a CPU cartridge according to the first aspect, wherein locking elastic pieces 16 are provided on both outer sides of the cartridge 10.

According to a third aspect of the present invention, in the CPU cartridge according to the first aspect, the end of the stopper piece 43 is bent to form an arc surface 432 for facilitating a locking operation. It is a heat sink combination device.

The invention according to claim 4 is characterized in that a slope 17 is formed at a portion of the upper end of the cartridge 10 opposite to the stopper 15, wherein the heat radiation piece combination device for a CPU cartridge according to claim 1. And

The invention of claim 5 is used as a cartridge 10, which is used for mounting a CPU substrate 20 with a concave concave space 11, and that a convex portion 12 and two convex portions are provided at appropriate positions in the concave space 11. The cartridge 10 is provided with a positioning column 13 and a fixed column 14 which are protruded so as to face each other, and a plurality of stoppers 15 are provided at a position facing the positioning column 13 at the upper end of the cartridge 10. A CPU board 20 having a perforation 23 at a position corresponding to the positioning column 13 and the fixed column 14; a heat radiation piece 30; and a plurality of heat radiation fin pieces 31; The heat sink fin piece 31 has two passages 32 at a portion facing the above-mentioned stopper portion 15, and a perforation 33 is provided at a position of the passage 32 facing the positioning column 13 and the fixing column 14. Up The heat-dissipating piece 30, which is a single fixing device 50, is laid over the passage 32, and tightly sandwiches the CPU board 20 between the heat-dissipating piece 30 with the cartridge 10. A ring portion 141 is formed near the upper end of the fixing column 14 and the fixing column 14 passes through the corresponding perforations 23, 33 of the CPU board 20 and the heat radiation piece 30. A first pressing plate 52 and a second pressing plate 53 are provided in the fixing device 50 so as to protrude into the passage 32, and the first pressing plate 52 and the second pressing plate 53 are mutually connected to one side. Large perforations 521, 531 and small perforations 522, 532 are provided, and the other side is connected and integrated with one connecting rod 51, and a stopper 511 is extended from the connecting rod 51, and the stopper is extended. A stop hole is provided at the end of 511, and large holes 521, 531 and small holes 52 are provided. 532 is provided at an appropriate position near the 532, and a positioning piece 524 is provided at an appropriate position near the stop piece 511 of the first pressing plate 52 and the second pressing plate 53 by a stamping press. The ring portion 141 of the fixed column 14 is fitted into the large hole 521, 531, and the stopper piece 511 is subjected to a pressing operation by the principle of leverage, so that the stopper hole is formed in the stopper 15 at the upper end of the cartridge 10. The positioning device 13 moves to the small perforations 522, 532, the positioning piece 524 is locked to the edge of the heat radiation piece 30, and the fixing device 50 is inserted into the heat radiation piece 30. It is assembled so that the bottom surface of the heat radiation piece 30 and the CPU chip 21 are in close contact with each other, and the heat radiation piece combination device for a CPU cartridge having the above configuration is provided.

According to a sixth aspect of the present invention, there is provided a heat dissipating piece combination device for a CPU cartridge according to the fifth aspect, wherein locking elastic pieces 16 are provided on both outer sides of the cartridge 10.

The invention according to claim 7 is characterized in that the end of the stop piece 511 is bent to form an arc surface for facilitating the locking operation. Equipment.

A device according to claim 5, wherein a slope (17) is formed on a portion of the upper end of the cartridge (10) opposite to the stopper (15). And

[0015]

[Embodiment of the invention]

 According to the present invention, there is provided a cartridge provided with a positioning column and a fixing column facing each other at appropriate positions, a plurality of stoppers provided at an upper end, and a concave ring portion provided at an upper end of the fixing column. A large and small perforation communicating with one side is provided, and a stop piece having a stop hole on the other side is extended, and a downwardly depressed operating fulcrum is directed to an appropriate position of the large and small perforation. And a fixing device provided with a positioning plate between the operating fulcrum and the cartridge. The cartridge is combined with one heat radiating piece and the CPU board is sandwiched therein, and the ring portion of the fixed column is provided. Is inserted into the large perforation of the fixing device, and the stopper is pushed down by using the principle of leverage, so that the stopper hole engages with the stopper at the upper end of the cartridge, causing the fixing device to move. , Pulling the positioning column in the direction of small drilling Engagement was locked, thus fixedly connected device is assembled in the radiating strip, the heat dissipation piece bottom and CPU chips are so brought into intimate contact.

[0016]

【Example】

 1 and 2 are a perspective view and an exploded perspective view, respectively, after the combination of the present invention. As shown in these figures, the present invention includes the following. That is, the cartridge 10 is used to mount the CPU board 20 with a concave space 11 which is concave, and is provided at an appropriate position of the concave space 11 with a convex portion 12 and two convex portions. The fixed positioning column 13 and the fixed column 14 are provided, a concave ring portion 141 is formed at the upper end of the fixed column 14, and the stopper 15 is provided at the upper end of the cartridge 10. Is provided so as to face the positioning post 13, and one stopper 15 is provided between the two positioning posts 13, and a slope 17 is formed at the upper end of the cartridge 10 so as to face the stopping portion 15 (see FIG. 7). Locking elastic pieces 16 are provided on both outer sides of the cartridge 10 so that the cartridge 10 can be mounted on a mounting frame (not shown) of the motherboard in the same manner as the PLGA package. The cartridge 10, one CPU substrate 20, mounted with the CPU chip 21, bonded to the back of the heat dissipating piece 30 with one heat transfer thin film 22, and at a position corresponding to the positioning column 13 and the fixed column 14 described above. The CPU board 20 having the perforations 23, one heat radiation piece 30, a plurality of heat radiation fin pieces 31, and two passages in a portion of the heat radiation fin pieces 31 opposed to the above-mentioned stopper 15. The heat dissipating piece 30 has two perforations 33 at positions corresponding to the positioning columns 13 and the fixing columns 14 of the passage 32. The two perforating devices 40 are large perforations communicating with one side thereof. 41 and a small perforation 42, a stop piece 43 on the other side, a stop hole 431 at the end of the stop piece 43, and a lower position at an appropriate position close to the large perforation 41 and the small perforation 42. There is a recessed fulcrum 44 Above with ends bent in stop piece 43 is an arcuate surface 432 are so as to enhance the smoothness of the locking operation fixedly connected device 40.

FIG. 3 is a sectional view of the present invention, in which the fixing device 40 is placed in the passage 32 of the heat radiation piece 30 but is not yet locked. At the time of assembly, the CPU substrate 20 is placed on the convex portion 12 of the concave space 11 of the cartridge 10, and the positioning column 13 and the fixing column 14 are respectively passed through the perforations 33 of the CPU substrate 20. Subsequently, the heat dissipating piece 30 is placed on the CPU substrate 20, the CPU chip 21 is joined to the bottom of the heat dissipating piece 30 by the heat transfer thin film 22, and the perforations 33 of the heat dissipating piece 30 are passed through the positioning pillars 13 and the fixed pillars 14. After that, the recesses 11 of the cartridge 10 are closed by the lower plate layer 35, and the heat radiating pieces 30 are closed by the upper plate layer 34. Protrude a certain height.

At this time, the large perforation 41 of the fixing device 40 is placed in the ring portion 141 of the fixed column 14, and an operation of pressing and locking the upper surface of the stopper 43 is performed. The operating fulcrum 44 is provided close to the large perforation 41 and the small perforation 42, and the moment of the force from the applied point (stop piece 43) to the operating fulcrum 44 is relatively large. By press-fitting, the stopper hole 431 can be engaged with the stopper 15 at the upper end of the cartridge 10, and the elastic member generated by the deformation of the fixing device 40 causes the radiating piece 30 to be pressed and the CPU chip to be pressed. 21 is in close contact with the surface.

At the same time as the press-fitting operation, the positioning piece 45 is locked to the edge of the heat radiating piece 30 (that is, corresponds to the upper plate layer 34), and the ring portion 141 of the fixed column 14 is smaller than the large hole 41. When the fixing column 14 enters the perforation 42 and cannot be moved further to the large perforation 41 due to the locking of the positioning piece 45, that is, one end of the fixing device 40 is locked to the ring portion 141 of the fixing column 14. Is held, and the other end is fixed in the passage 32 of the heat radiation piece 30 by the engagement of the stopper 43 and the stopper 15 (see FIG. 4).

At the time of removal, due to the design of the slope 17 of the cartridge 10, there is one gap between the stopper 43 and the upper end of the cartridge 10 to provide a space for applying force for removal, which is convenient for the removal operation. I have.

[0021] After combining the above, the present invention has the same appearance as the PLGA package CPU with the heat radiating piece, provides the mounting habits and method that the user has, and furthermore, the PLGA package. It can reduce costs and production time and provide the benefits of lower computer prices.

FIG. 5 shows another embodiment of the present invention. 6 is an exploded perspective view of the embodiment of FIG. According to this embodiment, the structures of the cartridge 10, the CPU board 20, and the heat radiating piece 30 are the same as those of the previous embodiment, and the description thereof will be omitted. In this embodiment, the above-mentioned two independent fixing devices are aligned to one another by using the connecting rod 51 to the solid-contact device 50, and the first pressing plate 52, the second pressing plate 53 and the Is defined.

The first pressing plate 52 and the second pressing plate 53 have the same large perforations 521, 531 and small perforations 522, 532, operating fulcrums 523, 533 and positioning pieces 524, 534 as those of the above-mentioned fixing device 50. The width of the connecting rod 51 connecting the first pressing plate 52 and the second pressing plate 53 is equivalent to the distance between the two passages 32 of the heat radiation piece 30. The second pressing plate 53 is made to correspond to the two passages 32, and the connecting rod 51 is provided with a stopper 511 facing the stopper 15 between the two positioning columns 13.

This embodiment is also combined with the same operation as that of the previous embodiment, except that when the stopper piece 511 is pressed, the first stopper plate 52 and the second stopper plate 53 operate simultaneously, and The positioning pieces 524 and 534 of the first pressing plate 52 and the second pressing plate 53 are locked to the edges (upper plate layer 34) of the heat radiating piece 30, and the small perforations 522 and 532 are pulled to fix the fixing column 14 Of the heat radiation piece 30 is completed by one pressing step.

[0025]

[Effect of the invention]

 In summary, the present invention provides a heat dissipating piece combination device for a CPU cartridge that includes a non-package board type CPU and a heat dissipating piece removably combined with the CPU. Provides practical new functions and new designs that are not seen before, and it is clear that its functionality and inventive step have been enhanced.

[Brief description of the drawings]

FIG. 1 is a perspective view after the combination of the present invention.

FIG. 2 is an exploded perspective view of the present invention.

FIG. 3 is a cross-sectional view of the present invention, showing a state in which the fixing device is placed in the passage of the heat radiation piece but is not yet locked.

FIG. 4 is a sectional view of the present invention, showing a state after the fixing device is locked.

FIG. 5 is another embodiment of the present invention.

FIG. 6 is an exploded perspective view of FIG.

FIG. 7 is a perspective view from another angle of FIG. 5;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Cartridge 11 Concave space 12 Convex part 13 Positioning pillar 14 Fixed pillar 141 Ring part 15 Stop part 16 Locking elastic piece 17 Slope 20 CPU board 21 CPU chip 22 Heat transfer thin film 23 Perforation 30 Heat radiation piece 31 Heat sink fin piece 32 Passage 33 Perforation 34 upper plate layer 35 lower plate layer 40 fixing device 41 large drilling 42 small drilling 43 stop piece 431 stop hole 432 arc surface 44 operating fulcrum 45 positioning piece 50 fixing device 51 connecting rod 511 stop piece 52 first pressing plate 521 Large drilling 522 Small drilling 523 Operating fulcrum 524 Positioning piece 53 Second pressing plate 531 Large drilling 532 Small drilling 533 Operating fulcrum 534 Positioning piece

Claims (8)

[Utility model registration claims] A cartridge (10) is provided for mounting a CPU substrate (20) having a concave space (11). A convex portion (12) and a convex portion (2) are provided at appropriate positions in the concave space (11). Positioning column 13 and fixed column 14
And a positioning column 1 at the upper end of the cartridge 10.
The cartridge 10 in which a plurality of stoppers 15 are provided at positions opposite to the position 3, the one CPU board 20, and the above-described C having a perforation 23 at a position corresponding to the positioning column 13 and the fixing column 14.
The PU substrate 20, which is one heat radiation piece 30, includes a plurality of heat radiation fin pieces 31, and has two passages 32 at a portion of the heat radiation fin pieces 31 opposed to the above-mentioned stopper 15. The heat radiating piece 30 is provided with a perforation 33 at a position opposed to the positioning column 13 and the fixed column 14, and is composed of two fixing devices 40. Heat radiation piece 30
The two fixing devices 40, which are tightly sandwiched between the ring members 1.
41, the fixing column 14 passes through the corresponding perforations 23, 33 of the CPU board 20 and the heat radiation piece 30 and the passage 3
2, a large perforation 41 and a small perforation 42 are provided on one side of the fixing device 40 and communicate with each other, and a stop piece 43 is extended on the other side. Is provided, an operation fulcrum 44 which is recessed downward is formed at an appropriate position approaching the large perforation 41 and the small perforation 42, and a positioning piece 45 is formed at an appropriate position near the stop piece 43 by a stamping press. The ring portion 141 of the fixed column 14 is fitted into the large hole 41 of the fixing device 40, and the stopper 4
3 is pressed, the stop hole 431 is inserted into the cartridge 10.
The fixing device 40 is moved by engaging with the stopper 15 at the upper end, the positioning column 13 is pulled in the direction of the small perforation 42, the positioning piece 45 is locked to the periphery of the heat radiation piece 30, and the fixing device is 4
0 is assembled in the heat radiating piece 30 so that the bottom surface of the heat radiating piece 30 and the CPU chip 21 are tightly joined to each other. 2. The apparatus according to claim 1, wherein locking elastic pieces are provided on both outer sides of the cartridge. 3. The heat radiation piece combination device for a CPU cartridge according to claim 1, wherein the end of said stopper piece 43 is bent to form an arc surface 432 for facilitating the locking operation. 4. A stopper 1 at an upper end of the cartridge 10.
The heat radiating piece combination device for a CPU cartridge according to claim 1, wherein a slope (17) is formed at a portion opposing to (5). 5. A cartridge 10 which is used to mount a CPU board 20 with a concave space 11 which is concave, and which is provided at an appropriate position of the concave space 11 with a convex portion 12 and two convex portions opposed to each other. Positioning column 13 and fixed column 14
And a positioning column 1 at the upper end of the cartridge 10.
The cartridge 10 in which a plurality of stoppers 15 are provided at positions opposite to the position 3, the one CPU board 20, and the above-described C having a perforation 23 at a position corresponding to the positioning column 13 and the fixing column 14.
The PU substrate 20, which is one heat radiation piece 30, includes a plurality of heat radiation fin pieces 31, and has two passages 32 at a portion of the heat radiation fin pieces 31 opposed to the above-mentioned stopper 15. The heat dissipating piece 30 provided with a perforation 33 at a position facing the positioning column 13 and the fixed column 14, which is a single fixing device 50, is laid over the passage 32, and connects the CPU substrate 20 with the cartridge 10. Heat radiation piece 30
The above-mentioned one fixing device 50, which is tightly sandwiched between the
41, the fixing column 14 passes through the corresponding perforations 23, 33 of the CPU board 20 and the heat radiation piece 30 and the passage 3
2, the first fixing plate 52 and the second pressing plate 53 are provided on the fixing device 50, and the first pressing plate 52 and the second pressing plate 53 communicate with each other. Large perforations 521,
531 and small perforations 522, 532 are provided, and the other side is connected and integrated by one connecting rod 51, and the connecting rod 5
1, a stop piece 511 is extended, a stop hole is provided at the end of the stop piece 511, and large holes 521, 531 and small holes 52 are provided.
2, 532 are provided at appropriate positions near the depressions, and positioning pieces 524 are provided at appropriate positions near the stop pieces 511 of the first pressing plate 52 and the second pressing plate 53 by stamping presses. The ring portion 141 of the fixed column 14 fits into the large perforations 521 and 531, and the stopper piece 511 is pressed by the leverage principle, so that the stopper hole is engaged with the stopper 15 at the upper end of the cartridge 10. And
The fixing device 50 moves, and the positioning column 13
2, the positioning piece 524 is locked to the edge of the heat radiating piece 30, the fixing device 50 is assembled in the heat radiating piece 30, and the bottom surface of the heat radiating piece 30 and the CPU chip 21 come into close contact with each other. A heat radiation piece combination device for a CPU cartridge having the above configuration. 6. The combination device according to claim 5, wherein locking elastic pieces are provided on both outer sides of the cartridge. 7. The heat radiation piece combination device for a CPU cartridge according to claim 5, wherein an end of the stopper piece 511 is bent to form an arc surface for facilitating a locking operation. 8. A stopper 1 at an upper end of the cartridge 10.
The heat radiation piece combination device for a CPU cartridge according to claim 5, wherein a slope 17 is formed at a portion facing the fifth piece.