JP2970508B2 - Method for manufacturing optical semiconductor module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing an optical semiconductor module, and more particularly to a method for manufacturing an optical semiconductor module used in an optical communication or optical transmission system.

[0002]

2. Description of the Related Art A conventional optical semiconductor module manufacturing apparatus for assembling a lens cap is provided with a camera 2 above an optical semiconductor package 1 and a lens cap 2 as shown in FIG.
0 is provided, and the position of the lens 3 is captured by the monitor TV 21. Based on this image information, the image processor 22 calculates the amount of deviation between the lens 3 and the center position of the optical semiconductor package 1, and the two-axis (X / Y) table 11 and the two-axis table controller 12 correct the amount of deviation. And then the welding power source 9
The cap 2 is fixed to the optical semiconductor package 1 by welding.

Another conventional example (Japanese Patent Application Laid-Open No. 62-21)
In the apparatus for manufacturing an optical semiconductor module disclosed in Japanese Patent No. 7210), a lens 3 is placed on the optical semiconductor package 1 and the cap 2 (right) as shown in FIG. Semiconductor chip 4,
An optical fiber 6 is shown. This is because the cap 2 and the lens 3 are separate, all the components of the module are movably assembled to the module base 5, the module is operated, and the alignment is adjusted while monitoring the module characteristics. The method of solid-bonding them is adopted.

[0004]

In the conventional optical module, first, the lens portion 3 of the cap with lens 2 is automatically detected and image-processed on the optical semiconductor package 1 so as to be aligned with the center position of the optical semiconductor package 1. After that, the cap with lens 2 was fixed by welding. In this case, the characteristics of the module (particularly the efficiency of optical coupling between the optical semiconductor chip 4 and the optical fiber 6) cannot be known until the assembly is completed. For this reason, extremely high-precision assembly performance was required, and a large number of man-hours and expensive equipment were required.

Another conventional example (Japanese Patent Laid-Open No. 62-21)
According to the structure of the "optical semiconductor module" described in Japanese Patent Application Laid-Open No. 7210), all components of the module are assembled in a movable state on the module base 5 and the alignment is adjusted while monitoring the module characteristics. It was intended to easily obtain high assembly accuracy. However, in the case of a method in which the module components (particularly, the lens assembly) are movable and the position is adjusted while monitoring the module characteristics as described above, the lens assembly is displaced again due to distortion during the solid connection. There is a danger of causing it, and there is a drawback that once combined, it cannot be corrected. As a result, the required high assembly accuracy may not be obtained.

[0006]

According to the present invention, there is provided a first step of welding and fixing a cap with a lens to an optical semiconductor package on which an optical semiconductor chip is mounted, and mounting an optical fiber so as to obtain a predetermined coupling efficiency. A second step of moving the obtained module base in the X, Y, and Z directions; and a third step of welding and fixing the optical semiconductor package to which the cap with lens is fixed to a part of the module base.
The optical semiconductor package is completely attached to the module base by repeating the second step and the third step a predetermined number of times so that the distortion generated at the third step is corrected in the second step. And a fourth step of welding and fixing the optical semiconductor module.

[0007] Further, the present invention provides a method for manufacturing a semiconductor device, comprising:
The method for manufacturing an optical semiconductor module according to the above, further comprising a step of operating a cap with a lens in the X and Y directions with respect to the optical semiconductor package on which the optical semiconductor chip is mounted so as to obtain a predetermined coupling efficiency. is there.

[0008]

In the present invention, an LD power supply for energizing the optical semiconductor package to emit light, a welding power supply for fixing the socket and the lens cap to the optical semiconductor package by welding, and an electrode, and moving the cap with lens to a plane 2 Three-axis (X, Y, Z) table and controller for moving the optical fiber and the module base, which receive light from the optical semiconductor package via the lens of the cap, the controller, and the module base in the plane and vertical directions. A light receiving detector that receives light transmitted through an optical fiber and a peak search controller that automatically searches for a peak position of the light;
It is equipped with a general controller that controls the whole operation, that is, the optical semiconductor package is operated, the cap with the lens and the optical fiber are adjusted, the coupling efficiency is monitored in an adjustable state, and welding is sequentially fixed while making corrections. Is what you can do.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the accompanying drawings.

[0010]

FIG. 1 shows an embodiment of the present invention. FIG. 1 is a block diagram of an embodiment of the present invention. Optical semiconductor package 1
Are connected in advance with a socket 8 and can be operated (emit light) from the LD power supply 7. A cap 2 with a lens 3 is provided on the optical semiconductor package 1 while being held by an electrode 10. Further, a module base 5 and an optical fiber 6 are provided thereabove, and light received by the optical fiber 6 is detected by a light receiving detector 15.

Then, by operating the optical semiconductor package 1, light is emitted from the optical semiconductor chip 4, and
The light enters the optical fiber 6 through the lens 3. At this time, the biaxial table controller 12,
The cap 2 with the lens 3 is operated in the X and Y directions by the two-axis (XY) table 11. The three-axis table controller 14 and the three-axis (X, Y, Z) table 13 operate the module base 5 and the optical fiber 6 in the X, Y, and Z directions.

Then, the operation is stopped when a predetermined coupling efficiency is obtained while the whole is in a movable state, and the welding power supply 9, the YAG laser emission optical system 17, and the YAG oscillator 18 are activated to connect the optical semiconductor package 1 with the optical semiconductor package 1. The cap with lens is fixed by welding. In addition, a general controller 18 is provided, and is responsible for overall control of the peak search controller 16, the welding power source 9, and the YAG oscillator 18. Here, whether the previously obtained coupling efficiency is reduced is monitored again, and the module base 5 and the optical fiber 6 are operated in the X, Y, and Z directions so as to return to the predetermined coupling efficiency. Then, the optical semiconductor package 1 and the module base 5 are again fixed by welding. Next, in the same manner as described above, the positions of the module base 5 and the optical fiber 6 are adjusted in the X, Y, and Z directions to return to a predetermined coupling efficiency, and then are sequentially fixed. In this manner, since the assembly is always performed so as to correct the distortion at the time of fixing, the assembly accuracy is not impaired.

[0013]

As described above, according to the present invention, while the optical semiconductor package is operated to adjust the cap with lens and the optical fiber, the coupling efficiency is monitored and corrected while the welding efficiency is being corrected. Since this method is used, there is an effect that a high-precision assembly performance of ± 20μ to ± 50μ from the conventional ± 100μ can be obtained with less man-hours without being affected by distortion at the time of fixing.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention.

FIG. 2 is a diagram showing a conventional technique.

FIG. 3 is a diagram showing another conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Optical semiconductor package 2 Cap 3 Lens 4 Optical semiconductor chip 5 Module base 6 Optical fiber 7 LD power supply 8 Socket 9 Welding power supply 10 Electrode 11 2-axis (X / Y) table 12 2-axis table controller 13 3-axis (XY Z) Table 14 3-axis table controller 15 Photodetector 16 Peak search controller 17 YAG laser emission optical system 18 YAG laser oscillator 19 General controller 20 Camera 21 Monitor TV 22 Image processing device

Continuation of front page (58) Field surveyed (Int.Cl. ⁶ , DB name) G02B 6/42

Claims (2)

(57) [Claims] 1. A first step of welding and fixing a cap with a lens to an optical semiconductor package on which an optical semiconductor chip is mounted, and a module base on which an optical fiber is mounted so that a predetermined coupling efficiency can be obtained. A second step of moving in the Z direction, a third step of welding and fixing the optical semiconductor package to which the cap with the lens is fixed to a part of the module base, and a distortion generated at the time of the third step A fourth step of completely welding and fixing the optical semiconductor package to the module base while repeating the second step and the third step a predetermined number of times so as to correct the second step in the second step. A method for manufacturing an optical semiconductor module, comprising: 2. The method according to claim 1, further comprising, before the first step, a step of operating the cap with the lens in the X and Y directions with respect to the optical semiconductor package on which the optical semiconductor chip is mounted so as to obtain a predetermined coupling efficiency. 2. The method for manufacturing an optical semiconductor module according to claim 1, wherein: