JP2868904B2 - Method of forming low reflection film for pin-fitting type optical connector - Google Patents
Method of forming low reflection film for pin-fitting type optical connectorInfo
- Publication number
- JP2868904B2 JP2868904B2 JP41343090A JP41343090A JP2868904B2 JP 2868904 B2 JP2868904 B2 JP 2868904B2 JP 41343090 A JP41343090 A JP 41343090A JP 41343090 A JP41343090 A JP 41343090A JP 2868904 B2 JP2868904 B2 JP 2868904B2
- Authority
- JP
- Japan
- Prior art keywords
- pin
- resin
- optical fiber
- optical connector
- fitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、光ファイバの接続に用
いられるピン嵌合穴を設けた光コネクタの光ファイバ接
合面に低反射膜を形成する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a low-reflection film on an optical fiber joint surface of an optical connector having a pin fitting hole used for connecting an optical fiber.
【０００２】[0002]
【従来の技術】光ファイバの接続に用いられる光コネク
タの中には、図２に示すようなピン嵌合型の光コネクタ
がある。このピン嵌合型光コネクタ３は、光ファイバ突
合わせ面４にピン嵌合穴１を設け、この嵌合穴１に嵌合
ピン９を挿入して、光テープ心線10の光ファイバ接合面
２の心合わせを行い、それらを突き合わせて接続するも
のである。この場合、光ファイバ接合面２からの反射光
を低減する為に、光ファイバの接合面２には、光ファイ
バのコアと同程度の屈折率を有する高分子樹脂を膜状に
形成する方法が提案されている。この高分子樹脂を光フ
ァイバ接合面２に膜状に形成する方法としては、先ず光
ファイバ突き合わせ面４に、高分子樹脂として例えばＵ
Ｖ硬化樹脂や熱硬化樹脂を膜状に塗布し、この樹脂膜に
ＵＶ光（紫外線）又は熱を付与して上記樹脂膜を硬化さ
せる方法により行われているが、ＵＶ硬化樹脂や熱硬化
樹脂を光ファイバ突合わせ面４に塗布する際、上記樹脂
は光ファイバ突合わせ面４に設けられたピン嵌合穴１内
にも流入し、これにＵＶ光や熱を付与すると上記樹脂は
嵌合穴１内にて硬化してしまい嵌合ピン９を嵌合する際
に、嵌合ピン９がスムースに嵌合されないばかりか、無
理に挿入しようとして嵌合ピン９を損傷させてしまうと
いう問題があった。2. Description of the Related Art Among optical connectors used for connecting optical fibers, there is a pin fitting type optical connector as shown in FIG. In this pin-fitting type optical connector 3, a pin fitting hole 1 is provided in an optical fiber mating surface 4, a fitting pin 9 is inserted into the fitting hole 1, and an optical fiber bonding surface of an optical fiber ribbon 10 is provided. The two are aligned, and they are butt-connected. In this case, in order to reduce the reflected light from the optical fiber bonding surface 2, a method of forming a polymer resin having a refractive index similar to that of the core of the optical fiber on the bonding surface 2 of the optical fiber in a film shape is known. Proposed. As a method of forming this polymer resin on the optical fiber bonding surface 2 in a film form, first, a polymer resin such as U
V-curing resin or thermosetting resin is applied in the form of a film, and UV light (ultraviolet light) or heat is applied to the resin film to cure the resin film. Is applied to the optical fiber butt surface 4, the resin also flows into the pin fitting hole 1 provided in the optical fiber butt surface 4, and when UV light or heat is applied thereto, the resin is fitted. When the fitting pin 9 is fitted due to hardening in the hole 1, not only the fitting pin 9 is not smoothly fitted, but also the fitting pin 9 is damaged by trying to insert it forcibly. there were.
【０００３】[0003]
【課題を解決するための手段】本発明はかかる状況に鑑
み鋭意研究を行った結果なされたもので、その目的とす
るところはピン嵌合性を損なわない、ピン嵌合型光コネ
クタの低反射膜形成方法を提供することにある。即ち、
本発明は、ピン嵌合穴を設けた光コネクタの光ファイバ
突合わせ面にＵＶ硬化樹脂又は熱硬化樹脂を膜状に塗布
し、次いで光ファイバ突合わせ面に設けた嵌合穴部位に
ＵＶ光又は熱の遮断処置を施し、しかるのち前記樹脂膜
にＵＶ光又は熱を付与して前記遮断処置を施した部位以
外の樹脂膜を硬化せしめ、次いで前記嵌合穴内の未硬化
樹脂を流出除去することを特徴とするものである。本発
明方法において、ＵＶ硬化樹脂又は熱硬化樹脂として
は、エポキシ系樹脂やアクリル系樹脂等が適用される。
又光ファイバ突合わせ面に塗布したＵＶ硬化樹脂をＵＶ
光から遮断する方法としては遮蔽板で遮蔽する方法が用
いられ、又熱硬化樹脂を熱から遮断する方法としては熱
源に遠赤外線や熱風を用いて上記熱を遮蔽板で遮蔽する
方法等が用いられる。又、光ファイバ突合わせ面の嵌合
穴内の未硬化樹脂を除去する方法としては、超音波洗浄
法により流出除去する方法等が適用される。SUMMARY OF THE INVENTION The present invention has been made as a result of intensive studies in view of the above circumstances, and an object of the present invention is to provide a low-reflection optical connector of a pin-fitting type optical connector which does not impair the pin-fitting property. An object of the present invention is to provide a film forming method. That is,
The present invention applies a UV curable resin or a thermosetting resin in a film shape to an optical fiber butting surface of an optical connector having a pin fitting hole, and then applies UV light to a fitting hole portion provided in the optical fiber butting surface. Alternatively, a heat shielding treatment is performed, and thereafter, UV light or heat is applied to the resin film to cure the resin film other than the part where the shielding treatment is performed, and then the uncured resin in the fitting hole is removed. It is characterized by the following. In the method of the present invention, an epoxy resin, an acrylic resin, or the like is applied as the UV-curable resin or the thermosetting resin.
In addition, UV curable resin applied to the optical fiber
As a method of shielding from light, a method of shielding with a shielding plate is used, and as a method of shielding the thermosetting resin from heat, a method of shielding the heat with a shielding plate using far infrared rays or hot air as a heat source is used. Can be As a method of removing the uncured resin in the fitting hole of the optical fiber butting surface, a method of removing the resin by an ultrasonic cleaning method or the like is applied.
【０００４】[0004]
【実施例】以下に、本発明の実施例を図面を参照して詳
細に説明する。図１イ〜ニは、本発明方法の一実施例を
示す工程説明図である。ピン嵌合穴１が２個設けられ、
光ファイバ接合面２が露出したピン嵌合型光コネクタ３
の光ファイバ突合わせ面４にエポキシ系のＵＶ硬化樹脂
を膜状５に塗布したのち（図イ）、この光ファイバ突合
わせ面４上に穴空きシート６を被せて、ピン嵌合穴１を
マスクし、次いで上方よりＵＶ光７を照射した（図
ロ）。次に前記の光ファイバ接合面２上のＵＶ硬化樹脂
膜５を硬化せしめて低反射膜８となし（図ハ）、しかる
のちピン嵌合穴１を含むＵＶ光が照射されなかった部分
の未硬化樹脂を超音波洗浄法により流出除去した（図
ニ）。以上ＵＶ硬化樹脂を用いた場合について説明した
が、熱硬化樹脂を用いた場合も、熱を遠赤外線により照
射する等の方法により、ＵＶ硬化樹脂の場合と同様の方
法により光ファイバ接合面に低反射膜を形成することが
できる。Embodiments of the present invention will be described below in detail with reference to the drawings. FIGS. 1A to 1D are process explanatory views showing one embodiment of the method of the present invention. Two pin fitting holes 1 are provided,
Pin-fitting type optical connector 3 with optical fiber bonding surface 2 exposed
After applying an epoxy-based UV curable resin on the optical fiber butting surface 4 in the form of a film 5 (FIG. 2A), a holed sheet 6 is put on the optical fiber butting surface 4 and the pin fitting hole 1 is formed. After masking, UV light 7 was irradiated from above (FIG. 2B). Next, the UV cured resin film 5 on the optical fiber bonding surface 2 is cured to form a low reflection film 8 (FIG. 3C). The cured resin was removed by an ultrasonic cleaning method (FIG. 2). Although the case where a UV-curable resin is used has been described above, even when a thermosetting resin is used, a method of irradiating heat with far-infrared rays or the like can be applied to the optical fiber bonding surface in a manner similar to that of the UV-curable resin. A reflective film can be formed.
【０００５】[0005]
【効果】以上述べたように本発明によれば、ピン嵌合性
を損なうことなく、ピン嵌合型光コネクタの光ファイバ
接合面に低反射膜を形成することができ、工業上顕著な
効果を奏する。As described above, according to the present invention, a low-reflection film can be formed on the optical fiber joint surface of a pin-fitting type optical connector without impairing the pin-fitting property, and the industrially remarkable effect is obtained. To play.
【図１】本発明方法の一実施例を示す工程説明図であ
る。FIG. 1 is a process explanatory view showing one embodiment of the method of the present invention.
【図２】ピン嵌合型光コネクタの説明図である。FIG. 2 is an explanatory diagram of a pin-fitting type optical connector.
１ ピン嵌合穴 ２ 光ファイバ接合面 ３ ピン嵌合型光コネクタ ４ 光ファイバ突合わせ面 ５ ＵＶ硬化樹脂膜 ６ 穴空きシート ７ ＵＶ光 ８ 低反射膜 ９ 嵌合ピン 10 光テープ心線 DESCRIPTION OF SYMBOLS 1 Pin fitting hole 2 Optical fiber joint surface 3 Pin fitting optical connector 4 Optical fiber butting surface 5 UV curing resin film 6 Hole sheet 7 UV light 8 Low reflection film 9 Fitting pin 10 Optical tape core
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平２−308207（ＪＰ，Ａ) 特開 昭58−205117（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) G02B 6/36 - 6/40 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-2-308207 (JP, A) JP-A-58-205117 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) G02B 6/36-6/40
Claims (1)
イバ突合わせ面にＵＶ硬化樹脂又は熱硬化樹脂を膜状に
塗布し、次いで光ファイバ突合わせ面に設けた嵌合穴部
位にＵＶ光又は熱の遮断処置を施し、しかるのち前記樹
脂膜にＵＶ光又は熱を付与して前記遮断処置を施した部
位以外の樹脂膜を硬化せしめ、次いで前記嵌合穴内の未
硬化樹脂を流出除去することを特徴とするピン嵌合型光
コネクタの低反射膜形成方法。A UV curable resin or a thermosetting resin is applied in a film shape to an optical fiber butting surface of an optical connector having a pin fitting hole, and then UV is applied to a fitting hole portion provided in the optical fiber butting surface. A light or heat blocking treatment is performed, and thereafter, the resin film is cured by applying UV light or heat to the resin film other than the portion where the blocking treatment is performed, and then the uncured resin in the fitting hole is removed. Forming a low-reflection film for a pin-fitting optical connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP41343090A JP2868904B2 (en) | 1990-12-21 | 1990-12-21 | Method of forming low reflection film for pin-fitting type optical connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP41343090A JP2868904B2 (en) | 1990-12-21 | 1990-12-21 | Method of forming low reflection film for pin-fitting type optical connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04220607A JPH04220607A (en) | 1992-08-11 |
| JP2868904B2 true JP2868904B2 (en) | 1999-03-10 |
Family
ID=18522066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP41343090A Expired - Fee Related JP2868904B2 (en) | 1990-12-21 | 1990-12-21 | Method of forming low reflection film for pin-fitting type optical connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2868904B2 (en) |
-
1990
- 1990-12-21 JP JP41343090A patent/JP2868904B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04220607A (en) | 1992-08-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |