JP2957226B2 - Casting materials for electrical and electronic components - Google Patents
Casting materials for electrical and electronic componentsInfo
- Publication number
- JP2957226B2 JP2957226B2 JP2106678A JP10667890A JP2957226B2 JP 2957226 B2 JP2957226 B2 JP 2957226B2 JP 2106678 A JP2106678 A JP 2106678A JP 10667890 A JP10667890 A JP 10667890A JP 2957226 B2 JP2957226 B2 JP 2957226B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- weight
- casting material
- filler
- epoxide resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電気−及び電子部品用の注型材料に関す
る。The present invention relates to a casting material for electrical and electronic components.
電気−及び電子部品を、機械的作用及び熱的負荷に対
して保護するために、注型材料で流し込み包囲すること
は一般に公知である。It is generally known to pouring and enclosing electrical and electronic components with a casting material in order to protect against mechanical and thermal loads.
西ドイツ特許（DE−PS）第3229558号明細書から、例
えば、電気部品用の例えば、高圧−点火コイルの含浸及
び注型のための注型材料は公知であり、これは、（ａ）
70:30の割合のビスフエノールＡとシクロオレフインと
をベースとするエポキシド樹脂、（ｂ）硬化剤としての
変性された無水ジカルボン酸例えば無水フタル酸、
（ｃ）促進剤としてのイミダゾール及び（ｄ）填料とし
てのチヨークより成る。From DE-A-3229558, casting materials are known for example for impregnating and casting high-pressure ignition coils for electrical components, for example, comprising (a)
An epoxide resin based on bisphenol A and cycloolefin in a ratio of 70:30, (b) a modified dicarboxylic anhydride as a curing agent such as phthalic anhydride,
It consists of (c) imidazole as accelerator and (d) thioke as filler.
更に、欧州特許（EP−Ａ）第182066号明細書から、電
気−及び電子部品用の、殊に強い熱が負荷される部品用
の注型材料が公知であり、これは、（ａ）特定構造の脂
環式樹脂、（ｂ）液状のジグリシジルエーテル−ビスフ
エノールＡ−エポキシド樹脂、（ｃ）末端カルボキシル
基を有するブタジエンとアクリロニトリルとからのコポ
リマー、（ｄ）硬化剤、（ｅ）促進剤及び（ｆ）鋼玉及
びアルミニウム粒子からの填料混合物より構成されてい
る。EP-A-182 066 also discloses casting materials for electrical and electronic components, in particular for components subjected to high heat loads, which comprises (a) Alicyclic resin having a structure, (b) a liquid diglycidyl ether-bisphenol A-epoxide resin, (c) a copolymer of butadiene having a terminal carboxyl group and acrylonitrile, (d) a curing agent, and (e) an accelerator. And (f) a filler mixture from corundum and aluminum particles.
電気−及び電子部品例えばダイオード及び半導体用の
注型材料は、更に市場で入手される。Casting materials for electrical and electronic components such as diodes and semiconductors are furthermore commercially available.
公知の注型材料の欠点は、これらが思い通りに加工で
きず、例えば不満足な粘度特性を示し、生理学的に無害
ではなく、低すぎる軟化温度を有し、かつ／又は大きす
ぎる熱膨張係数を有することである。Disadvantages of known casting materials are that they cannot be processed as desired, for example exhibit unsatisfactory viscosity properties, are not harmless physiologically, have a softening temperature that is too low and / or have a coefficient of thermal expansion that is too high. That is.
これに反して、請求項１に記載の特徴を有する本発明
の注型材料は、比較的低い粘度を有し、即ち、室温で良
好に流動性であり、従つて良好に加工でき、生理学的に
無害であり、小さい熱膨張率を有し、高いガラス転移温
度（Tg）を有し、即ち高い軟化温度を有する生成物をも
たらす利点を有する。On the contrary, the casting materials according to the invention having the features of claim 1 have a relatively low viscosity, that is to say they are well flowable at room temperature and therefore well processable, It has the advantage of having a low coefficient of thermal expansion, a high glass transition temperature (Tg), ie, a product having a high softening temperature.
有利な本発明による注型材料は、25℃での粘度40000
〜80000mPas及び25℃での密度約1.5〜1.7g/m2を有する
ことを特徴とする。An advantageous casting material according to the invention has a viscosity of 40,000 at 25 ° C.
~ 80,000 mPas and a density at 25 ° C of about 1.5-1.7 g / m 2 .
埋込まれた電気−又は電子部品を有する注型材料の加
工及び硬化は、慣用の公知方法で、即ち、殊に70〜220
℃の温度までの場合により段階的な数時間の加熱により
行なうことができる。The processing and hardening of the casting material with embedded electrical or electronic components is carried out in a customary known manner, i.e. in particular from 70 to 220
It can be carried out by heating for several hours, optionally in stages up to a temperature of ° C.
75℃での６時間硬化及び210℃での６時間硬化の後
に、例えば次の特性値が測定された： 線熱膨張率 25〜35×10-61/℃ ガラス転移温度（Tg） 160℃〜220℃ 熱伝導性 0.55〜0.8W/mK 本発明による注型材料を製造するために、低粘度で、
無色〜黄色の液体を生じる慣用の脂環式エポキシド樹
脂、例えば25℃の粘度350mPas及び80℃での粘度25mPas
を有し、市場で例えばアラルダイト（Araldit）例えば
アラルダイトCY179なる商品名で入手される慣用の脂環
式エポキシド樹脂を使用することができる。After curing for 6 hours at 75 ° C. and for 6 hours at 210 ° C., for example, the following property values were determined: coefficient of linear thermal expansion 25-35 × 10 −6 1 / ° C. Glass transition temperature (Tg) 160 ° C. ~ 220 ° C Thermal conductivity 0.55-0.8W / mK To produce the casting material according to the present invention, low viscosity,
Conventional cycloaliphatic epoxide resins which produce colorless to yellow liquids, e.g. a viscosity of 350 mPas at 25C and a viscosity of 25 mPas at 80C
A conventional alicyclic epoxide resin available on the market, for example under the trade name Araldit, for example Araldite CY179, can be used.
本発明により使用可能な典型的な脂環式エポキシド樹
脂は、シクロオレフインをベースとするものである。特
に有利な脂環式エポキシド樹脂は、式： のシクロオレフインをベースとするものである。Typical cycloaliphatic epoxide resins that can be used according to the present invention are based on cycloolefins. Particularly advantageous cycloaliphatic epoxide resins have the formula: Based on cycloolefin.
場合によつて、脂環式エポキシド樹脂と混合して又は
単独で使用される多官能性エポキシノボラツク樹脂と
は、特に、DIN53015による52℃での粘度1100〜70000mPa
s殊に1100〜1700mPasを有し、例えば次の構造単位： を有する高粘稠性もしくは半固体樹脂である。Optionally, polyfunctional epoxy novolak resins used in admixture with or independently of cycloaliphatic epoxide resins are, in particular, those having a viscosity of 1100 to 70,000 mPa at 52 ° C. according to DIN 53015.
It has in particular 1100 to 1700 mPas, for example the following structural units: Is a highly viscous or semi-solid resin having
本発明により使用される硬化剤即ち、屡々メチルエン
ドメチレンテトラヒドロフタル酸アンヒドリドとも称さ
れる無水メチルナデイツク酸が特に重要である。この硬
化剤の使用は、使用樹脂及び促進剤との共同作用で、本
発明により得られる高いガラス転移温度を得るために必
要であり、本発明により得られる小さい線熱膨張率は、
殊に無定形SO2をベースとする填料の使用により達成さ
れることが明らかになつた。Of particular importance is the curing agent used according to the invention, namely methylnadetic anhydride, often also referred to as methylendmethylenetetrahydrophthalic anhydride. The use of this curing agent is necessary to obtain the high glass transition temperature obtained by the present invention in cooperation with the resin used and the accelerator, and the small coefficient of linear thermal expansion obtained by the present invention is as follows:
In particular it has been clearly summer to be achieved by the use of fillers to the amorphous SO 2 based.
エポキシシランで前処理された無定形SiO2を使用する
ことが特に有利であることが判明した。この際、無定形
SiO2をポキシシランで前処理することは、付着性、湿気
保護及び流動化性の改良に役立つ。このような無定形Si
O2−製品は公知であり、市場で、例えばシルボンド−ク
オーツグートメール（Silbond−Quarz−gutmehle）なる
名称で入手される。It possible to use amorphous SiO 2 pretreated with epoxysilane is especially advantageous has been found. At this time, amorphous
Pretreating SiO 2 in Pokishishiran helps adhesion, moisture protection and fluidisable improved. Such amorphous Si
O 2 -products are known and are available commercially, for example under the name Silbond-Quarz-gutmehle.
填料分が注型材料の残りの成分の重量に対して57〜61
重量％である場合に、特に有利であることが判明した。The filler content is 57-61 based on the weight of the remaining ingredients of the casting material.
It has proven to be particularly advantageous when it is by weight.
無定形SiO2の主要分は２〜最大100μｍの粒径を有
し、微小分（＜2.5μｍ）はできるだけ少なく保持する
際に、特に有利であることが判明した。The major part of the amorphous SiO 2 has a particle size of 2 to up to 100 μm, the fines (<2.5 μm) having proved to be particularly advantageous in keeping as little as possible.
填料のシラン化又はエポキシド化の間に、他の構成成
分上への付着性は改良され、填料のこの粘度分布は、ゲ
ル化相及び硬化相の前に、填料の固化を低い範囲に作用
し、これによつて、線熱膨張率の当該部品例えば半導体
のそれに適合させる作用をする。熱伝導性も同様に改良
される。During the silanization or epoxidation of the filler, the adhesion on the other components is improved and this viscosity distribution of the filler has a low effect on the solidification of the filler before the gelling and curing phases. This serves to match the coefficient of linear thermal expansion of the component, for example a semiconductor. Thermal conductivity is likewise improved.
ガラス中空体の添加により、貯蔵の間の前混合物殊に
樹脂成分中の填料の沈殿傾向に対向する作用することが
できる。ゲル化−及び硬化相の前の懸濁（Aufschwimme
n）は、製品中の沈殿による填料の少ない表面に逆作用
をする。これにより、殊に、熱機械的負荷例えば温度変
換時の亀裂形成性が減少される。The addition of hollow glass bodies can act against the tendency of the filler to settle in the premix during storage, in particular in the resin component. Gelation-suspension before the hardening phase (Aufschwimme
n) works against low-fill surfaces due to precipitation in the product. This reduces, in particular, the cracking properties of thermomechanical loads, for example during temperature conversion.
色素としては、殊に酸化鉄をベースとするもの、例え
ばカラーインデツクスNoピグメントブラツク11を有する
黒色酸化鉄が効奏した。As the pigment, a pigment based on iron oxide, for example, a black iron oxide having a color index No. Pigment Black 11 was particularly effective.
促進剤は、イミダゾールをベースとする慣用の促進剤
例えばメチル化されたベンズイミダゾールから成つてい
てよい。The promoter may consist of customary promoters based on imidazole, for example methylated benzimidazole.
本発明による注型材料は、生理学的に無害の特性で、
種々の電気部品及び電子部品及びプラスチツク、金属、
セラミツク、珪素及び類似物からの構造要素の流し込み
包囲のため、かつ、従つて高い熱的及び／又は機械的負
荷のかけられる種々の部品例えばダイオード及び半導
体、自動車部品例えば発電機用の高圧点火コイル等の製
造のために好適である。The casting material according to the invention has physiologically harmless properties,
Various electrical and electronic components and plastics, metals,
Various components, such as diodes and semiconductors, high-pressure ignition coils for semiconductors, automotive components, such as generators, for pouring of structural elements from ceramics, silicon and the like, and thus subjected to high thermal and / or mechanical loads And the like.
例 １ 次の物質の混合により注型材料を製造した： （ａ） 式： のシクロオレフインをベースとする低粘度の脂環式エポ
キシド樹脂 （ｂ） 硬化剤としての無水メチルナジツク酸（メチル
エンドメチレンテトラヒドロフタル酸アンヒドリド） （ｃ） 促進剤としてのイミダゾール （ｄ） 填料としての無定形SiO2 （ｅ） 色素としての酸化鉄 物質（ａ）、（ｂ）及び（ｃ）を100:120:2の割合で
使用した。填料分は、全混合物に対して60.3重量％であ
り、酸化鉄分は0.3重量％である。Example 1 A casting material was prepared by mixing the following substances: (a) Formula: (B) Methylnadetic anhydride (methylendmethylenetetrahydrophthalic anhydride) as a curing agent (c) Imidazole as a promoter (d) Amorphous as a filler SiO 2 (e) Iron oxide as a dye Substances (a), (b) and (c) were used in a ratio of 100: 120: 2. The filler content is 60.3% by weight, based on the total mixture, and the iron oxide content is 0.3% by weight.
この注型材料の粘度は、25℃で測定して、約40000mPa
sである。このようにして製造された注型材料を、ダイ
オードの注型のために使用した。The viscosity of this casting material is approximately 40,000 mPa measured at 25 ° C.
s. The casting material produced in this way was used for casting diodes.
ダイオードの注型は、室温で、４−又は８−本ノズル
を通して行ない、この際、注型材料を有する貯蔵容器を
加圧した。The casting of the diode was carried out at room temperature through a four- or eight-nozzle, wherein the storage container with the casting material was pressurized.
迅速な引出し速度（Fadenabriss）及び良好な経過で
非常に短かい律動時間（Taktzeit）（約５秒）を保持す
ることができた。装置停止状態でノズルからの後滴下
（Nachtropfen）は起こらなかつた。A very short rhythm time (Taktzeit) (about 5 seconds) could be maintained with a fast withdrawal rate (Fadenabriss) and a good course. No post-dripping (Nachtropfen) from the nozzles with the device stopped.
硬化を、12時間にわたり即ち75℃で６時間、210℃で
６時間にわたり行なつた。Curing was carried out over a period of 12 hours, ie, 75 ° C. for 6 hours and 210 ° C. for 6 hours.
硬化された注型材料は次の特性データを有した： 線熱膨張率α 210℃まで :27〜30×10-61/℃ ＞210℃ :90〜100×10-61/℃ ガラス転移温度（Tg） :210℃ 熱伝導性 :0.59W/mK このように注型されたダイオードは＞200℃まで電気
的に機能しうる。The cured casting material had the following property data: Linear thermal expansion coefficient up to 210 ° C .: 27-30 × 10 −6 1 / ° C.> 210 ° C .: 90-100 × 10 −6 1 / ° C. Glass transition Temperature (Tg): 210 ° C Thermal conductivity: 0.59W / mK Diodes cast in this way can function electrically up to> 200 ° C.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｃ０８Ｌ 63/00 Ｃ０８Ｌ 63/00 Ｃ Ｈ０１Ｌ 23/29 Ｈ０１Ｌ 23/30 Ｒ 23/31 (72)発明者 ハンス―ヨアヒム・ザイデル ドイツ連邦共和国ヴアイプリンゲン‐ノ イシユタツト・アステルンヴエーク １ (72)発明者 イレーネ・イエンリツヒ ドイツ連邦共和国ヴイネンデン・ビルク マンスヴアイラー・ビルクマンスヴアイ ラーシユトラーセ 19 (72)発明者 ヴエルナー・プフアンダー ドイツ連邦共和国フエルバツハ・エツシ エンヴエーク10 (72)発明者 アルミン・フオール ドイツ連邦共和国ロイトリンゲン24・バ イ・デア・キルヒエ 12 (56)参考文献 特開 昭55−98848（ＪＰ，Ａ) 特開 昭55−93241（ＪＰ，Ａ) 特開 昭54−11160（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) C08G 59/20 C08G 59/42 C08G 59/56 C08L 63/00 - 63/10 C08K 3/36 C08K 7/28 H01L 23/29 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification code FI C08L 63/00 C08L 63/00 C H01L 23/29 H01L 23/30 R 23/31 (72) Inventor Hans-Joachim Seidel Germany Vaipringen-No Ishtattat Asternweg, Federal Republic 1 (72) Inventor Irene Jenrich, Vinenden-Birk, Germany Mansweirer-Birgmansweier Lashijtraße 19 (72) Inventor, Wuerner Pfunder, Felbatsuha-Etzsi, Federal Republic of Germany Embek 10 (72) Inventor Armin Voor Reutlingen 24, Germany Wei der Kirche 12 (56) References JP-A-55-98848 (JP, A) JP-A-55-93241 (JP) A) Patent Akira 54-11160 (JP, A) (58 ) investigated the field (Int.Cl. 6, DB name) C08G 59/20 C08G 59/42 C08G 59/56 C08L 63/00 - 63/10 C08K 3/36 C08K 7/28 H01L 23/29
Claims (8)
ポキシド樹脂を含有し、更に、本質的に、前記エポキシ
ド樹脂100重量部当たり 硬化剤としての無水メチルナディック酸 90〜120重量部 イミダゾールをベースとする促進剤 0.2〜２重量部 無定形SiO2をベースとする填料 55〜70重量部 色素 ０〜２重量部及び 追加の填料としてのガラス中空球粒子 ０〜0.5重量部 を含有し、25℃で40000〜80000mPasの粘度を示し、三酸
化アンチモン及び臭素化エポキシド樹脂を含有しないこ
とを特徴とする、電気部品及び電子部品用の注型材料。1. An alicyclic epoxide resin based on cycloolefin, further comprising essentially from 90 to 120 parts by weight of imidazole as a curing agent per 100 parts by weight of said epoxide resin. 0.2 to 2 parts by weight of a filler based on amorphous SiO 2 55 to 70 parts by weight containing 0 to 2 parts by weight of pigment and 0 to 0.5 parts by weight of glass hollow sphere particles as an additional filler at 25 ° C. A casting material for electric parts and electronic parts, characterized by showing a viscosity of 40,000 to 80,000 mPas and containing no antimony trioxide and brominated epoxide resin.
環式エポキシド樹脂と52℃での粘度1100〜1700mPasを有
する多官能性エポキシノボラック樹脂との混合物であ
る、請求項に１記載の注型材料。2. The method according to claim 1, wherein the epoxide resin is a mixture of an alicyclic epoxide resin which is dilute at room temperature and a polyfunctional epoxy novolak resin having a viscosity at 52 ° C. of 1100 to 1700 mPas. Casting material.
無定形SiO2を含有する、請求項１に記載の注型材料。3. The casting material of claim 1, wherein said filler comprises amorphous SiO 2 treated with epoxy silane.
ｍ〜100μｍの粒径を有し、前記無定形SiO2の微小分
（2.5μｍより小さい粒径を有するものとして定義され
る）をできるだけ少なく保持する、請求項１に記載の注
型材料。4. The main component of the amorphous SiO 2 in the filler is 2 μm.
It has a particle size of M～100myuemu, the minute amount of amorphous SiO 2 (defined as having a 2.5μm smaller particle diameter) as little hold possible, casting material according to claim 1.
〜100μｍの粒径を有し、前記無定形SiO2の微小分（2.5
μｍより小さい粒径を有するものとして定義される）を
できるだけ少なく保持する、請求項３に記載の注型材
料。5. The main component of the amorphous SiO 2 in the filler is 2 μm.
It has a particle size of ～100Myuemu, the minute amount of amorphous SiO 2 (2.5
4. The casting material of claim 3, wherein the casting material is kept as small as possible.
記載の注型材料。6. The casting material according to claim 1, wherein said dye contains iron oxide.
ド樹脂100重量部に対して少なくとも0.1重量部の量であ
る、請求項１に記載の注型材料。7. The casting material according to claim 1, wherein the content of the glass hollow sphere particles is at least 0.1 part by weight based on 100 parts by weight of the epoxide resin.
は、前記エポキシド樹脂100重量部当たり55〜61重量部
である、請求項１に記載の注型材料。8. The casting material according to claim 1, wherein the content of said filler based on amorphous SiO 2 is 55 to 61 parts by weight per 100 parts by weight of said epoxide resin.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19893913488 DE3913488C2 (en) | 1989-04-25 | 1989-04-25 | Potting compound for electrical and electronic components |
| DE3913488.1 | 1989-04-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02300230A JPH02300230A (en) | 1990-12-12 |
| JP2957226B2 true JP2957226B2 (en) | 1999-10-04 |
Family
ID=6379352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2106678A Expired - Lifetime JP2957226B2 (en) | 1989-04-25 | 1990-04-24 | Casting materials for electrical and electronic components |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2957226B2 (en) |
| DE (1) | DE3913488C2 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4138411C2 (en) * | 1991-11-22 | 1995-01-26 | Bosch Gmbh Robert | Curing potting compounds |
| DE19523897C2 (en) * | 1995-06-30 | 2002-10-24 | Bosch Gmbh Robert | Use of silicone-modified epoxy resins as casting compounds for electrotechnical or electronic components |
| US6096808A (en) * | 1998-01-29 | 2000-08-01 | Alpha Metals, Inc.. | Snap cure adhesive based on anhydride/epoxy resins |
| DE19901118C2 (en) * | 1998-02-25 | 2003-01-30 | Alfred Krueger | Modified cycloaliphatic epoxy resins which are solid at room temperature, process for their preparation and their use |
| US6462108B1 (en) * | 2000-07-20 | 2002-10-08 | National Starch And Chemical Investment Holding Corporation | High Tg potting compound |
| DE10055247A1 (en) * | 2000-11-08 | 2002-05-16 | Bosch Gmbh Robert | Device and method for wrapping an electronic component |
| ATE356413T1 (en) * | 2003-04-08 | 2007-03-15 | Abb Technology Ag | METHOD FOR PRODUCING MOLDED PARTS FOR LOW, MEDIUM AND HIGH VOLTAGE SWITCHING DEVICES |
| KR101571184B1 (en) * | 2008-01-08 | 2015-11-23 | 다우 글로벌 테크놀로지스 엘엘씨 | High Tg epoxy systems for composite application |
| DE102009003132A1 (en) * | 2009-05-15 | 2010-11-18 | Robert Bosch Gmbh | Plastic molding compound and process for its preparation |
| DE102015218839A1 (en) | 2015-09-30 | 2017-03-30 | Siemens Aktiengesellschaft | Potting compound and use |
| DE102018125567A1 (en) | 2018-10-16 | 2020-04-16 | Bayerische Motoren Werke Aktiengesellschaft | Coil and current-excited synchronous machine |
-
1989
- 1989-04-25 DE DE19893913488 patent/DE3913488C2/en not_active Expired - Lifetime
-
1990
- 1990-04-24 JP JP2106678A patent/JP2957226B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE3913488C2 (en) | 1994-02-03 |
| JPH02300230A (en) | 1990-12-12 |
| DE3913488A1 (en) | 1990-10-31 |
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