JP3025083U - Terminal structure of semiconductor device - Google Patents

Abstract

(57) Abstract: A signal terminal protruding from a resin case of a semiconductor device is reinforced so as not to be easily bent or broken even if some external force is applied to the terminal. Increase credibility. SOLUTION: In a semiconductor device in which a signal terminal 4, which is a plurality of pin terminals, and a guide pin 4 are aligned and drawn out from a resin case in which a main circuit power element and a control circuit element are incorporated, a guide pin, and The pin terminals are connected to each other by a band-shaped reinforcing insulating plate integrally insert-molded at the root side of the pin terminals to enhance the bending strength of the signal terminals.

Description

[Detailed description of the device]

[0001]

[Technical field to which the device belongs]

 The present invention relates to a semiconductor device terminal structure for an inverter power module, an intelligent power module, or the like.

[0002]

[Prior art]

 First, FIG. 5 shows the outer shape of the entire package of the conventional semiconductor device described above. In the figure, 1 is a resin case incorporating a main circuit power element and a control circuit element, 2 is a main circuit terminal drawn out in the peripheral region of the upper surface of the resin case 1, 3 is a signal terminal, and the signal terminal 3 Are arranged in a line on the left and right and protrude from the upper surface of the resin case 1 together with guide pins 4 arranged at both ends as pin terminals. The pin terminal as the signal terminal 3 is usually a thin brass square pin having a thickness of about 0.4 mm. The guide pin 4 also serves as a connector guide when connecting the flat cable connector for external wiring to the signal terminal 3.

Further, FIGS. 6A to 6C show various lead-out structures for the signal terminal 3 described above. In FIG. 6A, the signal terminal 3 is insert-formed in the resin case 1. In the figure, 5 is a metal base plate and 6 is a sealing resin (cast epoxy resin). Further, in (b), the signal terminal 3 is press-fitted through the resin case 1, and in (c), the signal terminal 3 is fixed to the sealing resin 6.

[0004]

[Problems to be solved by the device]

 As described above, in the conventional terminal structure, since the signal terminal 3 projects from the resin case 1 as a thin pin terminal, a slight external force is applied during semiconductor device product assembly, testing, product shipment, and transportation. The pin terminals may be bent or broken just by doing so, which often causes problems such as the inability to connect to the connector for external wiring smoothly or poor connection. The solution is quality control. From the aspect, it is a big issue.

The present invention has been made in view of the above points, and solves the above-mentioned problems with the above-mentioned signal terminals, and does not easily bend or break even if some external force is applied. An object of the present invention is to provide a terminal structure of a semiconductor device that has been strengthened.

[0006]

[Means for Solving the Problems]

 In order to achieve the above object, according to the present invention, a terminal structure is configured as follows. 1) In a semiconductor device in which a plurality of signal pin terminals and guide pins are lined up in a line from a resin case incorporating a main circuit power element and a control circuit element, the guide pin and the pin terminal are connected to each other. A band-shaped reinforced insulating plate is integrally connected over the space.

Further, in the above structure, the reinforcing insulating plate is insert-molded between the guide pin and the pin terminal by using the casting resin. 2) A printed wiring board for terminals, in which a plurality of signal terminals are arranged in a row and pulled out from a resin case incorporating a power element for the main circuit and a control circuit element, and the signal terminals are patterned with copper foil. To the terminal mounting part of the resin case.

Further, the terminal printed wiring board having the above structure can be assembled by connecting one end thereof to the control circuit printed wiring board inside the resin case. According to the configurations in 1) and 2) above, the signal terminals drawn out from the resin case are not separated and independent one by one, but are supported by the reinforcing insulation board or the insulation board of the printed wiring board. As the strength is increased, the signal terminals will not bend or break even if some external force is applied during handling.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings by classifying them according to the forms 1) and 2). In the drawings of the respective embodiments, the same members corresponding to FIG. 5 are designated by the same reference numerals. [Embodiment 1] FIGS. 1 (a) and 1 (b) show an embodiment corresponding to claim 1 of the present invention. In FIG. 1, a plurality of pin terminals are drawn out from a resin case 1 in a line. With respect to the signal terminals 3 and the guide pins 4 arranged at both ends of the terminal row, a band-shaped reinforcing insulating plate 7 is integrally connected to the root side of these parts across the parts. As a result, the bending strength of the square pin terminal having a small thickness is strengthened, and the signal terminal 3 is not bent or broken even if some external force is applied. When the external wiring connector (female connector) is connected to the signal terminal 3 adopting such a terminal structure, it is necessary to partially modify the structure so that the connector can be inserted up to the root of the pin terminal.

The reinforcing insulating plate 7 is integrally molded with the signal terminal 3 and the guide pin 4 by resin, and specifically, the signal terminal 3 and the guide pin 4 are formed on a resin molding die. It is manufactured by inserting a core (metal rod), injecting a casting resin into the core, and performing insert molding. Then, the terminal assembly integrated with the reinforcing insulating plate 7 is incorporated into the resin case 1 by the same method as shown in FIGS. Alternatively, the terminal assembly may be embedded in a printed wiring board for a control circuit and integrated into the resin case 1 and fixed with a sealing resin 6 (see FIG. 6).

As the material of the reinforcing insulating plate 7, PBT resin, PPS resin of the same material as the resin case 1, or epoxy and BT resin reinforced with glass fiber similar to the printed wiring board can be adopted. Further, FIG. 2 is an applied example, in which a rib-shaped projection 7a is bulged and formed in the middle of the reinforcing insulating plate 7. As a result, the strength against bending is further enhanced as compared with the structure of FIG.

[Embodiment 2] FIG. 3 shows an embodiment corresponding to claim 3 of the present invention. In this embodiment, the pin terminal shown in FIG. 5 or Embodiment 1 is used as the signal terminal 3. Is replaced with a printed wiring board to form the terminal structure. That is, reference numeral 8 is a printed wiring board for signal terminals, and the signal terminals 3 are pattern-formed as copper foils arranged in a line on a substrate (insulator) 8a of the printed wiring board 8. The signal terminal printed wiring board 8 is incorporated in the terminal mounting portion of the resin case 1 as shown in FIG. 4 (a) or 4 (b).

That is, in FIG. 4A, the printed wiring board 9 for the control circuit incorporated in the resin case 1 is used as a mother board and the printed wiring board 8 for signal terminals attached to the resin case 1 is drawn into the case. The ends are directly connected to the printed wiring board 9 and are internally wired between both the printed wiring boards. Reference numeral 9a is a control circuit element mounted on the printed wiring board 9, 10 is a main circuit power element (for example, an IGBT), and 10a is a power element mounting substrate. Further, in (b), the signal terminal printed wiring board 8 incorporated in the resin case 1 and the signal terminals patterned on the control circuit printed wiring board 9 are connected via the internal leads 11.

According to such a terminal structure, even if some external force is applied during handling of the product, there is no possibility that the signal terminal 3 protruding from the resin case 1 is deformed or broken. A connector known as a card edge connector can be applied to the connection between the signal terminal 3 formed on the printed wiring board 8 and the external wiring.

[0015]

[Effect of device]

 As described above, according to the configuration of the present invention, even if some external force is applied to the signal terminal protruding from the resin case, there is no possibility that the terminal itself will be bent or broken, and thus the semiconductor device product can be manufactured. Quality and reliability are improved. Moreover, the terminal structure of the present invention can be easily applied by directly using the production facilities of the component makers and device makers.

[Brief description of drawings]

1A and 1B are configuration diagrams of an embodiment corresponding to the first embodiment of the present invention, in which FIG. 1A is an external perspective view of a terminal structure, and FIG.

2 is an external perspective view of a terminal structure showing an application example of FIG.

FIG. 3 is an external perspective view of a terminal structure corresponding to Example 2 of the present invention.

FIG. 4 is a diagram showing an example of a connection structure with a printed wiring board for a control circuit for the terminal structure of FIG. 3, and (a) and (b) are connection structure diagrams of different examples.

FIG. 5 is an external view of an entire package of a conventional semiconductor device to which the present invention is applied.

FIG. 6 is a diagram showing an example of a connection structure of signal terminals in FIG. 5, and (a), (b), and (c) are connection structure diagrams of different examples.

[Explanation of symbols]

 1 Resin Case 3 Signal Terminal 4 Guide Pin 7 Reinforcing Insulation Plate 8 Signal Terminal Printed Wiring Board 8a Substrate 9 Control Circuit Printed Wiring Board 9a Control Circuit Element 10 Main Circuit Power Element

Claims (4)

[Scope of utility model registration request] 1. A plurality of signal pin terminals from a resin case incorporating a main circuit power element and a control circuit element,
A terminal structure of a semiconductor device in which a band-shaped reinforcing insulating plate is integrally connected across the guide pin and the pin terminal in a semiconductor device in which the guide pins are arranged in a line and pulled out. 2. The terminal structure for a semiconductor device according to claim 1, wherein a reinforcing insulating plate is insert-molded between the guide pin and the pin terminal by using a casting resin. 3. A semiconductor device in which a plurality of signal terminals are lined up in a row from a resin case incorporating a power element for a main circuit and a control circuit element and pulled out, and a terminal print in which a signal terminal is patterned as a copper foil. A terminal structure of a semiconductor device, wherein a wiring board is incorporated in a terminal mounting portion of a resin case. 4. A terminal structure for a semiconductor device according to claim 3, wherein one end of the terminal printed wiring board is connected to a control circuit printed wiring board inside the resin case.