JP3027448B2 - Wire bonding equipment - Google Patents
Wire bonding equipmentInfo
- Publication number
- JP3027448B2 JP3027448B2 JP3257272A JP25727291A JP3027448B2 JP 3027448 B2 JP3027448 B2 JP 3027448B2 JP 3257272 A JP3257272 A JP 3257272A JP 25727291 A JP25727291 A JP 25727291A JP 3027448 B2 JP3027448 B2 JP 3027448B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- discharge
- wire
- torch electrode
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78268—Discharge electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ワイヤボンディング装
置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding apparatus.
【０００２】[0002]
【従来の技術】従来のワイヤボンディング装置として
は、例えば特開平１−２５６１３４号公報記載のものが
知られている。このものは、ボール形成用トーチ電極と
して、イットリア入りタングステン合金またはランタン
入りタングステン合金を用いることにより、ボール形成
時の放電スタート性を向上し、ボール形状のばらつきを
小さくするようにしている。2. Description of the Related Art As a conventional wire bonding apparatus, for example, one disclosed in Japanese Patent Application Laid-Open No. 1-256134 is known. In this device, the use of a tungsten alloy containing yttria or a tungsten alloy containing lanthanum as a torch electrode for forming a ball improves discharge startability at the time of forming the ball and reduces variations in the ball shape.
【０００３】一方、ボール形成時の放電状態は一般的
に、図３のように示される。図３において、１はボンデ
ィングワイヤ、２はキャピラリツール、３はトーチ電
極、４は電源回路である。このような装置の放電におい
ては、放電を維持するために必要な電子放出が行われる
トーチ電極側では放電領域が広く、ワイヤ側では先端一
点に集中する。このような放電が繰り返されると、図４
のボール形成時の放電維持電圧電流特性に示すように、
放電維持電圧が安定しなくなる。すなわち、放電が繰り
返されると、トーチ電極３の表面上の放電領域周辺部に
炭素等の堆積物５が堆積し、トーチ電極３上の放電可能
領域が狭くなる。トーチ電極３として平板電極を用いた
場合、ソレノイド機構等によりトーチ電極３をボンディ
ングワイヤ１の直下にまで移動させ、ボンディングワイ
ヤ１とトーチ電極３との間で放電させ、ボールを形成す
るようにしている。[0003] On the other hand, a discharge state at the time of ball formation is generally shown in FIG. In FIG. 3, 1 is a bonding wire, 2 is a capillary tool, 3 is a torch electrode, and 4 is a power supply circuit. In the discharge of such a device, the discharge region is wide on the torch electrode side where electrons required for sustaining the discharge are emitted, and is concentrated at one point on the wire side. When such a discharge is repeated, FIG.
As shown in the sustaining voltage-current characteristics during ball formation,
The sustaining voltage becomes unstable. That is, when the discharge is repeated, deposits 5 such as carbon are deposited around the discharge area on the surface of the torch electrode 3, and the dischargeable area on the torch electrode 3 is narrowed. When a flat plate electrode is used as the torch electrode 3, the torch electrode 3 is moved to a position immediately below the bonding wire 1 by a solenoid mechanism or the like, and discharge is caused between the bonding wire 1 and the torch electrode 3 to form a ball. I have.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、このよ
うな従来のワイヤボンディング装置にあっては、トーチ
電極を移動させる構成となっていたため、トーチ電極表
面上の放電位置が変化し、また炭素等の堆積物によりト
ーチ電極表面上の放電面積が不安的になり、ボール径の
ばらつきが大きくなるといった問題点があり、この現象
は、前述の公報記載のように放電スタート性を向上して
も解消することはできない。However, in such a conventional wire bonding apparatus, since the torch electrode is moved, the discharge position on the surface of the torch electrode changes, and carbon and the like are changed. There is a problem that the discharge area on the surface of the torch electrode becomes unstable due to the deposits, and the variation of the ball diameter becomes large. This phenomenon is solved even if the discharge start property is improved as described in the above-mentioned publication. It is not possible.
【０００５】そこで、本発明は、ボール形成時のトーチ
電極表面上の放電領域を一定にすることにより、一定径
のボールを安定的に形成することができるワイヤボンデ
ィング装置を提供することを課題としている。Accordingly, an object of the present invention is to provide a wire bonding apparatus capable of stably forming a ball having a constant diameter by making a discharge region on the surface of a torch electrode at the time of ball formation constant. I have.
【０００６】[0006]
【課題を解決するための手段】請求項１記載の発明は、
平板トーチ電極のワイヤに対する対向面上に、開口部を
有する絶縁膜を形成し、ワイヤと平板トーチ電極との間
の放電を該絶縁膜の開口部を通して行うことにより、ワ
イヤの先端にボールを形成し、該ボールを所定電極にボ
ンディングするワイヤボンディング装置であって、 前記
平板トーチ電極交換時およびボンダー立上げ時に、ワイ
ヤと平板トーチ電極との間で予備放電が行われ、所定の
試験用ボンディングパッド上にボンディングが行われる
ことを特徴とするものである。According to the first aspect of the present invention,
An opening is formed on the surface of the flat torch electrode facing the wire.
Forming a ball at the tip of the wire by performing a discharge between the wire and the flat torch electrode through the opening of the insulating film , and bonding the ball to a predetermined electrode with a wire bonding apparatus . And said
When replacing the flat torch electrode or setting up the bonder,
Pre-discharge is performed between the electrode and the flat torch electrode,
Bonding is performed on the test bonding pad
It is characterized by the following.
【０００７】請求項２記載の発明は、請求項１の構成に
加え、前記ワイヤとは別個に針状電極を設け、平板トー
チ電極交換時およびボンダー立上げ時に、針状電極と平
板トーチ電極との間で予備放電が行われることを特徴と
するものである。 According to a second aspect of the present invention, in addition to the configuration of the first aspect , a needle electrode is provided separately from the wire, and
When replacing the touch electrode and setting up the bonder,
A preliminary discharge is performed between the plate and the torch electrode .
【０００８】[0008]
【０００９】[0009]
【作用】請求項１記載の発明では、開口部を有する絶縁
膜の形成により平板トーチ電極上の放電領域が一定にな
り、放電維持電圧が安定し、ボール径が一定になる。ま
た、予備放電により、平板トーチ電極の放電領域が清浄
され、本ボンディング時のボール形成が一層安定化す
る。請求項２記載の発明では、請求項１の作用に加え、
予備放電用の針状電極を設けたことにより、平板トーチ
電極の放電領域が清浄され、本ボンディング時のボール
形成が一層安定化し、さらに試験用ボンディングパット
に対するボンディング動作が不要になる。 According to the first aspect of the present invention, the formation of the insulating film having the opening makes the discharge area on the flat torch electrode constant, stabilizes the discharge sustaining voltage, and makes the ball diameter constant. Ma
In addition, the discharge area of the flat torch electrode is cleaned by preliminary discharge.
Ball formation during the final bonding is further stabilized.
You. According to the second aspect of the invention, in addition to the operation of the first aspect,
By providing needle electrodes for pre-discharge, flat torch
The discharge area of the electrode is cleaned and the ball is
Formation is more stable, and bonding pads for testing
The bonding operation for is unnecessary.
【００１０】[0010]
【００１１】[0011]
【００１２】[0012]
【実施例】以下、本発明を図面に基づいて説明する。図
１、図２は本発明に係るワイヤボンディング装置の一実
施例を示す図である。まず、構成を説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. 1 and 2 are views showing one embodiment of a wire bonding apparatus according to the present invention. First, the configuration will be described.
【００１３】図１、図２において、11はボンディングワ
イヤであり、ボンディングワイヤ11はキャピラリツール
12に支持されている。ボンディングワイヤ11の先端下方
には平板トーチ電極13が配置されている。ボンディング
ワイヤ11および平板トーチ電極13の間には電源回路14に
より所定の電圧が印加され、ボンディングワイヤ11と平
板トーチ電極13との間の放電により、ボンディングワイ
ヤ11の先端にボールが成され、該ボールが図示しない所
定電極にボンディングされるようになっている。1 and 2, reference numeral 11 denotes a bonding wire, and the bonding wire 11 is a capillary tool.
Supported by 12. Below the tip of the bonding wire 11, a flat torch electrode 13 is arranged. A predetermined voltage is applied between the bonding wire 11 and the flat plate torch electrode 13 by the power supply circuit 14, and a discharge is generated between the bonding wire 11 and the flat plate torch electrode 13, whereby a ball is formed at the tip of the bonding wire 11. The ball is bonded to a predetermined electrode (not shown).
【００１４】ここで、平板トーチ電極13のボンディング
ワイヤ11に対する対向面上に、開口部15ａを有する絶縁
膜15が形成されており、絶縁膜15の開口部15ａを通して
ボンディングワイヤ11と平板トーチ電極13との間で放電
が発生するようになっている。絶縁膜15の開口部15ａは
フォトリソグラフィにより形成され、開口部15ａの面積
は0.01〜1ｍｍ2に設定されている。16は平板トーチ電極
13を支持する電極治具であり、平板トーチ電極13は電極
治具16に対して着脱自在に取り付けられている。また、
電極治具16は図示しないソレノイド機構等により移動可
能であり、ボール形成時には絶縁膜15の開口部15ａがボ
ンディングワイヤ11の先端直下に位置するように、電極
治具16が駆動される。An insulating film 15 having an opening 15a is formed on a surface of the flat torch electrode 13 facing the bonding wire 11, and the bonding wire 11 and the flat torch electrode 13 are formed through the opening 15a of the insulating film 15. A discharge is generated between the two. The opening 15a of the insulating film 15 is formed by photolithography, and the area of the opening 15a is set to 0.01 to 1 mm 2 . 16 is a flat torch electrode
This is an electrode jig that supports the plate 13, and the flat torch electrode 13 is detachably attached to the electrode jig 16. Also,
The electrode jig 16 can be moved by a solenoid mechanism or the like (not shown), and the electrode jig 16 is driven such that the opening 15a of the insulating film 15 is located immediately below the tip of the bonding wire 11 during ball formation.
【００１５】一方、ボンディング手順としては、まず、
平板トーチ電極交換時およびボンダー立上げ時に、ボン
ディングワイヤ11と平板トーチ電極13との間で予備放電
を行って、図示しない所定の試験用ボンディングパッド
上にボンディングを行ない、または、ボンディングワイ
ヤ11とは別個に図２に示すような針状電極17を設け、平
板トーチ電極交換時およびボンダー立上げ時に、針状電
極17と平板トーチ電極13との間で予備放電を行なう。そ
して、この後に絶縁膜15の開口部15ａがボンディングワ
イヤ11の先端直下に位置するように電極治具16を移動さ
せて平板トーチ電極13をセットし、ワイヤ11と平板トー
チ電極13との間に放電を発生させて、ボンディングワイ
ヤ11の先端にボールを形成し、このボールを所定電極に
ボンディングする。On the other hand, as a bonding procedure, first,
At the time of replacing the flat torch electrode and starting up the bonder, a preliminary discharge is performed between the bonding wire 11 and the flat torch electrode 13 to perform bonding on a predetermined test bonding pad (not shown), or A needle electrode 17 as shown in FIG. 2 is separately provided, and a preliminary discharge is performed between the needle electrode 17 and the plate torch electrode 13 when replacing the plate torch electrode and when starting up the bonder. Then, after this, the flat plate torch electrode 13 is set by moving the electrode jig 16 so that the opening 15 a of the insulating film 15 is located immediately below the tip of the bonding wire 11, and between the wire 11 and the flat plate torch electrode 13. A discharge is generated to form a ball at the tip of the bonding wire 11, and the ball is bonded to a predetermined electrode.
【００１６】上述のような構成によれば、平板トーチ電
極13の放電領域を一定にすることができ、放電維持電圧
を安定させることができる。したがって、一定径のボー
ルを安定的に形成することができる。すなわち、一般に
平板トーチ電極上の放電領域面積は、放電電流値に略比
例する（正規グロー放電と同様な特性を示す）。このた
め、所定の放電電流値に相当する電極上の放電領域面積
よりも開口部15ａの面積を小さくすることにより、開口
部15ａが常に放電領域となり、放電領域を一定にするこ
とができる。この結果、放電領域周辺に堆積する炭素等
の堆積物による放電領域への影響をなくすことができ
る。一方、開口部15ａの面積を小さくしたことにより、
同一の放電電流においても放電維持電圧が高くなり放電
エネルギが大きくなるため、ボール径も大きくなる。According to the above configuration, the discharge area of the flat torch electrode 13 can be made constant, and the discharge sustaining voltage can be stabilized. Therefore, a ball having a constant diameter can be formed stably. That is, in general, the area of the discharge region on the flat torch electrode is substantially proportional to the discharge current value (having the same characteristics as the normal glow discharge). For this reason, by making the area of the opening 15a smaller than the area of the discharge region on the electrode corresponding to the predetermined discharge current value, the opening 15a always becomes a discharge region, and the discharge region can be kept constant. As a result, it is possible to eliminate the influence on the discharge region due to deposits such as carbon deposited around the discharge region. On the other hand, by reducing the area of the opening 15a,
Even at the same discharge current, the discharge sustaining voltage increases and the discharge energy increases, so that the ball diameter also increases.
【００１７】また、本実施例では、放電領域が平板トー
チ電極13の開口部15ａ内に固定されて、放電時のスパッ
タリングにより電極が消耗するので、平板トーチ電極13
を適宜交換する必要がある。この場合、フォトリソグラ
フィにより絶縁膜15の開口部15ａが形成されているの
で、交換用の平板トーチ電極13を準備する場合、開口部
15ａが同一のものを容易に成形することができる。した
がって、平板トーチ電極13を交換した場合でも、放電領
域を一定にすることができ、ボール径を一定にすること
ができる。In this embodiment, the discharge region is fixed in the opening 15a of the flat plate torch electrode 13, and the electrode is consumed by sputtering at the time of discharge.
Need to be replaced as appropriate. In this case, since the opening 15a of the insulating film 15 is formed by photolithography, when preparing a replacement flat plate torch electrode 13, the opening 15a is formed.
Those having the same 15a can be easily formed. Therefore, even when the flat torch electrode 13 is replaced, the discharge area can be kept constant, and the ball diameter can be kept constant.
【００１８】さらに、平板トーチ電極13が電極治具16に
着脱自在に取り付けられているので、平板トーチ電極13
が消耗した場合の交換を簡略化することができる。ま
た、取り外した平板トーチ電極13の表面を研磨し後、開
口部15ａを有する絶縁膜15を形成することにより、平板
トーチ電極を再生することもできる。またさらに、平板
トーチ電極交換時およびボンダー立上げ時、電極上の開
口部15ａには付着物等が存在すると、放電領域が固定さ
れているため、放電が安定しない場合があるが、本実施
例では、トーチ電極交換時およびボンダー立上げ時に
は、予備放電により、平板トーチ電極13の放電領域を清
浄することができるので、本ボンディング時のボール形
成を一層安定化することができる。なお、この時に形成
されるボールは試験用ボンディングパッドにボンディン
グするため、本ボンディングに影響を与えることはな
い。Further, since the flat torch electrode 13 is detachably attached to the electrode jig 16, the flat torch electrode 13
Replacement when the battery is exhausted can be simplified. After polishing the surface of the removed flat torch electrode 13, the insulating film 15 having the opening 15a is formed, whereby the flat torch electrode can be regenerated. Further, when the flat torch electrode is replaced and the bonder is started, if there is any deposit on the opening 15a on the electrode, the discharge area may be fixed and the discharge may not be stable. Then, at the time of replacing the torch electrode and at the time of starting the bonder, the discharge region of the flat plate torch electrode 13 can be cleaned by the preliminary discharge, so that the ball formation at the time of the final bonding can be further stabilized. Since the ball formed at this time is bonded to the test bonding pad, it does not affect the actual bonding.
【００１９】また一方、予備放電用の針状電極17を設け
た場合には、上述同様に平板トーチ電極の放電領域を清
浄することができ、さらに、試験用ボンディングパット
に対するボンディング動作を不要にすることができる。On the other hand, when the needle electrode 17 for preliminary discharge is provided, the discharge region of the flat torch electrode can be cleaned as described above, and the bonding operation to the test bonding pad becomes unnecessary. be able to.
【００２０】[0020]
【発明の効果】請求項１記載の発明によれば、開口部を
有する絶縁膜を平板トーチ電極上に形成しているので、
平板トーチ電極上の放電領域を一定にすることができ、
放電維持電圧を安定させ、ボール径を安定的に一定にす
ることができる。また、予備放電により、平板トーチ電
極の放電領域を清浄することができ、本ボンディング時
のボール形成を一層安定化することができる。 According to the first aspect of the present invention, since the insulating film having the opening is formed on the flat torch electrode,
The discharge area on the flat torch electrode can be made constant,
The discharge sustaining voltage can be stabilized , and the ball diameter can be stably kept constant. In addition, the flat discharge torch
The discharge area of the pole can be cleaned,
Ball formation can be further stabilized.
【００２１】請求項２記載の発明によれば、請求項１の
効果に加え、予備放電用の針状電極を設けたことによ
り、平板トーチ電極の放電領域を清浄することができ、
本ボンディング時のボール形成を一層安定化することが
でき、さらに試験用ボンディングパットに対するボンデ
ィング動作を不要にすることができる。 According to the second aspect of the invention, in addition to the effect of the first aspect, a needle electrode for preliminary discharge is provided.
The discharge area of the flat torch electrode can be cleaned,
It is possible to further stabilize ball formation during actual bonding.
To bond pads for testing.
This eliminates the need for a switching operation .
【００２２】[0022]
【図１】本発明に係るワイヤボンディング装置の一実施
例を示すその概略断面図。FIG. 1 is a schematic sectional view showing one embodiment of a wire bonding apparatus according to the present invention.
【図２】図１における装置において針状電極を設けた場
合の電極清浄動作を示す図。FIG. 2 is a diagram showing an electrode cleaning operation when a needle-shaped electrode is provided in the apparatus in FIG.
【図３】従来のワイヤボンディング装置の概略断面図。FIG. 3 is a schematic sectional view of a conventional wire bonding apparatus.
【図４】図３における装置の放電維持電圧電流特性を示
す図。FIG. 4 is a diagram showing discharge sustaining voltage-current characteristics of the device in FIG.
11 ボンディングワイヤ（ワイヤ） 13 平板トーチ電極 15 絶縁膜 15ａ 開口部 17 針状電極 11 Bonding wire (wire) 13 Flat plate torch electrode 15 Insulating film 15a Opening 17 Needle electrode
Claims (2)
に、開口部を有する絶縁膜を形成し、 ワイヤと平板トー
チ電極との間の放電を該絶縁膜の開口部を通して行うこ
とにより、ワイヤの先端にボールを形成し、該ボールを
所定電極にボンディングするワイヤボンディング装置で
あって、 前記平板トーチ電極交換時およびボンダー立上げ時に、
ワイヤと平板トーチ電極との間で予備放電が行われ、所
定の試験用ボンディングパッド上にボンディングが行わ
れること を特徴とするワイヤボンディング装置。 1. A surface of a flat torch electrode facing a wire.
Then, an insulating film having an opening is formed, and discharge between the wire and the flat torch electrode is performed through the opening of the insulating film.
A ball is formed at the end of the wire, and the ball is bonded to a predetermined electrode with a wire bonding apparatus .
There are, at the time and bonder startup the flat torch electrode replacement,
Predischarge is performed between the wire and the flat torch electrode,
Bonding on a fixed test bonding pad
Wire bonding apparatus which is characterized in that.
電極と平板トーチ電極との間で予備放電が行われること
を特徴とする請求項１記載のワイヤボンディング装置。 2. A needle-shaped electrode is provided separately from the wire, and the needle-shaped electrode is provided when the flat torch electrode is replaced and when the bonder is started up.
2. The wire bonding apparatus according to claim 1 , wherein a preliminary discharge is performed between the electrode and the flat torch electrode .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3257272A JP3027448B2 (en) | 1991-10-04 | 1991-10-04 | Wire bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3257272A JP3027448B2 (en) | 1991-10-04 | 1991-10-04 | Wire bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05102233A JPH05102233A (en) | 1993-04-23 |
| JP3027448B2 true JP3027448B2 (en) | 2000-04-04 |
Family
ID=17304079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3257272A Expired - Fee Related JP3027448B2 (en) | 1991-10-04 | 1991-10-04 | Wire bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3027448B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07263480A (en) * | 1994-03-18 | 1995-10-13 | Shinkawa Ltd | Method and apparatus for wire bonding |
| JP3400269B2 (en) * | 1996-10-17 | 2003-04-28 | 株式会社新川 | Ball forming device in wire bonding |
| JPH10125714A (en) * | 1996-10-17 | 1998-05-15 | Shinkawa Ltd | Method of forming ball for wire bonding |
| JP2003163235A (en) | 2001-11-29 | 2003-06-06 | Shinkawa Ltd | Apparatus for wire bonding |
-
1991
- 1991-10-04 JP JP3257272A patent/JP3027448B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05102233A (en) | 1993-04-23 |
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| LAPS | Cancellation because of no payment of annual fees |