JP3003461B2 - Capacitor array parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a capacitor incorporated in various electronic circuits and used as a noise filter or the like, and more particularly to a capacitor array component having a plurality of capacitor elements.

[0002]

2. Description of the Related Art As shown in FIG. 20, a conventional capacitor array component 81 includes signal inner conductors 86a and 86.
It comprises a dielectric sheet 84 having b and 86c on its surface, a dielectric sheet 84 having a ground internal conductor 88 on its surface, and a dielectric sheet 84 as a protective layer. After stacking these dielectric sheets 84, they are pressed and fired to obtain a capacitor array component 81 shown in FIG. Input / output electrodes 92a and 92b are formed on the rear and front side portions of the capacitor array component 81, and ground end surface electrodes 95 and 96 are formed on both ends. The signal inner conductors 86a to 86c are input / output electrodes 92a,
The ground internal conductor 88 is electrically connected to the ground end surface electrodes 95 and 96.

FIG. 22 shows the electrical characteristics of a capacitor array component 81.
It is an equivalent circuit diagram. The signal inner conductors 86a to 86c and
And the capacitor element C₁₁,
C₁₂, C ₁₃Is formed. Where L₁₁, L₁₂, L₁₃
Is each capacitor element C₁₁, C₁₂, C₁₃The inside of the ground
The residual inductance generated in the body 88 is shown.
This residual inductance L₁₁~ L₁₃Is a capacitor array
When the component 81 is used in a high frequency band,
It can no longer be ignored. However, the capacitor
Capacitor element C located at the center of ray component 81
₁₂Means that the distance to the ground end surface electrodes 95 and 96 is long.
Therefore, the other capacitor element C located on the end side ₁₁as well as
C₁₃Residual inductance L₁₁And L₁₃Residue compared to
Inductance L ₁₂Becomes larger. Therefore, noise
High frequency signal is grounded from signal inner conductors 86a-86c.
There is a problem that it is difficult for the inner conductor 88 to be bypassed.
Was.

An object of the present invention is to provide a capacitor array component having excellent insertion loss characteristics in a high frequency band.

[0005]

In order to solve the above-mentioned problems, a capacitor array component according to the present invention has a laminated structure.
Install in a direction perpendicular to the stacking direction of
And the input / output electrodes provided on both sides of the component.
A signal inner conductor electrically connected to the signal inner conductor ;
Ground internal conductor and ground provided in orthogonal directions
And a plurality of capacitor elements facing each other with a dielectric interposed therebetween, and the ground external electrode is provided on at least one of the front surface and the back surface of the component,
And the ground inner conductor and the ground outer electrode
Is applied to the ground end face electrodes provided on both end faces of the component.
The ground external electrode and the ground internal conductor are connected to the ground external electrode and the ground internal conductor , respectively.
It is electrically connected via the hole. In addition,
The capacitor array component according to the present invention is a component having a laminated structure.
Provided in a direction perpendicular to the lamination direction of the product, and
Electrically connected to the input / output electrodes provided on both sides of the part
Signal inner conductor and a direction perpendicular to the signal inner conductor.
With the ground internal conductor and ground external electrode provided
Have multiple capacitor elements facing each other across a dielectric
Having the ground external electrode on the front surface or the back surface of the component.
Provided on at least one of the surfaces, and
Ground end where land inner conductors are provided on both end surfaces of the component
Connected to the surface electrode, and connected to the ground end surface electrode.
The ground external electrode is electrically connected to the outer surface of the component.
The ground external electrode and the ground
Vias for shunting high frequency noise
Connected electrically through the Where the via
The hole extends from one of the ground end face electrodes to the other of the grounds.
Inside the ground in the direction toward the ground end electrode.
It is provided at least at the center of the conductor.

A ground external electrode is provided on at least one of the front and back surfaces of the capacitor array component,
By electrically connecting the ground external electrode and the ground internal conductor with via holes, the residual inductance generated in the ground internal conductor of each capacitor element is reduced.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a capacitor array component according to the present invention will be described below with reference to the accompanying drawings. First Embodiment, FIGS. 1 to 4 As shown in FIG. 1, a capacitor array component 1 has a dielectric sheet 2a provided with a ground external electrode 5a on the upper surface, and a dielectric material provided with a ground internal conductor 6a on the upper surface. Sheet 2b, signal inner conductors 7a, 7b, 7
The dielectric sheet 2c has a dielectric sheet 2c provided on its upper surface, a ground inner conductor 6b and a ground external electrode 5b provided on its upper and lower surfaces, respectively. Instead of the dielectric sheet 2d, two dielectric sheets in which the ground inner conductor 6b and the ground external electrode 5b are separately formed may be used. Further, the dielectric sheet 2a,
2d is provided with via holes 8a and 8b. Each of the dielectric sheets 2a to 2d is made of, for example, a ceramic material.

The ends of the ground external electrodes 5a and 5b are exposed at the left and right edges of the dielectric sheets 2a and 2d, respectively. The ends of the ground inner conductors 6a, 6b are exposed at the left and right edges of the dielectric sheets 2b, 2d, respectively. The ends of the signal inner conductors 7a to 7c are exposed at the front and rear edges of the dielectric sheet 2c. These electrodes 5a, 5
The conductor b and the conductors 6a, 6b, 7a, 7b, 7c are formed by applying a conductive paste to the surface of the dielectric sheets 2a to 2d by printing or the like and drying. As the conductive paste, a paste obtained by kneading a metal powder such as Ag or Ag-Pd with a binder and a solvent is used.

The above dielectric sheets 2a to 2d are stacked, pressed and fired to form a capacitor array component 1 as shown in FIG. Ground end surface electrodes 12 and 13 are provided on the left and right end surfaces of the capacitor array component 1, respectively, and input / output electrodes 14a and 14b are formed on the front and rear side surfaces, respectively. As shown in FIGS. 3 and 4, both ends of the ground external electrodes 5a and 5b and the ground internal conductors 6a and 6b are electrically connected to the ground end electrodes 12 and 13, respectively. Both ends of the signal inner conductors 7a to 7c have input / output electrodes 14a, 1a.
4b. In a stacked state,
The ground external electrode 5a and the ground internal conductor 6a are electrically connected via the via hole 8a, and the ground external electrode 5b and the ground internal conductor 6b are electrically connected via the via hole 8b. Further, the ground inner conductors 6a and 6b, the signal inner conductors 7a to 7c, and the ground
The poles 5a and 5b form three capacitor elements.

The capacitor array component 1 thus obtained
Is surface-mounted on the printed wiring board 20, for example. That is, the input / output electrodes 14a and 14b are respectively connected to the printed wiring board 2
The wire is electrically connected to the signal conductor provided on the surface of the "0" by solder and fixed. The ground end electrodes 12 and 13 are ground conductors 2 provided on the surface of the printed wiring board 20, respectively.
1 is electrically connected by solder and fixed. And
The high-frequency noise transmitted through the signal conductor is generated by the signal inner conductors 7a to 7a.
7c to ground internal conductors 6a, 6b and via hole 8
Through the external ground electrodes 5a and 5b via the external ground electrodes 5a and 5b, they flow to the ground end electrodes 12 and 13 and are removed to the ground side.

In this case, the ground external electrodes 5a, 5b are connected via the via holes 8a, 8b to the ground internal conductors 6a, 5b.
Since it is electrically connected to the central portion of the capacitor 6b, the residual inductance generated in the ground internal conductor of the three capacitor elements built in the capacitor array component 1 is reduced. In particular, the insertion loss characteristic of the capacitor element located at the center of the three capacitor elements is significantly improved.

[Second Embodiment, FIGS. 5 to 17] A capacitor array component according to a second embodiment will be described with reference to a structure in which two coil portions are stacked with a capacitor portion interposed therebetween.
FIGS. 5 to 15 show magnetic sheets 25a to 25c and 25h to 25k and dielectric sheets 25d to 25g constituting the capacitor array component. As shown in FIG. 5, a ground external electrode 26a is provided on the upper surface of the magnetic sheet 25a, and a via hole 28a is provided in the center. As shown in FIG.
Three coil conductors 27a are provided on the upper surface of b, one end of which is exposed to the edge of the magnetic sheet 25b, and the other end is provided with a via hole 35. Further, a via hole 28b is provided at the center of the magnetic sheet 25b.
Is provided. As shown in FIG.
On the upper surface of 5c, three coil conductors 27b are provided,
One end thereof is exposed at the edge of the magnetic sheet 25c. Further, a via hole 28c is provided in the center of the magnetic sheet 25c.

As shown in FIG. 8, a via hole 28d is provided at the center of the dielectric sheet 25d. As shown in FIG. 9, a ground inner conductor 29a is provided on the upper surface of the dielectric sheet 25e. As shown in FIG.
Three signal inner conductors 30a and 30b are provided on the upper surface of the dielectric sheet 25f, respectively. As shown in FIG. 11, a ground inner conductor 29b is provided on the upper surface of the dielectric sheet 25g, and a via hole 34a is provided in the center thereof.

As shown in FIG. 12, the magnetic sheet 25h
Is provided with a via hole 34b at the center. FIG.
As shown in FIG. 3, three coil conductors 32a are provided on the upper surface of the magnetic sheet 25i, one end of which is exposed at the edge of the magnetic sheet 25i, and the other end is provided with a via hole 36. Have been. Further, the magnetic sheet 25i
Is provided with a via hole 34c at the center. FIG.
As shown in FIG. 4, three coil conductors 32b are provided on the upper surface of the magnetic sheet 25j, and one end of the coil conductor 32b is exposed at the edge of the magnetic sheet 25j. Further, a via hole 34d is provided in the center of the magnetic sheet 25j. As shown in FIG. 15, a ground external electrode 26b is provided on the lower surface of the magnetic sheet 25k, and a via hole 34e is provided in the center.

Sheets 25a to 25k having the above construction
Are the sheets 25j, 25i, 2 sequentially on the sheet 25k.
After stacking 5h... 25a, they are pressed and fired, and FIG.
And a capacitor array component 39 shown in FIG. Ground end face electrodes 40, 41 are provided on the left and right end faces of the capacitor array component 39, respectively, and input / output electrodes 42a, 42
b is formed.

Both ends of the ground external electrodes 26a and 26b and the ground internal conductors 29a and 29b are electrically connected to ground end face electrodes 40 and 41, respectively. One end of each of the signal inner conductors 30a and 30b is electrically connected to the input / output electrodes 42a and 42b. One ends of the coil conductors 27a and 32a are electrically connected to the input / output electrode 42b, and one ends of the coil conductors 27b and 32b are electrically connected to the input / output electrode 42a. In the stacked state, the ground external electrode 26a and the ground internal electrode 29a are connected to the via holes 28 (28a, 28b, 2).
8c, 28d), and the ground external electrode 26b and the ground internal electrode 29b are electrically connected via via holes 34 (34a, 34b, 34c, 34d). And the ground inner conductor 29
a, 29b, signal inner conductors 30a, 30b and outside ground
A capacitor element is formed by the partial electrodes 26a and 26b . Further, the coil conductors 27a and 27b
The coil conductors 32a and 32b are connected in series through a via hole 36 to form a coil.

The capacitor array component 3 thus obtained
9 has the same operation and effect as the capacitor array component of the first embodiment. [Third Embodiment, FIG. 18] The capacitor array component 50 of the third embodiment has a structure in which two capacitor portions 51 and 52 are stacked with a coil portion 53 interposed therebetween.

FIG. 18 is a cross-sectional view of the capacitor array component 50 in the width direction. In the capacitor section 51, the ground inner conductor 54a and the signal inner conductor 55a are arranged inside the dielectric 58a in a state where they face each other. The ground inner conductor 54a is electrically connected to a ground external electrode 56a provided on the upper surface of the capacitor array component 50 via a via hole 57a. Similarly, in the capacitor section 52, the ground inner conductor 54b and the signal inner conductor 55b are disposed inside the dielectric 58b in a state where they face each other. The ground inner conductor 54b is connected to a ground external electrode 56 provided on the lower surface of the capacitor array component 50 via a via hole 57b.
b. The ground inner conductor 54a,
54b, the signal inner conductors 55a, 55b and the ground
Each of the poles 56a and 56b forms a capacitor element.

In the coil section 53, the coil conductor 60
a, 60b, and 60c are connected in series via a via hole (not shown), and a coil 60 is formed in the magnetic body 61. The ground outer electrodes 56a and 56b and the ground inner conductors 54a and 54b are electrically connected to a ground end face electrode 63 provided on the end face of the capacitor array component 50. One end of the signal inner conductor 55a and one end of the coil 60 are electrically connected to an input / output electrode 62a provided on one side surface of the capacitor array component 50. Further, the other ends of the signal inner conductor 55b and the coil 60 are electrically connected to an input / output electrode 62b provided on the other side surface of the capacitor array component 50.

The capacitor array component 5 thus obtained
0 has the same operation and effect as the capacitor array component of the first embodiment. [Other Embodiments] The capacitor array component according to the present invention is not limited to the above embodiment, but can be variously modified within the scope of the gist.

As in the above embodiment, the number of via holes for electrically connecting the ground inner conductor and the ground external electrode is not necessarily one. That is, the number may be appropriately increased or decreased according to the application, and may be two or more. However, in order to effectively remove noise in a high frequency band, it is preferable that at least one via hole is provided at the center of the ground internal electrode.

Further, the ground external electrode 75 may not be directly connected to the ground end face electrodes 71 and 72 on the surface of the component as in the capacitor array component 70 shown in FIG. In this case, the ground external electrode 7
Reference numeral 5 is directly connected to a ground conductor provided on a printed wiring board or the like by means such as soldering. here,
Reference numerals 73a and 73b denote input / output electrodes, and reference numeral 76 denotes a via hole for electrically connecting a ground internal conductor contained in the capacitor array component 70 to the ground external electrode 75.

Further, the ground external electrode does not necessarily need to be provided on the front and back surfaces of the component as in the above embodiment.
It may be provided on only one of the surfaces.

[0024]

As is apparent from the above description, according to the present invention, a ground external electrode is provided on at least one of the front and back surfaces of a component, and the ground external electrode and the ground external electrode are disposed inside the component. Since the grounded internal conductor is electrically connected to the via hole, the residual inductance generated in the grounded internal conductor of each capacitor element incorporated in the capacitor array component can be reduced. In particular, the residual inductance of the capacitor element located at the center of each capacitor element can be significantly improved.

Further, since the via hole is used as a means for connecting the ground external electrode and the ground internal conductor, the connection between the ground external electrode and the ground internal conductor can be made at a short distance, and relatively easily. Capacitor array components can be manufactured. As a result, a capacitor array component having excellent insertion loss characteristics in a high frequency band can be obtained.

[Brief description of the drawings]

FIGS. 1 to 4 show a first embodiment of a capacitor array component according to the present invention.

FIG. 1 is an assembled perspective view of a capacitor array component.

FIG. 2 is a perspective view showing the appearance of the capacitor array component shown in FIG.

FIG. 3 is a sectional view taken along the line III-III in FIG. 2;

FIG. 4 is a sectional view taken along line IV-IV of FIG. 2; FIGS. 5 to 17 show a second embodiment of the capacitor array component according to the present invention.

FIG. 5 is a plan view of a base sheet used for a capacitor array component.

FIG. 6 is a plan view of a base sheet used for a capacitor array component.

FIG. 7 is a plan view of a base sheet used for a capacitor array component.

FIG. 8 is a plan view of a base sheet used for a capacitor array component.

FIG. 9 is a plan view of a base sheet used for a capacitor array component.

FIG. 10 is a plan view of a base sheet used for a capacitor array component.

FIG. 11 is a plan view of a base sheet used for a capacitor array component.

FIG. 12 is a plan view of a base sheet used for a capacitor array component.

FIG. 13 is a plan view of a base sheet used for a capacitor array component.

FIG. 14 is a plan view of a base sheet used for a capacitor array component.

FIG. 15 is a plan view of a base sheet used for a capacitor array component.

FIG. 16 is a perspective view showing the appearance of a capacitor array component.

FIG. 17 is a sectional view taken along the line XVII-XVII of FIG. 16;

FIG. 18 is a sectional view showing a third embodiment of the capacitor array component according to the present invention.

FIG. 19 is a perspective view showing another embodiment of the capacitor array component according to the present invention. 20 to 22 show a conventional example.

FIG. 20 is an assembled perspective view of a conventional example.

FIG. 21 is a perspective view showing the appearance of the conventional example shown in FIG. 20;

FIG. 22 is an electric equivalent circuit diagram of the conventional example shown in FIG. 21;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Capacitor array component 2a, 2b, 2c, 2d ... Dielectric sheet 5a, 5b ... Ground external electrode 6a, 6b ... Ground internal conductor 7a, 7b, 7c ... Signal internal conductor 8a, 8b ... Via hole 25d, 25e, 25f, 25g dielectric sheet 26a, 26b ground external electrode 28 (28a, 28b, 28c, 28d) via hole 29a, 29b ground internal conductor 30a, 30b signal internal conductor 34 (34a, 34b, 34c, 34d, 34e) ... Via holes 39 ... Capacitor array components 50 ... Capacitor array components 54a, 54b ... Ground internal conductors 55a, 55b ... Signal internal conductors 56a, 56b ... Ground external electrodes 57a, 57b ... Via holes 58a, 58b ... Dielectric 70 ... Capacitor array components 75 … Ground external electrode 6 ... via holes

Claims (3)

(57) [Claims] 1. A component having a laminated structure with respect to a laminating direction.
Are provided in the direction orthogonal to
A signal inner conductor electrically connected to the input / output electrode, and a ground inner conductor and a ground outer electrode provided in a direction orthogonal to the signal inner conductor are opposed to each other with a dielectric interposed therebetween. Having a plurality of capacitor elements ,
External electrodes are provided on at least one of the front and back surfaces of the component, and
Ground external electrodes are connected to the ground
It is connected respectively to the command end surface electrodes, and the external ground electrode and the ground inner conductor high frequency noise
Are electrically connected via via holes for shunting
Capacitor array part, wherein are. (2) In the stacking direction of parts with a stacked structure
Are provided in the direction orthogonal to
Signal inner conductor electrically connected to the connected input / output electrodes
And a ground provided in a direction orthogonal to the signal inner conductor.
The internal conductor and the ground external electrode are
A plurality of opposing capacitor elements;
External electrode is at least one of the front and back of the component
Provided on one surface and the ground inner conductor is
Connected to ground end face electrodes provided on both end faces of the product
With the ground end face electrode and the ground external
The poles are electrically disconnected on the outer surface of the part,
The ground outer electrode and the ground inner conductor have a high circumference.
Electrically via via holes to shunt wave noise
Capacitor array section characterized by being connected
Goods. (3) From the ground end face electrode to the other
In the direction toward the ground end face electrode, the ground
The via hole is provided at least in the center of the internal conductor.
3. The method according to claim 1, wherein
Capacitor array parts.