JP2901093B2 - Laser punch press, laser processing head unit used for the punch press, connection device for connecting laser processing head unit and laser oscillator, and beam detection device used for laser beam path adjustment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a laser punch press, a laser processing head unit used for the laser punch press, and connecting the laser processing head unit and a laser oscillator. The present invention relates to a connection device and a beam detection device used for adjusting an optical path.

(Prior Art) Conventionally, a laser punch press that combines a punch press such as a turret punch press with a laser processing apparatus that performs laser processing has been developed. As a laser punch press capable of performing punching and laser processing on a plate-shaped workpiece by combining a punch press and a laser processing apparatus, for example, US Pat.
As described in Patent Document 5, a laser processing head is mounted on a frame of a punch press, and a laser beam oscillated from a laser oscillator arranged at a distance from the punch press is guided to the laser processing head. .

Further, as described in, for example, Japanese Utility Model Publication No. 63-7386, a laser processing head is mounted on a turret mold mounting hole in a turret punch press, and punching and laser processing are performed on a workpiece. Laser punch presses of the type that can be obtained have also been developed.

In any type of laser punch press, punching and laser processing are performed on a work piece, and extremely severe vibration occurs during punching.

During laser processing, a laser beam oscillated by a laser oscillator is guided to a laser processing head, and the laser processing is performed by irradiating the laser beam from the laser processing head to a workpiece.

(Problems to be Solved by the Invention) In a laser punch press, there is a problem that the optical path for guiding a laser beam from a laser oscillator to a laser processing head is likely to be misaligned due to severe vibration during punching.

Further, there is a problem that it is difficult to add a laser processing function to an existing punch press when attempting to combine punching and laser processing.

Further, in a configuration in which the punch press is, for example, a turret punch press, and the laser processing head is mounted on the turret, it is necessary to disconnect the laser processing head and the laser oscillator when the turret is rotated. There is a problem that the connection configuration with the terminal becomes complicated.

Furthermore, in the configuration in which the laser processing head is mounted on the punch press, there is a problem that the detection of the axis of the laser beam and the detection of the focal position are troublesome.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and a first object is that the optical system for guiding a laser beam to a laser processing head is unlikely to be misaligned, and is supposed to be misaligned. It is still another object of the present invention to provide a laser punch press that can easily perform centering.

A second object is to provide a laser processing head unit that can be easily mounted on an existing punch press and that is not easily affected by severe vibration during punching.

A third object is to provide a connection device that can easily perform connection and disconnection between a laser processing head unit mounted on a punch press and a laser oscillator.

A fourth object of the present invention is to provide a beam detection device capable of easily detecting the axis of a laser beam and the focus position when adjusting the optical path of the laser beam in a state where the laser processing head unit is mounted on a punch press. It is to provide.

[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above-mentioned object, the present invention provides a mold supported by an upper mold holder and a lower mold supported by a lower mold holder. And a laser processing head unit mounted at an appropriate position in a punch press for punching a plate material, a laser oscillator provided at a position separated from a processing station in the punch press, and a laser beam from the laser oscillator. An optical path adjusting device for guiding to a processing head unit, the optical path adjusting device includes a plurality of bend mirrors for appropriately bending a laser beam, and is provided on a laser oscillator side apart from the laser processing head unit. Wherein the optical path adjusting device includes a first optical path adjusting device that reflects a laser beam from a laser oscillator in a vertical A-axis direction. A second bend mirror supported by an A-axis table whose position can be adjusted in the A-axis direction, and reflecting a laser beam reflected by the first bend mirror in a horizontal B-axis direction orthogonal to the A-axis. A third bend mirror supported on a B-axis table supported on the A-axis table so as to be adjustable in the B-axis direction, and reflecting the laser beam reflected from the second bend mirror toward the laser processing head unit; It is provided with.

That is, according to the present invention, since the optical path adjusting device for guiding the laser beam to the laser processing head unit is provided on the laser oscillator side, it is hardly affected by violent vibration during punching press. Further, when the optical system for guiding the laser beam to the laser processing head is misaligned in the optical path, the plurality of bend mirrors provided in the optical path adjusting device may be adjusted at a position away from the punch press. The optical path can be easily aligned.

Further, the laser processing head unit according to the present invention includes:
A cylindrical outer guide that can be attached and detached with respect to the tool mounting light formed on the upper mold holder by the punch press, and the laser beam from the nozzle, condenser lens and laser oscillator side downward in the vertical direction on the condenser lens side A cylindrical inner guide that supports a reflecting bend mirror; and a vibration-proof support device that supports the inner guide in the outer guide so as to be vertically movable in a state in which transmission of vibration from the outer guide is interrupted. The anti-vibration support device includes a first elastic body that supports the inner guide in a floating state with respect to the outer guide, and an air damper that can freely expand and contract between the outer guide and the inner guide, It is provided with an accumulator which guarantees the pressure of the air damper.

That is, in the laser processing head unit according to the present invention, the outer guide has a double structure of the inner guide, and the first elastic body and the air damper which support the inner guide in a floating state between the outer guide and the inner guide. Therefore, even when the outer guide vibrates violently in the vertical and horizontal directions during punching, transmission of vibration to the inner guide is interrupted. Therefore, the optical system such as the condenser lens supported by the inner guide can be protected from vibration.

Further, a connection device according to the present invention is a connection device that connects a laser processing head unit mounted at an appropriate position of a punch press and a laser oscillator provided at a position separated from a processing station of the punch press, and is provided on the punch press side. The laser processing head unit has a tube guide port for protecting a laser beam incident on a bend mirror in the laser processing head unit, and has a gas connector for an assist gas supplied to the laser processing head unit, and is provided in the laser processing head unit. A first interface unit having an electrical connector connected to an electrical device, and a beam guide port provided on the laser oscillator side and freely connectable to a tube guide port, a gas connector, and an electrical connector in the first interface unit, respectively. ,gas It becomes a second interface unit with connectors and electrical connectors, in which at least one of the first interface unit or the second interface unit comprising close away freely configured relative to the other.

Therefore, according to the present invention, the connection and disconnection of the laser processing head unit mounted on the punch press and the optical path, gas flow path, and electric wiring on the laser oscillator side can be performed easily and frequently. Therefore, it is possible to easily attach a laser processing head unit to a tool mounting hole of a rotatable turret in a turret punch press and add a laser processing function to an existing turret punch press.

Still further, in the present invention, a casing detachable from a lower mold holder in a punch press, a UV table supported on the casing so as to be adjustable in a horizontal U and V axis directions, and a UV table The Z table is provided so as to be vertically adjustable and has a small-diameter hole, and a power sensor for detecting the power of the laser beam passing through the small-diameter hole of the Z table.

Therefore, the diameter of the laser beam oscillated from the laser oscillator is set to a relatively small diameter, the UV table is moved so that the small diameter laser beam passes through the small diameter hole, and the power distribution of the laser beam passing through the small diameter hole is adjusted. Is detected by the power sensor, and the position at which the detected value is maximum is detected, whereby the axis of the laser beam can be detected. When detecting the focal point of the condenser lens in the laser processing head unit after detecting the axis of the laser beam,
When the Z-table is moved up and down and the small-diameter hole coincides with the focal position, the detected value of the power sensor becomes maximum, so that the focal position can be easily detected.

Further, in the present invention, a casing detachable from a lower mold holder in a punch press, a rotary holder rotatably supported by the casing, and a beam splitter supported by the rotary holder and splitting a plurality of laser beams And a plurality of power sensors for detecting the output of each split laser beam, and a comparator for comparing the detection values of the respective power sensors, and a part of the laser beam incident on the beam splitter can be shielded from light. The light shielding member is provided so as to be freely changeable between a light shielding state position and a non-light shielding state position.

Therefore, according to the present invention, the output of the laser beam split by the beam splitter is detected by each power sensor, and the laser beam is oscillated so that the detection value of each power sensor becomes equal. Can be detected. Further, in a state where the light shielding member is positioned at the light shielding state position and a part of the laser beam is shielded, the condensing lens provided in the laser processing head unit is moved up and down to compare the detection values of the respective power sensors. Accordingly, it is possible to detect whether or not the light shielding member is located at the focal position, and thus to detect the focal position of the condenser lens.

(Embodiment) To explain the overall configuration of a laser punch press 1 according to an embodiment of the present invention, FIG. 1 is a plan view of the laser punch press 1. Laser punch press 1
It is a combination of a punch press 3 for performing punching on a plate-shaped workpiece W and a laser processing system 5 for performing laser processing.

Although the punch press 3 is illustrated as a turret punch press in the present embodiment, the punch press 3 is not limited to the turret punch press, but may be a general punch press. The configuration of the turret punch press is known,
The outline is as follows.

That is, the turret punch press includes a C-shaped or gate-shaped frame 7, on which a disk-shaped upper die holder (upper turret) 11 supporting a plurality of upper dies 9 in a detachable manner. A lower mold holder (lower turret: not shown) that supports a plurality of lower dies so that they can be detached and exchanged is provided opposite to the upper mold holder 11 when it is rotatably supported. . At a position above the upper mold holder 11, a striker (not shown) for pressing the upper mold 9 indexed and positioned in the processing station by rotation of the upper mold holder 11 is provided to be vertically movable. .

Furthermore, the turret punch press is provided with a fixed table 13 for horizontally supporting the workpiece W and a movable table 15. The movable table 15 is X
It is integrally mounted on both sides of a carriage base 17 extending in the axial direction (the left-right direction in FIG. 1), and is configured to move in the Y-axis direction integrally with the carriage base 17. The carriage 19 is mounted on the carriage base 17.
Is supported movably in the X-axis direction. The carriage 19 has a work clamp 21 that can grip the work PVSUW.
Is installed.

Since the turret punch press having the above configuration is known as described above, a more detailed description and a description of the operation will be omitted.

The laser processing system 5 includes a laser oscillator 23 provided at a position separated from a processing station of the punch press 3.
And a laser processing head unit detachably mounted in a tool mounting hole of the upper mold holder 11 in the punch press 3
25. On the side of the laser oscillator 23, an optical path adjusting device 27 for guiding the laser beam LB oscillated from the laser oscillator 23 to the laser processing head unit 25 is provided. Further, a bonding device 29 for connecting the laser oscillator 23 and the laser processing head unit 25 is provided. This connection device 29 is a laser processing head unit 25
And a second interface unit 33 provided on the side of the laser oscillator 23 and freely connectable to the first interface unit 31.

More specifically, the optical path adjusting device 27 is a laser oscillator 23
Are arranged in a housing 35 connected to the output side of the camera. The second interface unit 33 is housed in a housing extension 37 provided to extend from the housing 35 toward the die holder 11 of the punch press 3. The first interface unit 31 is mounted on the mold holder 11, and the laser processing head unit 25
When the indexing and positioning of the
It is provided to face the interface unit 33.

In the laser processing system 5 having the above-described configuration, the first and second interface units 31 and 33 are connected to each other after the laser processing head unit 25 is indexed and positioned at the processing station in the punch press 3. The laser beam LB from the laser oscillator 23 can be supplied to the laser processing head unit 25, and a gas flow path for an assist gas or the like and an electric wiring are connected to enable laser processing.

In order to directly guide the laser beam LB from the laser oscillator 23 to the laser processing head unit 25, the optical path adjusting device 27 is used.
Is provided with a plurality of pen mirrors for appropriately bending the laser beam LB.

More specifically, the optical path adjusting device 27 is configured as shown in FIGS.
It is configured as shown in the figure. That is, the optical path adjusting device 27 includes a base plate 39 fixed to the housing 35, and the base plate 39 includes the laser oscillator 23
A first bend mirror 41 that reflects a laser beam LB oscillated from the laser beam and horizontally incident in an A-axis direction corresponding to a vertical axis.
Is provided. The first bend mirror 41 is tilted and attached to a rotary table 43 provided to be rotatable around an axis in the A-axis direction.

Therefore, even if there is some error in the horizontal incidence angle of the laser beam LB with respect to the first bend mirror 41, by rotating the rotary table 43,
The laser beam LB can be accurately reflected in the A-axis direction.

The base plate 39 is provided with a plurality of guide posts 45 extending in the A-axis direction. An A-axis table 47 is supported on the guide posts 45 via slide bushes so as to be adjustable in position. The A-axis table 47 is provided with a second bend mirror 49 for reflecting the laser beam LB reflected in the A-axis direction by the first bend mirror 41 in a horizontal B-axis direction orthogonal to the A-axis. Along with
A third bend mirror 51 that horizontally reflects the laser beam LB from the second bend mirror 49 toward the laser processing head 25 mounted on the punch press 3 is mounted.

A of laser beam LB incident on laser processing head 25
A suitable number of guide posts 45 to adjust the axial displacement
Between them, a stopper plate 53 is fixed by a fixing bolt 55 so as to be adjustable in position. And the A-axis table
Motor bracket 57 attached to 47 and stopper plate
A coil spring 59 is stretched between the motor bracket 57 and the motor bracket 57, and an A-axis adjustment motor 61 for adjusting the position of the A-axis table 47 is mounted on the motor bracket 57. A-axis adjustment motor
61 is configured such that a plunger 63 such as a screw rod enters and exits in accordance with forward and reverse rotation of the motor 61,
The tip of the plunger 63 is in contact with the stopper plate 53.

With the above configuration, the stopper plate 53 and the A-axis table 47 are connected to the guide post while the fixing bolt 55 is loosened.
By moving along 45, the position adjustment in the A-axis direction can be largely performed. Also, stopper plate
With the 53 fixed to the guide post 45, the A-axis table 47 is moved in the A-axis direction by appropriately controlling and rotating the A-axis adjustment motor 61 under the control of a controller such as a computer or an NC controller. Can be fine-tuned. That is, according to the above configuration, the third bend mirror
The position of the laser beam LB reflected from the direction 51 toward the laser processing head unit 25 in the A-axis direction can be adjusted.

From the third bend mirror 51 to the laser processing head unit
In order to adjust the position of the laser beam LB reflected in the 25 direction in the B-axis direction, the third bend mirror 51 is provided with a B-axis table 65.
It is attached to. The B-axis table 65 is movable along a B-axis guide 67 provided on the A-axis table 47, and a coil spring 69 is stretched between the B-axis table 65 and the A-axis table 47. . The tip of a plunger 73 that allows the B-axis adjusting motor 71 mounted on the A-axis table 47 to come in and out comes into contact with a part of the B-axis table 65.

In the above configuration, the position of the B-axis table 65 can be adjusted in the B-axis direction by appropriately moving the plunger 73 in and out by driving the B-axis adjustment motor 71, and the third bend mirror 51
The position of the laser beam LB reflected in the direction of the laser processing head unit 25 in the B-axis direction can be adjusted.

Further, in order to accurately adjust the direction of the laser beam LB reflected from the third bend mirror 51 toward the laser processing head unit 25, the third bend mirror 51 is configured to be swingably adjustable in two axial directions. ing.

More specifically, as shown in FIG. 4, the third bend mirror 51 is a mirror casing 75 mounted on a B-axis table 65.
It is attached to a mirror holder 77 which is swingably mounted inside. The mirror holder 77 is pivotally supported by a mirror casing 75 at a pivot point 79 via a ball joint or the like, and is separated from the pivot point 79 in a direction orthogonal to the mirror casing 75.
The distal ends of the plungers provided so as to freely move in and out of the B-axis direction adjusting motor 83 and the A-axis direction adjusting motor 85 (see FIG. 3) mounted on the mirror casing 75 are in contact with 81A and 81B. Although not shown in detail, the mirror holder 77 is not shown.
Is biased by, for example, a spring or the like so as to always contact the plungers of the adjusting motors 83 and 85.

According to the above configuration, the mirror holder 77 can be appropriately rocked in two directions by appropriately controlling and rotating the motor 83 and the A-axis direction adjusting motor 85 in the B-axis direction by the control device. The directionality of the laser beam LB reflected from the mirror 51 toward the laser processing head unit 25 can be adjusted accurately.

Next, a third bend mirror in the optical path adjusting device 27
The laser processing head unit 25 for receiving a laser beam LB reflected at 51 and performing laser processing.
Will be described in detail.

As shown in detail in FIGS. 5 to 7, the laser processing head unit 25 is detachably mounted in a tool mounting hole 87 formed in the upper die holder (upper turret) 11 in the punch press 3. I have.

More specifically, the laser processing head unit 25 includes a cylindrical outer guide 89 that is roughly detachable from the tool mounting hole 87, a nozzle 91 that jets assist gas to a processing position of the workpiece W, and a laser 91. A cylindrical inner guide 97 supporting a condensing lens 93 for condensing the beam LB and a bend mirror 95 for reflecting the laser beam LB incident through the hole adjusting device 27 to the condensing lens 93 side, and the like. It is composed of

The inner guide 97 is mounted inside the outer guide 89 so as to be movable up and down, and between the inner guide 97 and the outer guide 89, the inner guide 97 is supported in a state where vibration from the outer guide 89 is cut off. A vibration isolating support device is provided. The anti-vibration support device includes an elastic member 99 such as an air damper or a coil spring for supporting the inner guide 97 in a floating state, and a scale between an inner peripheral surface of the outer guide 89 and an outer peripheral surface of the inner guide 97. It is composed of a free air damper 101.

More specifically, the outer guide 89 has a tool mounting hole
The outer guide 89 is fitted so that the axis of the outer guide 89 is aligned with the axis of the 87, and is fixed by a plurality of bolts 103. The inner peripheral surface at the lower end of the outer guide 89 is tapered.
89T is formed, and the circumferential groove 89 formed in the tapered portion 89T is formed.
A plurality of steel balls 105 are held in G via a retainer (not shown) so as to be slightly movable in the radial direction. After the tapered portion 97T formed at the lower end of the inner guide 97 is fitted into the tapered portion 89T, the steel ball 105 is slightly rotated with respect to the outer guide 89 to accurately adjust the direction. This is for assisting the above-mentioned rotation to be performed smoothly when holding is attempted, and may be omitted in some cases.

As described above, by fitting the taper portion 97T of the inner guide 97 to the table portion 89T of the outer guide 89, the axis of the outer guide 89 matches the axis of the inner guide 97, and the nozzle 91, The axis of the condenser lens 93 is stabilized at a specified position, and the laser processing is enabled.

Therefore, in order to lower the inner guide 97 against the elastic member 99 that supports the inner guide 97 in a floating state, a plurality of pressing cylinders 107 are provided above the outer guide 89.

The pressing cylinder 107 is provided at a plurality of positions of a ring member 111 fixed to the upper surface of the outer guide 89 by a plurality of bolts 109, and a lower end portion of a piston pin 113 provided in each pressing cylinder 107 so as to be vertically movable. Is the tapered part 1
Formed at 13T. Further, a dog 113D is attached to the upper end of the piston pin 113 projecting upward from the pressing cylinder 107, and the dog 113D is attached to the pressing cylinder 107.
Upper and lower sensors 115U and 115L are provided to detect the rise and fall of the air. On the other hand, an upper plate 117 is attached to the upper part of the inner guide 97.
A bush 119 having a tapered portion 113T of the piston pin 113 and a tapered hole which is detachable from the system is attached.

In the above configuration, when air is discharged from the air damper 101 and the inner guide 97 can move up and down, a working fluid is supplied to the pressing cylinder 107 to lower the piston pin 113. The 113T is engaged with the tapered hole of the bush 119, thereby restricting the rotation of the inner guide 97 and performing positioning in the circumferential direction. Thereafter, when the piston pin 113 is further lowered, the inner guide 97 is lowered against the elastic member 99, and the tapered portion 97T of the inner guide 97 is
Fits into 9 taper section 89T. Therefore, as described above, the axis of the inner guide 97 coincides with the axis of the outer guide 89, and laser processing is possible. Then, whether or not the inner guide 97 is positioned is determined by a sensor at the bottom.
115L is confirmed by detecting dog 113D.

Conversely, when the piston pin 113 of the pressing cylinder 107 is raised, the pressing down of the inner guide 97 is released.
The inner guide 97 is pushed up by the action of the elastic member 99 and is supported in a floating state. Therefore, in this state, by supplying air to the air bumper 101 to enlarge the air, the inner guide 97 is supported in a state where transmission of vibration from the outer guide 89 is cut off. The fact that the inner guide 97 is supported in a floating state can be confirmed by the upper sensor 115U detecting the dog 113D.

As described above, when supporting the inner guide 97 in a floating state, in order to guarantee the pressure of the air damper 101, an appropriate position of the laser processing head unit 25, in this embodiment, to the mold holder 11, to the air damper 101, A connected accumulator 121 (see FIG. 1) is provided. Therefore, even if there is a slight air leak from one part of the air pipe or the like, the air damper 101
Is guaranteed, and the inner guide 97 is securely supported.

As described above, when laser processing is performed in a state where the tapered portion 97T of the inner guide 97 is fitted to the tapered portion 89T of the outer guide 89, the distance between the workpiece W and the lower end of the nozzle 91 and the condensing lens It is necessary to adjust the focus position of 93 according to the thickness of the workpiece W or the like.

Therefore, in the present embodiment, the vertical slide 125 that supports the nozzle 91 and the condenser lens 93 is the inner guide 9.
7 is provided to be able to move up and down freely.

More specifically, a plurality of vertical guide columns 123 are provided in the inner guide 97, and the vertical slide 125 is configured to be guided up and down by the guide columns 123. The nozzle 9 is located below the vertical slide 125.
1 is installed.

To adjust the vertical slide 125 up and down,
A ball screw 127 (see FIG. 7) parallel to the guide support 123 is rotatably provided.
, A ball nut 129 attached to the vertical slide 125 is screwed. The ball screw 127 has a servomotor 131 attached to the upper plate 117 for vertically moving the nozzle.
Are linked together. The servo motor 131 is provided with a pulse encoder for detecting rotation, and is configured to detect rotation of the ball screw 127 to detect the vertical position of the nozzle 91.

Therefore, by appropriately rotating the ball screw 127 by the servo motor 131, the vertical slide 125
Is moved up and down, so that the vertical position of the nozzle 91 can be adjusted. By providing a distance sensor at the lower end of the nozzle 91 to detect the distance between the workpiece W and the nozzle 91, the distance between the nozzle 91 and the workpiece W can be appropriately controlled. .

In order to adjust the focal position of the condenser lens 93 up and down, a rotating gear 133 having an internal thread formed on the inner peripheral surface is rotatably supported on the upper side of the vertical slide 125. Inside, a cylindrical focus adjustment holder 137 whose rotation is regulated by a guide pin 135 erected on the upper part of the vertical slide 125 is screwed in such a manner that the vertical position can be adjusted. The condenser lens 93 is held by the focus adjustment holder 137 via the lens holder 139.

In order to rotate the rotating gear 133, a vertical slide 125
, A small-diameter gear 141 meshing with the rotating gear 133 is rotatably provided. That is, the small-diameter gear 141 is vertically splicably fitted to a spline shaft 143 that is rotatably supported perpendicularly to the inner guide 97. The upper end of the spline shaft 143 is operatively connected to an ultrasonic motor 145 mounted on the upper plate 117.

Therefore, the spline shaft 143 is
Is rotated through the small-diameter gear 141, so that the focus adjustment holder 137 screwed with the rotary gear 133 is rotated.
Is adjusted up and down. Therefore, this focus adjustment holder
The focal position of the condenser lens 93 held at 137 can be adjusted up and down.

The bend mirror 95 for reflecting the laser beam LB vertically downward in the direction of the condenser lens 93 is supported by a mirror holder 146 having a water jacket for water cooling. The mirror holder 146 has a cylindrical holder support 1 attached to the upper plate 117 above the condenser lens 93.
It is installed at an angle to 47. Above bend mirror 95
Is provided at a height position that accurately reflects the laser beam LB incident from the optical path adjusting device 27 when the inner guide 97 is lowered.

In the laser processing head unit 25 having the above configuration, the bend mirror 95 and the condenser lens 93 are used as an optical system.
The alignment of the optical system is important. Therefore, in this embodiment, the centering is performed in advance before the condenser lens 93 is mounted on the focus adjustment holder 137.

More specifically, as shown in FIG.
The lens holder 139 holding 93 is arranged in the outer holder 149, and a cylindrical outer holder 149 having a threaded portion on the outer peripheral surface for screwing into the focus adjustment holder 137. Tubular inner holder 151 to hold
And so on.

The condenser lens 93 includes a cylindrical lens pressing member 15.
3, cylindrical nut 15 screwed into inner holder 151
5 is fixed to the inner holder 151. The inner holder 151 is urged upward by a wave spring 159 elastically mounted between a ring-shaped spring holder 157 attached to a lower portion of the outer holder 149 and a bottom surface of the inner holder 151. Then, a plurality of steel balls 161 held in an annular groove 151G formed on the upper surface of the inner holder 151 are attached to the upper flange portion 149F of the outer holder 149.
The inner holder 151 is centered in contact with the tapered portion 149T formed on the lower surface of the inner holder 151.

Furthermore, the inner holder 1 is
In order to accurately align the center 51, an adjust set screw 163 capable of adjusting the upper portion of the inner holder 151 in the radial direction is screwed to a plurality (three or more) of the upper peripheral surface of the outer holder 149. is there. Further, a metal bellows 165 is stretched between the inner holder 151 and the outer holder 149 for the purpose of transmitting the heat of the seal and the inner holder 151 to the outer holder 149. further,
An O-ring 167 that seals when the lens holder 139 is mounted on the focus holder 137 is mounted on the upper part of the outer holder 149.

With the configuration as described above, by appropriately adjusting each set screw 163, the inner holder 151 can be smoothly swung and adjusted with respect to the outer holder 149, and the axis of the inner holder 151 or the center of the inner holder 151 can be adjusted to the axis of the outer holder 149. The axis of the optical lens 93 can be adjusted and adjusted. That is, the axial center adjustment can be performed in advance.

Further, the lens holder 139 having the above configuration is
At the time of performing laser processing in the state of being screwed to 37, the port 125P formed in the vertical slide 125 is used.
When the assist gas is supplied from the nozzle 91 into the nozzle 91 (see FIG. 6), the inner pressure applied to the condenser lens 93 and the like is received by the plurality of steel balls 161 and the inner holder 151 does not move in the axial direction. .

Upper die (upper turret) in punch press 3
When the laser processing is performed by indexing and positioning the laser processing head unit 25 mounted on the processing station, it is necessary to connect the first and second interface units 31 and 33 of the connection device 29 described above. Therefore, next, the first and second interface units 31,
33 will be described in detail.

For convenience of explanation, first the second interface unit
The configuration of the 33 will be described.

Referring to FIG. 9 and FIG.
9 and 10, an annular support plate 169 is provided integrally with the housing 35 in the housing extension 37 of the housing 35 in which the housing 35 is provided.
A plurality of guide bars 171 having a housing extending in the direction of the opening of the extending portion 37 are horizontally supported by the support plate 169, and an advancing / retreating member 173 is supported by the guide bar 171 in a reciprocating manner. I have.

A plurality of columns 175 extending in the direction of the opening of the housing extension 37 are horizontally attached to the advance / retreat member 173,
A connection plate 179 is vertically supported at the tip of the support 175 via a plurality of elastic A members 177 such as rubber members. A protection tube 181 through which the laser beam LB passes is supported at the center of the advancing / retreating member 173.

At the center of the connection plate 179, a protective tube 181 is provided.
Beam guide port 18 through which the laser boom LB connected to
3 are provided, and guide pins 185 are provided at a plurality of locations of the connection plate 179 so as to protrude horizontally. As shown in FIG. 11, the connection plate 179 has an electric connector 187 (wiring is provided) for electrically connecting to various electric products such as a motor and a sensor provided in the laser processing head unit 25. (Not shown), and a pair of gas connectors 189A and 189B for connecting flow paths (piping not shown) for assist gas, air, and the like. Further, the connection plate 179 has a water channel connector for connecting a flow path for cooling water or the like (the piping is not shown).
191 are provided.

In order to reciprocate the reciprocating member 173 along the guide bar 171, a ball nut 193 is mounted at an appropriate position of the reciprocating member 173, and the ball nut 193 is rotatably supported on the support plate 169. Screwed to a ball screw 195, and the ball screw 195 is connected to a servomotor 197 supported on a support plate 169.

Accordingly, the connection plate 179 can be moved toward and away from the first interface unit 31 via the advance / retreat member 173 by the rotational drive of the servo motor 197.

A dust cover 199 is provided at the opening of the housing extension portion 37 to be openable and closable in order to prevent dust in the housing extension portion 37. That is, a vertical cover guide 201 is provided at the tip of the housing extension portion 37, and the dust cover 199 is supported by the cover guide 201 so as to be vertically movable. The air cylinder 203 mounted on the housing extension 37 so as to be movable up and down is
Linked to 99. The dust cover 199 includes
An interlocking arm 205 for connecting and raising and lowering a similar dust cover provided on the first interface side is provided to protrude toward the first interface 31 side.

With the above configuration, the dust cover 199 can be moved up and down by operating the air cylinder 203 appropriately, and the opening of the housing extension 37 can be opened and closed.

As already described in FIG. 1, the first interface unit 31 is mounted on the mold holder 11 of the punch press 3, and when the laser processing head unit 25 is indexed and positioned in a processing station, the first interface unit 31 It can be connected to the 2 interface unit 33. A guide tube 207 for protecting a laser beam is provided between the first interface unit 31 and the laser processing head unit 25.

Further, between the first interface unit 31 and the laser processing head unit 25, wiring (not shown) connected to various electric products such as a motor and a sensor provided in the laser processing head unit 25 is provided. Various pipes (not shown) for assist gas, air and cooling water are also provided.

The connection block 209 in which the first interface unit 31 faces the second interface unit 33 includes:
A beam guide port 211 that can be connected to the beam guide port 183 in the second interface unit 33 is provided, and an engagement hole 213 that allows each guide pin 185 to be detachably connected is provided. Further, the connection block 209 is provided with various connectors (not shown) that are respectively connected to the electrical connector 187, the gas connectors 189A and 189B, and the water channel connector 191 in the second interface unit 33.

Further, the connection block 209 is provided with a cover guide 215, and the dust cover 217 is guided by the cover guide 215 so as to be vertically movable. And the above dust cover
217, the second interface unit 33
An engagement portion 219 that engages with the interlocking arm 205 provided on the dust cover 199 on the side is formed.

In the above configuration, when the first and second interface units 31 and 33 are in a state of facing each other,
When one of the dust covers 199 is raised by operating the air cylinder 203, the interlocking arm 205 provided on the dust cover 199 causes the engaging portion 219 of the other dust cover 217 to engage.
Is pushed up, the dust covers 199 and 217 rise at the same time.

As described above, when the advancing / retreating member 173 and the connection plate 179 of the second interface unit 33 are advanced toward the first interface unit 31 in a state where both dust covers 199 and 217 are raised, the connection plate 179 is formed.
And the connection block 209 are connected, and various connectors are connected. Therefore, the laser beam LB can be supplied from the laser oscillator 23 side to the laser processing head unit 25 side, the various motors 131 and 145 provided in the laser processing head unit 25 can be controlled, and the assist gas is ejected from the nozzle 91. Becomes possible.

That is, the laser processing is enabled by the connection between the first interface unit 31 and the second interface unit 33.

As described above, prior to connecting the first and second interface units 31 and 33 and starting laser processing,
It is important to detect whether or not the axis of the laser beam LB coincides with the axis of the tool mounting hole 87 in which the laser processing head unit 25 is mounted, for example.

Therefore, in the embodiment of the present invention, the laser beam LB
There is provided a beam detecting device 221 (see FIG. 12) capable of detecting the axis of the laser beam and detecting the focal position of the condenser lens 93 provided in the laser processing head unit 25.

More specifically, in the beam detection device 221, the upper and lower tool mounting holes 87 provided in the upper and lower mold holders (upper and lower turrets) in the punch press 3 are formed concentrically with high precision by simultaneous processing or the like. And is used by being mounted in a tool mounting hole 225 formed in a lower mold holder 223 such as a lower turret. This beam detecting device 221 is usually removed from the tool mounting hole 225, and is used only when detecting the laser beam LB.

Now, referring to FIG. 12, the tool mounting hole 225 of the lower mold holder 223 is such that the axis of the circular casing 227 in the beam detecting device 221 substantially coincides with the axis of the tool mounting hole 225. And are detachably fitted. In this casing 227, there is provided a U-table 229 capable of adjusting the position in the U-axis direction corresponding to the X-axis. This U-table 229 has a V-table capable of adjusting the position in the Y-axis direction corresponding to the Y-axis.
231 are supported. The V-table 231 supports a Z-table 233 that can move up and down along guide pins 232 erected on the V-table 231.

The Z table 233 has an aperture plate 235 having a small hole 235H at the center thereof through which the laser beam LB can pass.
Is mounted, and a cooling water pipe 237 is mounted. Further, the Z table 233 is provided with a conduit 241 such as a light guide for guiding the laser beam that has passed through the small hole 235H in the aperture plate 235 to the integrating sphere 239. The integrating sphere 239 is cooled by a cooling water pipe 243, and a power sensor 245 for detecting the output of the laser beam LB is provided at an appropriate position of the integrating sphere 239.

To move the Z table 233 up and down, the Y table 2
A vertical movement adjustment motor 247 is mounted on the motor 31, and the tip of a plunger 247 P that is moved up and down by the rotation of the motor 247 is in contact with the Z table 233.

In the above configuration, to detect the laser beam LB, the condenser lens 93 in the laser processing head unit 25 is required.
The laser beam LB from the laser oscillator 23
Into a small diameter guide beam.

As a method for obtaining a small-diameter guide beam, for example,
As shown in FIG. 8A, a configuration in which a pierhole aperture 253 having a pierhole having an appropriate diameter is inserted between an output mirror 249 and a rear mirror 251 in the laser oscillator 23, or
As shown in FIG. 13 (B), a configuration in which a pinhole aperture 253 is arranged outside is possible. In addition,
As shown in FIG. 13 (C), the pinhole aperture 253 is provided with a pinhole 253P and a large-diameter hole 253H orthogonal to each other in a columnar portion, and the pinhole is rotated by 90 ° to form a normal pinhole. It is desirable that the configuration can be switched between laser beam oscillation and small-diameter guide beams.

The small-diameter guide beam obtained by the above-described configuration is guided from the laser processing head unit 25 to the beam detection device 221 and the U table 229 and the V table 231 are appropriately moved to reduce the guide beam and the small diameter of the aperture plate 235. The position where 235H coincides and the detection value of the power sensor 245 becomes maximum is the position where the axis of the guide beam coincides with the axis of the small hole 235H. Accordingly, by detecting the positions of the U table 229 and the V table 231 at this time by the position detector, it is possible to detect the amount of deviation of the axis of the laser beam LB from the axis of the tool mounting hole 87.

After detecting the axis of the laser beam LB as described above, the condenser lens 93 is attached to the laser processing head unit 25.
Then, the vertical rotation motor 247 is controlled and rotated to move the Z table 233 up and down, and a position at which the output of the power sensor 245 is maximum is detected. Since the output of the power sensor 245 becomes maximum when the focal position of the condenser lens 93 and the small hole 235H of the aperture plate 235 match, the aperture plate 235 when the output of the power sensor 245 becomes maximum
By detecting the height position of the focusing lens, the focal position of the condenser lens 93 can be detected.

As described above, after detecting the axial position of the laser beam LB and the focal position of the condenser lens 93, the beam detector 221 is removed from the tool mounting hole 225, and instead, as shown in FIGS. 6 and 7, By attaching the work support ring 255, laser processing becomes possible. In laser processing, the laser beam passes through the large-diameter hole 253H of the pinhole aperture 253 in the laser oscillator 23.

FIG. 14 to FIG. 16 show a configuration of a beam detecting device 257 of another embodiment. The beam detection device 257 includes a ring-shaped casing 259 detachably fitted in the tool mounting hole 225 of the lower mold holder 223, and a rotating holder 261 is rotatably supported on the casing 259. .
A cylindrical detection housing 263 is attached to a lower portion of the rotary holder 261. A plurality of laser beams LB (in this embodiment) are provided at the center of a disk-shaped mirror holder 265 mounted in the detection housing 263. , A beam splitter 267 such as a cube mirror for splitting into two.

Further, the detection housing 263 includes a beam splitter 267.
The laser beam split by the
Concave mirror 27 condensing and incident on integrating sphere 269 provided at the bottom of 3
1 is provided. Each integrating sphere 269 is always water-cooled, and each integrating sphere 269 is provided with a power sensor 273. Each of the power sensors 273 is connected to a comparator 275, and the detected value is compared.

Therefore, the detection value of each power sensor 273 is compared with the comparator 275
By comparing the above, it can be detected whether or not the laser beam LB is equally divided. Each of the above power sensors 273
When the detected values are not equal to each other, the B-axis adjusting motor 71 in the optical path adjusting device 27 is driven to displace the optical path of the laser beam LB in the B-axis direction, so that the detected values of the respective power sensors 273 are adjusted to be equal. I do.

Next, the rotation holder 261 is rotated by 90 ° and each power sensor 2 is rotated.
Compare 73 detected values. In this case, the optical path adjusting device 27
Drive the A-axis adjustment motor 61 in the laser beam LB
Is displaced in the A-axis direction, the detection values of the power sensors 273 can be made equal.

That is, by rotating the rotary holder 261 by 90 ° and adjusting the optical path of the laser beam LB so that the detection values of the power sensors 273 become equal, the optical path of the laser beam LB can be accurately adjusted.

In order to automatically rotate the rotary holder 261 with respect to the casing 259, a first motor 277 is mounted on the casing 259, and a roller 2 attached to an output shaft of the motor 277 is provided.
79 is pressed against the upper surface of the rotary holder 261. Further, the casing 259 is rotatably provided with a pressing roller 281 for preventing the rotation of the rotary holder 261 from rising. Also, rotating holder 2
A horizontal pin 283 is attached to the rotating holder 261 to rotate the 61 exactly 90 °, and the two parts of the casing 259 come into contact with the pin 283 to restrict the rotation of the rotating holder 261 to 90 °. Stopper pins 285A and 285B are provided.

Therefore, by driving the first motor 277, the rotary holder 261 can be automatically rotated, and when the pin 283 provided on the rotary holder 261 contacts the stopper pins 285A, 285B, the driving of the first motor 277 is performed. By stopping, the rotation holder 261 can be accurately positioned at a position rotated by 90 °.

In order to detect the focal position of the condenser lens 93 provided in the laser processing head unit 25, the beam detection device 257 includes a light shielding member 287 such as a knife edge capable of shielding a part of the laser beam LB. Have been.

More specifically, an eccentric concave portion 289 eccentric about the radius of the laser beam LB is formed on the upper surface of the rotary holder 261, and a holder ring 291 is rotatably fitted in the eccentric concave portion 289. . The holder ring 291 is held by an eccentric recess 289 by a pressing roller 293 attached to the rotary holder 261.
Is held within. A drive roller 297 attached to the output of the second motor 295 mounted on the rotary holder 261 is pressed against the upper surface of the holder ring 291.

Therefore, the holder cylinder 291 is connected to the second motor 295
Is automatically rotated with respect to the rotary holder 261.

Ring-shaped holder 2 mounted on holder cylinder 291
The light shielding member 287 is attached at a position slightly eccentric from the center of 99. This light shielding member 287 is similar to that shown in FIGS.
In the position shown in the figure, the laser beam LB is located in a non-light-shielded state where light is not shielded,
When the laser beam LB is rotated by 180 °, the edge is positioned near the axis of the laser beam LB, as shown in FIG.
It is configured to occupy a light shielding state position for shielding the portion.

In order to restrict the rotation of the holder ring 291 to 180 °, two stopper pins 303 abutting on a pin 301 erected on the holder ring 291 are attached to the rotation holder 261 with a 180 ° phase shift.

In the configuration as described above, when the light shielding member 287 is positioned at a position where it shields a part of the laser beam LB, the detection values of the two power sensors 273 are equal to the second value in the positional relationship between the laser beam LB and the light shielding member 287. 17 (A),
Since it changes as shown in (B), (C) or (D), for example, in the case of FIGS. 17 (A) and (B), light is blocked when the difference between the detection values of the two power sensors 273 becomes zero. In order to detect the relative height position of the member 287, FIG.
In the case of (D), one of the motors 131 and 145 in the laser processing head unit 25 or one of the motors 131 and 145 in order to detect a relative height position when the detection by one power sensor 273 changes to the detection by the other power sensor. By driving both of them to adjust the vertical position of the condenser lens 93, the focal position of the condenser lens 93 can be adjusted to the position of the light blocking member 287, and the focal position can be detected.

As already understood, in the above configuration,
When performing punching on the workpiece W by the punch press 1, the connection state of the first and second interface units 31, 33 in the connection device 29 is maintained in a released state. Then, similarly to a normal turret punch press, the upper and lower turrets are rotated, and the desired upper and lower dies are indexed and positioned in the processing station to perform punching.

The shock vibration during the punching process is absorbed by the vibration isolating support device, so that the laser processing head unit 25 is not adversely affected by the vibration. Further, since the laser oscillator 23 and the optical path adjusting device 27 are separated from the punch press, they are not directly affected by the vibration and are less affected by the vibration.

After performing the punching process as described above, when performing laser processing, the upper and lower turrets are appropriately rotated,
After indexing and positioning the laser processing head unit 25 in the processing station, the first and second interface units 31 and 33 in the connection device 29 are connected. And the first
As illustrated in the figure, the suction port 309 of the flexible duct 307 connected to the suction device 305 mounted on the punching press 1 is
By the action of the fluid pressure cylinder 311, it is connected to a normal scrap discharge hole communicating with the processing station to perform a suction action.

A configuration in which the tool mounting suction port member of the lower turret in the punch press is mounted, and the suction port member is connected and detachable in the same manner as the first and second interface units, and is connected to the suction device. It is also possible to use

[Effects of the Invention] As can be understood from the embodiments described above, according to the present invention, the optical path of the laser beam can be adjusted on the laser oscillator side, so that the adjusting operation is easy and the adjusting section is a punch. It is hardly affected by the vibration of the press.

In addition, the laser processing head unit can be easily bonded to an existing punch press and is supported by the vibration isolating support device, so that it is hard to receive vibration during punching.

Further, according to the present invention, the connection between the laser processing head unit side bonded to the punch press and the laser oscillator side can be easily performed.

Furthermore, it is possible to easily detect the axial center position of the laser beam and the focus position of the condenser lens.

[Brief description of the drawings]

The drawings show an embodiment of the present invention, and FIG. 1 is an explanatory plan view showing the overall configuration of the apparatus. FIG. 2 is an enlarged view corresponding to the view taken along line II-II in FIG. FIG. 3 is a plan view of FIG. FIG. 4 is an enlarged view taken along the line IV-IV in FIG. FIG. 5 is an enlarged detailed view of an arrow V portion in FIG. FIG. 6 is a sectional view taken along the line VI-VI in FIG. FIG. 7 is a sectional view taken along line VII-VII in FIG. FIG. 8 is an explanatory sectional view showing a mounting portion of the condenser lens. FIG. 9 is a cross-sectional view showing a connecting portion. FIG. 10 is a plan sectional view of the same. FIG. 11 is a view taken along the line XI-XI in FIG. FIG. 12 is a sectional view of the laser beam detecting device. FIGS. 13 (A), (B) and (C) are explanatory diagrams of a laser beam oscillator. FIG. 14 is a cross-sectional view of another embodiment of the laser beam detecting device. FIG. 15 is a plan view of the same. FIG. 16 is a sectional view of a modification of FIG. FIGS. 17 (A), (B), (C) and (D) are explanatory diagrams of the detection value of the power sensor based on the positional relationship between the laser beam and the light shielding member.

 ──────────────────────────────────────────────────続 き Continuation of the front page (54) [Title of the Invention] Laser punch press, laser processing head unit used for the punch press, connection device for connecting laser processing head unit and laser oscillator, and beam used for laser beam path adjustment Detection device

Claims (9)

(57) [Claims] A laser processing head unit mounted at an appropriate position in a punch press for punching a sheet material by a die supported by an upper die holder and a lower die supported by a lower die holder. A laser oscillator provided at a position separated from a processing station in a punch press, and an optical path adjusting device for guiding a laser beam from the laser oscillator to the laser processing head unit,
The optical path adjusting device includes: a first bend mirror that reflects a laser beam from a laser oscillator in a vertical A-axis direction;
A second bend mirror that is supported by an A-axis table whose position can be adjusted in the axial direction and reflects the laser beam reflected by the first bend mirror in a horizontal B-axis direction orthogonal to the A-axis; The laser beam reflected from the second bend mirror is supported on a B-axis table which is supported so as to be adjustable in the B-axis direction, and can be swung to adjust the directionality of reflecting the laser beam reflected toward the laser processing head unit. Third
And a bend mirror. 2. A cylindrical outer guide detachable from a tool mounting hole formed in an upper mold holder in a punch press, and a laser beam from a nozzle, a condenser lens and a laser oscillator side. A cylindrical inner guide that supports a bend mirror that reflects vertically downward, and a vibration isolation support device that supports the inner guide up and down in the outer guide in a state in which transmission of vibration from the outer guide is interrupted. The vibration isolating support device includes a first elastic body that supports the inner guide in a floating state with respect to the outer guide, and an air damper that can be freely enlarged and reduced between the outer guide and the inner guide. A laser processing head unit comprising an accumulator for ensuring the pressure of the air damper. 3. A vertical slide is provided in the inner guide so that the vertical position can be adjusted, and the vertical slide is provided with the nozzle and the bend mirror, and a condenser lens is provided with the vertical position adjustable with respect to the nozzle. The laser processing head unit according to claim 2, wherein: 4. A cylindrical outer holder is detachably mounted on a portion where the vertical slide supports the condenser lens, and is screwed to adjust the vertical position, and a cylindrical inner holder is adjustable in axial center in the outer holder. 4. A laser processing head unit according to claim 3, wherein said inner holder is provided with a constant bias and said condenser lens is supported by said inner holder. 5. A connection device for connecting a laser processing head unit mounted at an appropriate position of a punch press and a laser oscillator provided at a position separated from a processing station of the punch press, and provided on the punch press side, The laser processing head unit has a guide port for a laser beam protection tube to be incident on a bend mirror and a gas connector for an assist gas supplied to the laser processing head unit, and an electric device provided in the laser processing head unit. A first interface unit provided with a connected electrical connector, and a guide port, a gas connector, and an electrical connector provided on the laser oscillator side and freely connectable to a guide port, a gas connector, and an electric corktor of the first interface unit, respectively. No. with connector Of it and an interface unit connecting device characterized by comprising close away freely configure at least one relative to the other of the first interface unit or the second interface unit. 6. A connection portion where the first and second interface units face each other is provided with a dust cover for protecting the connection portion so as to be openable and closable, and at least one of the interface units has a dust cover opened and closed. The connection device according to claim 5, further comprising a dust cover opening / closing device. 7. A casing detachable from a lower mold holder in a punch press, a U-V table supported on the casing so as to be position-adjustable in horizontal U and V axis directions,
A beam, comprising: a Z table supported on a V table so as to be vertically adjustable and provided with a small diameter hole; and a power sensor for detecting an output of a laser beam passing through the small diameter hole of the Z table. Detection device. 8. A casing detachable from a lower mold holder in a punch press, a rotary holder rotatably supported by the casing, a beam splitter supported by the rotary holder and splitting a plurality of laser beams, A plurality of power sensors for detecting the output of each split laser beam,
A beam detector, comprising: a comparator for comparing detection values of respective power sensors. 9. A laser beam incident on a beam splitter.
9. The beam detecting device according to claim 8, wherein a light-shielding member capable of shading a portion is freely changeable between a light-shielded state position and a non-light-shielded state position.