JP3044828U - Connection pin for circuit board - Google Patents

Abstract

An object of the present invention is to provide a circuit board connection pin that can be easily attached and detached and replaced without mounting an IC or an auxiliary board to a main circuit board by soldering or the like. SOLUTION: A connection pin 1 is composed of a fixed pin 3, a movable pin 2 and a spring 4, and a small diameter contact portion 5 is formed at one end of the movable pin 2 and a large diameter cylindrical portion 6 is formed at the other end. One end of the pin 3 is formed with a fitting portion 7 fitted into the cylindrical portion 6, the other end is formed with a press-fitting portion 9 fixed to a connection holder 8, and a connecting portion 10 is formed at the tip to connect to a circuit board. Is drilled on one side with a mounting hole 11 provided with a hole for inserting the contact portion 5 of the movable pin 2 and a hole for inserting the cylindrical portion 6 concentrically.
The movable pin 2 is inserted with the contact portion 5 first, the spring 4 is inserted into the cylindrical portion 6, the fitting portion 7 is fitted while compressing the spring 4, and the fixed pin 3 is press-fitted and fixed.
Was slidably held.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to circuit board connection pins for detachably connecting an IC or an auxiliary board to a main circuit board.

[0002]

[Problems to be solved by the invention]

 2. Description of the Related Art Conventionally, with the increase in the number of connection terminals of an LSI, a pin grid type package in which a large number of connection pins are planted on the lower surface of the LSI and bonded from the LSI chip to the connection pins has been adopted. However, in the pin grid type package, the distance between the pins is limited in order to implant the pins, and the pitch of 2.54 mm is almost the limit. In a multi-function, large-capacity LSI, the number of connection terminals becomes enormous, and the area increases with a 2.54 mm pitch, and the circuit board requires the same area, resulting in a large circuit board, resulting in cost and mounting problems. Has occurred. In addition, when the degree of integration of the LSI increases, the internal temperature of the LSI increases, and it is necessary to provide a heat radiating plate 23 on the upper surface of the LSI for heat dissipation, which causes a problem that the package becomes large.

As a countermeasure, as shown in FIG. 9 and FIG. 10, a ball grid type in which a number of balls 22 made of gold or solder are arranged on the lower surface of an LSI and bonded and connected directly from an LSI chip to the balls. IC21 has been developed. In this ball grid type IC, the one having a ball size approaching 1.27 mm has been developed, and is used in an LSI incorporating a digital signal processor or the like requiring a large number of connection terminals.

In order to directly solder this LSI to a circuit board, a conductor land is provided on the circuit board in accordance with the size between the balls, a cream solder is printed on the conductor land, and at the same time, a photocurable insulating material is provided around the periphery. A method of printing a resin or a thermosetting insulating resin, mounting a ball of a ball grid type IC on the conductor land, irradiating ultraviolet rays or heating at a high temperature, fixing the IC, and simultaneously performing solder connection is adopted. In this case, once the LSI is soldered to the circuit board, it is not easy to remove the LSI. If the LSI is defective, the entire circuit board is discarded. It is an object of the present invention to provide a circuit board connection pin which can be easily attached and detached and replaced without directly mounting the ball grid type IC on a circuit board.

[0005]

[Means to solve the problem]

 In the present invention, the connection pin is composed of a fixed pin, a movable pin, and a spring, and a small diameter contact portion that contacts the ball terminal of the IC is formed at one end of the movable pin, and a large diameter cylindrical portion is formed at the other end. At one end of the pin is formed a fitting part to be fitted into the cylindrical part, at the other end a press-fit part to be fixed to the connection holder, and at the tip a connection part to be connected to the circuit board. Drill a mounting hole that has a hole for inserting the contact part of the movable pin and a hole for inserting the cylindrical part concentrically, insert the movable pin into the mounting hole with the contact part first, and insert the spring into the cylindrical part Then, the fitting portion was fitted while compressing the spring, the fixed pin was press-fitted and fixed, and the movable pin was slidably held. In addition, a press-fit portion for fixing the cylindrical portion at one end of the fixing pin and a connection portion for connecting to the circuit board at the other end, and a contact for contacting the ball terminal of the IC at one end of the movable pin. And a fitting portion for fitting into the cylindrical portion at the other end. Furthermore, the connection pin is composed of a connection holder, a spring, a pair of upper and lower contact pins, and a pair of upper and lower flanged bushes, with one end of the contact pin contacting the ball terminal of the IC and the other end of the contact pin. Is vertically formed a disc portion, the connection holder is formed with an insertion hole through which the disc portion is inserted, while the flanged bush is provided with an axial hole through which the contact portion is inserted, and an outer diameter press-fit into the insertion hole. A disk was inserted from above and below with a spring interposed in the insertion hole, the contact pin was passed through the shaft hole, and the flanged bush was press-fitted from above and below. The connection pin is composed of a fixing pin, a connection holder, a spring, a bush with a flange, and a contact pin. The connection holder is provided with a plurality of through holes, and a fixing pin is provided on one side of the mounting hole. It was erected by press-fitting, a spring was inserted from the other side, and a bush with a flange into which a movable pin was inserted was pressed in against the spring, and the movable pin was slidably held.

[0006]

[Embodiment of the invention]

 Embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a front view showing the configuration of the connection pin of the present invention, and FIG. The connection pin 1 includes a movable pin 2, a fixed pin 3, and a spring 4. The movable pin 2 has a contact portion 5 formed at one end thereof, and a tip of the contact portion 5 is provided with a conical groove 27 which makes uniform contact with the ball terminal of the IC. The outer diameter of the other end of the movable pin 2 is made larger than that of the contact portion 5, and a cylindrical portion 6 is formed at the tip. One end of the fixing pin 3 is fitted into the cylindrical portion 6 at a certain depth according to the inner diameter of the cylindrical portion 6, a press-fit portion 9 is press-fitted into the connection holder 8, and the other end is connected to the circuit board. The connecting part 10 to be connected is formed. The outer diameter of the spring 4 is such that the outer diameter of the coil is slidably inserted into the cylindrical portion 6, and the spring 4 is inserted into the cylindrical portion 6 to urge the movable pin 2 outward. The connection holder 8 is made of an insulating material, and has a large number of mounting holes 11 formed on the surface thereof at regular intervals (for example, at a pitch of 1.27 mm) corresponding to an IC ball grid (shown in FIG. 9).

In this state, as shown in FIG. 2, the movable pin 2, the spring 4, and the fixed pin 3 are inserted into the mounting hole 11 of the connection holder 8 in this order, and the press-fit portion 9 of the fixed pin 3 is inserted into the connection holder 8. Press in. A circuit board (not shown) is provided with an insertion hole and a conductor land therearound in accordance with the fixing pin 3 of the connection holder 8, and the connecting portion 10 of the fixing pin 3 is inserted and soldered to the conductor land. Thus, the connection holder 8 is fixed to the circuit board by the connection portion 10 of the fixing pin 3. When the connection holder 8 is formed by injection molding, the inner diameter of the mounting hole 11 is reduced at the upper part thereof to form a stepped hole, and the contact portion 5 of the movable pin 2 is inserted through the small diameter portion of the stepped hole. The movable pin 2 can be prevented from falling off. The ball grid type IC is placed on the connection holder 8, the ball grid is aligned with the tip of the contact portion 5 of the movable pin 2, the ball grid type IC is pressed against the connection holder 8, the movable pin 2 is pushed in, and the spring 4 And the fixing pin 3 to securely connect to the circuit board.

FIG. 3 is a front view showing a configuration of a connection pin according to a second embodiment, and FIG. 4 is a cross-sectional view showing a mounting state of the connection pin. The fixing pin 3a has a cylindrical portion 6a at one end, a press-fitting portion 9a for press-fitting the connection holder 8, and a connecting portion 10 for connecting to the circuit board at the other end. The movable pin 2a has a contact portion 5a at one end, a conical groove 27 at the tip of the contact portion 5a, and a fitting portion 7a corresponding to the inner diameter of the cylindrical portion 6a at the other end. The outer diameter of the spring 4a is slidable on the cylindrical portion 6a, and is inserted into the cylindrical portion 6a to urge the movable pin 2a outward. A large number of mounting holes 11a are formed in the connection holder 8 at regular intervals, as in the above embodiment. As shown in FIG. 4, the movable pin 2a, the spring 4a, and the fixed pin 3a are inserted into the mounting hole 11a of the connection holder 8 in this order, and the press-fit portion 9a of the fixed pin 3a is pressed into the connection holder 8. The connection holder 8 is fixed to the main circuit board by inserting the connection portion 10 of the fixing pin 3a into a main circuit board (not shown) and attaching it to a solder. The present embodiment is an example in which a cylindrical portion 6a is formed on the fixed pin 3a side and a fitting portion 7a is formed on the movable pin 2a side, and its assembly and function are the same as those of the first embodiment.

FIG. 5 shows a third embodiment in which the connection holder 8 is replaced with a molded product made of an insulating material, and a laminated board (for example, a printed wiring board) made of an insulating material is used. , A pair of flanged bushes 13 and a coil spring 14. A number of mounting holes 11b are formed in the printed wiring board 16 in accordance with the ball grid of the ball grid type IC, and a conductor layer 19 is formed in the mounting holes 11b by through-hole plating. The contact pin 12 has a conical groove 27 corresponding to an IC ball terminal at one end of a slide portion 15 having a predetermined length, and a disk portion 17 formed vertically at the other end. The disk portion 17 is slidably inserted into the mounting hole 11b including the conductor layer 19. The flanged bush 13 has a stepped ring shape, and has a press-fit portion 9b press-fitted into the mounting hole 11b on one side and a flange 20 having an outer diameter covering the mounting hole 11b on the other side. A retaining projection or knurling is performed outside the press-fitting portion 9b, and a shaft hole 18 through which the slide pin portion 15 is inserted is provided in the center. The coil spring 14 is sandwiched between the disk portions 17 of the pair of upper and lower contact pins 12, inserted into the mounting hole 11b of the printed wiring board 16, and the slide pin portion 15 is inserted from above and below the bush 13 with the flange. And fix it. The printed wiring board 16 is sandwiched from above and below in accordance with the grid pattern of the circuit board and the ball grid of the IC, the ball grid type IC is pressed against the circuit board, and the coil springs 14 are pressed to form the grid pattern and the ball grid. Connect securely between In this embodiment, conduction can be secured by the upper and lower contact pins 12 and the coil springs 14 without plating through holes on the mounting holes 11b. 17, and the reliability of conduction can be further improved.

FIG. 6 shows a fourth embodiment, which comprises a fixed pin 3c, a connection holder 8, a movable pin 2c, a bush 13a with a flange, and a coil spring 14a. A plurality of mounting holes 11c are formed in the connection holder 8 in accordance with the ball grid of the ball grid type IC. One end of the fixing pin 3b is formed with a conical projection 24 for supporting one of the coil springs 14a, a press-fitting portion 9c for press-fitting and fixing the connection holder 8, and a connecting portion 10 for connecting to the circuit board at the other end. . The movable pin 2b has at one end a projection 25 consisting of a cylindrical portion and a conical projection fitted into the flanged bush 13a, and at the other end a conical groove 27 at the tip and a flange 20 of the flanged bush 13a. A disk portion 26 to be in contact is provided. The connection pin 10 is formed by press-fitting the fixing pin 3b from one side of the mounting hole 11c of the connection holder 8. The coil spring 14a is inserted from the other side of the mounting hole 11c, and the movable pin 2b is inserted into the flanged bush 13a as shown in FIG. Is held against the coil spring 14a. At this time, as shown in FIG. 8, the inner diameter of the flanged bush 13a is contracted by press-fitting, the movable pin 2b is pinched with the protrusion 25 left in the mounting hole 11c, and the movable pin 2b slides. Hold freely.

[0011] As described above, the connection pins 1 are composed of small-sized components corresponding to the ball grids of the ICs that are close to each other, and are continuously processed by an automatic machine. Special assembly means and labor are required to assemble and demonstrate its functions, which causes cost increases. In the present invention, by incorporating the connecting pin components in the mounting hole 11 of the connection holder 8 sequentially, the function can be sufficiently exhibited, and the labor and cost required for the assembly can be reduced.

[0012]

[Effect of the invention]

 As described above, the connection is made between the terminals of the main circuit board and the IC or the auxiliary board with the connection pins that can be extended and retracted by the spring, so that the connection can be made securely by the relatively simple holding means. Can be. Further, the IC or the auxiliary board can be mounted without soldering, the performance inspection thereof can be easily performed, and the defective replacement of the IC or the auxiliary board can be easily performed. In addition, by directly assembling the connection pins into the connection holder, a dedicated assembly machine as the connection pins and its labor can be omitted, and the manufacturing cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a front view showing a configuration of a connection pin according to the present invention.

FIG. 2 is a cross-sectional view showing an attached state of the connection pin.

FIG. 3 is a front view showing a configuration of a connection pin according to a second embodiment.

FIG. 4 is a cross-sectional view showing an attached state of the connection pin.

FIG. 5 is a cross-sectional view illustrating a mounting state of a connection pin according to a third embodiment.

FIG. 6 is a cross-sectional view illustrating a mounting state of a connection pin according to a fourth embodiment.

FIG. 7 is a cross-sectional view showing a state before mounting of the movable pin.

FIG. 8 is a sectional view showing an attached state of the movable pin.

FIG. 9 is a bottom view of the ball grid type IC.

FIG. 10 is a side view of a ball grid type IC.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Connection pin 2 Movable pin 3 Fixed pin 4 Spring 5 Contact part 6 Cylindrical part 7 Fitting part 8 Connection holder 9 Press-fit part 10 Connection part 11 Mounting hole 12 Contact pin 13 Bush with flange 14 Coil spring 15 Slide pin part 16 Printed wiring board 17 Disc portion 18 Shaft hole 19 Conductor layer 20 Flange 21 Ball grid type IC 22 Ball 23 Heat sink 24 Conical protrusion 25 Projection 26 Disc portion 27 Conical groove

Continued on the front page (51) Int.Cl. ⁶ Identification number Reference number in the agency FI Technical display location H01R 33/76 H01R 33/76

Claims (4)

[Utility model registration claims] 1. A connection holder having a plurality of connection pins provided between a main circuit board and an IC or an auxiliary board, and the IC or the auxiliary board is detachably connected to the main circuit board via the connection holder. In the connecting means, the connecting pin comprises a fixed pin, a movable pin, and a spring, and a small-diameter contact portion connected to an IC or an auxiliary substrate is formed at one end of the movable pin, and a large-diameter cylindrical portion is formed at the other end. At one end, a fitting portion to be fitted into the cylindrical portion, at the other end, a press-fitting portion to be fixed to the connection holder, and a connecting portion to be connected to the circuit board at the tip are respectively formed. A mounting hole is provided in which a hole for inserting the contact portion of the pin and a hole for inserting the cylindrical portion are provided concentrically. A movable pin is inserted into the mounting hole with the contact portion first, and a spring is inserted into the cylindrical portion. And press the spring The fitting portion fitted to slidably hold and connect pin circuit board comprising a movable pin fixing pin press-fitted to while. 2. A press-fitting portion for fixing a cylindrical portion to one end of the fixing pin, a press-fitting portion for fixing to a connection holder at the other end, and a connecting portion for connecting to a circuit board at the tip, and a ball terminal of an IC at one end of the movable pin. The connection pin for a circuit board according to claim 1, wherein a contact portion that makes contact and a fitting portion that fits into the cylindrical portion are formed at the other end. 3. The connection pin comprises a connection holder, a spring, a pair of upper and lower contact pins, and a pair of upper and lower flanged bushes, each of the contact pins having one end contacting a ball terminal of an IC, A disk portion is formed vertically at the other end, an insertion hole through which the disk portion is inserted is formed in the connection holder, and a shaft hole through which the contact portion is inserted through the flanged bush;
Forming an outer diameter portion for press-fitting into the insertion hole, inserting a disc portion from above and below with a spring in the insertion hole, passing a contact pin through the shaft hole, and press-fitting the flanged bush from above and below. Item 2. The connection pin for a circuit board according to Item 1. 4. The connection pin comprises a fixing pin, a connection holder, a spring, a bush with a flange, and a contact pin, wherein the connection holder has a plurality of through-holes formed therein. A fixed pin is erected by press-fitting on one side, a spring is inserted from the other side, and then a bush with a flange into which a movable pin is inserted is pressed in against the spring to hold the movable pin slidably. The connection pin for a circuit board according to claim 1.