JP2992864B2 - Circuit board manufacturing method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a circuit board in an electric device used as a power source of a portable telephone or other portable device. 2. Description of the Related Art A rechargeable battery is used as a power source for a mobile phone. In such a case, the charging circuit is not provided separately from the mobile phone, and the battery and the charging circuit are contained in one package. The stored items are attached to a mobile phone as one replacement part. In this case, a printed circuit board is used as the circuit board, but it is inefficient in production because it is manufactured for each circuit. An object of the present invention is to provide a method for mass-producing a printed circuit board as described above. Also, at that time, the circuit pattern itself can be made without terminal fittings. [0004] A plurality of circuit patterns are prepared by connecting a plurality of circuit patterns for one device in a strip shape by pressing a conductive thin plate. Exposing the part to be the terminal part of the pattern and the part to which the circuit parts are attached, cover the circuit pattern with a liquid insulating resin film by painting or printing for each device, and dry and cure this resin to make the circuit Then, the strip-shaped connected body was cut for each device. Since the circuit pattern itself is continuously formed by pressing from a thin plate, the circuit pattern itself is mass-produced, and the resin base of the circuit board is formed by coating or printing the resin for each device. Therefore, this is also mass-produced, and can be processed continuously in each step, and is efficient. When plating is applied to the terminal, a step such as masking is not required, and plating can be performed continuously and only on necessary portions. FIG. 1 shows an embodiment of the present invention. This figure shows some of the manufacturing steps in the order of steps.
A circuit pattern 21, a terminal pattern 22, and a lead pattern 10 are formed on a strip 1 of a 12 mmt nickel plate by press working. At this time, if the pattern interval is small and the circuit pattern is long, the auxiliary connection portion 3 is provided. (FIG. 1A) For each of the formed patterns, a liquid insulator is applied or printed with a silk screen or the like, except for a place 41 where a circuit element of a terminal pattern, a lead pattern and a circuit pattern is attached, and dried and cured to form a sheet. A circuit base 4 made of an insulator is formed (FIG. 1B). Since the conductors such as the conductor patterns 21 and 22 are formed so as to be interconnected at the interconnecting portions C on both side edges of the metal band 1, the mutual positions of the conductors are determined, and the liquid Since the insulator is applied and dried and hardened, the shape of the circuit pattern does not collapse even if the interconnecting part and the auxiliary connecting part 3 of each conductor pattern are cut and removed thereafter.
FIG. 1B shows a state where the liquid insulator is applied and dried and cured. In the case of applying this liquid insulator, a window hole 41 is formed in advance by leaving a portion where a circuit element such as a resistor and a rectifier is attached to the circuit pattern, and the window hole 41 is formed in advance.
These circuit elements 6 are attached to the circuit pattern by soldering or spot welding. The circuit element 6 may be attached before the application of the liquid insulator in the step (A). These insulating layers may be formed not only on one side of the circuit pattern but also on both sides. FIG. 1C shows that the interconnecting portions C and the auxiliary connecting portions 3 on both sides of each conductor pattern are cut off and removed by pressing, and the end of the terminal pattern 22 is bent and raised to form a terminal fitting 5.
Are shown. When cutting the interconnecting part C, a hole 7 from which the auxiliary connecting part 3 is punched and removed is also formed. FIG. 1D shows a state in which the circuit board is completed, the rechargeable battery 8 is mounted, and the positive and negative electrodes of the battery are connected to the lead pattern 10 of the circuit pattern by spot welding. Although the battery may be used alone, it is generally used in series with the lead plate 9.
It is joined by. The battery formed as shown in FIG. 1D is inserted into the package body 12, and the package lid 11 is closed to complete the battery package (FIG. 1E). The connection terminal for the external power source and the connection terminal for the circuit in the mobile phone are provided with notches (not shown in the drawing, which are covered with the conductor pattern) which are terminal blocks on the side surface of the package body 12. It is formed by turning the terminal so that it looks through the terminal and wraps around the edge of the notch. As the conductive plate constituting the conductive pattern, a nickel plate having high corrosion resistance is used because the electrolytic solution of the rechargeable battery is a strong alkali.
A clad plate or plated plate of u or Ni-Cu-Ni is used. Also, if the portion to be a terminal portion is subjected to strip-like plating (noble metal plating or the like) before or after patterning the metal band 1, contact resistance can be reduced and no loss of noble metal occurs. Therefore, cost can be reduced. As the liquid insulator, heat resistance, electrical insulation, and chemical resistance are required, and therefore, polyimide varnish, polyparabanic acid varnish, and the like are preferable. When heat resistance is not particularly required and low cost is required, a flexible adhesive or liquid rubber may be used. When an insulating film is formed by coating or silk screen printing, the insulating film is formed on both sides or one side, dried and cured. [0010] The battery loaded in the package may be used alone, but generally, the lead plates are spot-welded in series. When this battery is processed into the state shown in FIG. 1D, an adhesive tape or an adhesive or an adhesive is applied to a surface of the sheet-shaped insulator 4 which comes into contact with the battery, and the battery is moved during processing. Eliminating it will improve workability. 1D is applied to the package body 12 or the above-described adhesive or adhesive treatment is applied to the package body side or the side facing the body on the sheet-shaped insulator 4. Doing so improves workability. In the above embodiment, the circuit pattern is 0.1 to
Although a thin plate of 0.12 mmt is used, the thickness is selected according to the current capacity of the circuit pattern or the required strength of the terminal of the terminal pattern, and the thickness is not limited to the above range. For example, when the terminal block is wrapped with the terminal pattern of the circuit board in the package of FIG. 1E, or when the terminal block is fixed to the terminal block 13, if the adhesive B is used as shown in FIG. Even if it is thinner, it is sufficient as a terminal. For example, it may be about 0.05 mmt. However, the use of this adhesive is not limited to the case where the conductive plate is particularly thin. Conversely, it may be thicker than the above example. When the conductor plate is thick, as shown in FIG. 3, the terminal portion may be simply bent and placed on the terminal block of the package. According to the present invention, a circuit can be formed from a metal plate having an arbitrary thickness, and an insulating sheet is formed by a very simple and highly mass-producing method of coating or printing. Electrical device can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a semi-finished product at each process step in one embodiment of the apparatus of the present invention. FIG. 2 is a perspective view of a main part of another embodiment of the present invention. [Description of References] 1 Metal plate band 2 Circuit pattern 3 Auxiliary connection portion 4 Liquid insulator 5 coated and dried to form a sheet 5 Terminal fitting 6 Circuit element 7 Hole 8 Battery 9 Lead plate 10 Connection lead plate 11 Lid 12 Package body 13 Terminal block 22 Terminal pattern 41 Window hole B Adhesive

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01R 9/00 H01R 9/15-9/28 H01M 2 / 10,10 / 46 H02J 7/00

Claims (1)

(57) [Claims] Circuits for one device are formed in such a form that circuit patterns are fixed to each other so as not to be separated from each other, and a plurality of such circuit patterns for one device are connected in a strip shape. Prepared by pressing from a conductor thin plate in a state in which the terminal portion and the circuit parts are attached to the circuit pattern connection body for each device by liquid application by a coating method or a printing method. A resin film is formed, and this resin is cured to form a circuit pattern embedded in a resin sheet. Thereafter, the joints between the circuit patterns are cut off for each device, and then the circuit patterns are cut for each device. And a method for manufacturing a circuit board.