JP2897750B2 - Lead contact device for semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of testing the characteristics of a semiconductor device (hereinafter referred to as TCP) in which a semiconductor chip and leads are packaged on a tape, by bringing the leads of the TCP into contact with the contact pins of the test device. The present invention relates to a lead contact device of a semiconductor device for performing electrical conduction.

[0002]

2. Description of the Related Art Conventionally, when performing a TCP characteristic test, it is necessary to contact a contact pin of a test device with a TCP lead. As a lead contact device for making contact with the lead by the contact pin, the position of a TCP lead to be contacted, such as a TCP output signal pin lead, and the position of an output signal contact pin of a test apparatus to be brought into contact with the position are described. A method of contacting an output signal contact pin with a TCP lead while visually confirming the position of the output signal using a microscope has been adopted. FIG. 5 is a perspective view of a conventional lead contact device using this type of microscope, and FIG. 6 is a partially enlarged perspective view of a contact portion. In these figures, the microscope 1 on the base 15 confirms the positions and contact states of the output signal pin leads 11 and the output signal contact pins 5 of the TCP. Input signal contact pin 4
Is a pin for contacting a plurality of input signal pin leads of the TCP 10 all at once, and the output signal contact pin 5 is T
This pin is used to contact the CP output signal pin lead 11 one by one. The TCP stage 3 fixes the TCP using the clamp plate 12 and moves the TCP in the θ direction.
The output signal contact pin stage 7 moves the output signal contact pin 5 in the XYZθ directions. The contact stage 19 moves the input signal contact pin 4 and the TCP stage 3 in the XY directions. The upper illumination 2 illuminates the output signal pin lead 11 and the output signal contact pin 5.

Next, a contact method using this lead contact device will be described. The TCP stage 3 is detachable, and a block of input signal contact pins 4 is set at a predetermined position on the stage before being incorporated into the device, and is brought into contact with the input signal pin lead of the TCP.
Thereafter, the illumination 2 is turned on, and the operator moves the contact stage 19 while looking into the microscope 1, and moves the output signal pin lead 11 to be contacted to the center immediately below the microscope 1. Further, the output signal contact pin stage 11 is moved so that the tip of the output signal contact pin 5 can be seen while looking through the microscope 1.
And the output signal contact pins 5 are roughly aligned. Then, the output signal contact pin stage 7 and the contact stage 19 are moved in the XYθ directions, and the stage 7 is moved in the Z direction to perform high-precision positioning. Contact the pin leads.

[0004]

However, such a conventional contact device has the following problems. The first problem is that when the position of the contact pin and the TCP lead is visually adjusted while looking through the microscope, the adjustment is delicate and difficult, and the adjustment takes time. This is because, when a contact is made with a TCP pin lead having a narrow pitch of, for example, 70 μm or less, a microscope with a high magnification is used, the TCP lead and the contact pin are simultaneously focused and both positions are checked simultaneously. This is because the alignment cannot be performed, and the position adjustment must be performed by making contact many times while checking the respective positions. In addition, since the number of output pin leads is large, for example, 240 pins or more, if positioning is performed for each TCP lead to be contacted, it is necessary to adjust the positioning of the contact pins and the stage by the number of contacts to be contacted. It is.

A second problem is that the TCP leads and the TCP are damaged due to poor contact accuracy. The reason for this is that the position of the contact pin and the TCP lead can only be confirmed at the correct position when they are in contact with each other, so that the positions of the two cannot be recognized before the contact pins are contacted.
Therefore, before the contact, the contact pin becomes T
This is because they interfere with the CP lead and the TCP package and damage them.

SUMMARY OF THE INVENTION An object of the present invention is to make it possible to easily align a TCP lead with a contact pin, to make it possible to contact a TCP lead having a narrow lead pitch, and to damage the TCP lead and the like. The object of the present invention is to provide a lead contact device without the above.

[0007]

According to the present invention, there is provided a lead contact device comprising a TCP mounted on an optically transparent tape.
, A contact pin side stage on which a contact pin to be contacted with the TCP lead is mounted, a lower illumination for illuminating the TCP from below, and an upper illumination for illuminating the contact pin from above An illumination tube, an imaging tube arranged above the TCP and the contact pin to image a region where the contact is made, and a monitor for displaying a captured image obtained by the imaging tube. Here, in the image picked up by the image pickup tube, the lead is obtained as a dark image by the transmitted light of the lower illumination, and the contact pin is obtained as a bright image by the reflected light of the upper illumination.

In the present invention, there is provided a means for performing relative positioning between the lead and the contact pin and performing contact by relatively moving the semiconductor device-side stage and the contact pin-side stage based on a captured image on the monitor. . The alignment and contact execution means includes alignment information of one lead and a contact pin,
The position of the other lead and the contact pin is calculated based on the lead pitch or the number of leads input to the operation panel, and the position of the semiconductor device side stage and the contact pin side stage is controlled based on the calculation result. You. Further, the positioning and contact execution means is configured to reduce the relative distance between the semiconductor device side stage and the contact pin side stage and to make them contact.

[0009]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing the overall configuration of a contact device according to an embodiment of the present invention. In FIG. 1, the microscope 1 is mounted on a base 15 and the microscope 1 is mounted on a TCP stage 3 and observed with the microscope 1. Or an upper illumination 2 for illuminating a TCP and a contact pin in order to perform imaging with an imaging tube 6 described later, and an input signal contact pin 4 and an output signal contacted with an input signal pin lead and an output signal pin lead of the TCP. A contact pin 5, an imaging tube 6 for imaging a visual field observed by the microscope 1, an output signal contact pin stage 7 for positioning the output signal contact pin 5, an operation panel 8, an operation monitor 9, A monitor 10 for displaying image information captured by the imaging tube 6 is illustrated.

FIG. 2 is a block diagram of the contact device shown in FIG. 1, and the same parts as those in FIG. 1 are denoted by the same reference numerals. In this figure, components not shown in FIG. 1 are also shown, and a lower illumination 13 for capturing an image of the output signal pin lead of the TCP mounted on the tape into the image pickup tube 6 by transmitted light is provided. A contact stage 19 for driving the stages 3 and 7, a pulse motor 20 for driving the contact stage 19, a motor control circuit 17 for controlling the pulse motor 20, and image information captured by the image pickup tube 6. A processing circuit 16 for processing
A control circuit 18 for controlling the motor control circuit 17 and the processing circuit 16 is provided.

Next, a contact method using the above-described contact device will be described with reference to FIGS. FIG. 3 is a diagram showing a front configuration of the contact portion, and FIG. 4 is a diagram showing a plan configuration thereof. The TCP placed on the TCP stage 3 is fixed by the clamp plate 12. The clamp plate 12 has a window 1 at a portion corresponding to a contact of a TCP input signal pin lead (not shown) and an output signal pin lead 11.
2a is open. Stage 3 corresponding to this window
A window 3a is also opened at a portion of the window 3a, and a light transmitting member 14 such as glass is embedded in the window 3a. The lower illumination 13 disposed below the light transmitting member 14
When the light is emitted upward from, the light passes through the light transmitting member 14 and is irradiated on the output signal pin lead 11. When an image of the TCP lead 11 is picked up by the image pickup tube 6 disposed above the windows 3a and 12a, light is not transmitted through the output signal pin lead 11, and other TCP tapes are not used. Since light is transmitted through the portion, the difference in transmission of the light is imaged by the imaging tube 6, so that the output signal pin lead 11 can be recognized as a dark-field image.

On the other hand, when illumination is performed by emitting light toward the TCP side by the upper illumination 2 attached to the periphery of the image tube 6 above the TCP, this illumination light is output from the output signal contact pin 5. The position of the output signal contact pin 5 is recognized as a bright-field image by imaging the reflected light with the imaging tube 6. At this time, T
Since the output signal pin lead 11 of the CP 10 is covered with the resin film, the light of the upper illumination 2 is irregularly reflected on the resin surface, and is not recognized as a clear shape.

The image information obtained by the image pickup tube 6 is converted into an image signal by a processing circuit 16 and displayed on a monitor 8.
Therefore, the output signal pin lead 11 displayed on the monitor 8
The TCP stage 3 and the stage 7 of the output signal contact pin 5 are moved in the XYθ direction so that the images of the output signal contact pin 5 overlap with each other so that there is no displacement. As described above, by utilizing the reflected light from the upper illumination 2 and the transmitted light from the lower illumination 13, the TCP
The images of the leads and the contact pins can be taken into the image pickup tube 6 at the same time, and the alignment and contact can be performed easily and with high accuracy only by checking the screen of the monitor 10. After confirming that the TCP stage 3 and the contact pin stage 7 are set at predetermined positions and that the planar positions of the TCP lead and the contact pins match, the TCP lead is moved by moving the output signal contact pin stage 7 in the Z direction. Contact of the contact pin is realized. This prevents the TCP lead and the contact pin from interfering with each other before the alignment and damaging the TCP lead.

At this time, when the positioning of the output signal pin lead 11 to be first contacted is completed, the position information of the TCP stage 3 of the output signal pin lead is stored in the memory in the control group 18. When the output signal contact pin 5 is brought into contact with another output signal pin lead 11, TCP condition input is performed from the operation panel 8. When a lead pitch and the number of pins are input as conditions, the control unit 18 calculates a distance to another output signal pin lead based on the position information of one pin and the TCP condition. Therefore, when the lead number of the output signal pin to be contacted is input from the operation panel 8 and restarted, the control unit 18 calculates the moving distance of the TCP stage 3 based on the lead number and outputs the pulse motor control signal to the motor control circuit 17. Output to The motor control circuit 17 outputs a signal for driving the pulse motor 20, and drives the pulse motor 20. When the pulse motor 20 is driven, T
The CP stage 3 moves in the XY directions by a controlled amount,
The output signal pin lead of the number to be contacted is moved to just below the output signal contact pin 5. After confirming that the movement of the TCP stage 3 has been completed, the lead is brought into contact by moving the output signal contact pin stage 7 in the Z direction. As a result, the positioning of the TCP lead and the contact pin can be automated, and the contact work can be further facilitated.

[0015]

As described above, the present invention is provided with the upper illumination and the lower illumination for illuminating the TCP lead and the contact pin, and the configuration for performing imaging with the imaging tube by these illuminations. Thus, the TCP lead is obtained as a dark image by the transmitted light of the lower illumination, and the contact pin is obtained as a bright image by the reflected light of the upper illumination. Positioning can be performed.
As a result, it is possible to easily and accurately align the TCP lead and the contact pin. Also,
Based on the image information obtained by the image pickup tube, the control unit includes a positioning execution unit that performs an operation based on the number of leads and the lead pitch. After that, another TC
Positioning of the P lead and the contact pin can be automatically performed, and the positioning operation can be simplified.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing an overall configuration of a lead contact device of the present invention.

FIG. 2 is a block diagram of the lead contact device of FIG. 1;

FIG. 3 is a schematic sectional configuration diagram of a contact portion of the lead contact device of FIG. 1;

FIG. 4 is a plan view showing a contact state in the lead contact device of FIG. 1;

FIG. 5 is a perspective view showing the overall configuration of a conventional lead contact device.

6 is a perspective view of a contact portion of the contact device of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Microscope 2 Top illumination 3 TCP stage 4 Input signal contact pin 5 Output signal contact pin 6 Image pickup tube 10 Monitor 11 Output signal pin lead 12 Clamp plate 16 Processing circuit 17 Motor control circuit 18 Control part

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) G01B 11/00 G01R 31/26

Claims (5)

(57) [Claims] 1. A semiconductor device-side stage on which a semiconductor device having a semiconductor package mounted on a light-transmissive tape is mounted, and a contact pin side on which a contact pin contacting a lead of the semiconductor package is mounted. A stage, a lower illumination for illuminating the semiconductor device from below, an upper illumination for illuminating the contact pin from above, and an imaging tube arranged above the semiconductor device and the contact pin and imaging an area where the contact is performed A lead contact device for a semiconductor device, comprising: a monitor that displays a captured image obtained by the imaging tube. 2. The semiconductor device according to claim 1, wherein a lead image is obtained as a dark image by transmitted light of the lower illumination, and a contact pin is obtained as a bright image by reflected light of the upper illumination. Lead contact device. 3. A means for relatively moving the semiconductor device side stage and the contact pin side stage based on an image picked up by the monitor and performing alignment between the lead and the contact pin and contact.
Lead contact device for semiconductor devices. 4. The positioning and contact execution means calculates the position of another lead and a contact pin based on the positioning information of one lead and a contact pin and the lead pitch or the number of leads input to an operation panel. 4. The lead contact device for a semiconductor device according to claim 3, wherein the position of said semiconductor device-side stage and said contact pin-side stage is controlled based on a result of said calculation. 5. The lead contact device of a semiconductor device according to claim 4, wherein said positioning and contact execution means is configured to reduce the relative distance between the semiconductor device side stage and the contact pin side stage to make contact therebetween.