JP2990846B2 - Method of manufacturing photosensitive element and circuit for laser beam scanning exposure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to laser beam scanning exposure.
More specifically, the present invention relates to a method for manufacturing a photosensitive element and a circuit for use in a semiconductor device.
The present invention relates to a photosensitive element for beam scanning exposure and a method for manufacturing a circuit using the same.

[0002]

2. Description of the Related Art Conventionally, a dry film type photosensitive element which does not use a solvent is used in the manufacture of a circuit of a printed wiring board in view of resolution, workability and productivity. High sensitivity is required for the element. Especially in the case of scanning exposure with a laser beam, it is necessary to have sufficient sensitivity to the output light wavelength of the laser,
Although a photoinitiator and the like have been studied in order to increase the sensitivity, sufficient sensitivity has not yet been obtained. In the case of scanning exposure using a laser beam, there is a problem that the line width obtained after development differs depending on the scanning direction of the laser beam.

[0003]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, and achieves high sensitivity even when a scanning exposure is performed with a laser beam, and the dependence of the line width on the laser beam scanning direction. An object of the present invention is to provide a light-sensitive element for laser beam scanning exposure and a method for manufacturing a circuit using the same.

[0004]

SUMMARY OF THE INVENTION The present invention relates to a photosensitive element for laser beam scanning exposure having a cover film which substantially transmits light from a light source and a photopolymerizable photosensitive resin layer. naphthalate film laser beam scanning exposure photosensitive element using, and the laser beam scanning exposure sensitive <br/> light element is laminated on a substrate, after the scanning exposure from the cover film side with a laser beam , Development processing,
The present invention relates to a method for manufacturing a circuit, which is characterized by performing etching or plating.

In the present invention, the sensitivity of the photosensitive element in laser exposure is increased by the polyethylene naphthalate film used as the cover film, and the dependence of the line width on the laser beam scanning direction is reduced. The thickness of the cover film is 1 in terms of sensitivity and resolution.
２５25 μm is preferred.

The photopolymerizable photosensitive resin used in the present invention is not particularly limited. Resins shown in “Photosensitive Polymer” (Kodansha Scientific: Mototaro Nagamatsu, Hideo Inui, Chapter 7) For example, a mixture of a photopolymerizable monomer having an allyl group, a glycidyl group or the like and a copolymer or a homopolymer having a functional group such as an acrylic copolymer is used.

[0007] The photosensitive element for laser beam scanning exposure of the present invention is laminated on, for example, a glass epoxy copper clad laminate, subjected to scanning exposure with a laser beam from the cover film side, and then developed, etched or plated by a known method. By performing the processing, a highly reliable circuit can be manufactured.

[0008]

The present invention will be described below with reference to examples. Parts and% in the following examples indicate parts by weight and% by weight, respectively. Example 1 and Comparative Examples 1-4 (1) Preparation of photosensitive resin composition Acrylic copolymer (methacrylic acid / methyl methacrylate / butyl methacrylate / 2-ethylhexyl acrylate = 23/51/6/20 by weight) 40% ethyl cellosolve solution having a weight average molecular weight of about 90,000 as a copolymer 120 parts Tetraethylene glycol diacrylate 25 parts Hydroquinone 0.04 parts 2,6-bis (p-N, N-diethylaminobenzylidene) -4 0.18 parts of -methyl-4-azacyclohexanone 3.0 parts of p-chloro-N-ethylphenylglycine and 20 parts of methyl ethyl ketone were added and dissolved by stirring to obtain a photosensitive resin composition.

(2) Preparation of photosensitive element The obtained photosensitive resin composition was applied to each of the cover films shown in Table 1 using a bar coater.
The resultant was dried with a hot air convection dryer at about 3 minutes to obtain a photopolymerizable photosensitive element. The thickness of the dried photosensitive resin layer was 40 μm.

(3) Sensitivity measurement The above-mentioned photosensitive element was prepared to have a clean surface of 1.6.
Using a laminator, the rubber roll was heated to a temperature of 60 ° C. and pressed and heated so that the photosensitive resin layer and the copper surface were in contact with each other on a glass epoxy copper clad laminate having a thickness of mm. Next, a step tablet (manufactured by Dainippon Screen Co., Ltd., trademark grayscale,
An optical density step of 0.15, a minimum optical density of 0.05, a maximum optical density of 3.05, a negative film of 21 steps, and a laser direct writing apparatus (Nikon Corporation, LP- 3000D) and an ultra-high pressure mercury lamp exposure machine (3KW, HMW-201, manufactured by Oak)
Exposure was performed using each of B). Thereafter, the cover film was removed and a 1% Na ₂ CO ₃ aqueous solution at 30 ° C. was added for 6 hours.
The uncured portion was eluted by spraying for 0 seconds, and the number of steps of the step tablet was measured as the sensitivity of the photopolymerizable composition. The results are shown in Table 1. The greater the number of stages, the higher the sensitivity.

[0011]

[Table 1] Table 1 shows that in Example 1 using a polyethylene naphthalate film, high sensitivity was obtained by laser exposure and ultrahigh pressure mercury lamp exposure.

(4) Measurement of the influence of the line width on the scanning direction of the laser beam In the same method as in (3), a line width of 100 μm is formed on a copper-clad laminate on which the test photosensitive elements are laminated by a laser direct drawing apparatus.
Was subjected to scanning exposure. The exposure pattern was such that the line length direction included a line (a) perpendicular to the scanning direction of the laser beam and a line (b) parallel to the scanning direction of the laser beam.
After the exposure, development processing was performed in the same manner as in the above (3). Thereafter, the line widths of the obtained patterns (a) and (b) were measured with a reflection microscope. The results are shown in Table 1.
Table 1 shows that Example 1 has a smaller dependence of the line width on the laser beam scanning direction than Comparative Examples 1 to 4.

[0013]

According to the photosensitive element for laser beam scanning exposure of the present invention, high sensitivity can be obtained even when scanning exposure is performed with a laser beam, and the dependence of the line width on the running direction of the laser beam is reduced. it can be, this record
By using the photosensitive element for laser beam scanning exposure , a highly reliable circuit can be manufactured.

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) G03F 7/004 G03F 7/027 G03F 7/11 H05K 3/06

Claims (2)

(57) [Claims] 1. A laser beam having a cover film that substantially transmits light from a light source and a photopolymerizable photosensitive resin layer.
In beam scanning exposure photosensitive element, Le with a polyethylene naphthalate film as a cover film
Photosensitive element for laser beam scanning exposure . 2. The laser beam scanning exposure according to claim 1.
A method for manufacturing a circuit, comprising: laminating a photosensitive element for use on a substrate, performing scanning exposure with a laser beam from a cover film side, and then performing development processing, etching or plating processing.