JP2890074B2 - Heat exchange equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat exchanger, and more particularly, to a chemical-resistant sealing structure of a heat exchanger.

[0002]

2. Description of the Related Art When a highly corrosive chemical solution is used for general industry, the reaction rate greatly changes depending on the temperature of the solution, and therefore, it is necessary to always pay close attention to the control of the solution temperature.

[0003] In order to control the liquid temperature, various temperature control devices such as a thermostat have been developed.

As shown in FIG. 4, such a temperature control device usually circulates a processing liquid from a reaction tank 101 filled with the processing liquid by a pump 103 through a pipe 102, and heats the heat in a heat exchange section 104. The processing liquid is subjected to replacement, and the processing liquid subjected to temperature control and impurity removal through the filter 105 is returned to the reaction tank 101.

[0005] As shown in FIG. 5, a conventional heat exchanging portion is composed of heat exchanging plates 201 and 202 made of alumina which is not contaminated with a chemical solution by impurities. The heat exchange chamber 204 is formed by being opposed to each other with the wall 203 interposed therebetween, and in this heat exchange section, temperature control is performed on a liquid, for example, a semiconductor processing chemical liquid drawn out of the processing container by a pipe or the like. Things have been suggested.

In this apparatus, the surfaces of the heat exchange plates 201 and 202 are coated with a fluororesin in order to prevent a reaction with a semiconductor processing chemical solution, and the thermo modules 205 and 2 are used.
06, each is configured to be cooled or heated. The heat radiation sides of the thermo modules 205 and 206 are respectively radiated by the heat radiation blocks 209 and 209 cooled by the cooling water introduced through the cooling pipes 207 and 208, respectively.
210.

[0007] When the semiconductor processing chemical is introduced into the heat exchange chamber via the first pipe 211, it is cooled in the heat exchange chamber 4 and then returned to the processing vessel via the second pipe 212.

In this apparatus, the surfaces between the heat exchange plates 201 and 202 made of alumina and the side wall 203 are hermetically sealed by an O-ring made of fluorine-based rubber. When the chemical solution is used, there is a problem that deterioration occurs due to the chemical solution, liquid leakage occurs at a seal portion or the like, and impurities such as metal ions, which are considered to be eluted from the fluororubber when the chemical solution is used, elute.

In order to enhance the chemical resistance, an O-ring made of a fluorine-based rubber covered with a cover member such as a fluorine-based resin has been proposed. When the surface of the part wall is rough, there is a problem that airtightness is poor and liquid leakage easily occurs.

The present invention has been made in view of the above circumstances, and has as its object to provide a long-life and highly reliable hermetic seal structure.

[0011]

According to the present invention, there is provided a groove formed by a chemical-resistant member between two heat exchange plates which are disposed opposite to each other and have at least a surface formed of a chemical-resistant substance. In a heat exchange device in which a heat exchange chamber is hermetically sealed via a seal ring disposed so as to fit into the groove, a side wall having
Using the O-ring covered with a cover ring having a plurality of linear projections formed along the ring outer wall, the cover ring is installed so that the opening is on the opposite side of the chemical solution, The deformation of the cover ring causes the protrusion to be pressed against the inner wall of the groove.

Preferably, the cover ring is made of a fluorine resin.

[0013]

According to the first configuration, the O-ring composed of the elastic member is covered with the cover ring having a plurality of linear projections continuously formed at opposing portions along the ring outer wall. Therefore, in addition to the elasticity of the O-ring, the cover ring is deformed by the liquid pressure, and the protrusion is elastically fitted to the sealed member. Therefore, even if the surface of the sealed member is rough, A good airtight seal structure can be obtained.

Further, the O-ring is not directly in contact with the chemical, but is well protected by the cover ring, and the chemical resistance is extremely high.

When the cover ring is made of a fluorine-based resin, it is possible to obtain a highly sealed structure having high chemical resistance.

[0016]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a diagram showing a heat exchange device according to an embodiment of the present invention, and FIG. 2 is a diagram showing a seal ring used in the heat exchange device.

As shown in FIG. 2, the seal ring 10 is formed continuously with an O-ring 11 made of a fluorine-based rubber and around the O-ring 11 at opposing portions along the ring outer wall. It is characterized in that it is covered with a cover ring 13 made of a fluororesin having a plurality of linear projections 12 and having a U-shaped cross section.

As shown in FIG. 1, the heat exchange device which is hermetically sealed by using the seal ring is provided with heat exchange plates 1 and 2 made of aluminum plates, and is disposed inside these plates and has a fluorine-based surface. SiC plate 5 covered with resin films 3 and 4
6 is hermetically sealed to a side wall 7 made of a chemical-resistant resin such as a fluorine-based resin via the seal ring 10 to form a heat exchange chamber R. The temperature control is performed on the semiconductor processing chemical solution derived by P or the like.

A groove U is formed in the side wall 7. The heat exchange plates 1 and 2 are formed so as to be in contact with the semiconductor processing chemical via SiC plates 5 and 6 whose surfaces are coated with fluororesin films 3 and 4 in order to prevent the reaction with the semiconductor processing chemical and prevent the projections 12 The semiconductor processing liquid is cooled or heated by the thermo modules 8 and 9, respectively. Each of the heat radiating sides of the thermo modules 8, 9 is brought into contact with a heat radiating block (not shown) cooled by cooling water introduced through a cooling pipe.

When the semiconductor processing chemical is introduced into the heat exchange chamber R through the first pipe P ¹ , the liquid is cooled in the heat exchange chamber R and then returned to the processing vessel through the second pipe P _2. It is.

The heat exchange chamber R is sealed by a seal ring 10, and the projections 12 are elastically fitted into the SiC plates 5 and 6, which are members to be sealed, and the grooves U formed in the side walls. Therefore, the hermetic seal can be performed very efficiently and satisfactorily. Further, since the fitting is performed by the projections 12, even when the inner wall of the groove U is rough, airtightness can be improved.

Further, the O-ring 11 is well protected by the cover ring 13 without directly contacting the chemical. Further, since the cover ring 13 is made of a fluorine resin, the cover ring 13 has high chemical resistance and elasticity, so that a better sealing structure can be obtained.

The thermo modules 8 and 9 are respectively mounted so that one electrode is in contact with the surfaces of the heat exchange plates 1 and 2.

In this thermo module, an electrode pattern is formed on the surface of a plate made of carbon having good thermal conductivity, and a P-type thermoelectric element and an N-type thermoelectric element are formed on the electrode pattern via a solder layer. Are fixed alternately, and furthermore, these P
Similarly, the other electrodes of the type thermoelectric element and the N type thermoelectric element are connected to an upper electrode pattern formed on the surface of a heat exchange substrate made of carbon having good thermal conductivity.

By applying a current to this electrode pattern, for example, the heat exchange plate side becomes a low temperature part and the plate-like body becomes a high temperature part.

The shape of the heat exchanging section is not limited to the above-mentioned embodiment, but can be appropriately modified.

In the above embodiment, the O
Although a cover ring was used to cover the ring, as shown in FIG. 3, a U-shaped seal ring 20 made of a fluororesin was used.
May be configured. Also in this case, a plurality of linear projections 22 are continuously arranged on the outer wall of the seal ring 20 at opposing portions along the ring outer wall.

[0029]

As described above, according to the structure of the present invention, a plurality of O-rings formed of elastic members are continuously formed at opposing portions along the ring outer wall. Since the projections are covered with a cover ring having projections and deformed by hydraulic pressure to press the projections against the grooves, a good hermetic sealing structure can be obtained even if the surface of the member to be sealed is rough. .

[Brief description of the drawings]

FIG. 1 is a diagram showing a heat exchange device according to an embodiment of the present invention.

FIG. 2 is a view showing a seal ring used in the heat exchanger.

FIG. 3 is a view showing a seal ring according to another embodiment of the present invention;

FIG. 4 is a diagram showing a conventional temperature control device.

FIG. 5 is a diagram showing a conventional heat exchange device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 101 Reaction tank 102 Piping 103 Pump 104 Heat exchange part 105 Filter 201, 202 Heat exchange plate 203 Side wall 204 Heat exchange chamber 205, 206 Thermo module 207, 208 Cooling pipe 209, 210 Heat dissipation block 211 First piping 212 First 2 piping 1, 2 heat exchange plate 3, 4 fluorine resin film 5, 6 SiC plate 7 side wall 8, 9 thermo module 10 seal ring 11 O ring 12 protrusion 13 cover ring 20 seal ring 22 protrusion

Claims (1)

(57) [Claims] 1. A first and a second heat exchange plate, which are disposed to face each other and at least a surface of which is made of a chemical-resistant substance, and a groove which is provided inside these and is made of a chemical-resistant member. The first and second heat exchange plates are hermetically sealed to the side wall via a side wall having: and a seal ring arranged to fit in the groove. , The side wall and the first and second
A heat exchange device that forms a heat exchange chamber formed by a heat exchange plate and an O-ring in which the seal ring is formed of an elastic member; A cover ring formed of a chemical-resistant material having a U-shaped cross section and having a plurality of linear projections along the outer wall, wherein the cover ring has an opening in the opposite side of the chemical solution in the groove. Wherein the protrusion is pressed against the inner wall of the groove by deformation of the cover ring due to the pressure of the chemical solution.