JP3059828B2 - Light emitting diode display - Google Patents
Light emitting diode displayInfo
- Publication number
- JP3059828B2 JP3059828B2 JP4169173A JP16917392A JP3059828B2 JP 3059828 B2 JP3059828 B2 JP 3059828B2 JP 4169173 A JP4169173 A JP 4169173A JP 16917392 A JP16917392 A JP 16917392A JP 3059828 B2 JP3059828 B2 JP 3059828B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- light
- emitting diodes
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は複数の発光ダイオードラ
ンプを配置した発光ダイオード表示装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode display in which a plurality of light emitting diode lamps are arranged.
【０００２】[0002]
【従来の技術】従来より複数の発光ダイオードランプを
整列させて選択的に点灯駆動する装置が利用されてい
る。その中で例えば本出願人の特願平２−２５９２０１
号を図５に示す。表示装置の部分的平面図を示す図５に
於て、表示面基板４０上に発光ダイオードランプ４１が
配置されている。この発光ダイオードランプ４１に於
て、発光色が赤色の発光ダイオード４２と緑色の発光ダ
イオード４３が水平方向に載置面４４上に載置されてい
る。２個の青色の発光ダイオード４５が鉛直方向に載置
されている。そして各発光ダイオード４２、４３、４５
の周辺を覆う様に透光性樹脂４６が設けられている。2. Description of the Related Art Conventionally, there has been used a device for arranging a plurality of light emitting diode lamps and selectively driving them. Among them, for example, Japanese Patent Application No. 2-259201 filed by the present applicant.
The numbers are shown in FIG. In FIG. 5 showing a partial plan view of the display device, a light emitting diode lamp 41 is arranged on a display surface substrate 40. In this light emitting diode lamp 41, a light emitting diode 42 emitting red light and a light emitting diode 43 emitting green light are mounted on a mounting surface 44 in a horizontal direction. Two blue light emitting diodes 45 are mounted in the vertical direction. And each light emitting diode 42, 43, 45
The transparent resin 46 is provided so as to cover the periphery of.
【０００３】[0003]
【発明が解決しようとする課題】しかして上述の装置で
は、混色時の表示品質が悪い。例えば赤色、緑色の発光
ダイオード４２、４３を点灯させて橙色を表示する場合
に、この両発光ダイオードは載置面４４の中心に対して
偏心しているため、赤色、緑色の発光領域４７、４８が
水平方向４９に偏心する。ところが人が装置を見る時、
見る方向は水平方向４９に沿って行なわれ易い。何故な
らば人が装置を鉛直方向に沿って見るには人が背のびし
たりしゃがんだりする必要があるからである。そして人
がこの装置を観測する時、水平方向４９に沿って発光ダ
イオードランプ４１を左、中央、右から順に緑色、橙
色、赤色と変化して観測することになる。However, in the above-described apparatus, the display quality at the time of color mixing is poor. For example, when the red and green light-emitting diodes 42 and 43 are turned on to display orange, the red and green light-emitting regions 47 and 48 are eccentric with respect to the center of the mounting surface 44. Eccentric in the horizontal direction 49. However, when a person looks at the device,
The viewing direction is easily performed along the horizontal direction 49. This is because humans need to stretch and squat down to see the device vertically. When a person observes the device, the user observes the light emitting diode lamp 41 along the horizontal direction 49 in order from left, center, and right to green, orange, and red.
【０００４】次に青色の発光ダイオード４５は発光効率
が低いので、発光効率を上げるためにＰｎ接合を下にな
る様に（ジャンクションダウン）、サブマウント５０上
に銀ペーストを介して固着されている。ところが銀ペー
ストは濡れ性が良いのでＰｎ接合までも覆うので電流漏
れが生ずる。故に本発明は上述の従来の欠点に鑑みてな
されたものであり、混色時の表示品質の良いかつ電流漏
れを起こさない発光ダイオード表示装置を提供するもの
である。Next, since the blue light emitting diode 45 has low luminous efficiency, it is fixed on the submount 50 via a silver paste so that the Pn junction is located below (junction down) in order to increase the luminous efficiency. . However, since the silver paste has good wettability and covers even the Pn junction, current leakage occurs. Therefore, the present invention has been made in view of the above-mentioned conventional drawbacks, and provides a light emitting diode display device having good display quality at the time of color mixing and having no current leakage.
【０００５】[0005]
【課題を解決するための手段】本発明は上述の課題を解
決するために、表示面基板とその上に複数の発光ダイオ
ードランプを配置する。そしてその発光ダイオードラン
プの構成として、載置面の中心に対して略対称にかつ略
鉛直方向に発光色の異なる第１、第２の発光ダイオード
を配置する。載置面の中心に対して略対称にかつ略水平
方向に於て、第１、第２の発光ダイオードと異なる発光
色を持つ複数の第３の発光ダイオードを配置する。そし
て少なくとも各発光ダイオードの周辺を透光性樹脂で覆
うものである。According to the present invention, a display surface substrate and a plurality of light emitting diode lamps are arranged thereon to solve the above-mentioned problems. As a configuration of the light emitting diode lamp, first and second light emitting diodes having different emission colors are arranged substantially symmetrically and substantially vertically with respect to the center of the mounting surface. A plurality of third light emitting diodes having different emission colors from the first and second light emitting diodes are arranged substantially symmetrically and substantially horizontally with respect to the center of the mounting surface. Then, at least the periphery of each light emitting diode is covered with a translucent resin.
【０００６】本発明は更に望ましくは、載置面上のサブ
マウントの上に半田を介して第３の発光ダイオードを載
置するものである。[0006] The present invention further desirably mounts the third light emitting diode on the submount on the mounting surface via solder.
【０００７】[0007]
【作用】本発明は上述の様に、発光色の異なる第１、第
２の発光ダイオードを載置面の中心に対して略対称にか
つ略鉛直方向に配置する。故に第１、第２の発光ダイオ
ードを同時に点灯させた時、水平方向に第１、第２の発
光領域が略対称に存在するので、水平方向での混色の変
化が少ない。また本発明はサブマウント上に半田を介し
て第３の発光ダイオードを載置するので、漏れ性の悪い
半田はＰｎ接合まで達しないから、電流漏れを防止でき
る。According to the present invention, as described above, the first and second light emitting diodes having different emission colors are arranged substantially symmetrically and substantially vertically with respect to the center of the mounting surface. Therefore, when the first and second light-emitting diodes are simultaneously turned on, the first and second light-emitting regions are substantially symmetrical in the horizontal direction, so that there is little change in color mixture in the horizontal direction. Further, in the present invention, since the third light emitting diode is mounted on the submount via the solder, the solder having poor leakage does not reach the Pn junction, so that current leakage can be prevented.
【０００８】[0008]
【実施例】以下に本発明実施例を図１乃至図３に従って
説明する。図１は本実施例に係る発光ダイオード表示装
置の平面図、図２は図１のＡＡ断面図、図３は図２のＢ
部詳細図である。これらの図に於て、基台１は例えばコ
バールから成り、絞り加工を施こされ、上面に略平坦な
面、すなわち載置面２を有する。この載置面２には２ケ
の略扇形の切欠部が加工されている。この切欠部の中に
コバールから成るリード３、４、５、６、７、８が配置
されている。そして各リードを支持し、導電部を絶縁す
る様に基台１の絞り部の中へ、硬質ガラスから成る封止
剤９が設けられている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a plan view of a light emitting diode display device according to the present embodiment, FIG. 2 is a sectional view taken along the line AA of FIG. 1, and FIG.
FIG. In these drawings, a base 1 is made of, for example, Kovar, subjected to drawing, and has a substantially flat surface, that is, a mounting surface 2 on an upper surface. The mounting surface 2 has two substantially fan-shaped cutouts. The leads 3, 4, 5, 6, 7, 8 made of Kovar are arranged in the cutouts. A sealant 9 made of hard glass is provided in the narrowed portion of the base 1 so as to support each lead and insulate the conductive portion.
【０００９】第１の発光ダイオード１０は例えば透明な
ＧａＰから成り、波長７００ｎｍの赤色を発光し、大き
さは縦、横が約３００μｍ、厚さが約２８０μｍであ
る。第１の発光ダイオード１０は載置面２の中心より上
方に位置して、銀ペーストを介して載置面２上に固着さ
れている。第２の発光ダイオード１１は例えば透明なＧ
ａＰから成り、波長５６０ｎｍの緑色を発光し、大きさ
は縦、横が約３００μｍ厚さが約２８０μｍである。第
２の発光ダイオード１１は載置面２の中心より下方に位
置し、銀ペーストを介して載置面２上に固着されてい
る。上述の様に、第１、第２の発光ダイオード１０、１
１は載置面２の中心に対して略対称にかつ略鉛直方向に
配置されている。The first light emitting diode 10 is made of, for example, transparent GaP, emits red light having a wavelength of 700 nm, and is about 300 μm in length and width and about 280 μm in thickness. The first light emitting diode 10 is located above the center of the mounting surface 2 and is fixed on the mounting surface 2 via a silver paste. The second light emitting diode 11 is, for example, a transparent G
It is composed of aP, emits green light having a wavelength of 560 nm, and has a size of about 300 μm in length and width and about 280 μm in thickness. The second light emitting diode 11 is located below the center of the mounting surface 2 and is fixed on the mounting surface 2 via a silver paste. As described above, the first and second light emitting diodes 10, 1
1 is arranged substantially symmetrically with respect to the center of the mounting surface 2 and in a substantially vertical direction.
【００１０】サブマウント１２は略直方体の形状をして
おり、裏面から順次、金層１３と白金層１４と金層１５
と高い抵抗値を有するシリコン層１６と金層１７と白金
層１８と金層１９で形成されている。またシリコン層１
６の代りに、石英等の透明絶縁物を用いても良い。載置
面２の中心に対して略対称に銀ペーストが塗布され、そ
の上に２個のサブマウント１２が固着されている。The submount 12 has a substantially rectangular parallelepiped shape, and sequentially includes a gold layer 13, a platinum layer 14, and a gold layer 15 from the back.
And a silicon layer 16, a gold layer 17, a platinum layer 18, and a gold layer 19 having high resistance values. Silicon layer 1
Instead of 6, a transparent insulator such as quartz may be used. A silver paste is applied substantially symmetrically with respect to the center of the mounting surface 2, and two submounts 12 are fixed thereon.
【００１１】２個の第３の発光ダイオード２０は載置面
２の中心に対して略対称にかつ略水平方向に配置されて
いる。第３の発光ダイオード２０は裏面から順次、裏面
電極２１と不純物のアルミニウムを添加されたＳｉＣか
らなるＰ層２２と不純物の窒素を添加されたＳｉＣから
なるｎ層２３とＳｉＣからなる半導体基板２４と表面電
極２５から構成され、青色を発光する。そして裏面電極
２１の裏面からＰｎ接合までの長さは５〜１０μｍであ
る。第３の発光ダイオード２０はサブマウント１２上に
半田２６を介して固着されている。半田２６は例えば錫
６３％と鉛３７％からなる共晶ハンダペーストであり、
溶融温度２６０℃、３秒間の条件で、第３の発光ダイオ
ード２０とサブマウント１２を固着している。上述の様
に第１、第２、第３の発光ダイオード１０、１１、２０
はそれぞれ載置面２からＰｎ接合までの高さが略同一に
なる様に配置されている。The two third light emitting diodes 20 are arranged substantially symmetrically with respect to the center of the mounting surface 2 and substantially horizontally. The third light emitting diode 20 includes a back electrode 21, a P layer 22 made of SiC doped with aluminum as an impurity, an n layer 23 made of SiC doped with an impurity of nitrogen, and a semiconductor substrate 24 made of SiC. It is composed of a surface electrode 25 and emits blue light. The length from the back surface of the back electrode 21 to the Pn junction is 5 to 10 μm. The third light emitting diode 20 is fixed on the submount 12 via solder 26. The solder 26 is, for example, a eutectic solder paste composed of 63% tin and 37% lead.
The third light emitting diode 20 and the submount 12 are fixed at a melting temperature of 260 ° C. for 3 seconds. As described above, the first, second, and third light emitting diodes 10, 11, 20
Are arranged such that the height from the mounting surface 2 to the Pn junction is substantially the same.
【００１２】第１、第２、第３の発光ダイオード１０、
１１、２０はそれぞれ金属細線にてリード４とリード７
と載置面２に配線されている。２個のサブマウントには
それぞれ金属細線にて、リード５とリード６に配線され
ている。First, second, and third light emitting diodes 10,
11 and 20 are fine metal wires, respectively, lead 4 and lead 7
Is placed on the mounting surface 2. The two submounts are wired to the leads 5 and 6 by thin metal wires, respectively.
【００１３】透光性樹脂２７は光拡散剤が混入されたエ
ポキシ樹脂などから成り、第１、第２、第３の発光ダイ
オード１０、１１、２０の周辺と各配線の周辺と基台１
の側面を覆う様に設けられている。これらの部品により
発光ダイオードランプ２８が構成されている。The translucent resin 27 is made of an epoxy resin mixed with a light diffusing agent or the like, and has a periphery of the first, second, and third light emitting diodes 10, 11, and 20, the periphery of each wiring, and the base 1
It is provided so as to cover the side surface of. These components constitute a light emitting diode lamp 28.
【００１４】表示面基板２９はガラス入りエポキシ樹脂
からなり長尺の形状をしており、発光ダイオードランプ
２８の配置すべき位置に合わせて６個ずつの透孔を有し
ている。接続パッド３０は表示面基板２９の裏面の略中
央に長尺に設けられた配線パターンである。回路基板３
１はガラス入りエポキシ樹脂等からなり、表示面基板２
９と略直交して固定されている。発光ダイオードランプ
２８のリード３、４、５、６、７、８はそれぞれ回路基
板３１上の導電層に半田付けされている。上述の様にし
て、複数の発光ダイオードランプ２８が整列して表示面
基板２９上に固定され、例えば縦１６個×横１６個＝２
５６個の発光ダイオードランプ２８を有する発光ダイオ
ード表示装置３２が構成されている。The display surface substrate 29 is made of an epoxy resin containing glass and has a long shape, and has six through holes corresponding to positions where the light emitting diode lamps 28 are to be arranged. The connection pad 30 is a long wiring pattern provided substantially at the center of the back surface of the display surface substrate 29. Circuit board 3
Reference numeral 1 denotes a display surface substrate made of glass-containing epoxy resin or the like.
9 and is fixed substantially orthogonally. The leads 3, 4, 5, 6, 7, 8 of the light emitting diode lamp 28 are each soldered to a conductive layer on the circuit board 31. As described above, the plurality of light-emitting diode lamps 28 are aligned and fixed on the display surface substrate 29. For example, 16 × 16 = 2
A light emitting diode display device 32 having 56 light emitting diode lamps 28 is configured.
【００１５】次に本実施例に係る発光ダイオード表示装
置の発光ダイオードランプの点灯状態を図４に従って説
明する。最初に第１の発光ダイオード１０（赤色）と第
２の発光ダイオード１１（緑色）を点灯させて橙色を表
示する場合を述べる。第１、第２の発光ダイオード１
０、１１は載置面２の中心に対して略対称にかつ略鉛直
方向に配置されているので、赤色、緑色の発光領域３
３、３４が鉛直方向３５に偏心する。人が装置を観測す
る時、見る方向は水平方向３６に沿って行なわれ易い。
そして水平方向３６に沿って発光ダイオードランプ２８
を左、中央、右から順に観測した時、いずれの方向でも
橙色が変化せずに観測できる。Next, the lighting state of the light emitting diode lamp of the light emitting diode display device according to this embodiment will be described with reference to FIG. First, a case where the first light emitting diode 10 (red) and the second light emitting diode 11 (green) are turned on to display orange will be described. First and second light emitting diodes 1
Since the reference numerals 0 and 11 are arranged substantially symmetrically with respect to the center of the mounting surface 2 and in a substantially vertical direction, the red and green light emitting regions 3 are provided.
3, 34 are eccentric in the vertical direction 35. When a person observes the device, the viewing direction is likely to be along the horizontal direction 36.
Then, along the horizontal direction 36, the light emitting diode lamp 28
When observing in order from left, center, and right, you can observe without changing the orange color in any direction.
【００１６】次に第１の発光ダイオード１０（赤色）と
２個の第３の発光ダイオード２０（青色）を点灯させて
紫色を表示する場合を述べる。２個の第３の発光ダイオ
ード２０は載置面２の中心に対して略対称にかつ略水平
方向に配置されているので、混色となる紫色は載置面２
の中心を対称点として水平方向３６に沿って対称とな
る。従って水平方向３６に沿って発光ダイオードランプ
２８を左、中央、右から順に観測した時、いずれの方向
でも紫色が変化せずに観測できる。そして第２の発光ダ
イオード１１（緑色）と２個の第３の発光ダイオード２
０（青色）を点灯させて青緑を表示する場合も、上述の
紫色の場合と同様である。すなわち発光ダイオードラン
プ２８を左、中央、右から順に観測すると、いずれの方
向でも青緑が変化せずに観測できる。Next, a case will be described in which the first light emitting diode 10 (red) and the two third light emitting diodes 20 (blue) are turned on to display purple. Since the two third light-emitting diodes 20 are arranged substantially symmetrically and substantially horizontally with respect to the center of the mounting surface 2, the mixed color purple appears on the mounting surface 2.
Are symmetrical along the horizontal direction 36 with the center of symmetry as the point of symmetry. Accordingly, when the light-emitting diode lamp 28 is observed along the horizontal direction 36 from the left, the center, and the right, the purple color can be observed in any direction without change. Then, the second light emitting diode 11 (green) and the two third light emitting diodes 2
The case where blue (green) is displayed by lighting 0 (blue) is the same as the case of purple described above. That is, when the light-emitting diode lamp 28 is observed in order from the left, the center, and the right, the blue-green color can be observed in any direction without change.
【００１７】[0017]
【発明の効果】本発明は上述の如く、発光色の異なる第
１、第２の発光ダイオードを載置面の中心に対して略対
称にかつ鉛直方向に配置する。故に第１、第２の発光ダ
イオードを同時に点灯させた時、第１、第２の発光領域
は鉛直方向に偏心するが水平方向に略対称的に存在す
る。従って水平方向に沿って発光ダイオードを左、中
央、右又はその逆の順に観測した時、いずれの方向でも
混合色が変化せずに観測できる。According to the present invention, as described above, the first and second light emitting diodes having different emission colors are arranged substantially symmetrically with respect to the center of the mounting surface and in the vertical direction. Therefore, when the first and second light emitting diodes are simultaneously turned on, the first and second light emitting regions are eccentric in the vertical direction but exist substantially symmetrically in the horizontal direction. Therefore, when the light emitting diodes are observed in the horizontal, left, center, right or vice versa order, the mixed colors can be observed in any direction without change.
【００１８】本発明は更に望ましくは、サブマウント上
に半田を介して第３の発光ダイオードを載置する。半田
は加熱して液体となった状態で表面張力が強く、濡れ性
が悪いので、半田が第３の発光ダイオードの側面に沿っ
て這い上がることがない。故に半田がＰｎ接合まで達し
ないから電流漏れを防止できる。そして半田がサブマウ
ント上の金層と合金化することによって固着強度が確保
できる。The present invention further desirably mounts the third light emitting diode on the submount via solder. Since the solder has a high surface tension and poor wettability in a liquid state when heated, the solder does not crawl along the side surface of the third light emitting diode. Therefore, since the solder does not reach the Pn junction, current leakage can be prevented. Then, the solder is alloyed with the gold layer on the submount to secure the fixing strength.
【図１】本発明の実施例に係る発光ダイオード表示装置
の平面図である。FIG. 1 is a plan view of a light emitting diode display according to an embodiment of the present invention.
【図２】図１のＡＡ断面図である。FIG. 2 is a sectional view taken along the line AA of FIG.
【図３】図２のＢ部詳細図である。FIG. 3 is a detailed view of a portion B in FIG. 2;
【図４】本発明の実施例に係る発光ダイオード表示装置
の発光ダイオードランプの点灯状態を示す図面である。FIG. 4 is a view showing a lighting state of a light emitting diode lamp of the light emitting diode display according to the embodiment of the present invention.
【図５】従来の発光ダイオード表示装置の部分的平面図
である。FIG. 5 is a partial plan view of a conventional light emitting diode display device.
２ 載置面 １０ 第１の発光ダイオード １１ 第２の発光ダイオード １２ サブマウント ２０ 第３の発光ダイオード ２６ 半田 ２７ 透光性樹脂 ２８ 発光ダイオードランプ ２９ 表示面基板 ３２ 発光ダイオード表示装置 2 mounting surface 10 first light emitting diode 11 second light emitting diode 12 submount 20 third light emitting diode 26 solder 27 translucent resin 28 light emitting diode lamp 29 display surface substrate 32 light emitting diode display
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 33/00 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. 7 , DB name) H01L 33/00
Claims (2)
された複数の発光ダイオードランプを具備した発光ダイ
オード表示装置に於て、前記発光ダイオードランプは載
置面の中心に対して略対称にかつ略鉛直方向に配置され
た発光色の異なる第１、第２の発光ダイオードと、その
載置面の中心に対して略対称にかつ略水平方向に配置さ
れかつ前記第１、第２の発光ダイオードと異なる発光色
を持つ複数の第３の発光ダイオードと、少なくとも前記
各発光ダイオードの周辺を覆う透光性樹脂を具備する事
を特徴とする発光ダイオード表示装置。1. A light-emitting diode display device comprising a display surface substrate and a plurality of light-emitting diode lamps disposed on the display surface substrate, wherein the light-emitting diode lamps are substantially symmetric with respect to the center of the mounting surface. First and second light emitting diodes having different emission colors arranged substantially vertically and substantially symmetrically and substantially horizontally with respect to the center of the mounting surface thereof, and the first and second light emitting diodes are arranged substantially horizontally. A light-emitting diode display device comprising: a plurality of third light-emitting diodes having different emission colors from the light-emitting diodes; and a light-transmitting resin covering at least the periphery of each of the light-emitting diodes.
れ、そのサブマウント上に半田を介して前記第３の発光
ダイオードが載置されている事を特徴とする請求項１の
発光ダイオード表示装置。2. The light emitting diode according to claim 1, wherein a submount is mounted on the mounting surface, and the third light emitting diode is mounted on the submount via solder. Display device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4169173A JP3059828B2 (en) | 1992-06-26 | 1992-06-26 | Light emitting diode display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4169173A JP3059828B2 (en) | 1992-06-26 | 1992-06-26 | Light emitting diode display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0613657A JPH0613657A (en) | 1994-01-21 |
| JP3059828B2 true JP3059828B2 (en) | 2000-07-04 |
Family
ID=15881606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4169173A Expired - Fee Related JP3059828B2 (en) | 1992-06-26 | 1992-06-26 | Light emitting diode display |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3059828B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100682563B1 (en) | 1999-07-26 | 2007-02-15 | 라보 스피아 가부시키가이샤 | Bulk lens, light emitting body, lighting device and optical information system |
| TWI243644B (en) | 2000-04-21 | 2005-11-21 | Labosphere Inst | Scaring device |
| WO2007010879A2 (en) * | 2005-07-15 | 2007-01-25 | Matsushita Electric Industrial Co., Ltd. | Light-emitting module and mounting board used therefor |
| WO2008111504A1 (en) | 2007-03-12 | 2008-09-18 | Nichia Corporation | High-output light emitting device and package used therefor |
-
1992
- 1992-06-26 JP JP4169173A patent/JP3059828B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0613657A (en) | 1994-01-21 |
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