JP2800046B2 - High frequency welder device and method for producing synthetic resin film sheet using the same - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency welder used for heat-sealing a synthetic resin film and a method for manufacturing a synthetic resin film sheet using the welder. More specifically, an improved high-frequency welder device for intermittently performing high-frequency dielectric heating and sealing bonding of tape pieces to a belt-shaped synthetic resin film sheet at predetermined intervals within a relatively short time, and the high-frequency welder The present invention relates to a method for manufacturing a belt-shaped synthetic resin film sheet to which tape pieces are joined using a welding device.

[Prior Art] Generally, in order to heat-seal a synthetic resin film sheet to each other, a high-frequency welder device using high-frequency dielectric heating is used, as is well known. As an example of this, FIG. 3 shows an outline of a high-frequency welder device for performing heat seal bonding between such synthetic resin film sheets.

That is, in the prior art apparatus shown in FIG. 3, reference numeral 1 denotes a power supply terminal of a commercial AC power supply, 2 denotes a voltage regulator for setting a power supply voltage, 3 denotes a high-voltage transformer that boosts the set power supply voltage to a predetermined voltage, and 4 denotes a high-voltage transformer. A rectifier 5 converts the boosted AC voltage into a DC voltage. The load switch 5 is inserted between the voltage regulator 2 and the high-voltage transformer 3 and is turned on / off by an input to a switching terminal 6. In this case, SSR
And non-contact load switches. Reference numeral 8 denotes a high-frequency oscillator that oscillates by receiving the supply of the DC voltage rectified by the rectifier 4. Although not shown here, it is composed of an oscillating tube, a capacitor, and the like as is well known. Further, 9 is a matching device for a high-frequency current from the high-frequency oscillator 8, and 10a is a seal electrode which receives the supply of the high-frequency current and performs heat seal bonding with a counter electrode (ground electrode) 10b by high-frequency dielectric heating.

One embodiment of this type of heat-seal bonding between synthetic resin film sheets is as shown in FIG. 4, in which a main sheet 11 made of a belt-shaped synthetic resin film sheet is used. A piece of tape on the surface
While the part of 12 is partially heat-sealed 13 and welded, the main sheet 11 is formed into a tube to fill with food (eg sausage),
The both ends are tied and packed. For the product packaged in this way, the attached tape piece 12 is forcibly peeled off from the welded joint and peeled off, whereby a part of the main sheet 11 is broken and the pack is opened. It can be carried out. To the heat seal joint 13 in this case, the high-frequency dielectric heating means using the high-frequency welder device described above is applied in the following manner.

In other words, in the packaging device for the food or the like,
The seal electrode 10a and the ground electrode 10b of the high-frequency welder device are incorporated into the inside of the device, and the main sheet 11 made of the band-shaped synthetic resin film sheet is provided between the seal electrode 10a and the ground electrode 10b, corresponding to the packaging operation cycle of the device. Then, the supply movement is performed intermittently, and the tape piece 12 is also supplied sequentially.At the same time, at a time repeated interval synchronized with the intermittent operation, these two are pressed and sandwiched with each other, By controlling the load switch 5 to be turned on and off, a high-frequency current is applied substantially every relatively short time to perform high-frequency dielectric heating. Is sealed 13.

In this case, the relationship between the sealing time and the sealing current at the time of the intermittent heat sealing joining 13 of the tape piece 12 to the main sheet 11 is as shown in the waveform explanatory diagram of FIG.

Here, the ON time of the non-contact load switch 5 for the heat seal joining 13, in other words, the sealing time t interrupted each time is determined by the degree of welding of the tape piece 12 to the main sheet 11 or the breakage. Normally 0.07se considering ease etc.
It is set to about c, and the sealing current I _A at that time, 120
Set to about mA. And in this case, for the sealing time t which is intermittently every time, after the on operation of the non-contact load break switch 5, the rise time until reaching the sealing current I _A heat sealable has been set current value 120mA and The rise time of the former is mainly a delay time for charging a capacitor in the high-frequency oscillator 8, and the delay time of switching operation in each part of the circuit is added to the rise time. The value is not necessarily constant, and this will affect the actual heating time for dielectric heating based on the discharge from the latter capacitor.

That is, for example, in the case of the example shown in FIG. 5, in the earliest first wave, the duration corresponding to the sealing time t is 0.07 sec.
Of these, the rise time occupies 0.02 sec and the heating time is substantially 0.05 sec. Similarly, in the next second wave, the rise time occupies 0.03 sec and the heating time is substantially 0.04 sec, and there is a difference of 0.01 sec between these two heating times.

[Problems to be solved by the invention]

As described above, in the conventional high-frequency welding device, the main sheet using the band-shaped synthetic resin film sheet is used.
In contrast to 11, when the tape piece 12 is intermittently heated at a predetermined interval within a relatively short period of time by high-frequency dielectric heating and sealed and joined 13,
Among the sealing times t interrupted each time, the effective heating time for actually performing the dielectric heating is the delay time for charging the oscillation current to the capacitor in the high-frequency oscillator, the delay time for the switching operation, and the like. However, there is a problem that the heat-sealing state, in other words, the welding-joining state is strongly affected by the influence of the rise time to which the heat-sealing is applied.

The present invention has been made in order to solve such a conventional problem, and an object of the present invention is to make the intermittent sealing time as small as possible as much as possible so that the sealing time is always accurate. An object of the present invention is to provide a high-frequency welder of this type and a method of manufacturing a synthetic resin film sheet using the high-frequency welder, which can quickly and reliably perform a heat sealing operation.

[Means for solving the problem]

In order to achieve the above object, a high-frequency welder device according to the present invention includes a bypass resistor having a required resistance value inserted in parallel with a load switch for performing on / off control for a heat sealing operation. It was made.

That is, the present invention relates to an apparatus for heat-sealing a tape piece to a main sheet made of a strip-shaped synthetic resin film sheet by performing high-frequency dielectric heating intermittently at predetermined intervals within a relatively short period of time. A high-frequency welder device comprising: a high-frequency welder device having a load switch for controlling on / off of a seal operation; and a bypass resistor having a predetermined resistance value connected in parallel with the load switch of the high-frequency welder device; A method for manufacturing a band-shaped synthetic resin film sheet to which tape pieces are joined, wherein a welder device is used.

[Action]

Therefore, in the high-frequency welder device according to the present invention, a bypass resistor having a required resistance value is inserted in parallel with the load switch for performing on / off control for the heat sealing operation. Even when the bowl is off,
The energization of the high-frequency oscillator is continued at a low current, and the capacitor in the high-frequency oscillator can be precharged with the high-frequency current, thereby reducing the rise time of the high-frequency current during the heat sealing operation, and consequently, Thus, the substantial heating time can be stabilized. By stabilizing the heating time, it is possible to manufacture a synthetic resin film sheet in a constant state at all times.

〔Example〕

Hereinafter, an embodiment of a high-frequency welder device according to the present invention and a method of manufacturing a synthetic resin film sheet using the high-frequency welder device will be described in detail with reference to FIG. 1 and FIG.

FIG. 1 is a block diagram showing an outline of a high-frequency welder device to which this embodiment is applied, and FIG. 2 shows a relationship between a sealing time and a sealing current at the time of heat sealing joining of a tape piece to a main sheet in the same device. FIG. 4 is a waveform explanatory diagram. In these drawings of the embodiments, the same reference numerals as those in the drawings of the conventional example denote the same or corresponding parts.

That is, in the apparatus of FIG.
Is a power supply terminal, 2 is a voltage regulator for setting a power supply voltage, 3 is a high-voltage transformer, 4 is a rectifier, and 5 is inserted between the voltage regulator 2 and the high-voltage transformer 3. A non-contact load switch using an SSR or the like that is controlled to be off, and 7 has a required resistance value that is newly added in this embodiment and that is arranged and connected in parallel with the load switch 5. It is a bypass resistor. Reference numeral 8 denotes a high-frequency oscillator composed of an oscillation tube and a capacitor. Reference numeral 9 denotes a high-frequency current matching device. Reference numeral 10a denotes high-frequency dielectric heating between a counter electrode (ground electrode) 10b receiving a high-frequency current. Is a seal electrode for performing heat seal bonding.

In other words, in the apparatus of this embodiment, the tape pieces 12 are intermittently subjected to high-frequency dielectric heating at predetermined intervals within a relatively short period of time with respect to the main sheet 11 made of a belt-shaped synthetic resin film sheet, thereby performing heat seal bonding. In the high-frequency welder device shown in FIG. 1, a bypass resistor 7 having a required resistance value is connected in parallel to a load switch 5 for turning on and off a heat sealing operation.

Therefore, in the configuration of this embodiment, as in the case of the conventional example,
Between the sealing electrode 10a and the ground electrode 10b of the high-frequency welder device, a main sheet made of a band-shaped synthetic resin film sheet
11 and a piece of tape 12 of the same effect are intermittently supplied in accordance with the packaging operation cycle of the apparatus, and both are added at a repetition interval within a relatively short time synchronized with the intermittent operation. At the same time, the heat seal joining 13 can be performed as in the initial stage by controlling the load switch 5 to be turned on and off while performing the pressure clamping.

In the configuration of this embodiment, the relationship between the sealing time and the sealing current at the time of the heat seal joining 13 of the tape piece 12 to the main sheet 11 intermittently performed as described above is the same as that of the above-described conventional configuration. If you set the appropriate conditions,
As shown in FIG. 2, since the capacitor in the high-frequency oscillator 8 is always precharged with the high-frequency current by the bypass resistor 7 connected in parallel with the load switch 5, the following is performed. Become.

That is, according to the ON time of the load switch 5, 1
The time required for the rising of the high-frequency current in the sealing time t interrupted every time is
Conventionally, the delay time for charging the capacitor, which occupies most of the time, has been eliminated, and only the switching operation delay time has been eliminated. It is possible to secure the substantial dielectric heating time very stably, so that the expected heat seal joint 13 is always
It can be done in a constant state.

〔The invention's effect〕

As described above in detail, according to the present invention, even when the load switch is turned off, energization to the high-frequency oscillator is continued at a low current, and high-frequency current can be precharged to a capacitor in the high-frequency oscillator. Thus, the rise time of the high-frequency current during the heat sealing operation can be reduced, and the substantial dielectric heating time can be stabilized. Further, structurally, the bypass resistor for the load switch is simply provided. It is extremely simple because it only requires parallel connection, and it has excellent features such as easy implementation.By using such a high-frequency welding device, it is possible to constantly manufacture a band-shaped synthetic resin film sheet to which a tape piece is joined. Since the heat sealing operation can be performed in a constant state, an accurate and reliable heat sealing operation can be quickly performed.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an outline of a high-frequency welder device to which one embodiment of the present invention is applied, and FIG. 2 is a seal time and a seal current when a tape piece is heat-sealed to a main sheet in the above-mentioned embodiment device. FIG. 3 is a block diagram showing an outline of a conventional high-frequency welder device, FIG. 4 is a plan view showing an example of heat seal bonding between synthetic resin film sheets, FIG. 5 is an explanatory diagram showing a relationship between a sealing time and a sealing current in heat sealing bonding of a tape piece to a main sheet in the above-described conventional apparatus. DESCRIPTION OF SYMBOLS 1 ... Power supply terminal 2 ... Voltage regulator 3 ... High voltage transformer 4 ... Rectifier 5 ... Load switch 6 ... Switching terminal 7 ... Bypass resistor 8 ... High frequency oscillator 9 ... Matching 10a… Seal electrode 10b… Counter electrode, 11… Main sheet 12… Tape piece 13… Heat seal bonding

Claims (2)

(57) [Claims] An apparatus for heat-sealing a tape piece to a main sheet made of a strip-shaped synthetic resin film sheet by high-frequency dielectric heating intermittently at predetermined intervals within a relatively short period of time, and performing heat-sealing operation. A high-frequency welder device comprising a load switch having a required resistance value connected in parallel with a load switch of the high-frequency welder device having a load switch for controlling ON / OFF of the switch. 2. A high-frequency welding device for intermittently heat-sealing a tape piece to a main sheet made of a belt-shaped synthetic resin film sheet at a predetermined interval within a relatively short time. In the method for producing a strip-shaped synthetic resin film sheet, the high-frequency welter device includes a load switch for controlling on / off of a heat sealing operation, and has a required resistance value in parallel with the load switch. A method for producing a band-shaped synthetic resin film sheet to which a tape piece is joined, wherein a high-frequency welding device to which a resistor is connected is used.