JP2978676B2 - Multi-cell sputter ion pump - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sputter ion pump and, more particularly, to its structure.

[0002]

2. Description of the Related Art As shown in FIG. 3, a conventional sputter ion pump has a magnet, a grounded titanium cathode (hereinafter referred to as a cathode), and a cylindrical anode (hereinafter referred to as an anode) sandwiched between the cathodes. ) And a control power supply for supplying power to the anode. When a high voltage is applied between the cathode and the anode, the residual gas is efficiently ionized by the magnetic field of the magnet, and the cathode is sputtered.

[0003] The sputtered cathode (in this case, titanium) material adheres to the anode and the inner wall of the pump. These sputtered cathode materials are extremely active,
The residual gas can be adsorbed and exhausted. (See Fig. 4)

In the conventional sputter ion pump, since the cylindrical anode is disposed perpendicular to the two cathodes facing each other, the sputtered cathode material does not efficiently adhere to the anode surface. There was a disadvantage. In addition, since the anode is structurally opposed to the cathode, there is a problem that the area of the inlet of the pump is small and the pumping speed is low.

[0004]

The multi-cell sputter ion pump of the present invention has a cathode at the center of each cell,
A cell assembly having the outside of the cell as an anode, a pump casing for holding the same, a cathode control power supply for supplying power to the cathode, a solenoid coil having the pump casing as a shaft, and a solenoid for supplying power to the solenoid coil And a control power supply.

[0005]

Next, the present invention will be described with reference to the drawings. FIG. 1A is a longitudinal sectional view of a multi-sputter ion pump according to one embodiment of the present invention. Penning discharge is caused by the magnetic field formed by the solenoid coil and the voltage applied between the cathode and the anode, and the residual gas is ionized. The ionized residual gas collides with the cathode and sputters the cathode. The sputtered cathode material adheres to the inner wall of the anode and the inner wall of the pump casing. On the other hand, the gas incident from the inlet of the pump is partially ionized, and a part is adsorbed and exhausted by the sputtered cathode material.

FIG. 2 shows that a plurality of cell assemblies are arranged and the cells are arranged obliquely with respect to the air inlet, so that all gas molecules incident from the air inlet of the pump always collide with the inner wall of the cell.

[0007]

As described above, according to the present invention, by placing the cathode at the center of the cylindrical anode, the sputtered cathode material efficiently adheres to the inner wall of the anode.
A large number of cells can be accommodated in the pump by arranging the anodes in a triangular, quadrangular, pentagonal, and hexagonal configuration without any gap. From the above, the anode area increases and the amount of gas that can be adsorbed increases, so that the pumping speed and pumping amount of the vacuum pump increase.

Furthermore, by arranging a plurality of cell assemblies inclined with respect to the intake port in a plurality of stages, gas molecules incident from the intake port of the pump always collide with the anode surface, so that the gas molecules are adsorbed and exhausted. Is more likely to be performed. Therefore, there is an effect that the pumping speed of the vacuum pump is further increased.

[Brief description of the drawings]

FIG. 1A is a longitudinal sectional view of one embodiment of the present invention. Figure 1
FIG. 4 is an enlarged vertical sectional view of a B cell. FIG. 1-C is a cross-sectional view of one embodiment of the present invention.

FIG. 2 is a longitudinal sectional view of a second embodiment of the present invention.

FIG. 3 is a schematic diagram of a conventional sputter ion pump.

FIG. 4 is an enlarged view of FIG. 3;

Claims (3)

(57) [Claims] 1. A sputter ion pump in which an active metal such as Ti is sputtered and a gas is adsorbed on the sputtered metal. a pump (hereinafter referred to as cell) and a large number set, Ponpuke
Wrap a conductor around the jing to create a solenoid coil
A multi-cell sputter ion pump characterized in that the inlet of the pump and the opening of each cell are matched . 2. The multi-cell sputter ion pump according to claim 1 , wherein the multi-cell sputter ion pump has a cell which is angled with respect to a gas incident direction. 3. The multi-cell sputter ion pump according to claim 2 , wherein the cross section of the cell is triangular, quadrangular, hexagonal or a combination thereof without any gap.