JP2925758B2 - Tape sticking equipment for semiconductor wafers - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a tape attaching device for a semiconductor wafer. In particular, a semiconductor wafer that prevents bubbles from being generated between a semiconductor wafer and a tape that is adhered to the back surface thereof, makes it possible to adhere the tape to the semiconductor wafer better, and prevents chip scattering in a scribing process. The present invention relates to an improvement aiming to provide a tape adhering device for use.

[0002]

2. Description of the Related Art An adhesive tape is generally attached to the back surface of a semiconductor wafer for the purpose of preventing chips from being scattered in a semiconductor wafer scribing process. The present invention relates to a tape sticking apparatus for semiconductor wafers for sticking such a tape. A tape bonding apparatus for a semiconductor wafer according to the related art includes a wafer support on which a semiconductor wafer is mounted, tape spreading means for spreading a tape on the wafer support, and a tape support on the wafer support. Has a tape sticking means to stick on the semiconductor wafer mounted on, the wafer support table has a support receiving portion for supporting the periphery of the semiconductor wafer to be mounted,
A concave portion is formed surrounded by the support receiving portion, and pressurized gas is press-fitted at a central portion of the concave portion. The pressure of the pressurized gas prevents bending of the semiconductor wafer against the pressing force exerted on the semiconductor wafer by the tape attaching means (for example, a rubber roller type attaching means) at the time of attaching the tape.

[0003]

However, the smoothness of the surface of the semiconductor wafer may be extremely poor due to the circuit configuration and the presence of the pad for wire bonding. In some cases, a gap was formed between the semiconductor wafer and the semiconductor wafer. further,
In a conventional tape sticking apparatus for a semiconductor wafer, the pressure of the pressurized gas becomes too large, and a gap may be generated between the support receiving portion and the semiconductor wafer. Therefore, the above-mentioned pressurized gas is ejected through this gap, and a Karman vortex is generated by this ejected gas, and a part of the ejected gas flows around the back surface side of the semiconductor wafer and flows between the semiconductor wafer and the adhesive tape. There is the disadvantage of generating bubbles. When bubbles are generated, sticking in that region becomes impossible, and chips are scattered in a scribing step of the semiconductor wafer, thereby lowering productivity.

[0004] An object of the present invention is to eliminate the above-mentioned drawbacks, and it is possible to generate air bubbles between a semiconductor wafer and a tape adhered to the back surface even in the case of a semiconductor wafer having a poor surface smoothness. It is an object of the present invention to provide a semiconductor wafer tape adhering device which can prevent the occurrence of chip and improve the adhesion of the tape to the semiconductor wafer to thereby prevent the chips from scattering in the scribing step.

[0005]

The above object is achieved by the following means. That is, the semiconductor wafer (5) is supported, has a support receiving portion (11) in a region corresponding to the periphery of the semiconductor wafer (5) to be placed, and has a fluid press-in means (12) on a bottom surface, Wafer support (1) having fluid discharge means (13) along support receiving portion (11)
A tape spreading means (2) for spreading a tape (21) on the upper part of the wafer support (1); and the tape (21)
And a tape attaching means for attaching a tape to a semiconductor wafer (5) placed on the wafer support (1), wherein the support receiving portion (11) and the fluid A flow constriction wall (14) between the discharge means (13) and a fluid suction means (15) between the flow path constriction wall (14) and the support receiving portion (11); The fluid pressurizing means (12) communicates with a fluid pressurizing pump (16) and is provided with a pressure increasing chamber (17) at the center of the wafer support table (1). A semiconductor wafer (5), which is surrounded by a flow path constriction wall (18) having a short distance in the flow direction and is mounted on a support receiving portion (11) of the wafer support (1); (1) before being formed by the pressure of the fluid pressed into the space between A tape adhering apparatus for a semiconductor wafer having a wafer bulge measuring means (6) for measuring the expansion of the semiconductor wafer (5).

[0006]

The semiconductor wafer tape sticking apparatus according to the present invention, based on the following technical concept, prevents the pressurized fluid from being injected from the gap between the surface of the semiconductor wafer and the support receiving portion of the wafer support base. Is what you do. The fluid resistance between the fluid discharge means of the wafer support and the support receiving portion is increased, and the pressurized fluid is guided toward the fluid discharge means. The pressurized fluid is sucked out near the inside of the support receiving portion of the wafer support table.
The swelling of the semiconductor wafer mounted on the wafer support table due to the pressurized fluid is measured.

In order to embody the above technical idea, a flow path constriction wall is provided between the fluid discharge means of the wafer support and the support receiving section in order to realize the above technical idea. A fluid suction means is provided between the stenosis wall and the support receiving part, and a wafer swelling measuring means is provided for the above. By the above measures, the pressurized fluid adjusted to the desired fluid pressure is effectively guided to the fluid discharge means, so that the fluid can be prevented from being ejected from the gap between the semiconductor wafer and the support receiving portion, The generation of air bubbles between the wafer and the adhesive tape can be prevented.

[0008]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a tape sticking apparatus for a semiconductor wafer according to an embodiment of the present invention.

FIG. 1 shows a tape sticking apparatus for a semiconductor wafer according to an embodiment of the present invention. FIG. 2 shows a wafer support 1, tape spreading means 2, and tape sticking means in FIG. Things. Reference numeral 6 in FIG. 1 denotes a wafer swelling measuring unit. As the wafer swelling measuring means 6, for example, a displacement meter using a laser is used, and is provided on the side surface of the wafer support table 1.

Next, with reference to FIG. 2, the details of the wafer support 1 and the tape spreading means 2 in FIG. 1 will be described. 2 is a wafer support for supporting the semiconductor wafer 5. Reference numeral 11 denotes a support receiving portion provided in a region of the wafer support table 1 corresponding to the periphery of the semiconductor wafer 5. The support receiving portion 11 surrounds the outer peripheral edge of the wafer support surface with a support wall, and adsorbs the outer peripheral edge of the semiconductor wafer 5 on the wafer support surface to position the wafer on the wafer support table 1. A well-known vacuum suction unit (not shown) for fixing is provided. Numeral 12 denotes a fluid press-fitting means provided on the bottom surface of the wafer support 1 facing the semiconductor wafer 5, and is generally provided at the center of the bottom surface. Numeral 13 denotes a fluid discharge means provided along the support receiving portion 11, for example, a hole penetrating the bottom surface. Reference numeral 14 denotes a channel narrowing wall provided between the fluid discharge means 13 and the support receiving portion 11. Numeral 15 denotes a fluid suction means provided between the flow path constriction wall 14 and the support receiving portion 11, and in the present embodiment, an annular U-shaped groove provided along the support receiving portion 11 and the groove. And a vacuum pump 152 formed of a plurality of holes provided through the wafer support base 1 on the bottom surface of the fluid suction passage 151. Numeral 2 is a tape spreading means for spreading the tape on the upper portion of the wafer support table 1. For example, a tape gripping means 22 for gripping one end of the tape 21 and spreading the tape 21 and a tape feeding means 23 are provided. Become.
Reference numeral 3 denotes a roller type sticking means as a tape sticking means for sticking the tape 21 to the semiconductor wafer 5 placed on the wafer support table 1.

According to the tape sticking apparatus for a semiconductor wafer according to the present invention, the semiconductor wafer 5 is mounted on the side surface of the wafer support table 1 by using the wafer swelling measuring means 6 such as a displacement meter using a laser. The swelling of the semiconductor wafer 5 formed by the pressure of the fluid pressed into the space between the wafer and the wafer support 1 is measured. Based on the measurement result, the fluid pressure is adjusted. A desired fluid pressure can be secured.

Next, the operation of the semiconductor wafer tape attaching apparatus will be described. 2 indicate the flow direction of the fluid, and the dashed arrow in FIG.
Indicates the direction of movement of. Pressurized gas is press-fitted into the space between the semiconductor wafer 5 and the wafer support 1 via the fluid press-fitting means 12, and pressurizes the semiconductor wafer 5 upward. On the other hand, the roller-type sticking means 3 moves the semiconductor wafer 5 from one end to the other end in the direction indicated by the dashed arrow while pressing the tape 21 extended above the wafer support table 1 downward, The tape 21 is attached to the semiconductor wafer 5. At this time, the pressure by the above-mentioned pressurized gas that has secured the desired fluid pressure by the wafer swelling measuring means 6 and the pressing force by the above-mentioned roller-type sticking means 3 are substantially balanced, and the bending of the semiconductor wafer 5 is suppressed. To prevent the semiconductor wafer 5 from being damaged. The pressurized gas press-fitted into the space between the semiconductor wafer 5 and the wafer support 1 flows from the central portion of the wafer support 1 to the peripheral portion thereof, hits the flow path narrowing wall 14 and is substantially And is discharged below the wafer support 1. The pressing force of the roller-type sticking means 3 and the pressure of the pressurized gas substantially balance each other, thereby suppressing bending of the semiconductor wafer 5 and preventing damage to the semiconductor wafer 5. The pressurized gas press-fitted into the space between the semiconductor wafer 5 and the wafer support 1 leaks partly through a narrowed flow path between the wafer support narrowed wall 14 and the semiconductor wafer 5. The leaked pressurized gas is sucked out by the fluid sucking means 15 provided between the flow path constriction wall 14 and the support receiving portion 11 and is discharged to the space below the wafer support 1. Therefore, the above-described pressurized gas is not injected from the gap between the semiconductor wafer 5 and the support receiving portion 11, and therefore, no Karman vortex is generated here. No air bubbles are generated between the tape 21 to be adhered.

FIG. 3 is a side sectional view of a tape sticking device for a semiconductor wafer according to the present invention, in which a press type tape sticking unit is used instead of the roller type tape sticking unit shown in FIG. is there. In FIG. 3, reference numeral 4 denotes a press-type sticking means. The press-type sticking means 4 has a press member 41 made of a rubber molded body or the like that has a convex spherical surface and can be elastically deformed into a substantially flat shape when pressed. Other reference numerals are the same as those in FIG.

The operation of the semiconductor wafer tape adhering device is as follows. In the tape adhering operation, the press member 41 of the press-type adhering means 4 starts contact with the tape 21 from the center,
Spreads uniformly around the circumference.

[0015] As a pressing tape attaching means,
For example, a pressing member made of a rigid body or the like having a “camel-shaped” convex arc surface is used. In the pressing step, contact is started from one end side (the side of the tape gripping means 22), and the other end (tape) is rolled. The structure extending to the supply means 23) may be used.

FIG. 4 is a sectional view of a main part of the wafer support 1 of FIG. In FIG. 4, reference numeral 16 denotes a fluid press-fitting pump, which communicates with the fluid press-fitting means 12. Reference numeral 17 denotes a pressure increasing chamber provided at the center of the wafer support table 1 above the fluid press-fitting means 12. The pressure increasing chamber 17 is surrounded by a flow path narrowing wall 18 having a short flow direction distance. Other symbols are the same as those in FIG. The fluid pressurized by the fluid pressurizing pump 16 is suppressed by the flow path constriction wall 18, and is accommodated in the pressure increasing chamber 17 while maintaining the pressure generally, and is applied over a slightly wide area of the surface of the semiconductor wafer 5. Pressure, the pressure applied to the semiconductor wafer 5 increases, and the semiconductor wafer 5
Can be strongly prevented.

[0017]

As described above, the tape sticking apparatus for a semiconductor wafer according to the present invention comprises a wafer support for supporting semiconductors, a tape spreading means for spreading the tape on the wafer support, and a tape for tape. It has a tape sticking means for sticking to the semiconductor wafer on the support table, and the wafer support table is provided with a support receiving portion in a region corresponding to the periphery of the semiconductor wafer to be mounted, and a fluid press-fit on a bottom surface. Means are provided, a fluid discharge means is provided along the support receiving portion, and a flow path constriction wall is provided between the fluid discharge means and the support reception section. Fluid suction means is provided between the support receiving portion, and the fluid press-fitting means communicates with the fluid press-fitting pump, and a pressure increasing chamber is provided at the center of the wafer support table. With short flow path constriction walls Wafer bulge that measures the bulge of a semiconductor wafer that is formed by the pressure of a fluid that is enclosed and is pressed into a space between the semiconductor wafer mounted on a support receiving portion of the wafer support and the wafer support. Since the measuring means is provided, the fluid press-fitted into the space between the wafer support and the semiconductor wafer is effectively guided to the fluid discharging means by being blocked by the flow path narrowing wall, and the flow narrowing wall is formed. Part of the fluid that has exceeded is also sucked out by the fluid sucking means, and the fluid does not erupt from the gap between the semiconductor wafer and the support receiving portion to generate Karman vortex. The generation of air bubbles between the tape and the tape can be prevented.

Accordingly, the present invention provides a method for manufacturing a semiconductor wafer which has a poor surface smoothness and a gap between the semiconductor wafer and a tape to be adhered even when there is a gap between the semiconductor wafer and a support receiving portion of the wafer support. The present invention can provide a semiconductor wafer tape adhering device that prevents generation of air bubbles in a semiconductor wafer and makes it possible to adhere a tape to a semiconductor wafer more favorably and to prevent chip scattering in a scribing process.

[Brief description of the drawings]

FIG. 1 is an explanatory view of a semiconductor wafer tape sticking apparatus according to the present invention.

FIG. 2 is a detailed view showing a wafer support, a tape spreading means, and a tape sticking means of FIG. 1;

FIG. 3 is a detailed view showing a modified example of the tape attaching means of FIG. 2;

FIG. 4 is a sectional view of a main part of the wafer support table of FIG. 2;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wafer support stand 11 Support receiving part 12 Fluid injection means 13 Fluid discharge means 14 Flow path narrowing wall 15 Fluid suction means 151 Fluid suction path 152 Vacuum pump 16 Fluid injection pump 17 Pressure increasing chamber 18 Flow path narrowing wall 2 Tape spreading Means 21 Tape 22 Tape gripping means 23 Tape supply means 3 Roller-type bonding means 4 Press-type bonding means 41 Pressing member 5 Semiconductor wafer 6 Wafer swelling measuring means

Claims (1)

(57) [Claims] The semiconductor wafer (5) is supported, has a support receiving portion (11) in a region corresponding to the periphery of the semiconductor wafer (5) to be placed, and has a fluid press-in means (12) on a bottom surface. And a fluid discharge means (1) along the support receiving portion (11).
3) a tape supporting means (2) for spreading a tape (21) on the wafer supporting table (1), and a tape supporting means (2) for mounting the tape (21) on the wafer supporting table (1). 1) In a tape attaching device for a semiconductor wafer having a tape attaching means for attaching to a semiconductor wafer (5) placed thereon, the support receiving portion (11), the fluid discharging means (13), A flow path constriction wall (14), and the flow path constriction wall (14).
Fluid suction means (15) between the support receiving part (11)
The fluid press-fitting means (12) is provided with a pressure increasing chamber (17) at the center of the wafer support table (1) in communication with a fluid press-in pump (16). 1
7) is surrounded by a flow path constriction wall (18) having a short distance in the flow direction, and is placed on a support receiving portion (11) of the wafer support table (1).
Semiconductor wafer (5) and said wafer support
Formed by the pressure of the fluid pressed into the space between (1) and
Measuring the swelling of the semiconductor wafer (5) to be formed
A tape sticking device for semiconductor wafers, comprising a wafer swell measuring means (6) .