JP2894348B1 - Bonding equipment - Google Patents

Abstract

Kind Code: A1 Abstract: An adhesive device capable of uniformly bonding a film with an adhesive layer to an adherend without generating voids even when the surface of the adherend has undulation. provide. The bonding apparatus includes a lower flat pressure plate having a carved portion formed on a top surface for storing a rigid adherend.
And a pressure block 7 that moves up and down while the pressing film 10 is joined to the lower surface. An outlet 7b from which air is blown out is formed on the lower surface of the pressure block 7. The pressing film 10 is bonded to the film 11 with the adhesive layer placed on the upper surface of the rigid adherend 12, and the air is blown out from the outlet 7 a of the pressure block 7 so that the pressing film 10 causes the film 11 with the adhesive layer to By pressing, the film 11 with the adhesive layer and the rigid adherend 12 are uniformly adhered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for bonding a film with an adhesive layer to a rigid adherend, and more particularly to a void (void) even when the adherend surface of the adherend has undulation. The present invention relates to a bonding apparatus capable of bonding uniformly without generating ()).

[0002]

2. Description of the Related Art Conventionally, in order to uniformly bond a film with an adhesive layer and a rigid adherend over the entire adhesive surface, a pair of upper and lower parallel plates or a rotating roller is used to remove the rigid film from the rigid layer. This was done by pressing against the adherend.

Japanese Patent Application Laid-Open No. Sho 59-198113 discloses that
The film with the adhesive applied to the back side is closely attached to the base plate with the depression pattern, and the surface of the film is pressed with silicon rubber,
There is disclosed a method for attaching a film in which a film is stuck to a base plate by heating the film while making the film adhere to a depression portion of the base plate.

In Japanese Patent Application Laid-Open No. 5-131545, a suction table for mounting a molding base material on a lower chamber is provided.
A rubber-like elastic film is stretched on the lower surface of the opening of the upper chamber opposed to the lower chamber, a decorative sheet is arranged between the molding base material and the rubber-like elastic film, and the upper and lower chambers are joined. A vacuum press laminating method is disclosed in which a decorative sheet is pressed against the surface of a forming substrate by the rubber-like elastic film, and is softened and bonded by generating a pressure difference between the two chambers and heating the rubber-like elastic film. ing.

Further, JP-A-6-136328 discloses that
There is disclosed a vacuum pressure bonding apparatus in which a substrate is housed in a space made negative by a pair of upper and lower diaphragms, and a sign sheet is pressed against and fixed to the substrate by atmospheric pressure.

[0006]

In the conventional bonding method, there is a limit in mechanical precision in the parallelism of the pressing surface, and there is undulation in the bonding surface of the adherend, so that voids, ie, voids, are generated in the bonding surface. There was a case. Therefore, the film with the adhesive layer could not be uniformly bonded to the rigid adherend.

The present invention provides a bonding apparatus capable of uniformly bonding a film with an adhesive layer to an adherend without generating voids (voids) even when the adherend surface of the adherend has undulation. The purpose is to provide.

[0008]

The bonding apparatus according to the present invention is a bonding apparatus for bonding a film with an adhesive layer to an adherend, comprising: a pressing member having an air outlet; A pressing film in contact with the pressing member in a state in which the air outlet is closed, air supply means for supplying air to an air outlet of the pressing member, and the film with the adhesive layer through the pressing film to the adherend side. Pressurizing member moving means for moving the pressurizing member in order to press the pressing member.

The air outlet is preferably formed wider than the bonding surface between the film with the adhesive layer and the adherend.

It is preferable to have a pressing film moving means for moving the pressing film.

[0011] The pressing film moving means may include a supply roller for supplying the pressing film, and a winding roller for winding the pressing film.

[0012] An installation member may be provided in which a concave portion for receiving the adherend and a convex portion for mounting the film with the adhesive layer are formed.

The pressing film is made of, for example, polyimide,
It is made of a material such as vinyl chloride or SUS which has mechanical strength to withstand the air pressure from the air outlet and deforms in accordance with the undulation of the adhered surface of the adherend.

According to the present invention, the pressing member is moved by the pressing member moving means, and the pressing film is pressed against the film with the adhesive layer placed on the adherend. Then, the air supplied by the air supply means blows out from the outlet of the pressurizing member. Thereby, since the air and the pressing film act like a cushion, even if there is undulation on the bonding surface of the adherend, no void is generated on the bonding surface, that is, without generating a void, the film with the bonding layer is formed. It can be uniformly adhered to the adherend.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A bonding apparatus according to the present invention will be described below with reference to FIGS. The bonding device of the present invention,
A base 1 installed on the floor and an upper flat pressing unit 2 arranged above the base 1 and moved up and down by an elevating mechanism 4 are arranged to face each other. Rigid adherend 12 on base 1
The lower flat pressure platen 3 which is an installation member for mounting the pressure plate is installed, and a pressure block 7 which is a pressing member facing the lower flat pressure plate 3 is attached to the upper flat pressure portion 2.

As shown in FIG. 2A, a concave engraved portion 3a is provided on the upper surface of the lower flat pressure plate 3 so that a rigid adherend 12 for adhering the film 11 with an adhesive layer can be inserted therein.
Is formed, and a film 1 with an adhesive layer is
1 is placed.

As shown in FIG. 2B, the film 11 with an adhesive layer has a two-layer structure in which an adhesive layer 11b is laminated on a film base 11a.
Adhere to 2.

On the other hand, as shown in FIG. 1, the lower surface of the pressure block 7 has a film base 1 of a film 11 with an adhesive layer.
The pressing film 10 to be bonded to 1a is bonded. The pressing film 10 is unwound from the supply roller 5 attached to the upper flat pressing unit 2 on the side of the pressing block 7, and is taken up by a winding roller 6 similarly mounted to the upper flat pressing unit 2. The pressing film 10 is intermittently fed for each process while being joined to the lower surface of the pressing block 7 by, for example, rotating the winding roller 6. The pressing film 10 is made of, for example, polyimide, vinyl chloride, SU
It is preferable to use a material, such as S, which has a mechanical strength to withstand the air pressure at the time of pressing and has a property of deforming in accordance with the undulation of the bonding surface of the rigid adherend 12.

As shown in FIG. 2, the lower surface of the pressure block 7 is connected to an air supply path 7a through which air is supplied and communicates with the air supply path 7a. And an outlet 7b for blowing out the blown air. The opening surface of the outlet 7b is larger than the plane of the rigid adherend 12, so that the film 11 with the adhesive layer is pressed over the entire surface of the rigid adherend 12.

A pipe 14 for sucking factory air is connected to the air supply path 7a. As shown in FIG. 1, an air booster 13 for increasing the pressure of air is connected near the suction port of the pipe 14. Since normal factory air has a pressure of about 5 kgf / cm ² , the air blown from the outlet 7 b of the pressure block 7 is increased in pressure by the air booster 13 to, for example, 10 kgf / cm ² . The pipe 14 is further connected with a pneumatic regulator 8 for controlling air pressure and a solenoid valve 9 for blowing air out of the outlet 7b and for stopping the air.

The bonding apparatus according to the present invention is configured as described above. Next, a method for bonding the film with adhesive layer 11 to the rigid adherend 12 will be described.

First, as shown in FIG. 3, a rigid adherend 12 is put into the engraved portion 3a of the lower flat pressure plate 3 and stored. At this time, the solenoid valve 9 is closed, and no air is blown from the outlet 7b of the pressurizing block 7.

Next, as shown in FIG. 4, the adhesive layer 11b of the film 11 with an adhesive layer is placed on the rigid adherend 12 and the upper surface of the lower flat platen 3.

Next, as shown in FIG. 5, the upper flat pressing unit 2 is moved downward by the lifting mechanism 4, and the pressing film 10 bonded to the lower surface of the pressing block 7 is Press against the film base 11a.
The pressure block 7 presses the lower flat pressure plate 3 with a load stronger than the adhesive load.

Next, the solenoid valve 9 is opened, and factory air, which is made high in pressure by the air booster 13 and pressure-controlled by the pneumatic regulator 8, is blown out from the outlet 7 b of the pressurizing block 7 as shown in FIG. 6. With this air,
The pressing film 10 presses the film 11 with the adhesive layer toward the rigid adherend 12. At this time, even if the adhesive surface of the rigid adherend 12 has undulation,
Acts like a cushion, so that the film 11 with an adhesive layer and the rigid adherend 12 are uniformly bonded to each other without causing voids on the bonding surface.

When the bonding is completed, the electromagnetic valve 9 is closed, the air pressure in the outlet 7b of the pressure block 7 is reduced to the atmospheric pressure, and then the upper flat pressure unit 2 is moved upward by the lifting mechanism 4. Since the air pressure in the outlet 7b of the pressure block 7 is reduced to the atmospheric pressure, the pressure film 10 bonded to the lower surface of the pressure block 7 is not blown down. Then, the pressing film 10 used for bonding is wound up by the winding roller 6 for each bonding operation, and the next new pressing film 10 is supplied from the supply roller 5.

During this time, a new rigid adherend 12 is accommodated in the engraved portion 3a of the lower flat platen 3, and a new film 11 with an adhesive layer is bonded as described above. At this time, the unused portion of the press film 10 is joined to the new film 11 with the adhesive layer, so that the surface of the film 11 with the adhesive layer can always maintain a clean press surface.

The present invention is used, for example, in the following applications. (1) A commercially available industrial adhesive tape is adhered to a SUS plate such as a lead frame. (2) A TAB tape coated with an adhesive is bonded to the silicon wafer.

The present invention is not limited to the embodiments, and various changes can be made within the scope of the technical matters described in the claims.

[0030]

According to the present invention, the pressure applied by the pressing film is applied to the film with the adhesive layer adhered to the adherend by the air blown out from the outlet of the pressing member. Even if the film acts like a cushion and the adhesive surface of the adherend has undulation, the film with the adhesive layer and the rigid adherend are uniformly adhered to each other without voids on the adhesive surface. Therefore, by using the bonding apparatus of the present invention, the yield of products can be improved.

[Brief description of the drawings]

FIG. 1 is an overall front view of a bonding apparatus according to the present invention.

FIG. 2A is an enlarged front cross-sectional view of a main part of the bonding apparatus according to the present invention, and FIG. 2B is an enlarged front cross-sectional view of a film with an adhesive layer.

FIG. 3 is a front sectional view showing an initial step of bonding a film with an adhesive layer to a rigid adherend by the bonding apparatus according to the present invention.

FIG. 4 is a front cross-sectional view showing a step in the process of bonding a film with an adhesive layer to a rigid adherend using the bonding apparatus according to the present invention.

FIG. 5 is a front sectional view showing a step in the process of bonding the film with the adhesive layer to the rigid adherend by the bonding apparatus according to the present invention.

FIG. 6 is a front sectional view showing a final step of bonding a film with an adhesive layer to a rigid adherend by the bonding apparatus according to the present invention.

[Explanation of symbols]

 1: Base 2: Upper flat pressing unit 3: Lower flat pressing plate (installation member) 3a: Engraving unit (recess) 4: Elevating mechanism 5: Supply roller 6: Winding roller 7: Press block (Pressing member) 7b: outlet 8: pneumatic regulator 9: solenoid valve 10: pressing film 11: film with adhesive layer 12: adherend 13: air booster

Claims (7)

(57) [Claims] 1. A bonding apparatus for bonding a film with an adhesive layer to an adherend, comprising: a pressing member having an air outlet; and a pressing member having the air outlet of the pressing member closed. A pressing film to contact, an air supply means for supplying air to an air outlet of the pressing member, and the pressing member to press the film with the adhesive layer toward the adherend through the pressing film. And a pressure member moving means for moving. 2. The bonding apparatus according to claim 1, wherein the air outlet is formed wider than a bonding surface between the film with the adhesive layer and the adherend. 3. The bonding apparatus according to claim 1, further comprising a pressing film moving means for moving the pressing film. 4. The pressing film moving means has a supply roller for supplying the pressing film and a winding roller for winding the pressing film.
3. The bonding device according to claim 1. 5. The apparatus according to claim 1, further comprising an installation member formed with a concave portion for receiving the adherend and a convex portion for mounting the film with an adhesive layer. 3. The bonding device according to claim 1. 6. The press film is made of a material having a mechanical strength to withstand air pressure from an air outlet and deforming in accordance with undulation of an adhered surface of an adherend. The bonding device according to any one of claims 1 to 5, wherein 7. The bonding apparatus according to claim 6, wherein the pressing film is made of a material selected from the group consisting of polyimide, vinyl chloride, and SUS.