JP3032836U - IC heat dissipation block mounting structure - Google Patents

Abstract

(57) 【Abstract】 PROBLEM TO BE SOLVED: To mount a heat dissipation block for an IC. SOLUTION: A positioning seat for mounting the heat dissipation block is provided, and the heat dissipation block is provided on the positioning seat, and a protruding pin provided around the bottom end of the heat dissipation block is provided with a positioning slide on the inner periphery of the fitting ring at the center of the positioning seat. It is mounted by combining with the above and sliding into the positioning groove. Further, the positioning seat is easily attached to the CPU mounting seat by a fitting method using elasticity, and the fitting ring is connected to the positioning seat by a plurality of supports.
The position of the heat radiating block can be adjusted as necessary, and the heat radiating block can be crimped to the contact surface of the CPU by the recovery elasticity caused by the change in the shape of the supporting frame caused by sliding the heat radiating block into the positioning seat. .

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a type of heat dissipation block mounting structure for an IC, and more particularly to a structure applied to mounting a heat dissipation block on a CPU.

[0002]

[Prior art]

 Although the calculation speed of the CPU is increasing more and more, the CPU may generate an error during calculation due to the heat generated under the high-speed calculation, and if the generated heat cannot be effectively removed, the internal CPU There is also a risk that the precision integrated circuit may be destroyed. Therefore, how to quickly dissipate the heat generated by the CPU and how to effectively perform the function of the heat dissipation block have been issues of interest to the computer industry.

There are two types of conventional heat dissipation block mounting structures for CPUs (or broadly referred to as IC chips) that are mounted directly on the shoulders on both sides of the CPU and on the CPU mounting seat. The former is United States Patent No. 5313099, "HE AT SINK ASSEMBLY FOR SOLID STATE DEV ICES", which fixes the heat dissipation block fixing seat to the shoulder of the CPU package and fixes the heat dissipation block with screws. It was screwed into the seat to radiate heat from the CPU. The drawback is that the heat dissipation block fixing seat is likely to damage the CPU package, which may cause the CPU to be fractured or shattered, resulting in large damage. Further, in US Pat. No. 4,745,456 "HEATS SINK CLIP ASSEMBLY", a heat dissipation block is closely attached to the CPU by a mounting piece, and at the same time, the CPU is pressed against a fixed seat, but this requires that the CPU be removed before use. However, the design of the CPU was not suitable because it could easily cause the CPU terminals to bend or break. Further, U.S. Pat. No. 4,607,685 "HEAT SINK FOR INTEGRATED CIRCUIT PACKAGE" relates to a structure of a heat dissipation block having a multi-layered heat transfer piece and fitted onto a CPU package, but its assembly process is complicated. Also, it has a drawback that the CPU is easily damaged. As the latter technology, there is Taiwan Utility Model Publication No. 246982 "Computer CPU heatsink mounting member (Japanese translation)", which uses a standardized protrusion provided on the CPU mounting seat. Then, the heat dissipation block is pressed down above the CPU with an elastic mounting member, and the heat dissipation of the CPU is released to the heat dissipation block by stopping the heat dissipation of the CPU to the heat dissipation block. However, the creation is relatively inconvenient and inconvenient because the heat-dissipating block and the CPU are in close contact with each other by a pressing method, and at the same time, they are fitted to the protrusions of the CPU mounting seat. Further, since the attachment member of the creation has an inverted hook shape, it is difficult to remove, the projection is likely to be torn or broken, and a situation in which the attachment member cannot be firmly attached is likely to occur when reattaching. Therefore, the heat dissipation block can be quickly fixed to the CPU mounting seat and brought into close contact with the CPU. However, if there is a mounting structure that does not press the CPU, the heat generated by the CPU can be effectively removed, and duplication is repeated. It will not damage the CPU when installing it and will keep the integrity of the CPU mounting seat.

[0004]

[Problems to be solved by the invention]

 An object of the present invention is to provide a heat dissipation block mounting structure for IC, in which the heat dissipation block can be reliably and effectively crimped onto the IC chip.

Next, the present invention provides a heat dissipating block that can be easily and quickly fixed to the IC chip mounting seat, and does not damage existing projections on the IC chip mounting seat. It is an object of the present invention to provide a heat dissipation block mounting structure for an IC having a seat.

[0006]

[Means for Solving the Problems]

 According to a first aspect of the present invention, there is provided a mounting structure for crimping a heat dissipation block onto an IC chip, wherein the IC chip is inserted and placed in an IC chip mounting seat, and at least two edges are provided on an edge of the IC chip mounting seat. Two protrusions are provided, one positioning seat is assembled to the IC chip mounting seat by the protrusions, one fitting ring is provided on the positioning seat, and at least an appropriate position on the inner circumference of the fitting ring is provided. One positioning slide is provided, at least one positioning groove is provided at an appropriate position of the positioning slide, and at least two fingers protruding from the bottom end of the heat dissipation block are slid on the positioning slide. The heat dissipation block and the IC chip are brought into close contact with each other by being inserted and fitted into the positioning groove, so that an IC heat dissipation block mounting structure is provided.

According to a second aspect of the present invention, there is provided the heat dissipation block mounting structure for an IC according to the first aspect, in which at least two fitting ears are inserted into a positioning seat, and the projection of the IC chip mounting seat of the fitting ears is inserted. The IC heat dissipation block mounting structure is characterized in that the positioning seats are assembled to the IC chip mounting seats by fixing them to each other.

According to a third aspect of the present invention, in the heat dissipation block mounting structure for an IC according to the first aspect, the fitting ring is connected to the positioning seat by a plurality of supports, and the elasticity of the supports allows the heat dissipation block to be crimped. Is adjusted, and the heat dissipation block tightly touches the IC chip due to the recovery elasticity of the support frame.

[0009]

[Embodiment of the invention]

 The heat dissipation block mounting structure for an IC of the present invention is particularly applied to mounting the heat dissipation block on the CPU. In the present invention, a positioning seat for mounting the heat dissipation block is provided, and the heat dissipation block is attached to the positioning seat and the bottom of the heat dissipation block. It is mounted by combining the protruding pins provided around the ends with the positioning slideway on the inner circumference of the fitting ring at the center of the positioning seat and sliding it into the positioning groove. Further, the positioning seat is easily attached to the CPU mounting seat by a fitting method using elasticity. Further, the fitting ring is connected to the positioning seat by a plurality of supports so that the position of the heat dissipation block is improved. The position of the heat dissipation block can be adjusted as necessary, and the heat dissipation block can be pressed against the contact surface of the CPU by the recovery elasticity caused by the change in the shape of the support frame caused by sliding the heat dissipation block into the positioning seat.

[0010]

【Example】

 FIG. 1 is an exploded perspective view of a heat dissipation block 1 and a positioning seat 2 of the present invention. As shown in FIG. 3, a plurality of heat dissipation blades 11 used for heat dissipation are provided on the heat dissipation block 1, and guide grooves 12, 12 to which external heat dissipation fans are fitted are provided on side edges. ′ Is provided, and a plurality of heat dissipation holes 13 are provided at the bottom to increase the heat dissipation capacity by thermal convection, and at least two concave holes 14 and 14 ′ are provided at the side edge of the bottom. The holes 14 and 14 'are formed with the protruding fingers by the pins 4 and 4'pressingly contacted with each other, and are used for positioning by fitting the positioning slideways 221 provided on the positioning seat 2 to each other. It Further, as shown in FIG. 2, the positioning seat 2 is assembled to a standardized CPU mounting seat 52, the CPU mounting seat 52 is welded onto an electric circuit board 54, and the CPU mounting seat 52 further includes a CPU 51. Is inserted. Among them, standardized projections 521, 521 'are provided on two sides of the CPU mounting seat 52, and heat radiation blocks of different designs can be mounted. In the present invention, the fitting ears 3 and 3'are first inserted into the fitting openings 25 and 25 'of the positioning seat 2 and then fixed to the projections 521 and 521'. The user can slightly bend the positioning seat 2 having elasticity by merely tilting the locking piece 21, and the fitting ear 3 is fitted to the projection 521 from the side, and the positioning seat 2 When removing, and if the locking piece 21 is slightly tilted, the fitting ear 3 is interlocked and the protrusion 521 can be ejected from the side. In this way, the conventional method of forcibly pulling out upward can be prevented, and therefore the protrusion can be prevented from being damaged. In addition, at least two limiting pieces 24 are provided on the side edge of the positioning seat 2 so that the positioning seat 2 can be stabilized.

Further, as shown in FIG. 4, after the positioning seat 2 is already assembled to the CPU mounting seat 52, the heat dissipation block 1 is provided on the positioning seat 2 with the protruding finger-shaped pins 4, 4 ′. , When the pins 4 and 4'slide into the positioning groove 222 (not shown on the other side) by being slid into the positioning slideway 221 in the fitting ring 22 supported by the plurality of supports 23, heat radiation is performed. The positioning of the block 1 in the positioning seat 2 is completed. Naturally, since the thicknesses of the CPUs 51 are different from each other, the degree of difficulty in sliding in and locating the heat dissipation block 1 is different. However, this is effectively adjusted by the elastically deformable support 23, and as shown in FIG. 5, when the thickness of the CPU 51 is relatively thick, the support 23 is slightly deformed and the heat dissipation block 1 is relatively easy. It can be slid in and positioned, and the heat dissipation block 1 is pressed by the recovery elasticity of the support 23 to be joined to the CPU 51. In addition, after the heat dissipation block 1 and the CPU 51 are effectively brought into close contact with each other, the heat generated by the CPU 51 is transmitted to the heat dissipation block 1 and is released into the atmosphere by natural convection with a relatively large area. A radiating fan 53 provided in the upper guide grooves 12, 12 'forcibly radiates heat by the blade 531.

[0012]

[Effect of the invention]

 According to the present invention, by appropriately designing the positioning seat and the heat dissipation block, the positioning seat can be fixed to the CPU mounting seat, which eliminates the disadvantage that the projection of the CPU mounting seat is easily damaged in the conventional technology. The design of the pin of the heat dissipation block allows the heat dissipation block to be fixed on the positioning seat smoothly and with effective compression force, and it is a novel and innovative idea in view of its practicality.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of the present invention.

FIG. 2 is a view showing a mounting operation of the positioning seat of the present invention to the CPU mounting seat.

FIG. 3 is a side view of a heat dissipation block of the present invention.

FIG. 4 is a view showing a mounting operation of the heat dissipation block of the present invention to a positioning seat.

FIG. 5 is a side view of the present invention with a heat dissipation fan attached.

[Explanation of symbols]

1 ... Heat dissipation block 11 ... Heat dissipation blade 1
2, 12 '... Guide groove 13 ... Heat dissipation hole 14, 14' ... Recessed hole 2 ...
Positioning seat 21 ... Locking piece 22 ... Fitting ring 221 ...
・ Positioning slide 222 ・ ・ ・ Positioning groove 23 ・ ・ ・ Brace 24 ・ ・ ・
Limiting piece 25, 25 '... Fitting mouth 3, 3' ... Fitting ear 4, 4
・ ・ ・ Pin 51 ・ ・ ・ CPU 52 ・ ・ ・ CPU mounting seat 52
1, 521 '... Protrusion 53 ... Radiating fan 54 ... Electric circuit board

Claims (3)

[Utility model registration claims] 1. A mounting structure for crimping a heat dissipation block onto an IC chip, wherein the IC chip is inserted and placed in an IC chip mounting seat, and at least two protrusions are provided on an edge of the IC chip mounting seat. One positioning seat is assembled to the IC chip mounting seat with the protrusion, one fitting ring is provided on the positioning seat, and at least one positioning slide is provided at an appropriate position on the inner circumference of the fitting ring. Is provided, at least one positioning groove is provided at an appropriate position of the positioning slide, and at least two fingers protruding from the bottom end of the heat dissipation block are slid into the positioning slide to form the positioning groove. The heat dissipation block and the IC
A heat dissipation block mounting structure for ICs, characterized in that the chips are brought into close contact with each other. 2. The heat dissipation block mounting structure for an IC according to claim 1, wherein at least two fitting ears are inserted into the positioning seat, and the positioning is performed by fitting the fitting ears with the projections of the IC chip mounting seat. A heat dissipation block mounting structure for an IC, characterized in that the seat is assembled to the IC chip mounting seat. 3. The heat dissipation block mounting structure for an IC according to claim 1, wherein the fitting ring is connected to the positioning seat by a plurality of supports, and the elasticity of the supports adjusts the crimping position of the heat dissipation block. A heat dissipation block mounting structure for an IC, characterized in that the heat dissipation block closely contacts the IC chip due to recovery elasticity.