JP2941345B2 - Surface temperature measurement method for printed wiring boards - Google Patents
Surface temperature measurement method for printed wiring boardsInfo
- Publication number
- JP2941345B2 JP2941345B2 JP2081170A JP8117090A JP2941345B2 JP 2941345 B2 JP2941345 B2 JP 2941345B2 JP 2081170 A JP2081170 A JP 2081170A JP 8117090 A JP8117090 A JP 8117090A JP 2941345 B2 JP2941345 B2 JP 2941345B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- surface temperature
- circuit pattern
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
Landscapes
- Testing Or Calibration Of Command Recording Devices (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ この発明はプリント配線板の表面温度測定方法に関す
る。Description: TECHNICAL FIELD The present invention relates to a method for measuring the surface temperature of a printed wiring board.
［従来の技術］ 従来、プリント配線板の表面温度を測定する方法は、
熱起電力の既知なる２種類の金属線若しくは箔材例えば
コンスタンタン線と銅線とを接合させた熱電対を用意
し、この熱電対の接合点を測定者がプリント配線板の被
測定箇所に押し当てて表面温度を測定していた。[Prior art] Conventionally, a method of measuring a surface temperature of a printed wiring board is as follows.
A thermocouple in which two types of metal wires or foil materials having known thermoelectromotive forces are bonded, such as a constantan wire and a copper wire, is prepared, and a junction point of the thermocouple is pressed by a measurer onto a measured portion of a printed wiring board. To measure the surface temperature.
［発明が解決しようとする課題］ しかしながら、このような測定方法では熱電対の押し
当て方によっては被測定箇所と熱電対との間に隙間やズ
レが生じて正確な温度測定ができないという不都合があ
った。[Problems to be Solved by the Invention] However, such a measuring method has a disadvantage that a gap or a gap is generated between the measured portion and the thermocouple depending on how the thermocouple is pressed, so that accurate temperature measurement cannot be performed. there were.
この発明は上記実情に鑑みてなされたもので、プリン
ト配線板の表面温度を正確に測定できるプリント配線板
の表面温度測定方法を提供することを目的とする。The present invention has been made in view of the above circumstances, and has as its object to provide a method for measuring the surface temperature of a printed wiring board that can accurately measure the surface temperature of the printed wiring board.
［課題を解決するための手段］ この発明は上記課題を解決するために、プリント配線
板の銅箔回路パターンに銅材との熱起電力が既知なる異
種金属材の一方の端部を溶接により接合し、他方の端部
と上記接合点で接合されて該プリント配線板上の略周縁
部にまで達している銅箔回路パターンの延長部若しくは
延長部から引き出した銅線とを測定器に接続して、プリ
ント配線板の表面温度を測定することを特徴とする。Means for Solving the Problems In order to solve the above problems, the present invention welds one end of a dissimilar metal material having a known thermoelectromotive force with a copper material to a copper foil circuit pattern of a printed wiring board by welding. The other end is connected to the measuring instrument with the extension of the copper foil circuit pattern joined at the above-mentioned junction and reaching the substantially peripheral portion on the printed wiring board or a copper wire drawn from the extension. Then, the surface temperature of the printed wiring board is measured.
［作用］ この発明に係わるプリント配線板の表面温度測定方法
では、銅材と対をなして熱電対となりうる金属材を溶接
によりプリント配線板の銅箔回路パターンに接合し、他
方の端部と上記接合点で接合されている銅箔回路パター
ンの延長部若しくは延長部から引き出した銅線とを測定
器に接続して上記接合点の熱起電力によりプリント配線
板の表面温度を測定する。[Operation] In the method for measuring the surface temperature of a printed wiring board according to the present invention, a metal material that can form a thermocouple by forming a pair with a copper material is joined to a copper foil circuit pattern of the printed wiring board by welding, and the other end is connected to the other end. The extension of the copper foil circuit pattern joined at the junction or a copper wire drawn from the extension is connected to a measuring instrument, and the surface temperature of the printed wiring board is measured by the thermoelectromotive force at the junction.
従って、この発明によればプリント配線板の表面温度
を直接的に測定するようにしたので、従来の測定方法に
比べてプリント配線板の表面温度をより正確に測定でき
る。Therefore, according to the present invention, since the surface temperature of the printed wiring board is directly measured, the surface temperature of the printed wiring board can be measured more accurately than the conventional measuring method.
［実施例］ 以下、この発明の実施例を図面に基づいて説明する。
第１図はプリント配線板の表面温度測定方法を説明する
図である。同図において、プリント配線板１上には電子
回路を構成する回路パターン２と、表面温度測定用に設
けられた回路パターン３とが設けられている。各回路パ
ターン2,3は例えば銅箔をエッチングすることにより形
成されている。この回路パターン３の一方端には直径が
0.1〜0.3mm程度のコンスタンタン線４が接合箇所５に溶
接により接合されている。また、回路パターン３の他方
端にはコンスタンタン線４と同じく直径が0.1〜0.3mm程
度の銅線６が接合箇所７に溶接若しくは半田付けなどに
より接続されている。この場合、コンスタンタン線４と
回路パターン３との溶接箇所５が被測定部となる。Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram for explaining a method for measuring the surface temperature of a printed wiring board. In FIG. 1, a circuit pattern 2 constituting an electronic circuit and a circuit pattern 3 provided for measuring a surface temperature are provided on a printed wiring board 1. Each of the circuit patterns 2 and 3 is formed by, for example, etching a copper foil. One end of this circuit pattern 3 has a diameter
A constantan wire 4 of about 0.1 to 0.3 mm is joined to the joint 5 by welding. A copper wire 6 having a diameter of about 0.1 to 0.3 mm, like the constantan wire 4, is connected to the other end of the circuit pattern 3 by welding or soldering. In this case, the welded portion 5 between the constantan wire 4 and the circuit pattern 3 becomes the measured portion.
そして、コンスタンタン線４と銅線６とを計測器８に
接続し、計測器８で熱起電力を計測することにより溶接
箇所５における表面温度を測定できる。この実施例は特
にプリント配線板１自体が発熱体になる場合に有効であ
る。Then, by connecting the constantan wire 4 and the copper wire 6 to the measuring instrument 8 and measuring the thermoelectromotive force with the measuring instrument 8, the surface temperature at the welding portion 5 can be measured. This embodiment is particularly effective when the printed wiring board 1 itself becomes a heating element.
［発明の効果］ 以上説明したように、この発明によればプリント配線
板の表面温度を直接的に測定するようにしたので、測定
の設定方法に比べてプリント配線板の表面温度をより正
確に測定できる。[Effect of the Invention] As described above, according to the present invention, the surface temperature of the printed wiring board is directly measured, so that the surface temperature of the printed wiring board can be more accurately measured as compared with the measurement setting method. Can be measured.
図面は発明の実施例を示すもので、第１図は測定方法を
示す図である。 １……プリント配線板、2,3……回路パターン、４……
コンスタンタン線、５……溶接箇所、６……銅線、７…
…接合箇所、８……計測器。The drawings show an embodiment of the invention, and FIG. 1 is a diagram showing a measuring method. 1 ... printed wiring board, 2,3 ... circuit pattern, 4 ...
Constantan wire, 5 ... weld, 6 ... copper wire, 7 ...
... Junction, 8 ... Measuring instrument.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) G01K 7/08 G01K 7/02 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) G01K 7/08 G01K 7/02
Claims (1)
との熱起電力が既知なる異種金属材の一方の端部を溶接
により接合し、他方の端部と上記接合点で接合されて該
プリント配線板上の略周縁部にまで達している銅箔回路
パターンの延長部若しくは延長部から引き出した銅線と
を測定器に接続して、プリント配線板の表面温度を測定
することを特徴とするプリント配線板の表面温度測定方
法。An end of a dissimilar metal material whose thermal electromotive force with a copper material is known is joined to a copper foil circuit pattern of a printed wiring board by welding, and the other end is joined at the above-mentioned joining point. The method is characterized in that the surface temperature of the printed wiring board is measured by connecting an extension of the copper foil circuit pattern reaching the substantially peripheral portion on the printed wiring board or a copper wire drawn from the extension to a measuring instrument. Method for measuring the surface temperature of a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2081170A JP2941345B2 (en) | 1990-03-30 | 1990-03-30 | Surface temperature measurement method for printed wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2081170A JP2941345B2 (en) | 1990-03-30 | 1990-03-30 | Surface temperature measurement method for printed wiring boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03282223A JPH03282223A (en) | 1991-12-12 |
| JP2941345B2 true JP2941345B2 (en) | 1999-08-25 |
Family
ID=13738985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2081170A Expired - Fee Related JP2941345B2 (en) | 1990-03-30 | 1990-03-30 | Surface temperature measurement method for printed wiring boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2941345B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2978324A1 (en) * | 2011-12-23 | 2013-01-25 | Continental Automotive France | Electronic device for forming motherboard of e.g. wheel antilock device, of car, has measurement unit formed with measuring path, voltage measuring device and microprocessor to measure electric current between connection points |
| DE102015206840A1 (en) | 2015-04-16 | 2016-10-20 | Bayerische Motoren Werke Aktiengesellschaft | Thermally monitored charging device |
-
1990
- 1990-03-30 JP JP2081170A patent/JP2941345B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03282223A (en) | 1991-12-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |