JP2856706B2 - CPU socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a CPU socket, and more particularly to a CPU socket with a capacitor into which an LSI such as a multi-pin personal computer CPU is inserted.

[0002]

2. Description of the Related Art Discrete capacitors are mounted in sockets into which CPU ICs and the like are inserted, in order to attenuate unnecessary signals transmitted through the pins of the ICs. (See, for example, Japanese Utility Model Application Laid-Open No. 56-138488.) Normally, a capacitor is required near the power supply terminal of the IC to remove power supply noise. ICs that require multiple power supplies
If you try to place multiple capacitors as close as possible to the pins of the IC for the purpose of removing interfering electromagnetic waves radiated to the outside of the housing, etc., the shape of the socket becomes large, the wiring needs to be routed, and the stray inductance increases. Affects the circuit characteristics.

[0003]

The conventional CPU described above.
The socket has a drawback that it is difficult to reduce the size and the circuit characteristics are deteriorated.

[0004]

According to a first aspect of the present invention, there is provided a CPU socket having a number of through-holes corresponding to all pins of a CPU LSI, and contacting a multilayer substrate having an electrode layer and a dielectric layer. Insert a contact lead from the lower surface of the multilayer substrate, and electrically connect the contact to a multilayer capacitor formed using the electrode layer and the dielectric layer, wherein the CPU socket,
Contact corresponding to Vcc pin and GND pin of LSI
An inner layer connection land is provided in the through hole into which
You.

According to a second aspect of the present invention, in the CPU socket according to the first aspect , the inner layer connection land is connected to the electrode layer.

[0006]

Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a partially cutaway side view showing an embodiment of the present invention. The CPU socket shown in FIG.
Number of through holes A11, B corresponding to all pins
,... Are inserted into the multilayer substrate 101 having openings, and contact leads A19, B projecting from the lower surface of the multilayer substrate 101 are inserted.
20 are connected to a substrate on the main body side not shown. The multilayer board 101 has an insulating layer 5, a GND layer 2, a capacitor layer 3, a Vcc layer 4, and the like between the housings 1a and 1b. The capacitor layer 3 is further divided into electrode layers 6, 8 and a dielectric layer 7.

Since the pin arrangement of the LSI 9 used as a CPU is fixed, a GND is used as a CPU socket.
The inner layer connection land A13 is provided in the through hole A11 corresponding to the pin 10, and the through hole B corresponding to the Vcc pin 11 is provided.
12 is provided with an inner layer connection land B14,
The capacitor 12 formed by the electrodes 6b and 8b with the dielectric layer 7 interposed between the capacitor 13 and the inner layer connection land B14.
Are connected using the electrode layers 6 and 8, the Vcc pin 11
Can be bypassed to the GND pin 11.

[0009]

According to the CPU socket of the present invention, since the contacts are inserted into the multilayer substrate having a built-in capacitor, it is easy to reduce the size and improve the circuit characteristics.

[Brief description of the drawings]

FIG. 1 is a partially cutaway side view showing an embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 contact 2 GND layer 3 capacitor layer 4 Vcc layer 5 insulating layer 6 electrode layer 7 dielectric layer 8 electrode layer 9 LSI 10 GND pin 11 Vcc pin 12 capacitor

Claims (2)

(57) [Claims] 1. A contact is inserted into a multi-layer substrate having an electrode layer and a dielectric layer, the number of through holes corresponding to all pins of a CPU LSI, and contact leads are inserted from the lower surface of the multi-layer substrate. out, electrically connected to CPU socket smell the contact to the capacitor of the electrode layer and the dielectric layer laminated type formed by using a
Therefore, the code corresponding to the Vcc pin and the GND pin of the LSI
The inner layer connection run is
CPU socket characterized by providing a socket. Wherein said inner connection lands CPU socket of claim 1, wherein connected to the electrode layer.