JP2972186B1 - Manufacturing method of sound insulation panel for building materials - Google Patents

Abstract

The present invention provides a panel which is used for floors, walls and the like in houses and various facilities and exhibits unprecedented sound insulation and strength. SOLUTION: This is a sound insulating panel for building materials having a rubber chip layer 3 between a wooden layer 1 and a wooden layer 1 via a foamable adhesive 2, wherein the average diameter of rubber chips is 0.1 to 2.5 mm and the particle diameter is not uniform. There is a feature. In addition, 3 to 20% by weight of wood powder was mixed with the rubber chips, or these panels were used as a base material and integrated with a surface material to obtain a sound insulation panel for building materials.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a sound insulating panel for building materials having a wooden surface layer having excellent sound insulating performance.

[0002]

2. Description of the Related Art Conventionally, an elastic body such as a rubber sheet is sandwiched between a front surface material and a back surface material in order to enhance vibration proof and sound insulation. However, there is a limit to enhancing the sound insulation performance of a panel simply sandwiching a rubber sheet or the like. On the other hand, there is also a problem that a large amount of waste is required to be disposed of, as in the case of manufacturing rubber products and waste tires, and it is becoming increasingly difficult.

[0003]

SUMMARY OF THE INVENTION The present invention seeks to provide a panel which can be used on floors and walls of houses and various facilities to exhibit unprecedented sound insulation (including vibration isolation) and strength. In particular, it is intended to contribute to environmental problems and the like due to reuse of scrap rubber.

[0004]

As a result of examining the above-mentioned problems, it has been found that, in the production of a sound insulation panel for building materials having a rubber chip layer between wood layers, the bonding of the rubber chip layer is difficult.
The adhesive fills the voids formed by the rubber chip layer.
Use a foaming adhesive to ensure that there are no voids
Manufacture of sound insulation panels for building materials characterized by bonding and integration
Manufacturing method . The woody layer mentioned here is preferable because the plywood in which the thin plates are laminated is thin (several mm thick) and has strength, but the use of a timber thin plate itself having a thickness of several mm is not excluded. The rubber that makes up the rubber chip layer is obtained by cutting burrs removed from the product after vulcanization molding into small pieces. It is a crushed waste tire or the like.

[0005] Then, the foaming adhesive referred here, in nature the adhesive is solidified with foaming, the reactive adhesive that occur the gas during the reaction. When a normal adhesive is used, the gap formed by the rubber chip layer is filled with the adhesive, so the sound insulation is reduced by that amount.However, when the wood layer and the rubber chip layer are bonded via the foaming adhesive, The wood layer and the rubber chip layer are adhered after securing the void.
In particular, when a urethane foam adhesive is used, the adhesive strength between the wood layer and the rubber chip layer is high.

The average diameter of the rubber chip particles used is 0.1
~ 2.5 mm is preferred. The average diameter of rubber chip particles is 0.1mm
The following are difficult to prepare, and if the average diameter exceeds 2.5 mm, it becomes difficult to form a strong rubber layer. Also,
The particle size should be irregular. The reason is that if the particle size is different, the individual volume of the void existing between the particles or between the woody layer and the rubber chip layer is different, so that the damping effect is exhibited in response to sounds and vibrations of various frequencies. It is.

Further, wood powder of 3 to 20% by weight is mixed with the rubber chips. When wood powder is mixed in the rubber chip, the wet wood powder supplies the water required for the foaming and curing reaction when using a urethane foaming adhesive, and depending on the type of reactive adhesive, it absorbs excess water. , A reaction promoting action is obtained. In addition, wood flour has a sound absorbing effect because it is porous, and is also suitable for use as a sound insulating panel for building materials from this point. Any of the above-mentioned sound insulating panels for building materials can be used as they are, or they can be used as base materials to make sound insulating panels for building materials such as flooring and the like integrated with plywood or synthetic resin surface materials. .

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 As shown in FIGS. 1 and 2, two layers of EPT rubber chips having an average diameter of 0.1 to 2.0 mm are sandwiched between three 2.5 mm-thick plywoods with a urethane foam adhesive. Integrally, a sound insulation panel for building materials having a rubber chip layer 3 between the wood layers 1 and the wood layer 1 via a foaming adhesive 2 was obtained. A 12mm thick sound insulation panel for building materials was used as a whole. The gap 4 is secured despite being integrated with the adhesive. These voids contribute to sound insulation, vibration suppression during walking, and softness. As a result of measuring the sound insulation performance of this sound insulation panel for building materials, LL-40 specified by JISA 1419 was confirmed as the sound insulation grade of the floor.

Example 2 A 2 mm thick plywood 2 is mixed with EPT rubber chips having an average diameter of 2 to 0.1 mm and wood powder at 5% and integrated with a urethane foam adhesive to form a 12 mm thick sound insulation panel for building materials. And LL-40 was also confirmed for the sound insulation performance of this sound insulation panel for building materials.

Examples 3 and 4 and Comparative Examples 1 and 2 As shown in Table 1, the mixture of rubber chips having a diameter of 0.1 to 2.5 mm, the uniformity of 2 mm, the presence or absence of wood powder when 3 mm or more, and the adhesion 2.5mm when the agent is foaming or non-foaming
About the sandwich type panel between the wooden boards,
The sound insulation performance was measured.

[0011]

[Table 1]

As is clear from the results of Examples 1 to 4,
It is preferable that the diameter of the rubber chips is not uniform, and the blending of wood flour has a favorable effect. The adhesive is preferably foamable. In each of the examples, the adhesion between the woody layer and the rubber chip layer is strong and does not easily peel off.

As a surface material 5 as shown in FIG. 3, an oak wood board is pasted on the surface and a wooden floor material (12 mm) of plywood coated with wiping is applied to the sound insulation panel for building material obtained in Example 1.
Thickness) was adhered. The sound insulation performance of this sound insulation floor panel is LL-40.
Was confirmed. The material of the rubber chip layer 3 may be the same as in the first embodiment, or the material may be changed.

[0014]

According to the method for producing a sound insulating panel for building materials of the present invention, a panel used for floors, walls, ceiling panels, etc., exhibiting unprecedented sound insulating properties, vibration damping properties and high strength. Can be provided. In particular, it also contributes to environmental problems due to the reuse of scrap rubber and wood flour.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view of a sound insulating panel for building materials obtained by a manufacturing method of the present invention.

FIG. 2 is an enlarged cross-sectional view taken along line AA in FIG.

FIG. 3 is a building material obtained in another embodiment of the production method of the present invention.
FIG. 2 is a partially cutaway perspective view of the sound insulation panel for use in the present invention.

[Explanation of symbols]

 Reference Signs List 1 wood layer 2 foaming adhesive 3 rubber chip layer 4 void

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-9-60144 (JP, A) JP-A-3-11743 (JP, U) JP-A-59-117737 (JP, U) (58) Investigation Field (Int.Cl. ⁶ , DB name) E04B 1/86 B32B 21/04 G10K 11/16

Claims (3)

(57) [Claims] 1. A method for manufacturing a sound insulation panel for building materials having a rubber chip layer between wood layers, said rubber chip layer comprising:
The adhesive fills the voids formed by the rubber chip layer when bonding
Use foaming adhesive to secure voids
A method for producing a sound insulation panel for building materials, wherein the sound insulation panel for a building material is bonded and integrated in an assembled state . 2. The rubber chip has an average diameter of 0.1 to 2.5 mm and a particle diameter of 0.1 to 2.5 mm.
2. The building material according to claim 1, wherein
Manufacturing method of sound insulation panel. 3. Wood powder of 3 to 20% by weight based on rubber chips
To promote the reaction by supplying or absorbing moisture
The sound insulating panel for building materials according to claim 1 or 2,
Manufacturing method.