JP2857838B2 - Socket connector for package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket connector used for connecting a BGA (ball grid array) package or the like.

[0002]

2. Description of the Related Art In a conventional socket connector for a BGA package, a C-shaped elastic contact is used. In this type of connector, the thickness of the contact is increased in order to make the contact resilient, resulting in a larger socket connector. In the connection portion between the socket connector and the board, the contact can easily correspond to a through hole in the board, but there is a surface where connection between the contact and the pad on the board is difficult.

[0003] When a contact is damaged, the contact must be replaced. In this case, in the case of a C-shaped contact, the contacts on both sides of the damaged contact become obstacles. There is a disadvantage that it becomes difficult.

Further, since no means such as an insulating member is provided between the C-shaped portion of the contact and the C-shaped portion of the adjacent contact, vibration, impact, etc. If the contact is inclined due to the above, the C-shaped portions may come into contact with each other and cause a short circuit.

[0005]

SUMMARY OF THE INVENTION Accordingly, the present invention improves the disadvantages of the conventional package socket connector, reduces the thickness of the package socket connector as a whole, and facilitates the connection. In addition, it is intended to facilitate the exchange of the contacts and to prevent the contacts from contacting each other.

[0006]

The present invention employs the following means to solve the above-mentioned problems.

(1) A base, a contact, a middle for supporting the contact, and a built-in cover for aligning the contact, wherein the contact has elasticity, exhibits a corrugated shape, and Socket connector for package supported by seesaw structure.

(2) The package according to (1), wherein the position of the contact of the contact on the package side and the position of the contact of the contact on the substrate side are relatively displaced from the same straight line in the thickness direction of the connector. Socket connector.

(3) The package socket connector according to (1), wherein the projection provided at the tip of the contact and the solder ball provided on the package come into contact with each other.

[0010]

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Four embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing the appearance of a socket connector for a BGA package according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view showing the first embodiment of the present invention. The BGA package socket connector includes a base 1, a middle (insulator) 2, a contact 3, a built-in cover 4, a package plate 5, a bolt 6, and a nut 7.

The contact 3 has the shape shown in FIG.
It is made of a corrugated elastic conductor composed of a BGA package solder ball contact 3a, a board pad contact 3b, and engaging portions 3d on both sides of the center. B
The GA package solder ball contact 3a is provided with a wedge-shaped projection 3c for piercing the solder ball.

As shown in FIG. 4, the contact 3 is sandwiched between the built-in cover 4 and the base 1 and the middle 2
Supported and integrated. The built-in cover 4 insulates each of the plurality of contacts 3 and aligns the BGA package solder ball contacts 3a of each contact 3. The built-in cover 4 is a BGA package 2
0 and a fitting portion 4b of the BGA package 20 for guiding the BGA package 20.
Contact 3a for package solder ball and BGA package 2
0 can be aligned with the BGA package solder balls 21 provided in the BGA. Similarly, the base 1 also insulates each of the plurality of contacts 3 and aligns the contact 3b for the substrate pad of each contact 3.

The base 1, the middle 2, the contacts 3 and the built-in cover 4 are assembled into an assembly 10, the BGA package 20 is fitted on the assembly 10, the package plate 5 is covered, and the whole is fastened to the substrate 30 with the bolts 6 and the nuts 7. . The force applied to each contact 3 varies depending on the degree of the tightening. Arm 3 of contact 3 projecting from middle 2
e is elastically deformed when a squeezing force is applied by the BGA package 20 and the substrate 30 in the vertical direction in FIG.
The package solder ball contact 3a contacts the BGA package solder ball 21, the board pad contact 3b contacts the board pad 31, and the BGA package 20 and the board 30 are connected.

The details of the assembly of the assembly 10 will be described. First, the contact 3 is inserted into the middle 2 and the engaging portions 3d, 3d of the contact 3 are supported by the middle 2, so that the contact 3 is within a small angle range. It is rotatable. Next, the middle 2 is placed on the base 1 placed on the substrate 30.
Of the base 1, cover the built-in cover 4, and fix the built-in cover 4 by the locking portion 1 b of the base 1. The state thus far is shown by a solid line in FIG. BGA package 2
When fitting 0, the BGA package 20 is fitted into the built-in cover 4 and the package plate 5 is covered.
By tightening the bolt 6 and the nut 7, the BGA
The package 20 is sandwiched between the wedge-shaped protrusion 3 c of the contact 3 a for the BGA package solder ball of the contact 3 and the package plate 5.

Next, a second embodiment of the present invention will be described.
In the first embodiment, the package plate 5 is formed as a simple plate. However, in the second embodiment, as shown in FIG. The package plate 5 is provided with a spring 5a.

Next, a third embodiment of the present invention will be described.
In the first embodiment, the substrate 30 is provided with the substrate pad 31, but when the substrate is provided with a through hole (see the through hole 32 in FIG. 8), as shown in FIG. In the third embodiment, the base 1 and the middle 2 can be integrated, and the package plate 5 is formed on the package plate 5 with the locking portion 5b without being screwed. And the bolt and nut can be omitted.

FIG. 8 shows a fourth embodiment of the present invention.
The fourth embodiment differs from the third embodiment only in that the package plate 5 lacks the locking portion 5b.
However, the bolt 6 and the nut 7 are required.

[0021]

The present invention has the following effects.

(1) The entire thickness of the package socket connector can be reduced.

(2) Assembly and disassembly of the package socket connector can be easily performed.

(3) The contact between the contact and the solder ball provided on the package is stabilized, and the pitch of the contact hardly shifts.

(4) The connection between the package socket connector and the board can be made using pads or through holes on the board, which is convenient.

(5) When the contact is damaged, only the contact can be easily replaced.

[Brief description of the drawings]

FIG. 1 is a perspective view of the appearance of a first embodiment of the present invention.

FIG. 2 is an exploded perspective view showing the first embodiment of the present invention.

FIG. 3 is a perspective view of a contact according to the first embodiment of the present invention.

FIG. 4 is a sectional view showing a state in which a BGA package is fitted to the first embodiment of the present invention and is fixed to a substrate with bolts and nuts.

FIG. 5 shows the first embodiment of the present invention before the BGA package is fitted.
It is sectional drawing of an Example and a board | substrate.

FIG. 6 is a perspective view of a package plate according to a second embodiment of the present invention.

FIG. 7 is an exploded perspective view showing a third embodiment of the present invention.

FIG. 8 is a cross-sectional view showing a state in which a BGA package is fitted into a fourth embodiment of the present invention and is fixed to a substrate with bolts and nuts.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 base 1a concave portion 1b locking portion 1c locking concave portion 2 middle (insulator) 3 contact 3a contact for BGA package solder ball 3b contact for substrate pad 3c wedge-shaped protrusion 3d engaging portion 3e arm portion 4 built-in cover 4a guide portion 4b fit Part 5 Package plate 5a Spring for absorbing thickness tolerance 5b Locking part 6 Bolt 7 Nut 10 Assembly 20 BGA package 21 BGA package solder ball 30 Substrate 31 Substrate pad 32 Through hole

Claims (3)

(57) [Claims] 1. A base, a contact, a middle supporting the contact, and a built-in cover for aligning the contact, wherein the contact has elasticity, exhibits a corrugated shape, and has a A socket connector for a package, which is supported by a seesaw structure. 2. The position of the contact of the contact on the package side and the position of the contact of the contact on the substrate side are relatively displaced from the same straight line in the thickness direction of the connector. The socket connector for the package described. 3. The package socket connector according to claim 1, wherein a projection provided at a tip of said contact is in contact with a solder ball provided on a package.