JP2956827B2 - Integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit device in which the structure of a signal pad is improved and high-frequency on-wafer measurement can be realized with high accuracy.

[0002]

2. Description of the Related Art FIG. 10 shows a conventional typical integrated circuit device B.
1 is shown. This integrated circuit device B1
It shows the individual. In FIG. 10, 1 is a signal input pad, 2 is a signal output pad, 3 is a power supply pad, 4 is an integrated circuit main body, and 5 is an electrical ground in the integrated circuit. In this conventional integrated circuit device B1, the signal input pad 1 is arranged so as to face a direction orthogonal to the left side b, and the signal output pad 2 is arranged so as to face a direction orthogonal to the right side c. a is an upper side, d is a lower side, and adjacent sides a to d are in a right angle relationship with each other. As described above, the arrangement in which the signal input / output pad is performed in a direction orthogonal to the side is such that, when performing on-wafer measurement using the RF probe and the prober station, the moving direction of the arm for fixing the probe is four orthogonal directions (XY directions) in the horizontal direction. It is only due to being.

FIG. 11 shows an integrated circuit device B shown in FIG.
FIG. 2 is a diagram schematically showing a state in which probe heads 20A, 20B, and 20C are brought into contact with 1. In each probe head, 6 is a signal terminal (S), 7 is a ground terminal (G), and 8 is a power supply terminal.

Here, in the measurement of S-parameters using a network analyzer in a high-frequency band exceeding 50 GHz, port 1 (signal input pad 1 in integrated circuit device B1) and port 2 (integrated circuit device) of the integrated circuit device to be measured are measured. probe head 20 B is brought into contact with the device B1 signal output pad 2), 20 C are must be placed opposite. This is because the impedance reference base for calibration of the network analyzer is only for calibration between the GSG-type heads facing each other, and high-precision calibration cannot be performed between two probes arranged at right angles to each other.

[0005]

For this reason, it is possible to measure S-parameters in a high-frequency band exceeding 50 GHz without any problem up to a two-port pair circuit, but a three-port pair circuit (frequency multiplier, distribution circuit, In the case of a composite circuit, etc.) or a four-terminal pair circuit (differential amplifier, etc.), the calibration becomes insufficient.
There was a problem that high-precision measurement was not possible.

FIG. 12 shows a conventional distribution circuit integrated circuit device B.
2 shown. 2A is a first signal output pad, and 2B is a second signal output pad. Others are the same as those shown in FIG. When the measurement is performed by connecting the first port of the network analyzer to the signal input pad 1 and the second port to the first signal output pad 2A, for each of the pads 1 and 2A,
There is no problem because the opposing probe heads 20B and 20C can be used. In this case, the probe head 20D is brought into contact with the second signal output pad 2B, and the signal terminal 6
Act as a matching impedance termination terminal.

However, when the measurement is performed by connecting the second port to the second signal output pad 2B, the probe head 20D must be brought into contact with the second signal output pad 2B. Since the probe head 20B does not face the signal input pad 1 and the probe head 20B does not face the probe head 20B, sufficient calibration cannot be performed, and there is a problem that high-precision measurement cannot be performed. At this time, the probe head 20C is brought into contact with the first signal output pad 2A, and the signal terminal 6 functions as a matching impedance terminal.

As described above, in the conventional integrated circuit device B, as shown in FIG. 13, the signal input pad 1 and the signal output pad 2 are oriented in a direction orthogonal to the sides a to d. The probe head 20 can be brought into contact only from its orthogonal direction, and as described above, if the respective signal pads are provided on mutually orthogonal sides, the probe head cannot be opposed. Was.

The present invention has been made in view of the above points, and its object is to improve the orientation of signal pads,
An object of the present invention is to provide an integrated circuit device in which a probe head can always be opposed to each other so that high-precision high-frequency measurement can be performed.

[0010]

According to a first aspect of the present invention, in an integrated circuit device having a plurality of signal pads capable of on-wafer high-frequency measurement, a part or all of the signal pads are provided on each side of the integrated circuit device. An integrated circuit device is provided which is provided at an inclined angle with respect to each of the sides so that measurement can be performed from all four parallel directions.

According to a second aspect, in the first aspect, a part or all of the signal pad is provided with respect to each of the sides.
The integrated circuit device is provided at an angle of 45 degrees, 135 degrees, 225 degrees, or 315 degrees.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An integrated circuit device A according to the present invention is shown in FIG.
As shown in the figure, the signal input pad 1 and the signal output pad 2 are provided so as to be oriented at substantially 45 degrees with respect to each of the sides b and d (sides a and c) which are orthogonal to each other. Any of 20A ', 20B, 20C, and 20D can contact the signal input pad 1 and the signal output pad 2.

[First Embodiment] FIG. 2 shows a first embodiment of the present invention.
FIG. 5 is a diagram showing an integrated circuit device A1 as a distribution circuit according to the embodiment. This integrated circuit device A1 is provided with a signal input pad 1 on a side b, which is directed in a direction orthogonal to the side b.
On the side of the side a, a power supply pad 3 is provided near one end thereof, and a first signal output pad 2A is formed near the other end thereof and is directed obliquely at 45 degrees. In addition, a second portion which is oriented at 45 degrees with respect to both sides c and d is formed at a corner between the sides c and d.
A signal output pad 2B is provided.

FIG. 3 is a diagram showing a case where the signal input pad 1 of the integrated circuit device A1 is connected to the first port of the network analyzer and the first signal output pad 2A is connected to the second port for measurement. At this time, since the first signal output pad 2A is provided at an angle of 45, the first signal output pad 2A can be brought into contact therewith using the probe head 20C. That is, high-frequency measurement can be performed using the probe head 20C that faces the signal input pad 1 and the probe head 20C that faces the signal input pad 1. At this time, the probe head 20D is brought into contact with the second signal output pad 2B, and the signal terminal 6 functions as a matching impedance terminal.

FIG. 4 is a diagram showing a case where the signal input pad 1 is connected to the first port of the network analyzer and the second signal output pad 2B is connected to the second port for measurement. At this time, since the second signal output pad 2B is provided at an angle of 45, the second signal output pad 2B can be brought into contact therewith using the probe head 20C. That is, also in this case, high-frequency measurement can be performed using the probe heads 20B and 20C facing each other. At this time, the probe head 20D is brought into contact with the first signal output pad 2A, and the signal terminal 6 functions as a matching impedance terminal.

If the power supply pad 3 is eliminated in the integrated circuit device A1 and power can be supplied from the signal input pad 1, the probe head 20A
Is replaced with the probe head 20A 'described above, and the first signal output pad 2A is formed by the probe head 20A' and the lobe head 20D opposed thereto.
High-frequency measurement between the second signal output pad 2B and the second signal output pad 2B can also be performed.

FIG. 5 shows the transmission characteristic S21 between the signal input pad 1 and the signal output pad 2 of the conventional integrated circuit device B1 according to the measuring method described with reference to FIG. 11, and the conventional integration according to the measuring method described with reference to FIG. Transmission characteristics S3 between signal input pad 1 and second signal output pad 2B of circuit device B2
FIG. 3 is a diagram illustrating a frequency characteristic of No. 1; As described above, probe heads facing each other can be used between the pads 1-2 in FIG. 11, so that the transmission characteristics S21 thereof are well calibrated and highly accurate measurement can be performed. Since the probe heads which are orthogonal to each other and are not opposed to each other are used, the transmission characteristics S31 are insufficiently calibrated, so that errors in measured values are particularly large at high frequencies.

FIG. 6 shows the signal input pad 1 and the signal output pad 2A of the integrated circuit device A1 of this embodiment described with reference to FIG.
FIG. 5 is a diagram showing a transmission characteristic S21 between the signal input pad 1 and the frequency characteristic of a transmission characteristic S31 between the signal input pad 1 and the second signal output pad 2B described with reference to FIG. As described above, in the integrated circuit device A1, the probe head 20 which always faces the
Since the measurement was performed at B and 20C, it can be seen that good data was obtained up to the high frequency band.

FIG. 7 shows the phase θ21 between the signal input pad 1 and the signal output pad 2 of the conventional integrated circuit device B1 according to the measuring method described with reference to FIG. 11, and the conventional integrated circuit according to the measuring method described with reference to FIG. FIG. 14 is a diagram illustrating a frequency characteristic of a phase θ31 between the signal input pad 1 and the second signal output pad 2B of the device B2. Thus, the pad 1 of FIG.
The phase θ21 between −2 and −2 is well-calibrated and can be measured with high accuracy. However, the phase θ31 between the pads 1-2B in FIG. 12 is insufficiently calibrated and it is very difficult to measure the phase especially at high frequencies. Met.

FIG. 8 shows a signal input pad 1 and a signal output pad 2A of the integrated circuit device A1 of this embodiment described with reference to FIG.
FIG. 5 is a diagram showing a frequency characteristic of a phase θ21 between the signal input pad 1 and the phase θ31 between the signal input pad 1 and the second signal output pad 2B described with reference to FIG. Thus, in the integrated circuit device A1, the probe heads 20B, 20C
It can be seen that good phase data was obtained up to the high frequency band.

[Second Embodiment] FIG. 9 is a diagram showing an integrated circuit device A2 of a four-terminal pair circuit according to a second embodiment. This is one in which all four corners of the integrated circuit device A2 are provided with input, output, or input / output signal pads 9 at 45 degrees to face the corners. In this case, high-frequency measurement can always be performed using the probe heads facing each other, even between any of the signal pads 9, and sufficient calibration can be performed.

[Other Embodiments] In the above description, the configuration of the pad of the present invention is not limited to a coplanar transmission line, but is applicable to an integrated circuit device by another wiring process. is there. In the above, the direction of the signal pad is 45 degrees, 135 degrees, 225 degrees,
Although described as 315 degrees, the angle may be slightly deviated from this angle.

[0023]

As described above, according to the present invention, before the measurement can be performed from all four directions parallel to each side of the integrated circuit device.
Since the signal pads are provided at an angle to each side, the measurement between the two signal pads can be performed by contacting the opposing probe head, and sufficient calibration is possible, and high accuracy is achieved. The feature is that it becomes possible to perform various measurements.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining a structure of a signal input / output pad illustrating a principle of the present invention.

FIG. 2 is a schematic plan view of an integrated circuit device of the distribution circuit according to the first embodiment of the present invention.

FIG. 3 is a diagram for explaining a measuring method between signal pads 1-2A of the integrated circuit device of FIG. 2;

4 is a diagram for explaining a measuring method between signal pads 1-2B of the integrated circuit device of FIG. 2;

FIG. 5 is a frequency characteristic diagram of S parameters obtained by the conventional measurement method shown in FIGS. 11 and 12;

FIG. 6 is a frequency characteristic diagram of S parameters obtained by the measurement method shown in FIGS. 3 and 4 of the present invention.

7 is a frequency characteristic diagram of a phase obtained by the conventional measurement method shown in FIGS. 11 and 12. FIG.

FIG. 8 is a frequency characteristic diagram of a phase obtained by the measurement method shown in FIGS. 3 and 4 of the present invention.

FIG. 9 is a schematic plan view of a four-terminal pair integrated circuit device according to a second embodiment of the present invention.

FIG. 10 is a plan view of a conventional integrated circuit device.

11 is a signal pad 1-2 of the integrated circuit device of FIG.
FIG. 6 is a diagram for explaining a measurement method during the measurement.

12 is a signal pad 1-2 of the integrated circuit device of FIG.
It is a figure for explaining the measuring method between B.

FIG. 13 is a diagram for explaining signal pads of a conventional integrated circuit device.

[Explanation of symbols]

1: signal input pad, 2: signal output pad, 2A: first
Signal output pad, 2B: second signal output pad, 3: power supply pad, 4: integrated circuit body, 5: electrical ground, 6: signal terminal of probe head, 7: ground terminal of probe head, 8: probe head Power terminal, 9: signal terminal, 2
0A ', 20A-20D: probe head, ad:
Sides.

Claims (2)

(57) [Claims] An integrated circuit device having a plurality of signal pads capable of on-wafer high-frequency measurement, wherein a part or all of the signal pads can be measured from all four directions parallel to each side of the integrated circuit device. Before
An integrated circuit device provided at an angle with respect to each side . 2. A method according to claim 1, wherein a part or all of said signal pad is
2. The integrated circuit device according to claim 1, wherein the respective sides are provided at an angle of 45 degrees, 135 degrees, 225 degrees, or 315 degrees.