JP2814530B2 - Electronic device housing mounting device - Google Patents

Electronic device housing mounting device

Info

Publication number
JP2814530B2
JP2814530B2 JP1067001A JP6700189A JP2814530B2 JP 2814530 B2 JP2814530 B2 JP 2814530B2 JP 1067001 A JP1067001 A JP 1067001A JP 6700189 A JP6700189 A JP 6700189A JP 2814530 B2 JP2814530 B2 JP 2814530B2
Authority
JP
Japan
Prior art keywords
electronic device
device housing
mounting
substrate
engagement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1067001A
Other languages
Japanese (ja)
Other versions
JPH02246195A (en
Inventor
陽二 猪股
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1067001A priority Critical patent/JP2814530B2/en
Publication of JPH02246195A publication Critical patent/JPH02246195A/en
Application granted granted Critical
Publication of JP2814530B2 publication Critical patent/JP2814530B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Mounting Components In General For Electric Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、通信機等の電子機器を内蔵した筐体を自動
車に搭載する場合や他の通信装置に装着する場合に用い
る電子機器筐体の取付装置に関するものである。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to mounting of a housing of an electronic device used when a housing incorporating an electronic device such as a communication device is mounted on an automobile or mounted on another communication device. It concerns the device.

従来の技術 従来、無線機等の電子機器を内蔵した筐体を自動車に
搭載するには取付マウントを用いている。以下、従来の
取付装置について図面を参照しながら説明する。
2. Description of the Related Art Conventionally, an attachment mount is used to mount a housing containing an electronic device such as a wireless device on an automobile. Hereinafter, a conventional mounting device will be described with reference to the drawings.

第2図は従来の取付装置の一例を示し、取付前の状態
の斜視図である。第2図に示すように取付マウント51
を、取付穴52を利用して取付ねじ(図示省略)により車
体等に取付ける。この取付マウント51の内側に電子機器
筐体53を矢印で示すように挿入する。これに伴い、電子
機器筐体53の両側に形成した係合溝54を取付マウント51
の係合突条55と係合する。電子機器筐体53を圧縮ばね56
の弾性に抗して押込むと、電子機器筐体53のガイド穴57
を取付マウント51のガイドピン58と嵌合し、コネクタ59
と60を接続する。このとき、電子機器筐体53の両側前側
部に突設された係合突起61と取付マウント51の前側に形
成された係合溝62を係合すると共に、係合突起61の上部
に突設されたロックピン63が取付マウント51に回動可能
に支持されたロックレバー64をばね(図示省略)の弾性
に抗して回動させ、係合溝62の上方に形成されたロック
溝65に入る。これと同時にロックレバー64がばねの弾性
により復帰し、ロックピン63を抜止め状態にロックす
る。
FIG. 2 shows an example of a conventional mounting device, and is a perspective view of a state before mounting. As shown in FIG.
Is mounted on a vehicle body or the like by using a mounting screw (not shown) using the mounting hole 52. An electronic device housing 53 is inserted inside the mounting mount 51 as shown by an arrow. Accordingly, the engagement grooves 54 formed on both sides of the electronic device housing 53 are attached to the mounting mount 51.
Engages with the engagement ridge 55. Compression spring 56 for electronic device housing 53
When it is pushed in against the elasticity of the
Mates with the guide pins 58 of the mounting mount 51, and the connector 59
And 60 are connected. At this time, the engagement protrusions 61 formed on the front sides of the both sides of the electronic device housing 53 engage with the engagement grooves 62 formed on the front side of the mounting mount 51, and the protrusions are formed on the upper portions of the engagement protrusions 61. The lock pin 63 is rotatably supported by the mounting mount 51 so that the lock lever 64 is rotatable against the elasticity of a spring (not shown). enter. At the same time, the lock lever 64 returns due to the elasticity of the spring, and locks the lock pin 63 in the retaining state.

第3図は従来の取付装置の他の例を示し、取付状態の
側面図である。第3図に示すように取付マウント71を、
取付穴(図示省略)を利用して取付ねじ(図示省略)に
より車体等に取付ける。この取付マウント71に電子機器
筐体72を載せると共に、電子機器筐体72の背面の係合溝
73を取付マウント71の係合突条74と係合する。そして、
固定板75の一側を取付マウント71の前側の傾斜板76にね
じ77等により固定し、固定板75の他側を電子機器筐体72
の前側の傾斜面78上に重ねて抜止め状態に押さえる。
FIG. 3 shows another example of the conventional mounting device, and is a side view of the mounted state. As shown in FIG.
It is mounted on a vehicle body or the like by using a mounting screw (not shown) using a mounting hole (not shown). The electronic device housing 72 is mounted on the mounting mount 71, and the engagement groove on the back of the electronic device housing 72 is provided.
The engagement 73 engages with the engagement protrusion 74 of the mounting mount 71. And
One side of the fixing plate 75 is fixed to the inclined plate 76 on the front side of the mounting mount 71 with screws 77 and the like, and the other side of the fixing plate 75 is
On top of the inclined surface 78 on the front side, and hold it in a retaining state.

発明が解決しようとする課題 しかしながら、上記従来例のうち、前者の構成では、
激しい振動を受けると、ロックレバー64が回動し、ロッ
クピン63がロック溝65より離脱するおそれがあり、電子
機器筐体53の確実な取付状態を維持することができな
い。一方、後者の構成では、電子機器筐体72の着脱の
際、ねじ77を回転させるための工具を必要とするため、
その作業が面倒であり、しかも、多くの作業時間を必要
とする。また、上記従来例のいずれの構成においても部
品点数が多いため、コストアップになるなどの課題があ
った。
Problems to be Solved by the Invention However, among the above conventional examples, in the former configuration,
When subjected to severe vibration, the lock lever 64 may rotate, and the lock pin 63 may be detached from the lock groove 65, so that the electronic device housing 53 cannot be securely mounted. On the other hand, in the latter configuration, a tool for rotating the screw 77 is required when attaching or detaching the electronic device housing 72,
The work is cumbersome and requires a lot of work time. Further, in each of the above-described conventional examples, there are problems such as an increase in cost due to a large number of parts.

本発明は、このような従来の課題を解決するものであ
り、電子機器筐体の着脱を容易に、かつ短時間で行うこ
とができ、しかも、電子機器筐体を確実な固定状態に保
持することができ、また、コストの低下を図ることがで
きるようにした電子機器筐体の取付装置を提供すること
を目的とするものである。
The present invention is to solve such a conventional problem, and can easily and detachably mount an electronic device housing in a short time, and further, hold the electronic device housing in a fixed state. It is another object of the present invention to provide an electronic device housing mounting device capable of reducing the cost.

課題を解決するための手段 本発明は、上記目的を達成するために、電子機器筐体
と、自動車に搭載する取付マウントとを有する取付装置
において、上記電子機器筐体は、一側に形成された第1
の係合部と、他側に形成された第2の係合部とを有する
ものであり、上記取付マウントは、略コの字状の形状を
しており、基板と、側板と、ロックレバーと、突部とを
有するものであり、上記側板は、上記基板の一側に取り
付けられ、上記第1の係合部に係合する第3の係合部を
有するものであり、上記ロックレバーは、上記基板の他
側に回動可能に支持されるとともに、ばねにより上記第
3の係合部側に回動するように加圧され、上記第2の係
合部と弾撥的に係合する第4の係合部とを有するもので
あり、上記突部は、上記基板の中央部に形成されてお
り、上記第1、第3の係合部、および第2、第4の係合
部がしているときに、上記電子機器筐体が上記突部を押
圧することにより、上記基板を弾性変形させる長さのも
のであることを特徴とする構成にしたものである。
Means for Solving the Problems In order to achieve the above object, the present invention provides a mounting device having an electronic device housing and a mounting mount mounted on an automobile, wherein the electronic device housing is formed on one side. First
And a second engaging portion formed on the other side. The mounting mount has a substantially U-shape, and includes a substrate, a side plate, and a lock lever. And a protrusion, wherein the side plate is attached to one side of the substrate and has a third engaging portion that engages with the first engaging portion. Is rotatably supported by the other side of the substrate, and is pressurized by a spring so as to rotate toward the third engagement portion, and is resiliently engaged with the second engagement portion. And a fourth engaging portion that engages with the first and third engaging portions, and the second and fourth engaging portions are formed at a central portion of the substrate. When the joining portion is formed, the electronic device housing is of a length such that the substrate is elastically deformed by pressing the protrusion. It is obtained by a configuration that.

作用 したがって、本発明によれば、電子機器筐体の第1の
係合部と第2の係合部を取付マウントの第3の係合部と
第4の係合部であるロックレバーに係合することにより
取付けることができ、この取付状態では電子機器筐体に
より取付マウントの突部を加圧して取付マウントの基板
を弾性変形させているので、この基板の反撥弾性によ
り、電子機器筐体の第1の係合部と第2の係合部を取付
マウントの第3の係合部と第4の係合部であるロックレ
バーに押圧し、強固に固定することができる。また、ロ
ックレバーをばねの弾性により外方へ回動させることに
より、電子機器筐体を取付マウントより離脱させること
ができる。
Therefore, according to the present invention, the first engagement portion and the second engagement portion of the electronic device housing are connected to the lock levers, which are the third engagement portion and the fourth engagement portion of the mounting mount. In this mounting state, the protruding portion of the mounting mount is pressed by the electronic device housing to elastically deform the substrate of the mounting mount. The first and second engaging portions are pressed against the lock levers, which are the third and fourth engaging portions of the mounting mount, and can be firmly fixed. Further, by rotating the lock lever outward by the elasticity of the spring, the electronic device housing can be detached from the mounting mount.

実 施 例 以下、本発明の実施例について図面を参照しながら説
明する。
Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings.

第1図は本発明の一実施例の構成を示すものである。
第1図に示すように電子機器筐体1の後側面に第1の溝
状の係合部2が水平方向に形成され、電子機器筐体1の
前側面に第2の溝状の係合部3が水平方向に形成されて
いる。取付マウント4は金属製で、基板5の両側に脚部
6が連設され、基板5の中央部に電子機器筐体1を支持
する突部7がビス8により取付けられている。基板5の
後側には側板9が連設され、側板9の上縁に上記第1の
係合部2と係合し得る突条からなる係合部10が形成され
ている。基板5の前側部には上面第2の係合部3と係合
し得る第4の係合部としてロックレバー11が設けられて
いる。ロックレバー11は先端部内方に上記第2の係合部
3と係合し得る係合部12が突設され、先端部外方に操作
部13が突設されている。このロックレバー11はその基部
が基板5の前側に水平方向に取付けられた軸14に回動可
能に支持され、軸14に嵌装されたばね15の一側が基板5
に係合され、他側がロックレバー11に係合され、ロック
レバー11はばね15の弾性により先端の係合部12が後方の
第3の係合部10側に回動するように加圧されている。そ
して、電子機器筐体1の第1と第2の係合部2と3を取
付マウント4の第3と第4の係合部10と12に係合した状
態で電子機器筐体1が突起7を加圧し、基板5をやや弾
性変形し得るように設定されている。
FIG. 1 shows the configuration of one embodiment of the present invention.
As shown in FIG. 1, a first groove-shaped engaging portion 2 is formed on a rear side surface of the electronic device housing 1 in a horizontal direction, and a second groove-shaped engaging portion is formed on a front side surface of the electronic device housing 1. The part 3 is formed in the horizontal direction. The mounting mount 4 is made of metal. Legs 6 are continuously provided on both sides of the substrate 5, and a protrusion 7 for supporting the electronic device housing 1 is mounted at the center of the substrate 5 with screws 8. A side plate 9 is continuously provided on the rear side of the substrate 5, and an engaging portion 10 formed of a ridge that can be engaged with the first engaging portion 2 is formed on an upper edge of the side plate 9. A lock lever 11 is provided on the front side of the substrate 5 as a fourth engagement portion that can engage with the upper surface second engagement portion 3. The lock lever 11 has an engaging portion 12 protruding from the inside of the distal end portion and capable of engaging with the second engaging portion 3, and an operating portion 13 protruding from the distal end portion. The lock lever 11 has a base portion rotatably supported by a shaft 14 horizontally mounted on the front side of the substrate 5, and one side of a spring 15 fitted on the shaft 14
The other side is engaged with the lock lever 11, and the lock lever 11 is pressurized by the elasticity of the spring 15 so that the distal end engaging portion 12 rotates toward the rear third engaging portion 10 side. ing. When the first and second engaging portions 2 and 3 of the electronic device housing 1 are engaged with the third and fourth engaging portions 10 and 12 of the mounting mount 4, the electronic device housing 1 protrudes. 7 is set so that the substrate 5 can be slightly elastically deformed.

以上の構成において、以下、電子機器筐体1の取付動
作について説明する。
In the above configuration, the mounting operation of the electronic device housing 1 will be described below.

まず、取付マウント4を、基板5の取付穴(図示省
略)を利用して取付ねじ(図示省略)により車体等に取
付ける。次にこの取付マウント4の第3の係合部10に電
子機器筐体1の第1の係合部2を係合し、次に電子機器
筐体1を回動させ、その前側下部によりロックレバー11
の係合部12の上面傾斜部12aを押圧してロックレバー11
をばね15の弾性に抗して外方へ逃がし、電子機器筐体1
により突起7を加圧し、基板5をやや弾性変形させた状
態になると、ロックレバー11がばね15の弾性により復帰
し、第4の係合部12が電子機器筐体1の第2の係合部3
と係合する。この取付状態では電子機器筐体1により取
付マウント4の突部7を加圧して取付マウント4の基板
5を弾性変形させているので、この基板5の反撥弾性に
より、電子機器筐体1の第1の係合部2と第2の係合部
3を取付マウント4の第3の係合部10と第4の係合部12
に押圧し、強固に固定することができる。また、ロック
レバー11を操作部13の操作によりばね15の弾性に抗して
外方へ回動させることにより、第4の係合部12を第1の
係合部3より離脱させ、次に電子機器筐体1を回動さ
せ、第1の係合部2を第3の係合部10より離脱させるこ
とにより、電子機器筐体1を取付マウント4より離脱さ
せることができる。
First, the mounting mount 4 is mounted on a vehicle body or the like with mounting screws (not shown) using mounting holes (not shown) of the substrate 5. Next, the first engaging portion 2 of the electronic device housing 1 is engaged with the third engaging portion 10 of the mounting mount 4, and then the electronic device housing 1 is rotated and locked by the lower front portion. Lever 11
Pressing the upper inclined portion 12a of the engaging portion 12 of the lock lever 11
To the outside against the elasticity of the spring 15, and
When the projections 7 are pressed by the pressure and the substrate 5 is slightly elastically deformed, the lock lever 11 is returned by the elasticity of the spring 15, and the fourth engagement portion 12 is engaged with the second engagement of the electronic device housing 1. Part 3
Engage with. In this mounting state, the projection 5 of the mounting mount 4 is pressed by the electronic device housing 1 to elastically deform the substrate 5 of the mounting mount 4. The first engaging portion 2 and the second engaging portion 3 are connected to the third engaging portion 10 and the fourth engaging portion 12 of the mounting mount 4.
And firmly fixed. Further, the fourth engaging portion 12 is disengaged from the first engaging portion 3 by rotating the lock lever 11 outward by operating the operating portion 13 against the elasticity of the spring 15, By rotating the electronic device housing 1 and disengaging the first engaging portion 2 from the third engaging portion 10, the electronic device housing 1 can be disengaged from the mounting mount 4.

発明の効果 以上述べたように本発明によれば、電子機器筐体の第
1の係合部と第2の係合部を取付マウントの第3の係合
部と第4の係合部であるロックレバーに係合することに
より取付けることができ、この取付状態では電子機器筐
体により取付マウントの突部を加圧して取付マウントの
基板を弾性変形させているので、この基板の反撥弾性に
より、電子機器筐体の第1の係合部と第2の係合部を取
付マウントの第3の係合部と第4の係合部であるロック
レバーに押圧し、強固に固定することができる。また、
ロックレバーをばねの弾性により外方へ回動させること
により、電子機器筐体を取付マウントより離脱させるこ
とができる。このように電子機器筐体を取付マウントに
対し、工具を要することなく着脱することができ、着脱
操作を容易に、かつ短時間で行うことができる。また、
電子機器筐体を取付マウントに確実な固定状態に保持す
ることができ、激しい振動にも充分耐えることができ
る。また、構成部品点数が少ないので、コストの低下を
図ることができる。
Effect of the Invention As described above, according to the present invention, the first engagement portion and the second engagement portion of the electronic device housing are connected by the third engagement portion and the fourth engagement portion of the mounting mount. It can be mounted by engaging with a certain lock lever. In this mounted state, the projection of the mounting mount is pressed by the electronic device housing to elastically deform the substrate of the mounting mount. The first and second engaging portions of the electronic device housing are pressed against the lock levers, which are the third and fourth engaging portions of the mounting mount, and are firmly fixed. it can. Also,
By rotating the lock lever outward by the elasticity of the spring, the electronic device housing can be detached from the mounting mount. As described above, the electronic device housing can be attached to and detached from the mounting mount without using a tool, and the attaching / detaching operation can be performed easily and in a short time. Also,
The housing of the electronic device can be held securely on the mounting mount, and can withstand severe vibration. Further, since the number of components is small, the cost can be reduced.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明の一実施例における電子機器筐体の取付
装置を示し、取付状態の一部破断側面図、第2図および
第3図はそれぞれ従来の電子機器筐体の取付装置を示
し、第2図は取付前の状態の斜視図、第3図は取付状態
の側面図である。 1……電子機器筐体、2……第1の係合部、3……第2
の係合部、4……取付マウント、5……基板、7……突
部、10……第3の係合部、11……ロックレバー、12……
第4の係合部、15……ばね。
FIG. 1 shows a mounting device for an electronic device housing according to an embodiment of the present invention. FIG. 1 is a partially cutaway side view of the mounted state, and FIGS. 2 and 3 each show a conventional mounting device for an electronic device housing. FIG. 2 is a perspective view of a state before mounting, and FIG. 3 is a side view of the mounting state. 1 ... Electronic device housing, 2 ... First engagement part, 3 ... Second
.., Mounting mount, 5... Substrate, 7... Protruding portion, 10... Third engaging portion, 11... Lock lever, 12.
Fourth engagement portion, 15... Spring.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】電子機器筐体と、自動車に搭載する取付マ
ウントとを有する取付装置において、 上記電子機器筐体は、一側に形成された第1の係合部
と、他側に形成された第2の係合部とを有するものであ
り、 上記取付マウントは、略コの字状の形状をしており、基
板と、側板と、ロックレバーと、突部とを有するもので
あり、 上記側板は、上記基板の一側に取り付けられ、上記第1
の係合部に係合する第3の係合部を有するものであり、 上記ロックレバーは、上記基板の他側に回動可能に支持
されるとともに、ばねにより上記第3の係合部側に回動
するように加圧され、上記第2の係合部と弾撥的に係合
する第4の係合部とを有するものであり、 上記突部は、上記基板の中央部に形成されており、上記
第1、第3の係合部、および第2、第4の係合部が係合
しているときに、上記電子機器筐体が上記突部を押圧す
ることにより、上記基板を弾性変形させる長さのもので
ある、 電子機器筐体の取付装置。
1. A mounting device having an electronic device housing and a mounting mount mounted on an automobile, wherein the electronic device housing is formed on a first engagement portion formed on one side and on another side. The mounting mount has a substantially U-shape, and has a substrate, a side plate, a lock lever, and a protrusion, The side plate is attached to one side of the substrate, and
The lock lever is rotatably supported by the other side of the substrate, and a spring engages with the third engagement portion by a spring. And a fourth engaging portion resiliently engaged with the second engaging portion. The projecting portion is formed at a central portion of the substrate. When the first and third engagement portions and the second and fourth engagement portions are engaged, the electronic device housing presses the protrusion, whereby An electronic device housing attachment device having a length that allows a substrate to elastically deform.
JP1067001A 1989-03-17 1989-03-17 Electronic device housing mounting device Expired - Fee Related JP2814530B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1067001A JP2814530B2 (en) 1989-03-17 1989-03-17 Electronic device housing mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1067001A JP2814530B2 (en) 1989-03-17 1989-03-17 Electronic device housing mounting device

Publications (2)

Publication Number Publication Date
JPH02246195A JPH02246195A (en) 1990-10-01
JP2814530B2 true JP2814530B2 (en) 1998-10-22

Family

ID=13332268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1067001A Expired - Fee Related JP2814530B2 (en) 1989-03-17 1989-03-17 Electronic device housing mounting device

Country Status (1)

Country Link
JP (1) JP2814530B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0537596U (en) * 1991-10-29 1993-05-21 松下電器産業株式会社 Electronic device mounting device
JP4550297B2 (en) * 2001-01-30 2010-09-22 株式会社東海理化電機製作所 Vehicle communication device
JP6756643B2 (en) * 2017-03-07 2020-09-16 日本発條株式会社 How to attach / detach the in-vehicle unit support device and in-vehicle unit

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5541643U (en) * 1978-09-13 1980-03-17
JPS5787192A (en) * 1981-09-18 1982-05-31 Chuo Meiban Mfg Co Method of mounting part on printed circuit board

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JPH02246195A (en) 1990-10-01

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