JP2974027B1 - Electronic circuit cooling method and cooling structure thereof - Google Patents

Abstract

A cooling method for an electronic circuit and a cooling structure for an electronic circuit capable of achieving a reduction in the size of an apparatus by reducing the number of components and an improvement in productivity by reducing the number of components with respect to a cooling structure of a plurality of distributed integrated circuits. The point is to provide. SOLUTION: As shown in FIG. 1, a cooling structure of an electronic circuit according to the present embodiment comprises a first integrated circuit group 1, a second integrated circuit group 2, a heat transfer plate 3, a heat radiating component 4, and a connecting member 5. And rotating shaft 6
And an elastic heat conductor 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for an electronic circuit having a plurality of integrated circuits, and more particularly to a method for cooling an electronic circuit in which integrated circuits are distributed and a cooling structure thereof.

[0002]

2. Description of the Related Art In the prior art, as shown in FIG. 4, a heat radiation component 4 is attached to each integrated circuit 20 on a circuit board 10, or several integrated circuits 20 are grouped as shown in FIG. The cooling is performed by attaching the heat radiating component 4 to each group, and the spring 8 is provided between the integrated circuit 20 and the heat radiating component 4.

[0003]

However, the prior art has the following problems. Individual integrated circuit 2
Therefore, it is necessary to provide a heat radiating means, which increases the number of parts and the time required for assembling. Therefore, it is necessary to construct a structure for cooling the integrated circuits 20 distributed at a plurality of locations at a low cost. There was a problem that it was difficult.

The present invention has been made in view of such a problem, and an object of the present invention is to reduce the number of components in a cooling structure of a plurality of integrated circuits 20 which are arranged in a distributed manner, to reduce the size of the device, and An object of the present invention is to provide a cooling method of an electronic circuit and a cooling structure thereof, which can achieve an improvement in productivity by reducing the number of parts.

[0005]

An object of the present invention is to provide a method for cooling an electronic circuit having a plurality of integrated circuits, the method comprising the steps of: And a second integrated circuit group, a heat transfer plate is opposed to the first integrated circuit group, and the second integrated circuit group is
A heat dissipating component is opposed to the heat dissipating component via an elastic heat conductor having elasticity, and a connecting member that thermally and mechanically couples the heat transfer plate and the heat dissipating component is disposed. A supporting means serving as a mechanical fulcrum provided between the connecting members, the supporting means being held at a position where the connecting member applies a force to the elastic thermal conductor via the heat dissipating component; The heat transfer plate is brought into contact with the first integrated circuit group using a repulsive force of a body, and heat generated from the first integrated circuit group is dissipated from the heat radiating component via the connecting member. The method for cooling an electronic circuit is as follows. The gist of the present invention according to claim 2 is that one end of a spring is engaged with the support means, and the other end of the spring is engaged with a housing that holds the circuit board. The heat transfer plate is the first
2. The method for cooling an electronic circuit according to claim 1, wherein an upper limit of a force for pressing the integrated circuit group is set. The gist of the present invention according to claim 3 is that the connecting member includes a rotation shaft serving as the support means at a position where the elastic heat conductor is pressed against the second integrated circuit group via the heat dissipation component. Due to the repulsive force of the elastic thermal conductor pressed against the heat dissipating component, the heat dissipating component moves in a direction opposite to the direction in which the second integrated circuit group is pressed, and the heat transfer plate has the rotation axis as a fulcrum. The heat transfer component moves in a direction opposite to the heat dissipating component, the heat transfer plate contacts the first integrated circuit group, and the heat transfer plate and the heat dissipating component are thermally coupled by the connecting member, and 3. The method of cooling an electronic circuit according to claim 1, wherein heat generated from the circuit group is dissipated from the heat radiating component to cool the first integrated circuit group. The gist of the present invention according to claim 4 is a cooling structure of an electronic circuit having a plurality of integrated circuits, wherein a heat transfer plate facing a first integrated circuit group having a plurality of integrated circuits on a circuit board; An elastic heat conductor opposed to a second integrated circuit group having a plurality of integrated circuits different from the integrated circuit on the circuit board; a heat dissipating component disposed at a position in contact with the elastic heat conductor; A connecting member including a heat dissipating component and the heat transfer plate,
There is provided a cooling structure for an electronic circuit, comprising: support means for supporting the connecting member between the heat dissipating component and the heat transfer plate. The gist of the present invention according to claim 5, wherein the supporting means is a rotating shaft provided in a width direction of the substantially strip-shaped connecting member, and the connecting member is configured to be connected to the first integrated circuit group and the first integrated circuit group. 5. The semiconductor device according to claim 4, wherein the plurality of integrated circuits are arranged above the circuit board surface in a direction in which the integrated circuit groups are arranged, and the rotating shaft is rotatably attached to a housing holding the circuit board. The cooling structure of the electronic circuit described above. The gist of the present invention is that the heat transfer plate and the heat radiating component are provided at both ends of the connecting member held in a substantially horizontal direction by attaching the rotating shaft to the housing. A cooling structure for an electronic circuit according to claim 4 or claim 5. The gist of the present invention is that the support means has one end fixed to the housing and the other end fixed to the rotating shaft, and the heat transfer plate presses the first integrated circuit group. The cooling structure for an electronic circuit according to any one of claims 4 to 6, further comprising an elastic spring for setting an upper limit of the force.

[0006]

Embodiments of the present invention will be described below in detail with reference to the drawings. As shown in FIG. 1, the cooling structure of the electronic circuit according to the present embodiment includes a first integrated circuit group 1.
, A second integrated circuit group 2, a heat transfer plate 3, a heat radiating component 4, a connecting member 5, a rotating shaft 6, and an elastic heat conductor 7.

[0007] The first integrated circuit group 1 and the second integrated circuit group 2 are distributed on a circuit board 10. The heat transfer plate 3 is disposed at a position facing the first integrated circuit group 1, and the heat radiating component 4 is
It is arranged at a position facing the integrated circuit group 2. Connecting member 5
Has a rotating shaft 6 that thermally and mechanically connects the heat transfer plate 3 and the heat radiating component 4 and serves as a mechanical fulcrum. The elastic heat conductor 7 is provided between the second integrated circuit group 2 and the heat radiating component 4.

Next, the operation of the electronic circuit cooling method according to the present embodiment will be described with reference to FIG. The heat radiation component 4
Determines the position of the mechanical fulcrum or the rotating shaft 6 so as to press the elastic thermal conductor 7 against the second integrated circuit group 2 with a predetermined force. Then, the heat radiating component 4 moves in the direction of the arrow due to the repulsive force of the elastic thermal conductor 7. At this time, the heat transfer plate 3
And the heat dissipating component 4 are connected by the connecting member 5 and the fulcrum or the rotating shaft 6 is located between the heat transfer plate 3 and the heat dissipating component 4, so that the heat transfer plate 3 moves in the direction opposite to the heat dissipating component 4. Heat transfer plate 3
Is moved toward the first integrated circuit group 1, so that the heat transfer plate 3 comes into contact with the first integrated circuit group 1. Since the heat transfer plate 3 and the first integrated circuit group 1 are in contact with each other and the heat transfer plate 3 and the heat radiating component 4 are thermally coupled by the connecting member 5, the heat generated from the first integrated circuit group 1 is a heat radiating component. 4 and the first integrated circuit group 1 is cooled.

As described above, the heat transfer plate 3 and the heat radiating component 4 are mechanically connected to each other, and the connecting member 5 is connected to the mechanical fulcrum or the rotating shaft 6.
The heat transfer plate 3 and the heat radiating component 4 move like a seesaw around the mechanical fulcrum or the rotating shaft 6. Here, an elastic heat conductor 7 having elasticity is used for thermal coupling between the second integrated circuit group 2 and the heat radiating component 4 arranged on the heat radiating component 4 side, and the pressure is applied to the integrated circuit 20. By doing so, the heat radiating component 4 is pushed up, and the heat transfer plate 3 is pressed against the first integrated circuit group 1 around the fulcrum or the rotating shaft 6, so that the heat transfer plate 3 is located between the first integrated circuit group 1 and the heat transfer plate 3. Can be secured thermally. The heat generated in the first integrated circuit group 1 is transmitted to the heat radiating component 4 via the heat transfer plate 3 and the connecting member 5 and is radiated.

As shown in FIG. 3, a cooling structure for an electronic circuit according to another embodiment is such that a spring 8 is incorporated in a rotating shaft 6. In this embodiment, the spring 8 is incorporated in a connecting member 5. This makes it possible to set the upper limit of the force by which the heat transfer plate 3 pushes the first integrated circuit group 1.

That is, the heat transfer plate 3 and the heat radiating component 4 are connected by the connecting member 5, and a fulcrum or a rotating shaft 6 is provided between the heat transfer plate 3 and the heat radiating component 4. An elastic heat transfer member 7 having elasticity is disposed between the second integrated circuit group 2 that dissipates generated heat, and a fulcrum or a rotating shaft 6 is formed by utilizing the elastic repulsion of the elastic heat conductor 7. The heat transfer plate 3 on the opposite side is brought into contact with the first integrated circuit group 1 which is the object to be cooled, and both the first integrated circuit group 1 and the second integrated circuit group 2 are simultaneously cooled.

In the present embodiment, the present invention is not limited to this, and can be applied to a cooling structure and a cooling method for electronic components on a substrate suitable for applying the present invention.

Further, the number, position, shape, etc. of the above-mentioned constituent members are not limited to the above-mentioned embodiment, but can be set to a suitable number, position, shape, etc. for carrying out the present invention.

In the drawings, the same components are denoted by the same reference numerals.

[0015]

Since the present invention is configured as described above, the following effects can be obtained. The number of components can be reduced as compared with the conventional cooling structure, and the pressure for pressing the first integrated circuit group and the second integrated circuit group is determined by the position of the rotating shaft which is the support means attached to the connecting member. The work of adjusting the pressing pressure is simplified, and the amount of assembly work is reduced, so that an improvement in productivity can be achieved.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a cooling structure of an electronic circuit according to an embodiment of the present invention.

FIG. 2 is a diagram showing the operation of FIG.

FIG. 3 is a configuration diagram showing another embodiment of FIG. 1;

FIG. 4 is a diagram showing an example of a cooling structure according to the related art.

FIG. 5 is a diagram showing an example of another cooling structure according to the related art.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 first integrated circuit group 2 second integrated circuit group 3 heat transfer plate 4 heat dissipating component 5 connecting member 6 rotating shaft 7 elastic heat conductor 8 spring 10 circuit board 20 integrated circuit

Claims (7)

(57) [Claims] 1. A method for cooling an electronic circuit comprising a plurality of integrated circuits, comprising: dividing a plurality of integrated circuits on a circuit board into two groups of a first integrated circuit group and a second integrated circuit group; A heat transfer plate is opposed to the first integrated circuit group, and a heat radiating component is opposed to the second integrated circuit group via an elastic heat conductor having elasticity. A connecting member that mechanically couples is provided, and a supporting means serving as a mechanical fulcrum is provided on the connecting member between the heat transfer plate and the heat dissipating component. Holding the elastic thermal conductor at a position where a force is applied to the elastic thermal conductor via a heat dissipating component, using the repulsive force of the elastic thermal conductor to contact the heat transfer plate with the first integrated circuit group, It is characterized in that heat generated from the circuit group is dissipated from the heat radiating component via the connecting member. Electronic circuit method of cooling to. 2. An end of a spring is engaged with the support means, and the other end of the spring is engaged with a housing for holding the circuit board. 2. The method for cooling an electronic circuit according to claim 1, wherein an upper limit of a force pressing the integrated circuit group is set. 3. The connecting member includes a rotating shaft serving as the support means at a position where the elastic heat conductor is pressed against the second integrated circuit group via the heat radiating component, and is pressed against the heat radiating component. Due to the repulsive force of the elastic heat conductor, the heat dissipating component moves in a direction opposite to the direction in which the second integrated circuit group is pressed, and the heat transfer plate is a direction opposite to the heat dissipating component with the rotation axis as a fulcrum. The heat transfer plate contacts the first integrated circuit group, the heat transfer plate and the heat radiating component are thermally coupled by the connecting member, and the heat generated from the first integrated circuit group 3. The method according to claim 1, wherein the first integrated circuit group is cooled by dissipating the first integrated circuit group. 4. A cooling structure for an electronic circuit having a plurality of integrated circuits, wherein the heat transfer plate faces a first integrated circuit group having a plurality of integrated circuits on a circuit board; An elastic heat conductor facing a second integrated circuit group having a plurality of integrated circuits different from the integrated circuit; a heat dissipating component disposed at a position in contact with the elastic heat conductor; A cooling structure for an electronic circuit, comprising: a connecting member having a plate; and support means for supporting the connecting member between the heat radiating component and the heat transfer plate. 5. The support means is a rotating shaft provided in a width direction of the substantially strip-shaped connecting member, and the connecting member is formed by the first integrated circuit group and the second integrated circuit group. 5. The electronic circuit cooling device according to claim 4, wherein the rotating shaft is rotatably attached to a housing that holds the circuit board, and is provided above the circuit board surface in a line-up direction. Construction. 6. The heat transfer plate and the heat radiating component are provided at both ends of the connecting member held in a substantially horizontal direction by attaching the rotating shaft to the housing. A cooling structure for an electronic circuit according to claim 4. 7. The support means has one end fixed to the housing and the other end fixed to the rotating shaft, and sets an upper limit of a force with which the heat transfer plate presses the first integrated circuit group. The cooling structure for an electronic circuit according to claim 4, further comprising an elastic spring.