JP2849886B2 - Busbar fixing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bus bar fixing method suitable for use in an electric junction box or the like used for connecting a wire harness.

[0002]

2. Description of the Related Art An electric junction box (hereinafter simply referred to as "J / B") generally houses a circuit mainly having a joint absorbing function of a wire harness in a case, and a large number of fuses, relays, and the like on the outer surface of the case. It is configured by mounting electrical components and providing a connector receiving portion. And several J
By distributing / B at appropriate positions in the vehicle, wiring of the wire harness is facilitated, and the wiring form is simplified.

FIG. 12 shows an example of such a J / B.
A wiring board assembly e ₁ , e ₂成 る composed of a plurality of bus bars C and an insulating substrate d is stacked and accommodated in the upper case a and the lower case b, and the tabs are formed upright above or below the bus bar c. connection terminals) protruding in the connection portion, such as a connector receiving part g ₁ and the fuse insertion portion g ₂ having a f in a case, bond where the terminal connector h and the fuse i of the wire harness W, relay j, the circuit breaker k It has a structure to make it. Here, 1 denotes a female-female relay terminal used for connecting the tab f to an external fuse terminal or the like, and m denotes a tab insertion hole.

In the J / B configuration, the bus bar is fixed to a wiring insulating substrate made of synthetic resin or the like, and the fixing structure is disclosed in Japanese Patent Application Laid-Open No. Sho 55-144710 and Japanese Utility Model Application Publication No. Sho.
It is disclosed in Japanese Patent Application Laid-Open No. 8-7772 and the like, and its outline will be described below. That is, in the structure shown in FIGS. 6 and 7 , the locking claws 4 formed on the bus bar 3 are pressed into the locking holes 2 formed on the insulating substrate 1. Although the tip of the locking claw 4 is stopped in the locking hole 2 in the illustrated configuration,
There is also a structure that protrudes from the locking hole 2 to the rear side of the insulating substrate 1.

In the structure shown in FIGS. 8 and 9 , while the projection 5 is formed on the insulating substrate 1, the locking hole 6 formed in the bus bar 3 is inserted through the projection 5, and
It is the one that crushes the tip of the so-called resin and caulks the resin. Further, in the structure shown in FIGS. 10 and 11 , a pair of projections 5a and 5b are formed on the insulating substrate 1, the bus bar 3 is sandwiched between the projections 5a and 5b, and then the tips of the projections 5a and 5b are crushed and resin caulked. Things.

[0006]

However, in recent years, one of the technical trends of J / B has been the increase in density, and the number of busbars has also tended to increase. However, in the structures shown in FIGS. 6 and 7 , the projections 4 are one of the factors that hinder high-density due to obstruction in circuit layout. In addition, 8 to
In the structure shown in FIG. 11 , the protrusions for caulking 5, 5a, 5
b is easy to break, and there are many variations in resin caulking,
Together, they lacked reliability. Furthermore, in order to securely fix the bus bar 3 by resin caulking, it was necessary to provide a large number of caulking protrusions.

Further, in the structure shown in FIGS. 8 and 9 , the locking hole 6 is formed in the buzz bar 3, so that the cross-sectional area is reduced, which electrically contributes to an increase in resistance. Therefore, when the number of openings of the locking holes 6 is increased, undesired phenomena such as a decrease in the amount of current and heat generation occur. The present invention has been made based on the above circumstances, and an object of the present invention is to provide a bus bar fixing method for easily and surely fixing a bus bar to an insulating substrate.

[0008]

SUMMARY OF THE INVENTION The object of the present invention is to solve the above-mentioned problem by providing an insulating substrate corresponding to a wiring path set on an insulating substrate.
Advance fixing metal tip is fixed in a desired position of the substrate, after placing the busbar to the fixed metal chip, the bus bar
The method is achieved by a method for fixing a bus bar, comprising irradiating a laser from the upper part of the laser to weld the fixing metal chip and the bus bar.

[0009]

In other words, since the bus bar is laser-welded to the fixing metal chip which has been insert-molded on the insulating substrate in advance, the bus bar is integrated with the fixing metal chip at important points. Therefore, it is not necessary to provide a locking projection on the bus bar, and a projection for caulking the resin is not required, and it is possible to increase the density, improve the reliability, and improve the efficiency of the fixing operation.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to FIGS. It goes without saying that the present invention is not limited to this embodiment. Figure 1 shows J /
FIG. 2 is a perspective view showing an external appearance of a main part of B, FIG. 2 is a cross-sectional view showing insert molding of a fixing metal chip, and FIGS. In the description of the embodiment, the structure of the main part of the J / B will be described with reference to FIGS. 1 and 2, and then the laser welding will be described with reference to FIGS.

On the insulating substrate 11, a pair of ribs 13a and 13b forming a path for arranging the bus bar 12 are integrally formed, and a fixing metal chip 14 is insert-molded at a desired position of the path. . The ribs 13a and 13b are for preventing leakage with the adjacent bus bar, and the bus bar 12 is preferably made of a metal such as brass which is easy to process and has excellent conductivity.

The fixing metal chip 14 (hereinafter simply referred to as a metal chip) has a flat circular shape and a thickness of the insulating substrate 1.
The thickness is set to be smaller than the thickness of 1, and the entire shape is formed, for example, in a coin shape. Since the metal chip 14 is insert-molded at a desired position when the insulating substrate 11 is formed, the metal chip 14 is fixed at a desired position on the insulating substrate 11 and does not come off.

Although illustration of the entire J / B is omitted, the J / B may be formed by laminating an appropriate number of the insulating substrates 11 shown in FIG. A relay, a fuse, a connection terminal, and the like are provided as needed. Next, a method of fixing the bus bar 12 will be described with reference to FIGS. When fixing the bus bar 12, the bus bar 12 is inserted between the pair of ribs 13a and 13b as shown by arrows in FIG. 3, and the bottom surface of the bus bar 12 contacts the metal chip 14 as shown in FIG. Position. In this state, a laser is applied to the bus bar 12 from above the bus bar 14 by the laser irradiation device 15.

As a result, the bus bar 12 and the metal chip 14
5 is melted as shown in FIG.
Is welded to the metal tip 14. Since the metal chip 14 is fixed to the insulating substrate 11, the bus bar 12
Is also fixed to the insulating substrate 11 via the metal chip 14. The fixing of the bus bar 12 is automatically performed sequentially at the insert molding position of the metal chip 14 by, for example, NC control. Therefore, the bus bar 12 is automatically and efficiently fixed at a predetermined position on the insulating substrate 11.

Although the embodiment of the present invention has been described above, the present invention is not limited to the above, and various modifications are possible. For example, the planar shape of the metal tip 14 is not limited to a circle, but may be applied by cutting a metal piece into a square. Also, above
Is In you施例, the metal chip 1 4, at the time of molding the insulating substrate 11, as has been described as being insert molded into the desired position, the present invention is to be limited to such a configuration Instead, for example, a metal chip can be press-fitted and fixed to an insulating substrate.

[0016]

As described above, the bus bar fixing method according to the present invention is to insert-mold a fixing metal chip on an insulating substrate in advance and to laser-weld the bus bar to the fixing metal chip. Therefore, the bus bar is securely fixed to the insulating substrate via the fixing metal chip at a key point. Therefore, there is no peeling of the bus bar from the insulating substrate, and the reliability is remarkably improved. Further, since the structure of the insulating substrate is simplified, the thickness can be reduced.
It is possible to increase the density of an electric junction box or the like using this insulating substrate.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part of an insulating substrate showing one embodiment of the present invention.

FIG. 2 is a sectional view of a main part showing a structure of an insulating substrate.

FIG. 3 is a cross-sectional view illustrating a bus bar welding step.

FIG. 4 is a cross-sectional view showing laser welding of a bus bar.

FIG. 5 is a sectional view showing a welded state of a bus bar.

FIG. 6 is a perspective view showing a first example of a conventional bus bar fixing structure.
FIG .

FIG. 7 is a sectional view of a main part showing a conventional bus bar fixing structure.
It is .

FIG. 8 is a sectional view showing a second example of a conventional bus bar fixing structure.
FIG .

FIG. 9 is a plan view showing a conventional bus bar fixing structure.
You .

FIG. 10 is a sectional view showing a third example of a conventional busbar fixing structure.
FIG .

FIG. 11 is a plan view showing a conventional bus bar fixing structure.
You .

FIG. 12 is an exploded perspective view illustrating a conventional electric junction box.
You .

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Insulating substrate 12 Bus bar 13a, 13b Rib 14 Metal chip for fixing 15 Laser irradiation device

Claims (1)

(57) [Claims] 1. Corresponds to a wiring path set on an insulating substrate
After fixing a fixing metal chip at a desired position of the insulating substrate , and disposing a bus bar on the fixing metal chip,
Fixing method of the bus bar, characterized in that the laser welding and said fixing metal chip and said bus bar by laser irradiation from the top of the bus bar.