JP2944316B2 - Dielectric substrate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dielectric substrate having an oscillation circuit formed on a substrate by a microstrip line and used in a microwave frequency band.

[0002]

2. Description of the Related Art As shown in FIG. 3, a conventional dielectric substrate 11 is fixed to a metal case 4 and has a microstrip line 6 and an oscillation active element 7 on the substrate. It is in a state of protruding. For fixing the dielectric substrate 11 to the metal case 4, preliminary soldering is performed in advance on the contact surface between the dielectric substrate 11 and the metal case 4, and then both are fixed by soldering. In this case, whether the solder is rotating all around the substrate 11 or
Alternatively, the confirmation of soldering, such as whether the turned solder is not oxidized, can be performed only when the solder has turned to the outer periphery of the substrate 11.

[0003] This type of oscillation circuit is configured by disposing a microstrip line 6 and the like on a substrate 11. It has the feature that it can be miniaturized.

[0004]

In the oscillation circuit using the conventional dielectric substrate described above, the presence of the solder 2 provided between the dielectric substrate 11 and the metal case 4 changes the oscillation frequency wavelength. It is causing it. If the soldering is incomplete, an air layer partially exists between the dielectric substrate 11 and the metal case 4, and when the temperature around the oscillator changes, the difference in the linear expansion coefficient causes the air to expand. The volume of the layer fluctuates, changing the wavelength of the oscillation frequency. There is a problem that an error is generated in the wireless transmission signal depending on how the oscillation frequency fluctuates.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has been made in consideration of the above problem. The purpose is to provide a dielectric substrate.

[0006]

In order to achieve the above-mentioned object, an element and a microstrip line are provided on the upper surface side, and solder is provided over the entire lower surface side, and is fixed to a metal case by the solder and is connected to a high frequency. A dielectric substrate used for an oscillator that oscillates a signal, wherein the excess solder among the solder and the metal case and the bottom surface of the substrate are provided over the entire surface of the portion where the mounted elements or microstrip lines are not arranged. It is characterized in that a large number of holes different from the grounding through holes are provided to penetrate from the front to the back of the substrate into which air flows.

[0007]

In the present invention configured as described above, when the dielectric substrate is soldered to the metal case, the degree of solder rotation is confirmed from the hole, and excess solder flows into the hole.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a sectional view in which a dielectric substrate 1 according to the present embodiment is fixed to a metal case 4, and FIG. 2 is a plan view thereof. In FIG. 1 and FIG.
In the portion of the dielectric substrate 1 on which the oscillation active element 7 is not disposed, a hole 3 of a conduction hole or a through hole is provided penetrating the dielectric substrate 1. The hole 3 is formed in the dielectric substrate 1
Solder 5, dielectric substrate 1 and metal case on bottom side
It functions as an escape hole for the air between 4
You.

[0011] The fixing of the dielectric substrate 1 will be described. When the dielectric substrate 1 is soldered to the metal case 4, the soldering operation can be performed while checking the turn of the solder 2 through the holes 3. Also, even if extra solder 5 is generated, it flows into the hole 3 and the amount of solder 2 between the dielectric substrate 1 and the metal case 4 can be made uniform, and the dielectric substrate 1
Since the air between the metal case 4 also flows into the hole 3,
The generation of an air layer between the dielectric substrate 1 and the metal case 4 can be prevented.

For this reason, the fluctuation of the oscillation frequency can be prevented from the dielectric substrate side.

[0011]

As described above, according to the present invention, the soldering between the dielectric substrate and the metal case can be performed uniformly, and the generation of the air layer between the dielectric substrate and the metal case can be reduced. Can be prevented.

[Brief description of the drawings]

FIG. 1 is a sectional view of a state in which a dielectric substrate according to an embodiment is fixed.

FIG. 2 is a plan view of the above.

FIG. 3 is a plan view showing a state in which a conventional dielectric substrate is fixed.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Dielectric board 2 Solder 3 Hole 4 Metal case 5 Extra solder

──────────────────────────────────────────────────続 き Continued on front page (51) Int.Cl. ⁶ Identification code FI H03B 5/18 H03B 5/18 C

Claims (1)

(57) [Claims] An element and a microstrip line are provided on an upper surface side, and solder is disposed over an entire lower surface side, and is fixed to a metal case by the solder and used as a dielectric substrate used for an oscillator that oscillates a high-frequency signal. An excess solder of the solder and air existing between the metal case and the bottom surface of the substrate over the entire surface of the portion where the mounted elements or microstrip lines are not arranged.
Write a flow Maseru penetrating from the table of the substrate to the back, ground
A dielectric substrate provided with a large number of holes different from through holes for use .