JP2868912B2 - Metal sheet soldering equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering apparatus suitable for joining thin metal plates such as copper tapes in an overlapped state.

[0002]

2. Description of the Related Art For example, as a shielding material for a power cable or the like,
A tape-shaped copper thin plate having a width of 15 mm to 40 mm and a thickness of about 0.1 mm is often used. When such metal sheets are overlapped and joined together, TIG welding and seam welding are difficult because of their thin thickness, and joining is performed by manual soldering.

[0003]

However, in the manual soldering as described above, the soldering strength varies depending on the skill of the operator, so that the bonding strength tends to be unstable. Also, as shown in FIG. 10 and FIG.
In addition, since the protrusions 82 due to excess solder are generated, the work requires skill.

[0004] For this reason, the work efficiency has been lowered in addition to the quality of the joint. In the figure, reference numerals 6 and 8 indicate thin metal plates, and reference numeral 84 indicates solder.

Accordingly, the present invention provides a soldering apparatus for a thin metal plate, which can uniformly perform soldering of joints without variation, and can assure quality of joints with stable strength and improve workability. The purpose is to provide.

[0006]

DISCLOSURE OF THE INVENTION The present invention has been made to achieve the above-mentioned object, and is characterized by a setting mechanism for superposing and positioning a joining portion of metal sheets and a joining mechanism of each of the above-mentioned metal sheets. A solder dispenser that supplies solder, a pressing mechanism that presses the bonding portion with a large pressing surface, and a heating unit that heats the bonding portion and melts the solder in accordance with the pressing operation of the pressing mechanism, And a cooling means for solidifying the solder in response to the pressing operation.

Further, according to the present invention, there is provided a pressing mechanism made of ceramic for a pressing surface in contact with the overlapping joint of the thin metal plates, and the pressing surface is provided with hot air for melting the solder of the joining portion. And a hot air discharge hole for discharging cold air for solidifying the solder can be formed.

[0008]

According to the present invention, the metal sheets to be joined by the setting mechanism are positioned at a predetermined position with their joining portions overlapped. A fixed amount of solder is supplied to the joint portion of the thin metal plate by a solder dispenser through an arbitrary setting process.

Then, the joint is pressed by the pressurizing surface of the pressurizing mechanism, and the solder of the joint is melted by the heating means so that the joint is brought into close contact. Excess solder extruded from the joint due to the pressure is prevented from rising by the pressurized surface having a larger area than the joint, and is kept substantially flush with the outer surface of the joint.

Further, the solidification of the solder is rapidly performed by the cooling means, and the excess solder is prevented from flowing out.

Further, according to the present invention, the bonding portion is pressed by the pressing surface formed of ceramic, and the solder is melted by hot air blown out from the hot air discharge hole, whereby the bonding portion is brought into close contact.

Next, the solidification of the solder is rapidly performed by the cool air blown out from the cool air discharge holes, and the excess solder is prevented from flowing out. The ceramic prevents the excessive solder from adhering to the pressurized surface and also prevents the temperature from rising due to hot air.

[0013]

1 to 9 show an embodiment of the present invention.
The soldering apparatus 2 is provided with a pressing mechanism 4 standing on the base 3. On both sides of the pressing mechanism 4, thin metal plates 6, 8 such as a copper tape are overlapped with respective joints. A pair of setting mechanisms 10, 10 positioned together are provided.

The pressurizing mechanism 4 is provided with a solder dispenser 14 for applying an appropriate amount of paste solder to a joint portion of one of the thin metal plates 8, and an air heater 16 as a heating means for melting the solder. And an air cooler 18 as cooling means for rapidly solidifying the solder.

The pressurizing mechanism 4 is roughly composed of a frame 20, a movable pressurizing portion 22 mounted on an upper portion of the frame 20, and a fixed pressurizing portion 24 mounted on a lower portion of the frame 20. Movable pressure unit 22 and fixed pressure unit 2
Pressing plates 26 and 28 made of ceramic are provided on the opposing surfaces of the respective members 4.

The movable pressurizing section 22 is subjected to primary pressurization by driving members 30, 30 such as air cylinders fixed to the frame 20, and the head 22a inserted into the shaft hole 20a at the upper end of the frame 20 is moved. The secondary pressurization as strong pressurization is performed by the drive member 32 via the drive member 32. Reference numeral 32a indicates a driving rod of the driving member 32. In addition, the movable pressurizing section 2
In 2, air heaters 16, 16 are arranged side by side in the width direction of the thin metal plates 6, 8, and respective blower tubes 34, 34 are connected to pressure plates 26, 28.

In the fixed pressurizing section 24, air heaters 16, 16 are arranged in the width direction of the thin metal plates 6, 8 like the movable pressurizing section 22, and the blower tubes 34, 34 are connected to the pressurizing plate 28. Have been. Further, air coolers 18, 18 which are fixed to the frame 20 in parallel with the longitudinal direction of the thin metal plates 6, 8 are provided.
Are connected to the pressure plate 28.

The setting mechanisms 10, 10 are respectively
Pedestals 38, 38 fixed to the base 3, pedestals 38, 3
The clamp members 40 and 40 attached to the upper surface of the metal sheet 8 and gripping the metal sheets 6 and 8, the stopper members 42 and 42 for positioning the tips of the metal sheets 6 and 8 and releasing them at the time of setting, and the clamp members 40 and 40. Metal sheet 6,
And a feed member 44, such as an air cylinder, for positioning the joining position of the metal sheets 6, 8 by moving it in the longitudinal direction. As the clamp members 40, 40, for example, those having a toggle structure can be adopted.

The stopper member 42 is, for example, a soldering device 2
A driving member 46 such as an air cylinder attached so as to advance and retreat in the vertical direction of the
And a step block 48 fixed to the tip of the head. The ends of the thin metal plates 6 and 8 are brought into contact with the steps of the step block 48 and positioned, and then clamped. By lowering the step block 48, the metal sheets 6, 8
Are released, and the metal sheets 6, 8 are positioned by overlapping the joints by the feed of the feed member 44 by a predetermined amount.

The solder dispenser 14 includes, for example, a slide member 50 movably attached to the frame 20 of the pressing mechanism 4 in the width direction of the thin metal plates 6 and 8,
A driving member 52 such as an air cylinder which is fixed to 0 and moves up and down in the vertical direction of the soldering apparatus 2 and a solder injector 54 connected to the driving member 52 can be schematically constituted. Reference numerals 56, 58, and 60 indicate a slide rail, a slide body, and a connection plate, respectively.

The driving of the driving member 52 determines the proximity of the solder injector 54 to the joint of the thin metal plate 6 or 8, and the driving of the slide member 50 applies the solder in the width direction of the joint.

In FIG. 3, reference numerals 62, 64, 6
6 is a guide piece fixed to the movable pressurizing section 22,
Guide rail fixed to frame 20, air cooler 1
8 shows a holder for fixing 8 to the frame 20.

As shown in FIG. 4, the press plates 26 and 28 are, for example, substantially press surfaces 26 which press the joints P of the thin metal plates 6 and 8 in order to facilitate the flatness of the press surfaces.
Only a and a can be formed in a convex shape. Pressure surface 26a, 28a is formed in a size having a longitudinal dimension h _1, respectively greater dimension than lateral dimension w ₁ h _2, w ₂ of the junction P.

The pressure plates 26 and 28 may be entirely formed of a heat insulating material such as ceramic, but the entire pressure surfaces 68 and 7 are formed.
By forming a ceramic layer only on the zero or substantially pressurized surfaces 26a, 28a by means of, for example, thermal spraying, it is possible to avoid the solder adhesion and the temperature rise due to heating.

Hot air discharge holes 26b, 28b are formed in the pressure plates 26, 28 so as to penetrate in the thickness direction at positions where the blower tubes 34 of the air heater 16 are connected and open to the pressure surfaces 26a, 28a. ing. In addition, a large-diameter portion 34a is formed at the tip of the blower tube 34 of the air heater 16 so that hot air can be retained.

The lower pressurizing plate 28 has a connecting position of the blower tube 36 of the air cooler 18 (preferably a position for cooling both longitudinal ends of the thin metal plates 6 and 8 at the joint P) in the thickness direction. Penetrate and pressurized surfaces 26a, 28
A cool air discharge hole 28c opening at a is formed. The blower pipe 36 has, for example, a connection port 36a and a cool air discharge hole 28c.
Connected to.

Next, the joining process of the metal sheets 6, 8 by the soldering device 2 will be described. As shown in FIG. 5, the thin metal plates 6, 8 are positioned so that the respective joints P are overlapped by the setting mechanisms 10, 10, and the solder 72 is supplied to the joints P by the solder dispenser 14. Next, as shown in FIG.
The movable pressurizing section 22 is moved by the above operation, and primary pressurization is performed, so that the solder 72 is extended.

As shown in FIG. 7, hot air is supplied from the air heater 16 in response to the primary pressurizing operation, and the hot air is blown out from the hot air discharge holes 26b, 28b of the pressurizing plates 26, 28 to form the joint P Heat. As a result, the solder 72
Is melted, the hot air supply is stopped, and the driving member 3
By the operation 2, secondary pressurization, which is strong pressurization, is performed, and the joint P is brought into close contact. In this case, since the pressing surfaces 26a and 28a have a larger area than the joint P, the excess solder 72a extruded from the joint P is prevented from rising, and the solder P
Leveled with the outside.

Further, the pressing surfaces 26a,
Since a strong pressure is applied by 28a, warpage of the joint P is prevented and flatness accuracy and uniformity of the joint strength are obtained. Therefore, the quality assurance of the joint is maintained for a long time. In addition, by using the hot air system, indirect contact heating is performed as compared with the soldering iron, and the outflow of the solder 72 is suppressed.

Next, as shown in FIG. 8, cold air is supplied from the air cooler 18 in response to the secondary pressurizing operation of the movable pressurizing section 22. As a result, rapid solidification of the solder 72 is obtained, and the outflow of the surplus solder 72a is prevented. In this regard, the formation of protrusions by the surplus solder 72a is also prevented. Further, since at least the substantial pressing surfaces 26a and 28a are formed of ceramic, the pressing plates 26 and 28 by heating are formed.
Is prevented from being kept warm, and a decrease in cooling efficiency by the air cooler 18 is prevented.

When the cooling is completed, the pressure clamp and the like are released, and the joined product is taken out as shown in FIG. In this case, since the pressing surfaces 26a and 28a are formed of ceramic, solder does not adhere to the pressing surfaces 26a and 28a, so that removal can be performed smoothly.

The amount of movement of the movable pressurizing section 22, the feed member 44, the solder dispenser 14, etc., shown in this example,
The amount of pressurization and the like are automatically controlled by a control device (not shown).

Although the specific arrangement example of the hot air discharge holes 26b and 28b and the cool air discharge hole 28c has been described, the present invention is not limited to this, and the positioning is appropriately performed within a range where the melting and rapid solidification of the solder 72 can be obtained well. Or they can be arranged.

The metal thin plates 6 and 8 are not limited to copper tapes, but can be applied to all thin metal materials to be soldered.

[0035]

According to the present invention, the joining work can be facilitated and standardized by automation of setting and the like, and the working efficiency can be improved and the working cost can be reduced.

In addition, uniform pressure contact of the joint can be obtained by the surface pressure of the large pressure surface, and warpage and protrusion of excess solder can be avoided, so that the strength can be stabilized, and therefore the joint can be stabilized. Quality can be improved.

Further, according to the present invention, since the pressing surface is formed of ceramic, it is possible to avoid inconveniences such as instability of temperature control due to a rise in temperature, and to avoid solder adhesion to the pressing surface. The removal operation can be facilitated.

[Brief description of the drawings]

FIG. 1 is a schematic side view showing one embodiment of a thin metal sheet soldering apparatus according to the present invention.

FIG. 2 is a schematic side view of a solder dispenser portion.

FIG. 3 is a schematic side view of a pressing mechanism.

FIG. 4 is an exploded perspective view around a pressing surface.

FIG. 5 is a schematic sectional view showing an operation in a joining process.

FIG. 6 is a schematic sectional view showing an operation in a joining process.

FIG. 7 is a schematic sectional view showing an operation in a joining process.

FIG. 8 is a schematic sectional view showing an operation in a joining process.

FIG. 9 is a schematic sectional view showing an operation in a joining process.

FIG. 10 is a schematic sectional view showing a conventional soldering state.

FIG. 11 is a schematic sectional view showing a conventional soldering state.

[Explanation of symbols]

 Reference Signs List 2 soldering device 4 pressurizing mechanism 10 setting mechanism 14 solder dispenser 16 air heater (heating means) 18 air cooler (cooling means) 26a, 28a pressing surface 26b, 28b hot air discharge hole 28c cold air discharge hole

Claims (2)

(57) [Claims] 1. A setting mechanism for superposing and positioning a joint of metal sheets, a solder dispenser for supplying solder to the joint of each of the metal sheets, a pressing mechanism for pressing the joint with a large pressing surface, An apparatus for soldering a thin metal plate, comprising: a heating unit that heats the above-mentioned joint to melt the solder in response to the pressing operation of the pressing mechanism; and a cooling unit that solidifies the solder in response to the pressing operation. . 2. A hot air discharge for discharging hot air for melting solder of the joint on the pressurizing surface, comprising a pressurizing mechanism made of ceramics, the pressurizing surface being in contact with the overlapping joint of the thin metal plates. An apparatus for soldering a thin metal plate in which holes and cold air discharge holes for discharging cold air for solidifying the solder are formed.