JP2953626B2 - Support rod standing point determination device for circuit board inspection device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a support rod standing point determining apparatus for a circuit board inspection apparatus having an XY unit used for determining the quality of a mounting board.

2. Description of the Related Art Conventionally, various circuit board inspection devices are used on a mounting board, that is, a printed circuit board on which a large number of electrical components are soldered, and probe pins are appropriately brought into contact with necessary inspection points on the board. The quality of the substrate is determined by the electrical measurement. In particular, the one in which an XY unit driven by a servomotor or the like is installed on a measuring table on which a substrate to be inspected is installed supports the probe pins by the movable part of the arm that moves along the guide rail, The XY
Controlling the unit is convenient because the probe pins can be appropriately moved in the X-axis, Y-axis, and Z-axis directions from above the substrate to sequentially contact preset inspection points.

However, before measurement, the substrate to be inspected 10 is placed with the substrate support part 14 (14a, 14b) provided at the center of the measuring table 12 with the solder side up and the component side down as shown in FIG. The two corresponding edges are fixed and installed. However, since the component surface is set downward, the substrate 10 to be inspected becomes large, and the substrate 10 is bent when heavy components are mounted, and the probe pins do not make good contact.

Therefore, to prevent the board 10 from bending, the support rod 16 is
Of the component is brought into contact with an appropriate position, for example, the center of the component surface, and is supported. When a magnet 18 is attached to the lower end of the support rod 16, the support rod 16 can be adsorbed to an arbitrary position on the measuring table 12 made of an iron plate or the like and can be erected. Alternatively, if a large number of holes are provided on the measuring table at equal pitches and a banana plug is attached to the lower end of the support rod, the support stand can be set at an arbitrary position.

In addition, the upper surface of the iron plate or the like forming the measuring table 12 is finished to a state close to a mirror surface by plating, so that the component surface can be reflected when the substrate 10 is set. Therefore, the support bar 16 is set up at the point where the component is not mounted while looking at the component surface reflected on the measuring table 12. In addition, support rod 16 to stand at once
Of course, the number and the contact positions are appropriately changed according to the type, such as the size and weight of the inspected substrate 10 and the arrangement state of components.

Generally, such a support bar works effectively when it is set up at the center of the substrate. However, when the size of the substrate 10 becomes large, it is difficult to project and view the mounting state of the central portion on the measurement table, and the workability is not good. In addition, if there are many types of boards to be inspected recently and the number of boards for each type is small, the number of support rods and standing points differ for each type. Is required,
If the labor and time burden are large, the inspection cannot be speeded up. If the standing points are shifted, parts and the like are easily damaged and accurate measurement cannot be performed.

The present invention has been made in view of such a conventional problem, and an appropriate number of support rods are quickly and accurately erected at an appropriate point on a measuring table according to the type of a substrate to be inspected. The object of the present invention is to provide a support rod standing point determination device for a circuit board inspection device capable of improving workability, speeding up inspection, and performing accurate measurement without damaging parts and the like. I do.

Means for Solving the Problems Means for achieving the above object will be described below with reference to FIG.

Support rod standing point determination device for this circuit board inspection device
Numeral 74 stands on the measuring table 20 on which the board to be inspected is to be set up, and an appropriate number of support rods are provided to support the board, with the tips abutting on the component surface of the board, and necessary inspection points on the solder surface of the board. XY where the probe pin 32 is appropriately moved and brought into contact
It is attached to a circuit board inspection device including the unit 24.

In the preceding stage, the contact point of the support rod is specified for the substrate 22 to be inspected which is placed on the measuring table 20 with the two sides reversed during the inspection, and the coordinate data (x0, y) of the designated point C is specified.
0) is read by teaching work by moving the probe pin 32, and each of two points A1 and A2 at arbitrary symmetrical positions on the component surface 26 around the inversion axis 66 of the board 22. Coordinate data (x1, y),
(X2, y) for reading the specified point data (x0, y0) and the symmetric point data (x1, y) and (x2, y) in the middle stage. Standing point data generating means 80 for calculating the coordinate data (x1 + x2-x0, y0) of the standing point C 'of the support bar on the measuring stand 20 corresponding to the solder surface of the substrate 22, and the respective point data are A memory 54 for storing the information, and a switch 82 for indicating a standing point C ′ for indicating the standing point C ′ on the measuring table 20 at the subsequent stage;
Operation, the standing point data (x1 +
x2−x0, y0), and a standing point indicating means 86 for indicating the standing point C ′ of the support bar on the measuring table 20 with the probe pin 32.

Operation As described above, in the former stage, the designated point data reading means 76 contacts the part surface 26 of the substrate 22 to be inspected, which is installed on the measuring table 20 with the two sides upside down at the time of inspection, and the contact point of the support rod Is specified, and the coordinate data (x0, y
0) is read by the teaching operation by moving the probe pins 32, and stored in the memory 54 provided in the middle stage.
Also, the symmetric point data reading means 78 uses the reversal axis 66 of the substrate 22.
The coordinate data (x1, y) and (x2, y) of the two points A1 and A2 at arbitrary symmetric positions on the component surface 26 are read by the teaching operation by moving the probe pin 32, and prepared at the middle stage. Stored in the memory 54. However, if the coordinate data of two points at any symmetric position on the component surface 26 is known, these data may be read by key input.

In the middle stage, the measurement corresponding to the solder surface of the substrate 22 which is inverted from the designated point data (x0, y0) and the symmetric point data (x1, y), (x2, y) previously read by the standing point data creating means 80 The coordinate data (x1 + x2-x0, y0) of the standing point C 'of the support bar on the platform 20 is calculated. The coordinate data (x1 + x2-x0, y0) of this standing point is also stored in memory.
Remember in 54.

In the latter stage, the switch 82 for standing point indication is operated,
The standing point indicating means 84 reads the standing point data (x1 + x2-x0, y0) from the memory 54, and causes the probe pin 32 to indicate the standing point C 'of the support bar on the measuring table 20 with the probe pin 32.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

FIG. 2 is a block diagram schematically showing a circuit board inspection apparatus having an XY unit to which the present invention is applied, and FIG. 3 is a schematic view showing an arrangement relationship between a substrate to be inspected and an XY unit on a measurement table. It is a top view. In the figure, reference numeral 20 denotes a measuring table of a circuit board inspection apparatus, reference numeral 22 denotes a bare board of a substrate to be inspected installed at the center thereof, and reference numeral 24 denotes an XY unit installed around its periphery so as to surround two sides of the substrate to be inspected 22. It is. Note that another set of XY units may be provided so as to surround the other two sides of the substrate 22 to be inspected.

The substrate 22 to be inspected is placed on a substrate supporting portion such as a rail of the measuring table 20, with the upper surface being the component surface 26 and the lower surface being the solder surface with both surfaces being turned upside down. The XY unit 24 includes a guide rail 28 parallel to the X axis, an arm 30 parallel to the Y axis,
A pin support 34 for moving the probe pins 32 in the axial direction is provided. Moreover, the arm 30 is driven by the servomotor 36 and can reciprocate in the direction of the arrow along the guide rail 28, and the pin support 34 is also driven by the servomotor 38 and can reciprocate in the direction of the arrow along the arm 30. The probe pins 32 are driven by a stepping motor 40,
Is vertically moving in a direction perpendicular to the upper surface of. Each of these motors
36, 38, and 40 are the X-axis, Y-axis,
A control signal is received via each of the Z-axis drivers 44, 46, 48.
A signal indicating the rotation of each of the motors 36, 38, 40 also enters the controller 42.

The controller 42 is, for example, a microcomputer and includes a CPU (central processing unit) 50, a ROM (read only memory) 52, a RAM (read / write memory) 54, an input port 56, an output port 58, a bus line 60, and the like. ing. The CPU 50 corresponds to the brain part, which is the center of the microcomputer. The CPU 50 controls the entire circuit board inspection apparatus according to the instructions of the program, performs arithmetic and logical operations, and temporarily stores the results. It also controls peripheral devices. The ROM 52 stores a control program for controlling the entire circuit board inspection apparatus, a support rod standing point determination processing program, and the like. The RAM 54 also stores designated point data, symmetric point data, standing point data, and the like, which will be described later. The input port 62 is connected to an input unit 62 including a switch for indicating a standing point and a key for inputting data.
Signal lines enter from 8, 40 respectively. Output port 5
The display 8 is connected to a display 64 showing the above-mentioned point data, measurement data for judging the quality of the mounting board, and the like, and signal lines are output to the drivers 44, 46, and 48, respectively. The bus line 60 includes an address bus line, a data bus line, a control bus line, and the like for connecting them, and is also connected to peripheral devices.

 Next, the support rod standing point determination processing operation will be described.

FIG. 4 is a diagram showing the correspondence between the substrate to be inspected and the XY coordinate axes, and FIGS. 5 and 6 are flowcharts showing a support rod standing point determination processing program. This processing program is executed by steps P1 to P9. First, P1
Then, the contact point of the support rod on the component surface 26 of the substrate 22 to be inspected is designated, and signals from all the motors 36, 38, and 40 are obtained by teaching the coordinate data of all designated points by moving the probe pins 32. To the controller 42. Note that the coordinates at an arbitrary point among them are represented by C
Let it be a point (x0, y0). At this time, unlike during normal inspection, there is no need to protrude the probe pin 32, so that the tip stops without contacting the substrate 22, so that the gap with the substrate 22 is about 2 mm even if it goes down. Set. Incidentally, the signal input to the controller 42 from each of the servomotors 36 and 38 indicates that one pulse moves by 0.02 mm. Also, the signal input from the stepping motor 40 indicates that the rotation of one step is 0.9 degrees. Next, the process proceeds to P2, and it is determined whether the reversal axis of the substrate 22 to be inspected is parallel to the X axis or the Y axis. If the reversal axis 66 is parallel to the Y axis, go to P3. In P3, two points A1 and A2 at arbitrary symmetrical positions on the component surface 26, for example, two midpoints on both sides parallel to the Y axis, are similarly coordinated by the teaching work, with the reversal axis 66 of the substrate 22 as a center,
The respective X coordinates are x1 and x2. The Y coordinates of A1 and A2 are the same. After all, if the point specified as the contact point of the support bar is symmetric with respect to the x-axis with respect to the inspection state where the solder surface is actually turned up, B1 and B2 are taken points, and if the point is symmetric with respect to the Y-axis, You will get points for A1 and A2. If the X coordinates of A1 and A2 are clear, key input can be performed. Then go to P4. At P4, the coordinate data (x1 + x2-x0, y0) of the standing point C 'of the support bar on the measuring table 20 corresponding to the solder surface in which the substrate 22 has been inverted and put into the inspection state is calculated. Therefore, the substrate 22 is removed from the support. Next, go to P5, and operate the switch or key provided on the input unit 62 to turn on the switch for indicating the standing point. Then go to P6. In P6, when the signal from the controller 42 via the drivers 44, 46, and 48 enters each of the motors 36, 38, and 40, the arm 30 and the pin support 34 move, and then the probe pin 32 goes down, and the tip thereof stands upright. Point C 'is indicated. At this time, the tip of the probe pin 32 is lowered only to the same height as that during the teaching operation. Therefore, a support bar is set up at the standing point C 'on the measuring table 20 indicated by the probe pin 32. Next, go to P7 and determine whether there is still a point at which the support bar is to be raised. In the case of YES, return to P5, repeat P5, P6, and P7, and raise the support bar at another standing point. In this way, when all the erecting points have been designated in P6, NO in P7
Is determined, and the support rod standing point determination processing is stored.

In the above P2, if the reversal axis of the substrate 22 is parallel to the X axis, P8
Go to In P8, the component surface is centered on the reversal axis 68 of the board 22.
Similarly, two points B1 and B2 located at arbitrary symmetrical positions, for example, midpoints on both sides parallel to the X axis are coordinated by teaching work, and their Y coordinates are defined as y1 and y2. In addition,
The X coordinates of B1 and B2 are the same. Then go to P9. In P9, the measuring table 20 corresponding to the solder surface in which the substrate 22 has been turned over and placed in the inspection state.
The coordinate data (x
0, y1 + y2-y0). Then, the substrate 22 is removed from the supporting portion, and the process goes to P5. Similarly, the standing point C ″ is indicated by the probe pin 32, and the supporting rod is erected there.
After all, if the substrate 22 to be inspected is a rectangle, one side orthogonal to the X axis is arranged parallel or coincident with the X axis, and the other side is arranged parallel or coincident with the Y axis.
Since there are always 6 and 68, either one should be selected as the inversion axis for determining the standing point. By the way, if the created standing point data is saved for each type of board, the support rod can be easily set even when the board is switched.

Thereafter, in order to perform electrical measurement on the mounted components of the board under test 22, the board 22 is placed on a support provided at the center of the measuring table 20, and the solder surface is turned up and the component surface is turned down. When the standing point data is created, the positions of the reversing shafts 66 and 68 are matched with each other. Then, as shown in FIG. 7, the substrate 22 is favorably supported from below by the support rod 70 abutting on an appropriate point on the component surface 26. Therefore, the XY unit 24 is appropriately controlled by the controller 42, and the tip of the probe pin 32 is sequentially brought into contact with a predetermined inspection point (measurement land) on the solder surface 72. In addition, IC (integrated circuit)
Parts and the like can be attached. Then, a measurement current is applied to each component from the measurement unit via each probe pin 32 or the like, or a measurement voltage is applied to measure a resistance value, a capacitance value, an inductance value, and the like. As a result, the quality of the substrate to be inspected 22 can be determined.

According to the present invention described above, an appropriate number of support rods can be quickly and accurately set up at an appropriate point on the measuring table according to the type of the substrate to be inspected. Therefore, workability can be improved,
In addition to speeding up the inspection, accurate measurement can be performed without damaging parts or the like.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a support rod standing point determination device of a circuit board inspection device according to the present invention. FIG. 2 is a block diagram schematically showing a circuit board inspection apparatus having an XY unit to which the present invention is applied. FIG. 3 is a schematic plan view showing an arrangement relationship between a substrate to be inspected and an XY unit on a measuring table of the circuit board inspection apparatus;
FIG. 4 is a diagram showing the correspondence between the substrate to be inspected and the XY coordinate axes. 5 and 6 are flowcharts showing a support rod standing point determination processing program stored in the circuit board inspection apparatus. FIG. 7 is a partial perspective view showing an arrangement relationship of a substrate to be inspected, a support rod, an XY unit, and the like on a measurement table of the circuit board inspection apparatus. FIG. 8 is a partial perspective view showing a substrate to be inspected and a support bar installed on a measuring table of a conventional circuit board inspection apparatus. 20 ... measuring table, 22 ... board to be inspected, 24 ... XY unit, 26 ... component surface, 32 ... probe pin, 54 ... memory, 66, 68 ... reversing axis, 70 ... support Rod, 72 ... solder side,
74... Support rod standing point determination device, 76... Designated point data reading means, 78... Symmetrical point data reading means, 80... Standing point data creating means, 82. ...... Standing point indicating means

Claims (1)

(57) [Claims] An appropriate number of support rods are provided on a measuring table on which a substrate to be inspected is to be placed to support the substrate by abutting a tip thereof on a component surface of the substrate, and necessary inspection on a solder surface of the substrate is performed. Move the probe pin appropriately to the point and make contact with it.
In a circuit board inspection apparatus equipped with a Y unit, a contact point of a support rod is designated for a component surface of a board to be inspected which is installed on the measuring table with the two sides reversed at the time of the inspection. A designated point data reading means for reading coordinate data by teaching work by moving a probe pin, and symmetric point data reading for reading each coordinate data of two points at an arbitrary symmetric position on a component surface with the inverted axis of the board as a center. Means, and erected point data creating means for calculating coordinate data of erected points of the support rods on the measuring table corresponding to the solder surface of the board inverted from the designated point data and the symmetric point data; A memory for storing each point data, a switch for indicating the standing point on the measuring table, and a switch for And a standing point indicating means for reading the standing point data from the memory by operation of the switch and indicating the standing point of the supporting rod on the measuring table with a probe pin. Standing point determination device.