JP3030278B2 - Polishing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus for polishing and cleaning dirt such as coins, medals and pachinko balls used in playgrounds such as pachinko parlors and game centers.

[0002]

2. Description of the Related Art In pachinko parlors, coins, medals, pachinko balls and the like used in playgrounds such as pachinko parlors and game centers gradually become dirty with dirt and dust over a long period of use. Periodic cleaning or polishing is performed by a cleaning device or a polishing device installed inside the island or the like.

[0003] As a conventional cleaning device, there is a system in which an object to be cleaned such as a coin is immersed in hot water to perform cleaning. There is a method of polishing by mixing and stirring.

However, the conventional cleaning apparatus has a problem that not only the work efficiency is low because the cleaning operation is a batch processing, but also that a large amount of hot water and a waste water treatment require time and effort. However, there is a problem that maintenance such as management of abrasive grains and regular replacement is troublesome. For this reason, recently, a polishing apparatus that does not use hot water or abrasive grains has been developed, and is disclosed in JP-A-8-294578 and JP-A-8-294578.
No. 294579. The present inventor has disclosed a polishing apparatus which does not require hot water or abrasive grains as disclosed in
No. 224 discloses this.

[0005] By using these devices, it becomes possible to continuously perform polishing work of coins, pachinko balls, etc., so that the work efficiency is improved, and a hot-water cleaning type cleaning device or an abrasive type polishing device is used. As compared with the polishing apparatus of the above, the labor required for maintenance can be reduced.

[0006]

Problems to be Solved by the Invention
In the case of the polishing apparatus disclosed in Japanese Patent Application Laid-open No. 8 or JP-A-8-294579, dust removed from the object to be polished such as coins during the polishing operation passes through a chute and is sucked into a dust collector via a filter. However, since the range over which the suction force of the dust collector can reach is limited, dust accumulates in portions outside this range, for example, in the gap between the rotating brush and the fixed brush or near the outer periphery of the rotating plate. Cheap. If dust accumulates on these parts, the polishing ability decreases, so it is necessary to remove the dust regularly.If such dust removal work is neglected, it will re-attach to the object to be polished and the work efficiency will be remarkable. descend.

[0007] In the case of the polishing apparatus disclosed in Japanese Patent Application Laid-Open No. 10-15224, abrasive dust or the like generated in a casing is utilized by utilizing an air flow generated by rotation of a blade formed on the upper surface of an upper disk. Is discharged out of the dust outlet together with the air. However, dust having a large specific gravity, such as metal powder or rubber powder, is unlikely to move due to the airflow, and thus falls down due to gravity and easily accumulates around the coin discharge disk disposed at the lower part of the casing. Dust that has accumulated in such a portion needs to be removed periodically by opening the casing, so that maintenance is troublesome.

An object of the present invention is to provide a polishing apparatus which is excellent in a polishing function, does not cause a decrease in polishing ability due to accumulation of dust and the like, and is easy to maintain.

[0009]

SUMMARY OF THE INVENTION According to the present invention, there is provided a polishing method for polishing an object to be polished by rotating at least one of a plurality of abrasives arranged in a casing and passing the object between the abrasives. Is characterized in that a plurality of slits are provided on an outer periphery of a rotating body for discharging an object to be polished disposed in a casing, and a dust collecting means for collecting dust in the casing is provided.

With this configuration, the polishing operation can be efficiently performed only by passing the object to be polished between the abrasives, and the polishing operation is provided on the outer periphery of the rotating body for discharging the object to be polished. Since the plurality of slits agitate the gas in the casing during the polishing operation, dust having a large specific gravity generated during the polishing operation does not accumulate, and these dusts are sequentially collected by the dust collecting means. The inside can always be kept clean.

Therefore, the polishing ability does not decrease due to the accumulation of dust in the casing, and the frequency of cleaning is reduced, so that maintenance is easy. In this case, as the dust collecting means, a dust collector provided with a suction fan capable of continuously sucking air, a filter for collecting dust, and the like can be employed.

Further, the polishing apparatus of the present invention can have a structure in which dust in the casing is recovered by circulating gas between the casing and the dust collecting means. By adopting such a structure, it becomes possible to perform the polishing operation by bringing the casing and the dust collecting means close to a closed state, and there is no exhaust to the outside of the apparatus, so that air pollution can be prevented and noise can be reduced. Further, during the polishing operation, the gas circulating in the casing is heated by the operation heat of the apparatus and becomes higher than room temperature, so that there is also an effect of drying the polished object.

Further, in the polishing apparatus of the present invention, a structure can be provided in which dust in the casing is collected by generating a gas flow in the direction of gravity in the casing. By generating such a gas flow, dust can be collected in the direction in which the dust falls, so that dust having a large specific gravity can be efficiently collected.

Here, the slit may be formed in a direction intersecting the radial direction and the rotation axis direction of the rotating body for discharging the object to be polished. With this structure, when the rotating body for rotating the object to be polished is rotated, a gas flow is generated around the slit, which spreads in the radial direction and moves in the direction of the rotation axis. Even in this case, there is no accumulation in the vicinity of the rotating body for discharging the object to be polished, and the object can be collected without loss.

Further, the rotating body for discharging the object to be polished may be formed of a buffer material having a function of preventing damage to the object to be polished. With such a structure, a coin or the like to be polished is not damaged when coming into contact with the rotating rotating body for discharging the polished object.

In this case, a polyethylene resin can be used as the cushioning material. Polyethylene resin has high strength, low coefficient of friction, and excellent durability, so that the kinetic energy of the material to be polished discharged at high speed from the polishing material after polishing is It can be discharged to In addition, since polyethylene resin hardly generates abrasion powder when it comes into contact with the object to be polished,
Dust can be reduced. In addition, as a buffer material made of a polyethylene resin, a material obtained by high-pressure molding of an ultrahigh-density molecular weight polyethylene resin having a molecular weight of 3,000,000 to 5,000,000 can be suitably used.

Further, the rotating body for discharging the object to be polished may be structured so as to be detachable from a rotary driving body for rotating the rotating body. By adopting such a structure, when the rotating body is worn or deteriorated due to long-term use or the like, it becomes possible to replace only the rotating body, thereby improving the maintainability.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a polishing apparatus according to an embodiment, and FIG. 2 is a longitudinal sectional view of the polishing apparatus.
Note that, for convenience of explanation, the mounting state of the upper cover 28 in FIG. 1 is different from the mounting state of the upper cover 28 in FIG. 2, and the upper cover 28 is shown rotated 90 degrees from each other.

As shown in FIGS. 1 and 2, a polishing apparatus 10 of the present embodiment comprises an upper disk 12 and a lower disk 13 in which brush-like abrasives 11X and 11Y are implanted in a donut shape. , 11Y are arranged vertically so as to face each other. The lower disk 13 is connected to the motor 1 via a belt 15.
The upper disk 12 is rotatably mounted on a cylindrical support shaft 16 via a bearing 30. In addition, a dish-shaped guide member 18 is arranged at the center of the lower disk 13.

In the polishing apparatus 10, the upper disc 12 is moved so that the abrasives 11X, 11X of the upper disc 12 and the lower disc 13 are selected according to the type and size of the object to be polished.
The tips of Y can be set in either a contact state or a separated state.

In the case of this embodiment, as shown in FIG. 2, the tips of the abrasives 11X and 11Y are set to be separated from each other, but this is caused by the rotation of the lower disc 13 driven by the motor 14. The upper disk 12 also rotates in the same direction due to the wind pressure and the resistance when the coin C, which is the object to be polished, is inserted between the abrasives 11X and 11Y. In this case, the rotation is suppressed by the air resistance generated in the plurality of fins 17 radially formed on the upper surface of the upper disk 12, and thus the upper disk 12 rotates with a delay with respect to the lower disk 13. That is,
During the operation of the polishing apparatus 10, the rotation speed of the upper disk 12 is kept lower than the rotation speed of the lower disk 13.

When polishing the coin C, the motor 1
4, the lower disk 13 is rotated, and the support shaft 16 is rotated.
When the coin C is inserted through the opening 16a at the upper end, the coin C comes into contact with the guide member 18 and then moves in the outer peripheral direction by centrifugal force, and is rotating while sliding with each other.
11Y, while passing therethrough, the contact between the abrasives 11X, 11Y and the coin C causes the coin C
The dirt and the like adhering to are removed.

In this case, the guide slopes 19X and 19Y are formed by gradually shortening the abrasive located on the inner peripheral portions of the upper disk 12 and the lower disk 13 toward the center.
Since the dish-shaped guiding member 18 is arranged at the center of the lower disk 13, the inserted coin C becomes horizontal while moving along the upper curved surface of the guiding member 18, and the upper and lower polishing members are polished. It is smoothly guided between the members 11X and 11Y.

The guide member 18 is formed of ultra-high-density molecular weight polyethylene having a small coefficient of friction and excellent wear resistance.
Since the upper surface of the guide member 18 is a smooth curved surface,
The coin C can be slid smoothly. The chevron-shaped protrusion 18p at the center of the guide member 18 is for rapidly dispersing the inserted coin C in the outer peripheral direction, and has an ultrahigh-density molecular weight so as not to damage the coin C. Made of polyethylene.

A skirt-shaped guide member 33 is arranged below the support shaft 16 so that the abrasive material 11
Since the outer diameter of the guide member 18 is larger than the inner diameter of X, the coin C that has reached the inner peripheral portion of the abrasive 11X after being inserted
Is always horizontal regardless of its posture and enters between the abrasives 11X and 11Y.
However, there is no situation in which the stagnation occurs in an upright state.

Since the guide member 18 is detachable, when polishing non-directional items such as pachinko balls, the guide member 18 can be used with the guide member 18 removed. In this case, since the guiding slope 19Y is also formed on the inner peripheral portion of the polishing material 11Y, the object to be polished can be smoothly guided between the polishing materials 11X and 11Y.

The coin C, which has been polished between the abrasives 11X and 11Y, is ejected from the outer periphery by the action of centrifugal force. The ejected coin C comes down immediately after coming into contact with the surface of the buffer member of the guide member. Be guided. Thereafter, while the coin C falls downward, the rotating member 41 attached to the cylindrical body 39 that rotates together with the lower disk 13 (see FIG. 3).
After being guided to the outer periphery by the guide auxiliary piece 42 spreading outward by centrifugal force and reaching the cushioning material 25 attached on the discharge disk 24, it is discharged from the discharge port 27 by rotation thereof.

Here, the dust collecting function of the polishing apparatus 10 of the present embodiment will be described with reference to FIGS. 3 is a partially cutaway front view of the discharge rotating body, FIG. 4 is a plan view of the discharge rotating body, FIG. 5A is an enlarged plan view of a portion A in FIG. 4, and FIG. It is a front view enlarged view of A part.

In the polishing apparatus 10 of this embodiment, a plurality of slits 50 are provided on the outer periphery of the cushioning material 25 provided on the discharge disk 24, and a dust collector 51 for collecting dust in the casing 23 is provided. I have Dust collector 51
Is provided with a suction fan capable of continuously sucking air, an exchangeable filter for collecting dust, and the like.

With such a configuration, the slit 50 of the cushioning material 25 agitates the air in the casing 23 during the polishing operation, so that the dust having a large specific gravity generated during the polishing operation is discharged from the discharge disk 24. Since these dusts are sequentially collected by the dust collector 51 without being accumulated near the outer periphery of the casing 23, the inside of the casing 23 can be always kept clean. Therefore, the polishing ability does not decrease due to the accumulation of dust in the casing 23, and the frequency of cleaning is reduced, so that maintenance is easy.

In the polishing apparatus 10, the casing 23
The dust collector 51 is connected to the dust collector 51 by a hose 52, and has a structure in which dust in the casing 23 is collected by circulating air therebetween. Therefore, it is possible to perform the polishing operation while keeping the casing 23 and the dust collector 51 in a substantially sealed state, and there is no exhaust to the outside of the apparatus, so that there is no fear of air pollution and noise can be reduced. Further, during the polishing operation, the air circulating in the casing 23 is heated by the operation heat of the apparatus and becomes higher than the room temperature, so that the coin C, which is the object to be polished, is also dried.

Further, in the polishing apparatus 10, the casing 2
Since the structure is such that the dust in the casing 23 is collected by generating an air flow moving from the top to the bottom in the inside of the casing 3, that is, an air flow in the direction of gravity, the dust can be collected in a falling direction. Even dust with a large specific gravity is efficiently collected.

On the other hand, as shown in FIG. 5, in the polishing apparatus 10, the slit 50 is inclined at an angle of 25 degrees with respect to the radial direction 53 of the discharge disk 24 and at an angle of 45 degrees with respect to the rotation axis direction 54. They are arranged. With such an arrangement, when the discharge disk 24 is rotated, an airflow that moves downward while spreading radially is generated around the slit 50, so that even dust having a large specific gravity is generated. It does not accumulate around the discharge disk 24 and can be collected without leakage.

In the polishing apparatus 10, the discharge disk 24
Since the upper cushioning material 25 is made of a high-strength, low-frictional-coefficient, and highly durable polyethylene resin, polishing of the coin C discharged at high speed from between the abrasives 11X and 11Y after polishing is completed. While efficiently reducing the kinetic energy, the kinetic energy can be discharged to the outside of the casing 23 from the discharge port 27, and the coin C is not damaged. Further, since the polyethylene resin hardly generates abrasion powder when it comes into contact with the coin C, dust can be reduced.

In this case, as the polyethylene resin forming the cushioning material 25, a high-density ultra-high-molecular-weight polyethylene resin having a molecular weight of 3,000,000 to 5,000,000 is molded under high pressure. Although such a polyethylene resin does not have good adhesiveness to other materials, the rubber material 55 is pressed against the cushioning material 25 to form a two-layer structure in advance, and the cushioning material 25 is bonded to the discharge disk 24 to form a cushioning material. The material 25 can be securely bonded to the discharge disk 24.

Since the cushioning material 25 is detachable from the discharge disk 24, the cushioning material 25 can be used for a long time.
When is worn or deteriorated, it is possible to replace only the cushioning material 25, and the maintenance is excellent.

[0037]

According to the present invention, the following effects can be obtained.

(1) In a polishing apparatus for polishing an object to be polished by rotating at least one of a plurality of abrasives disposed opposite to each other in a casing and passing the object to be polished between the abrasives, Along with providing a plurality of slits on the outer periphery of the polished object discharge rotating body disposed in,
By providing the dust collecting means for collecting dust in the casing, it is possible to efficiently polish the object to be polished,
Since dust is collected while agitating the gas in the casing by the slit, a reduction in polishing ability due to dust accumulation does not occur, the frequency of cleaning is reduced, and maintenance is easy.

(2) By collecting dust in the casing while circulating gas between the casing and the dust collecting means, it becomes possible to perform the polishing operation by bringing the casing and the dust collecting means closer to a closed state, Since there is no exhaust to the outside of the apparatus, air pollution can be prevented and noise can be reduced. Also, during the polishing operation, the gas circulating in the casing is heated by the operating heat of the device and becomes higher than room temperature,
An effect of drying the object to be polished also occurs.

(3) By generating a gas flow in the direction of gravity in the casing and collecting dust in the casing,
Since dust can be collected in the direction in which it falls, even dust having a large specific gravity can be efficiently collected without being missed.

(4) The slit is formed in a direction intersecting the radial direction and the rotation axis direction of the rotating body for discharging the object to be polished.
Since a gas flow in a certain direction is generated around the slit, even dust having a large specific gravity does not accumulate, and can be collected without fail.

(5) By forming the rotating body for discharging the object to be polished from a cushioning material having a function of preventing damage to the object to be polished,
The coin or the like to be polished is not damaged when it comes into contact with the rotating rotating body for discharging the polished object.

(6) If a polyethylene resin is used as the cushioning material, the polyethylene resin has a high strength, a low coefficient of friction, and excellent durability. It is possible to discharge the object out of the casing while efficiently reducing the kinetic energy of the object to be polished. Further, since the polyethylene resin hardly generates abrasion powder when it comes into contact with the object to be polished, dust can be reduced.

(7) The rotating body for discharging the object to be polished can be attached to and detached from the rotating driving body for rotating the rotating body.
Since it is possible to replace only the rotating body, maintenance is improved.

[Brief description of the drawings]

FIG. 1 is a plan view showing a polishing apparatus according to an embodiment.

FIG. 2 is a longitudinal sectional view of the polishing apparatus shown in FIG.

FIG. 3 is a partially cutaway front view of a discharge rotating body.

FIG. 4 is a plan view of the discharge rotating body shown in FIG. 3;

5A is an enlarged plan view of a portion A in FIG. 4, and FIG.
3 is an enlarged front view of the portion A. FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Polishing apparatus 11X, 11Y Abrasive material 12 Upper disk 13 Lower disk 14 Motor 15 Belt 16 Support shaft 16a Opening 17 Fin 18 Induction member 18p Projection 19X, 19Y Induction slope 23 Casing 24 Discharge disk 25 Buffer material 27 Discharge Outlet 28 Upper cover 30 Bearing C Coin 33 Guide member 39 Cylindrical body 41 Rotating member 42 Guiding auxiliary piece 50 Slit 51 Dust collector 52 Hose 53 Radial direction 54 Rotational axis direction 55 Rubber material

Claims (6)

(57) [Claims] 1. A brush-like abrasive material implanted on a disk is vertically
Place in the casing so as to face each other and grind the upper and lower
In a polishing apparatus for polishing the object to be polished by rotating at least one of the materials and passing the object to be polished between the abrasives, the abrasive is discharged from the outer periphery of the abrasive and downward.
A rotating body for discharging the object to be polished having a structure for guiding the object to be dropped and discharging it from the discharge port together with the abrasive.
The disposed below the abrasive, the air provided with a plurality of slits of structures for agitating the casing on the outer periphery of the workpiece discharge rotary bodies, by sucking air in the stirred casing A polishing apparatus comprising a dust collecting means for collecting dust in a casing. 2. The polishing apparatus according to claim 1, wherein dust in the casing is collected by circulating gas between the casing and the dust collecting means. 3. The method according to claim 1, further comprising generating a gas flow in the direction of gravity in the casing to collect dust in the casing.
3. The polishing apparatus according to 2. 4. The polishing apparatus according to claim 1, wherein the slit is formed in a direction intersecting a radial direction and a rotation axis direction of the rotating body for discharging the object to be polished. 5. The polishing apparatus according to claim 1, wherein the rotating body for discharging the object to be polished is formed of a cushioning material having a function of preventing damage to the object to be polished. 6. The polishing apparatus according to claim 5, wherein the buffer is a polyethylene resin.