JP2943528B2 - Patterned substrate and method of making the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate having a pattern which requires a precise alignment mark and is used for an electronic device and the like, and a method for producing the same.

[0002]

2. Description of the Related Art Conventionally, in order to form a pattern on a plane with a size, shape, and position accuracy, a photomask or a photolithography method in which the size, shape, and position accuracy of the photomask are directly printed, There are printing methods using screen, letterpress, intaglio, and lithographic printing plates as original plates, ink jet, bubble jet, and discharge drawing methods that form by moving the position of drawing points with a mechanism to eject fluid, depending on the needs of each. They have been properly used depending on dimensions, shapes, positional accuracy, cost, work efficiency, and the like.

[0003]

SUMMARY OF THE INVENTION Among the above-mentioned methods,
According to the photographic method or the photolithography method, a resolution of about 1 to 10 microns can be obtained, and a distance accuracy of 15
About 5 to 10 microns can be obtained at a distance of about 0 mm. By using these methods, it is possible to make functional patterns with high dimensional accuracy and sufficiently precise alignment marks, but there are many steps such as coating, pre-baking, exposure, development, rinsing, after-baking, and processing time is long, Costs tended to be excessive, such as the difficulty in effectively utilizing materials. For this reason, it has often been used to meet the requirements of precision particularly required in industrial production.

[0004] In the printing method, material cost, equipment cost,
The production man-hours are small and the cost can be reduced. Also, in terms of the dimensional accuracy of the functional pattern, a fine line of about 15 to 20 microns can be created by the intaglio offset method, and high definition can be limited. However, like a positioning mark, the distance accuracy between two marks formed apart from each other is several tens of microns at a distance of about 150 mm due to accumulation of elongation of the original, and the like. Since the position differs depending on the substrate, alignment cannot be performed, or even if alignment can be performed, the relative position between the function pattern and the alignment mark cannot be adjusted, and the target function pattern cannot be aligned. It was causing trouble. This will be described with reference to FIG.

A function pattern C10 is formed on a substrate C9 by intaglio offset printing. At this time, the alignment marks 11a, 11b, 11c and 11d of the substrate C9 are also formed at four places in the substrate at the same time. In this case, since the expansion and contraction occurs in the printing direction, the alignment marks 11a and 11b of the substrate C are shifted from the points 12a and 12b which should be originally.
It is formed with a shift. Although not specifically shown in the figure, 1
A similar situation occurs for 1c and 11d. This 2
Since the accuracy of the distance between points reaches several tens of microns, a substrate made by this method does not function as an alignment mark when a plurality of sheets are overlapped.

[0006] In addition, a method of creating only by moving the position of a drawing point having a mechanism for ejecting a fluid has a resolution of 1
5-20 microns, the distance accuracy between two distant points
It is relatively good at 5 to 10 microns. However, because the drawing point moves and forms a pattern, "one-stroke writing" requires a large amount of time to create a single substrate depending on the substrate size and pattern. Not used much.

As described above, there has been no best method with high reproducibility of dimensions, shapes, positional accuracy, high productivity, and low cost. Rich in industrial productivity with low material costs, equipment costs and processes, and short processing time, good resolution,
In addition, a method with an excellent position accuracy has been desired.

[0008]

According to a first aspect of the present invention, there is provided a method of forming a main function pattern by offset printing, and moving a drawing point with a mechanism for ejecting a fluid from a first alignment mark formed by offset printing. And forming a second alignment mark to form a substrate.

[0009]

According to the present invention, a main function pattern is formed by offset printing, and a second positioning is performed by a drawing point position moving method having a mechanism for ejecting a fluid from a first positioning mark formed by offset printing formed at the same time as a starting point. Form a mark. According to this method, since the formation of the main functional pattern depends on printing, it has industrial productivity and is advantageous in terms of cost, such as low material costs, equipment costs, and a small number of production steps.

[0010] In addition, an alignment mark is created by moving the drawing point, but the number of created locations is small per substrate, and
Since it is a small shape, there is no waste in time.

The resolution is about 15 to 20 microns,
Further, the distance accuracy between two distant points is about 5 to 15 microns, and a pattern having a relatively high shape, size and position accuracy can be obtained.

[0012]

An embodiment of the present invention will be described with reference to FIG.

[0013] Vertically 300 mm x 300 mm thick
In the intaglio offset method, on the substrate A1 made of millimeter glass, the necessary creation function pattern A3 is provided within the range of 50 mm inside from the end face, and at two points 10 mm away from the outside of one side. The first alignment mark 5a,
5b is formed. This state is shown in FIG. 2 (a) for explaining the process progress of the embodiment of the present invention.

Next, as shown in FIG. 2 (b), the position of the first alignment mark 5a is detected by a CCD or the like and is set as the origin, and is set to a point 70 mm in the vertical direction (y direction) therefrom. ,
The second alignment mark 6a and the second alignment mark 6b at a point 70 mm away from the first alignment mark 5b as the origin are provided. It was formed using one type of ink jet. Next, at a point 90 mm apart in the vertical direction (y-direction) with the first alignment mark 5a as the origin, the second
The second alignment mark 6d was formed at a position 90 mm away from the first alignment mark 5c and the first alignment mark 5b.

As described above, the substrate A having the first alignment marks 5a and 5b and the second alignment marks 6a, 6b, 6c and 6d shown in FIG. 1 is formed.

A board B2 used in combination with the board A1 is shown in FIG. 1.1 mm thick and 25 widths
A necessary creation function pattern B4 and first alignment marks 7a and 7b are formed by offset printing on a substrate B2 made of glass of 0 × 250 mm. Next, the position of the first alignment mark 7a is set as the origin, and at a point 70 mm apart in the vertical direction (y direction), the second alignment mark 8a and the first alignment mark 7b are set as the origin. The second alignment mark 8b is located at a point separated by millimeters.
Was formed. Next, the second alignment mark 8c and the first alignment mark 7 are placed at a point 90 mm apart in the vertical direction (y direction) from the first alignment mark 7a as the origin.
8d was formed at a point 90 mm away from b as the origin.

FIG. 4 shows the combination of the substrates A and B obtained by these methods. Second alignment marks 8a-8b and 6a-6b shown as an example
Since the distance accuracy is high as described later, the positioning operation is easily performed.

Second substrate A prepared by the method of the present invention
Table 1 shows the measured values of the distance between the alignment marks.
Shown in

[0019]

[Table 1]

The substrate A1 is prepared in the same manner as the substrate A1.
Table 2 shows the measured values of the distance between the second alignment marks of the substrate B used in combination with the above.

[0021]

[Table 2]

As described above, in the substrate A1 and the substrate B2, the distance accuracy between two alignment marks 160 mm apart is about 5 to 15 microns. As described above, since the origin of the second alignment mark is the first alignment pattern formed at the time of forming the creation function pattern, the relative position between the second alignment mark and the creation function pattern is accurate. This does not hinder the work of assembling the substrates.

The method according to the present invention has the advantages of high position and distance accuracy, as well as coating, pre-baking, exposure,
There are no complicated steps such as development, rinsing, and after-baking, so that the processing time is short and the material can be effectively used.

The main process is a printing method, and in terms of cost, material costs, equipment costs, production man-hours, etc. are small and it is possible to reduce the cost. Also, in terms of the dimensional accuracy of the functional pattern, a fine line of about 15 to 20 microns can be created by the intaglio offset method, and high definition can be realized.

The formation of the alignment mark uses a method of moving the drawing point with a mechanism for ejecting the fluid, which is a "one-stroke writing" with high positional accuracy and requires a long time to make. However, since only a few small shapes are created, the working time is not increased.

As described above, according to the present method, the best precision pattern substrate having high reproducibility of size, shape, positional accuracy, high productivity and low cost can be obtained.

Further, there are many advantages such as low industrial costs such as low material costs, equipment costs and steps, and short processing time, good resolution, and excellent positional accuracy.

On the other hand, the measured values of the distance between the alignment marks in the case where the conventional example shown in FIG. It is shown in 3).

[0029]

[Table 3]

The distance accuracy between the alignment marks is 16
At a distance of 0 mm, the distance becomes about 50 to 90 microns, the relative position between the alignment mark and the created function pattern is also inaccurate, and the work of assembling the substrates is hindered.

[0031]

According to the present invention, material productivity, equipment costs and steps are small, and the processing time is short.
A substrate with a pattern having good resolution and excellent positional accuracy and a method for producing the same can be provided.

[Brief description of the drawings]

FIG. 1 is a plan view of a substrate A with a pattern according to an embodiment of the present invention.

FIGS. 2A and 2B are plan views showing the process progress of an embodiment of the present invention. FIG. 2A shows a state in which a functional pattern and a first alignment mark are created. FIG. 2B shows a state in which two second alignment marks are created.

FIG. 3 is a plan view of a substrate B combined with a substrate A according to an embodiment of the present invention.

FIG. 4 is a side view showing a combined state of a substrate A and a substrate B according to the embodiment of the present invention.

FIG. 5 is a plan view showing a conventional example of a substrate with a pattern.

[Explanation of symbols]

Reference Signs List 1 substrate A 2 substrate B 3 creation function pattern A 4 creation function pattern B 5a, 5b first alignment mark 6a-6d second alignment mark 7a, 7b first alignment mark 8a-8d second position Alignment mark 9 Substrate C 10 Creation function pattern C 11a to 11d Alignment mark 12a, 12b of substrate C Original alignment mark 11a, 11b
What should be

Claims (4)

(57) [Claims] 1. A function pattern and a first alignment mark are formed on a substrate by offset printing, and a second alignment mark for the purpose of performing an assembling operation is defined by using the first alignment mark as a starting point. Method of making a substrate with a pattern formed as a substrate. 2. A method according to claim 1, wherein the position of the second alignment mark is arranged on both sides of the first alignment mark. 3. A method for producing a patterned substrate, wherein the method for forming the second alignment mark according to claim 1 is a fluid ejection method. 4. A patterned substrate having an alignment mark obtained by the method for producing a patterned substrate according to claim 1.