JP3033324U - Semiconductor device - Google Patents

Abstract

(57) Abstract: [PROBLEMS] To suppress the spread of solder in a component mounting portion to secure the original required amount of solder, and to reliably solder an electronic component. SOLUTION: A plurality of component mounting portions 4a and 4b extending from connecting portions 2 and 5 made of plate materials, and adjacent component mounting portions 4
In a semiconductor device in which the electronic component 7 is mounted and soldered between a and 4b, and the electronic component 7 and the component mounting portions 4a and 4b are resin-sealed, molten solder is provided near the electronic component 7 to be soldered. Slits S for suppressing outflow are provided in the component mounting portions 4a and 4b.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a semiconductor device having a structure in which an electronic component such as a semiconductor element is soldered onto a lead frame, and more particularly to a semiconductor device in which the outflow of solder from a soldering portion is suppressed.

[0002]

[Prior art]

 FIG. 2 shows a lead frame used in a conventional semiconductor device of this type which is pressed from a copper strip. A plurality of component mounting portions 4a are formed on the lead frame 1 from one connecting portion 2 via the lead portion 3. Further, a plurality of component mounting portions 4b are formed from the other connecting portion 5 via the locking portion 6. The electronic component 7 is soldered between the component mounting portions 4a and 4b using solder cream as shown in the figure. Semiconductor elements, resistors, capacitors, etc. are used as the electronic component 7.

After the electronic component 7 is soldered onto the lead frame 1 as described above, the engaging portion 6 between the other connecting portion 5 on the upper side in the drawing and the component mounting portion 4b is shown by a two-dot chain line. Cut at a position of L1 by a machine such as a press. Next, the component mounting portion 4a and the electronic component 7 including a part of the lead portion 3 extending from the one coupling portion 2 are resin-sealed. After that, when one of the connecting portions 2 is cut at the position of the cut line L2, a semiconductor device having four leads protruding in the same direction is completed.

[0004]

[Problems to be solved by the invention]

 By the way, the lead frame 1 is tin (Sn) or solder plated on a copper plate having a thickness of about 0.5 mm in order to have good solderability. For this reason, when the solder cream applied when soldering the electronic component 7 is melted, the solder spreads over a wide range as shown by the dot in the figure. In such a case, the amount of solder in the soldering portion directly below the electronic component 7 becomes small, the soldering is likely to be incomplete, and the reliability in terms of soldering strength and the like deteriorates.

[0005]

[Purpose of the invention]

 The present invention has been made in order to solve the above problems, and suppresses the spread of the solder in the component mounting portion to secure the original required solder amount and to ensure the soldering of electronic components. It is an object to provide a semiconductor device.

[0006]

[Means for Solving the Problems]

 The semiconductor device of the present invention has a plurality of component mounting portions extending from a connecting portion made of a plate material and electronic components mounted between adjacent component mounting portions and soldered, and the electronic components and the component mounting portions are resin-sealed. In the stopped semiconductor device, a slit for suppressing outflow of molten solder is provided in the component mounting portion in the vicinity of soldering of the electronic component.

[0007]

[Embodiment of the invention]

 An embodiment of the present invention will be described below with reference to FIG. The same parts as those in FIG. 2 are designated by the same reference numerals. In the figure, a slit S is provided in the vicinity of a portion on the component mounting portions 4a and 4b formed on the lead frame 1 to which the electronic component 7 is soldered. The slit S1 is formed in the component mounting portion 4b like a long hole. Further, the other slits such as the slits S2, S3, ... Are made into concave portions which are notched from the end portions of the component mounting portions 4a, 4b. The slit S as described above can be formed at the same time when the copper strip is pressed. Further, its size is not particularly limited. Solder cream is applied to the lead frame 1 only on the portions that need to be soldered using a predetermined mask. Next, the electronic component 7 is mounted on the applied solder cream and heated in a furnace to fix the solder.

When the lead frame having the slits formed as described above is soldered, the melted solder is blocked by the slits and does not spread to the outside, as shown by the dot in FIG. Stay in the region. As compared with the conventional example shown in FIG. 2, the solder spread area is relatively narrowed down. After that, a predetermined semiconductor device is completed through the same steps as conventional ones.

[0009]

[Effect of the invention]

 As described above, according to the present invention, the slit formed in the lead frame suppresses the spread of the solder, and as a result, it is possible to secure a sufficient amount of solder in the portion that originally requires soldering. This enables effective soldering and improves the reliability of the device itself.

[Brief description of the drawings]

FIG. 1 is a plan view showing a part of a lead frame used in a semiconductor device of the present invention.

FIG. 2 is a plan view showing a part of a lead frame used in a conventional semiconductor device.

[Explanation of symbols]

 1 Lead frame 2 One connection part 3 Lead parts 4a, 4b Component mounting part 5 Other connection part 6 Engagement part 7 Electronic component S Slit

Claims (2)

[Utility model registration claims] 1. An electronic component is mounted and soldered between a plurality of component mounting portions extending from a connecting portion made of a plate material and adjacent component mounting portions, and the electronic component and the component mounting portion are resin-sealed. In the semiconductor device, a slit for suppressing the outflow of molten solder is provided in the component mounting portion in the vicinity of the electronic component being soldered. 2. The semiconductor device according to claim 1, wherein the slit is a long hole or a concave portion cut inward from one end of the component mounting portion.