JP2887959B2 - Electronic component mounting device for electromagnetic relay - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for mounting electronic components such as an operation display device and a surge absorbing device on an electromagnetic relay.

[0002]

2. Description of the Related Art Electronic components attached as accessories to an electromagnetic relay include an operation display device for displaying an operation state by an LED or the like, and a surge absorbing device for absorbing a surge voltage generated when a self-coil is demagnetized. As the surge absorbing device, a diode is used for a DC circuit, and a CR circuit including a capacitor and a resistor is used for an AC circuit.

[0003] Such an electronic component mounting device comprises a lead frame on which the electronic component is mounted, and a synthetic resin holder molded integrally with the lead frame, and a yoke is formed in a through hole provided in the holder. The locking piece of the return spring cut and raised in the above is press-fitted and fixed to the electromagnetic relay main body. An electromagnetic relay with an operation display device is disclosed in Japanese Patent Application Laid-Open No. 62-123624. The attached electromagnetic relay is described in Japanese Utility Model Laid-Open No. 2-61040.

[0004]

However, in the electronic component mounting device according to each of the above publications, the circuit components are arranged only on one side of the armature return spring, and only one of the operation display device and the surge absorbing device can be mounted. . In order to put the CR circuit and the operation display device in one holder, the lead frame constituting the connection circuit of the parts must be wired avoiding the return spring in the center.
This is because the shape is complicated and processing becomes difficult. In particular, a capacitor and a resistor of the CR circuit to be attached to the AC200V class excitation coil need to have a large rated voltage or large power consumption, and accordingly, the outer diameter is increased and the arrangement of parts is limited. Therefore, a first object of the present invention is to provide an electronic component mounting device for an electromagnetic relay in which both the operation display device and the surge absorbing device can be mounted simultaneously by devising the shape of the lead frame.

On the other hand, in order to mount an electronic component on a lead frame, conventionally, as shown in FIG. 7, an electronic component (capacitor in the case of FIG. 7) 14 is directly mounted on the lead frame 5 and its electrode portion 5c is connected to the lead frame. The electrode 14 a of the electronic component 14 is connected with the solder 20. As another example, as shown in FIG. 8, the electronic component 14 is inserted between the electrode portions 5c of the lead frame 5, and the electrode 14a of the electronic component 14 and the electrode portion 5c of the lead frame 5 are soldered. Connected. Note that a recess 21 is formed in the holder 6 integrally formed with the lead frame 5, and the electronic component 14 inserted between the electrode portions 5 c, 5 c is accommodated in the recess 21.

However, the method of mounting and soldering an electronic component on a lead frame has a problem that if the external dimensions of the electronic component are large, the electronic component that protrudes from the holder cannot be accommodated in the cover of the electromagnetic relay. In addition, since the method of inserting an electronic component between the electrode portions of the lead frame and soldering involves soldering the press-cut surface of the electrode portion and the electrode of the electronic component, the electronic component is placed on the lead frame and soldered. The wettability of the solder is smaller than in the case of attaching, and the connection strength may be insufficient. Accordingly, a second object of the present invention is to provide an electronic component mounting device for an electromagnetic relay that can solder an electronic component to a lead frame with sufficient strength without protruding from a holder.

[0007]

In order to achieve the first object, the present invention provides an operation display device in which a lead frame is formed in an arch shape, straddles both sides of a return spring, and sandwiches the return spring. And components necessary for the surge absorbing device. Also, in order to achieve the second object,
According to the present invention, an opposing electrode portion of a lead frame to which an electronic component is attached is bent into an L shape, an electronic component is inserted between these electrode portions, and the electrode and the electrode portion are soldered.

[0008]

[Function] By forming a lead frame in an arch shape and passing between the armature return spring and the ceiling of the electromagnetic relay cover, the lead frame is straddled on both sides of the return spring without making the lead frame complicated, and the operation is displayed. The components of the device and the surge absorber can be mounted simultaneously. That is, the capacitor and the resistor of the CR surge absorbing device are arranged with the center return spring interposed therebetween, and the lead frame of the part connecting the capacitor and the resistor is pressed into an arch shape to form the space between the return spring and the electromagnetic relay cover. Pass through. The arch portion is insert-molded integrally with the synthetic resin holder for insulation from the return spring. On the other hand, the lead frame connected to the circuit component of the operation display device passes behind the return spring retaining piece of the yoke. Also, by bending the electrode portion of the lead frame into an L-shape, the wet area of the solder when the electronic component is inserted between the electrode portions and soldered is increased, and the soldering strength is increased.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. Here, FIG. 1 is a plan view of an electromagnetic relay in which electronic components are mounted on a yoke, FIG. 2 is a rear view of the electronic component mounting device in FIG. 1, and FIG. FIG. 4 is an exploded perspective view of the yoke and the electronic component mounting device of FIG. 1, FIG. 5 is a cross-sectional view of a main part along line VV of FIG. 1, and FIG. It is a longitudinal cross-sectional view which shows the mounting state of a capacitor. In these figures, 1 is a U-shaped yoke, 2 is an armature hinged thereto, 3 is a return spring mounted between the locking piece 1a cut and raised by the yoke 1 and the armature 2. It is. The electronic component mounting device 4 includes a lead frame 5 having a pattern shown by a broken line in FIG. 1 and a synthetic resin holder 6 integrally formed with the lead frame 5, and a locking piece 1a is inserted into a through hole 7 provided in the holder 6. Is press-fitted and fixed to the yoke 1.

A lead frame 5 includes a parallel circuit of an LED 9, a resistor 10, and a protection diode 11 constituting an operation display device 8, a limiting resistor 12 connected in series with the LED 9, a resistor 10, and a capacitor 14 and a resistor 15 constituting a surge absorbing device 13. The operation display device 8 and the surge absorbing device 13
Are connected in parallel to the exciting coil 16 via the legs 5a and 5b of the lead frame 5.

[0011] Of the above electronic components, LED 9, resistor 10,
The protection diode 11 and the resistor 15 are arranged on one side of the return spring 3 at the center of the yoke, and the limiting resistor 12 and the capacitor 14 are arranged on the other side. The lead frame connecting portion 17 for connecting the capacitor 14 and the resistor 15 of the surge absorbing device 13 is formed in an arch shape, passes between the return spring 3 and the ceiling of the electromagnetic relay cover 18 (FIG. 5), and displays the operation. A lead frame connecting portion 19 connecting the LED 9 and the like of the device 8 to the limiting resistor 12 passes behind the locking piece 1a. The lead frame connecting portions 17 and 19 are covered by the holder 6, and are insulated from the return spring 3 and the locking piece 1a, respectively.

As shown in the figure, a capacitor 14 and a resistor 15 of a CR surge absorbing device 13 are arranged on the left and right sides of a return spring 3 and a lead frame connecting portion 17 for connecting them.
Is pressed into an arch shape so as to pass between the return spring 3 and the ceiling of the cover 18, so that the lead frame connecting portion 17 is largely detoured to the rear of the locking piece 1a in order to avoid the return spring 3. This is unnecessary, and instead, the lead frame connecting portion 19 of the operation display device 8 can be passed behind the locking piece 1a, so that the shape of the lead frame 5 is simplified, and the operation display device 8 and the surge absorbing device 13
Can be simultaneously mounted on the lead frame 5.

Here, a relatively small LED 9 and a resistor 10 are used.
Are mounted on the lead frame 5 and mounted thereon. A capacitor 14 larger than these is inserted between the electrode portions so as not to protrude from the holder 6 and mounted on the lead frame 5. That is, in FIG. 6, the capacitor 14 is connected to the electrode 5 of the lead frame 5.
c, 5c, and are accommodated in the recess 21 of the holder 6, but the electrode portion 5c of the lead frame 5 is bent in an L-shape along the electrode 14a of the capacitor 14, and the electrode portion 5c The electrodes 14a are connected by solder 20. As is clear from the figure, the lead frame 5
The wetted area between the electrode 5c of the capacitor 14 and the electrode 14a of the capacitor 14 and the solder 20 is larger than the conventional example of FIG. 8 due to the presence of the L-bent portion of the electrode 5c, and the soldering strength is increased.

[0014]

According to the present invention, since the lead frame is formed in an arch shape and straddles both sides of the return spring, the operation display device and the surge absorbing device can be formed without complicating the shape of the lead frame. Simultaneous mounting can be realized. Further, by bending the electrode portion of the lead frame into an L-shape, a sufficient solder wetting area can be secured even when an electronic component is inserted between the electrode portions and soldered, and a decrease in soldering strength is avoided. be able to.

[Brief description of the drawings]

FIG. 1 is a plan view of an electromagnetic relay showing an embodiment of the present invention.

FIG. 2 is a rear view of the electronic component mounting device in FIG. 1;

FIG. 3 is a connection diagram showing a connection between an excitation coil and an operation display device and a surge absorbing device in FIG. 1;

FIG. 4 is an exploded perspective view of the yoke and electronic component mounting device of FIG. 1;

FIG. 5 is a cross-sectional view of a main part along line VV in FIG. 1;

FIG. 6 is a longitudinal sectional view showing a mounting state of the capacitor in FIG. 1;

FIG. 7 is a longitudinal sectional view showing a conventional general mounting state of an electronic component.

FIG. 8 is a longitudinal sectional view showing another conventional mounting state of an electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Yoke 1a Locking piece 3 Return spring 4 Electronic component mounting device 5 Lead frame 5c Electrode part 6 Holder 7 Through hole 8 Operation display device 13 Surge absorbing device

Claims (2)

(57) [Claims] An armature return spring formed of a lead frame on which an electronic component is mounted, and a synthetic resin holder molded integrally with the lead frame, the armature return spring being cut and raised by a yoke in a through hole provided in the holder. in the electronic component mounting apparatus of the electromagnetic relay locking piece is fixed to the electromagnetic relay body is pressed in, characterized in that the lead frame has been formed in an arch shape so reluctant extend over both sides of the armature return spring Electronic part mounting device for electromagnetic relay. 2. A folding the opposed electrode portion of the lead frame in which the electronic component is mounted on each L-shape, the soldered and the electrode portions and the electrode by inserting the electronic component between these electrode portions 2. The method according to claim 1, wherein
The electronic component mounting device of the electromagnetic relay described above.