JP2799062B2 - Electronic component mounting equipment - Google Patents
Electronic component mounting equipmentInfo
- Publication number
- JP2799062B2 JP2799062B2 JP2275378A JP27537890A JP2799062B2 JP 2799062 B2 JP2799062 B2 JP 2799062B2 JP 2275378 A JP2275378 A JP 2275378A JP 27537890 A JP27537890 A JP 27537890A JP 2799062 B2 JP2799062 B2 JP 2799062B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- height
- head
- suction
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、電子部品を吸着保持する着脱自在な吸着手
段を有する電子部品実装装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial application field) The present invention relates to an electronic component mounting apparatus having detachable suction means for suction holding an electronic component.
（従来の技術） 電子部品実装装置では、異形チップ部品やフラットパ
ッケージIC等様々な電子部品をプリント基板上に実装す
る。これらの部品実装は、部品を確実に吸着し、その後
部品を部品位置決め高さまで上昇させヘッドに付属して
いるチャックにより部品を４方向から把持することによ
り部品の位置補正を行ない、プリント基板上に実装す
る。この際、部品を確実に吸着するために、その部品に
適合した形状のノズルが必要であるので、部品の種類に
応じてノズルの交換を行なう。(Prior Art) In an electronic component mounting apparatus, various electronic components such as odd-shaped chip components and flat package ICs are mounted on a printed circuit board. In mounting these components, the components are securely sucked, then the components are lifted to the component positioning height, and the components are corrected from four directions by chucking the components with the chuck attached to the head, and the components are corrected on the printed circuit board. Implement. At this time, a nozzle having a shape suitable for the component is necessary in order to surely suck the component, so the nozzle is replaced according to the type of the component.
以下、図面を用いて、従来の電子部品実装装置を説明
する。Hereinafter, a conventional electronic component mounting apparatus will be described with reference to the drawings.
第４図に示すように、部品を実装する場合、その実装
する部品に適合するノズルを予め設定されたデータを基
にノズルストッカ１から選出し、その選出されたノズル
は、XYロボット２がノズルストッカ１内のノズル位置へ
移動し、ヘッド３に取付けられる。ヘッド３にノズルを
取付けたら、XYロボット２は、部品供給部４まで移動
し、そこでノズルに電子部品を真空吸着する。その後、
XYロボット２はプリント基板５へ移動し、ヘッド３は電
子部品を吸着した状態で部品位置決め高さH1まで上昇す
る。第５図に示すように、ヘッド３が部品位置決め高さ
H1まで上昇すると、４方向からチャック６が電子部品７
を把持して位置決めを行なう。更に、第６図に示すよう
に、位置決めが完了したら、ヘッド３は実装位置の基板
上面の高さH2より電子部品の高さH3分上方まで下降して
電子部品をプリント基板へ実装する。これにより、電子
部品７を吸着してから実装するまでの作業を正確に実行
していた。As shown in FIG. 4, when mounting a component, a nozzle suitable for the component to be mounted is selected from the nozzle stocker 1 based on preset data. It moves to the nozzle position in the stocker 1 and is attached to the head 3. When the nozzle is attached to the head 3, the XY robot 2 moves to the component supply unit 4, where the electronic component is vacuum-sucked to the nozzle. afterwards,
XY robot 2 moves to the printed board 5, the head 3 is raised in a state of sucking the electronic component to component positioning height H 1. As shown in FIG. 5, the head 3 has a component positioning height.
When ascending to H 1, the chuck 6 becomes the electronic component 7 from four directions.
To perform positioning. Furthermore, as shown in FIG. 6, after the positioning is completed, the head 3 for mounting electronic components to a printed circuit board descends from the height H 2 of the upper surface of the substrate mounting position to a height H 3 minutes above the electronic component . As a result, the operation from mounting the electronic component 7 to mounting the electronic component 7 has been performed accurately.
（発明が解決しようとする課題） しかし、上記従来の電子部品実装装置においては、交
換したノズルの高さが前のノズルの高さと異なっていた
り、ノズルの長期使用による磨耗で高さが変化していた
場合、予め設定されていた高さで電子部品を吸着保持で
きなかったり、電子部品の位置決めが正確に行なえなか
ったり、実装時の高さが基板の高さまで足りなかったり
して吸着不良や装着不良を発生することがあった。(Problems to be Solved by the Invention) However, in the above-described conventional electronic component mounting apparatus, the height of the replaced nozzle is different from the height of the previous nozzle, or the height changes due to wear due to long-term use of the nozzle. The electronic component cannot be suction-held at the preset height, the electronic component cannot be positioned accurately, or the mounting height is not enough to the height of the board. In some cases, mounting failure occurred.
そこで、本発明は、ノズルの高さが変化することによ
る電子部品の吸着不良や吸着不良を無くし、電子部品の
吸着から装着までを常に安定して行える電子部品実装装
置を提供することを目的とする。Accordingly, an object of the present invention is to provide an electronic component mounting apparatus that eliminates suction failure and suction failure of an electronic component due to a change in the height of a nozzle, and can always stably perform suction to mounting of the electronic component. I do.
［発明の構成］ （課題を解決するための手段） 上記目的を達成するために、本発明は、電子部品を吸
着保持する着脱自在な吸着手段を有する電子部品実装装
置において、前記吸着手段の基準高さを設定する設定手
段と、前記吸着手段の移動経路にこの吸着手段の検出セ
ンサを有し、この検出センサの検出領域内と検出領域外
との間にて前記吸着手段を移動させたときのその移動中
における前記検出センサの出力値の変化に基づいて前記
吸着手段の実高さを検出する検出手段と、前記設定手段
からのデータと前記検出手段からのデータとを基に前記
吸着手段の高さ偏差量を算出する演算手段と、この演算
手段からの偏差量を基に前記吸着手段の動作量を制御す
る制御手段とを具備したことを特徴とする。[Means for Solving the Problems] In order to achieve the above object, the present invention relates to an electronic component mounting apparatus having a detachable suction means for sucking and holding an electronic component. Setting means for setting a height, and a detection sensor for the suction means in a moving path of the suction means, and when the suction means is moved between a detection area of the detection sensor and outside the detection area. Detecting means for detecting the actual height of the suction means based on a change in the output value of the detection sensor during the movement thereof; and the suction means based on data from the setting means and data from the detection means. And a control means for controlling the operation amount of the suction means on the basis of the deviation amount from the calculation means.
（作用） このように構成された本発明の電子部品実装装置によ
れば、吸着手段の交換や磨耗などにより吸着手段の高さ
が変化した場合でも、検出手段による吸着手段の実高さ
のデータと設定手段のデータとを基に吸着手段の高さ偏
差量が算出手段にて算出され、その偏差量を基に吸着手
段の動作量が制御される。(Operation) According to the electronic component mounting apparatus of the present invention configured as described above, even when the height of the suction unit changes due to replacement or wear of the suction unit, the data of the actual height of the suction unit by the detection unit. The height deviation amount of the suction unit is calculated by the calculation unit based on the data of the setting unit and the data of the setting unit, and the operation amount of the suction unit is controlled based on the deviation amount.
（実施例） 以下、本発明の実施例を図面を用いて詳細に説明す
る。(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
第１図に示すように、本実施例は、電子部品10を吸着
保持するノズル11と、このノズル11を有するヘッド12
と、このヘッド12の基準高さを設定する設定回路13と、
ヘッド12の実高さを検出する検出回路14と、設定回路13
からのデータと検出回路14からの計数値とを基にヘッド
12の高さ偏差量を算出する演算回路15と、この演算回路
15からの偏差量を基にヘッド12の動作量を制御する制御
回路16を有している。また、検出回路14は、パルスカウ
ンタ17と透過形センサ18とから構成される。As shown in FIG. 1, this embodiment includes a nozzle 11 for sucking and holding an electronic component 10 and a head 12 having the nozzle 11.
A setting circuit 13 for setting a reference height of the head 12,
A detection circuit 14 for detecting the actual height of the head 12, and a setting circuit 13
Head based on the data from the
An arithmetic circuit 15 for calculating the height deviation amount of 12, and this arithmetic circuit
It has a control circuit 16 for controlling the operation amount of the head 12 based on the deviation amount from 15. The detection circuit 14 includes a pulse counter 17 and a transmission sensor 18.
このように構成された本実施例においては、まずノズ
ルストッカ（図示せず）よりノズル11をヘッド12に取付
け、その後ヘッド12は所定の基準高さHSまで下降し、パ
ルスカウンタ17のカウンタを「０」にリセットする。そ
して、この位置からヘッド12は上昇限HLまで上昇する。
そして、この間パルスカウンタ17は、基準高さHSからヘ
ッド12の実高さの検出を開始して、基準高さHSと上昇限
HLとの間に設けられた透過形センサ18が上昇中のヘッド
12の位置変化に伴って「ON」から「OFF」になった時点
でパルスカウンタ17はヘッド12の実高さの検出を終了す
る。従って、この時のパルスカウンタ17の計数値が基準
高さHSから透過形センサ18が設けられている位置、即ち
ノズル11を考慮したヘッド12の実高さを示している。In the present embodiment having such a configuration, first, a nozzle stocker mounting the nozzle 11 from the (not shown) in head 12, then the head 12 is lowered to a predetermined reference height H S, the counter of the pulse counter 17 Reset to "0". Then, from this position, the head 12 moves up to the ascending limit HL .
Then, during this time the pulse counter 17 starts the detection of the actual height of the head 12 from the reference height H S, reference height H S and the ascent limit
The head in which the transmission sensor 18 provided between H and L is rising
When the position of the head 12 changes from “ON” to “OFF” in accordance with the position change, the pulse counter 17 ends the detection of the actual height of the head 12. Accordingly, the count value of the pulse counter 17 at this time indicates the actual height of the reference position where the transmission type sensor 18 is provided from the height H S, or head 12 in consideration of the nozzle 11.
次に、XYロボット（図示せず）は、部品供給部の位置
まで移動して、ヘッド12により電子部品の吸着を行な
う。電子部品の吸着は、部品供給部の電子部品がある高
さまでヘッド12が下降して行なわれる。電子部品の吸着
が終了すると、XYロボット（図示せず）は、プリント基
板上の実装位置まで移動すると共に、ヘッド12は、所定
の部品位置決め高さまで上昇する。その後、所定の部品
位置決め高さまで上昇したら、４方向からチャック（図
示せず）が吸着している電子部品の位置決め補正を行な
い、位置決めが完了した後、ヘッド12は実装位置のプリ
ント基板上面の高さから電子部品の高さ分を考慮した高
さまで下降して電子部品をプリント基板上に実装する。Next, the XY robot (not shown) moves to the position of the component supply unit and causes the head 12 to suck the electronic component. The suction of the electronic component is performed by lowering the head 12 to a height at which the electronic component in the component supply unit is located. When the suction of the electronic components is completed, the XY robot (not shown) moves to the mounting position on the printed circuit board, and the head 12 moves up to a predetermined component positioning height. Thereafter, when the electronic component is raised to a predetermined component positioning height, the chuck (not shown) corrects the position of the electronic component sucked from four directions, and after the positioning is completed, the head 12 moves to the height of the upper surface of the printed board at the mounting position. Then, the electronic component is lowered to a height considering the height of the electronic component, and the electronic component is mounted on a printed circuit board.
以上の動作を実行するときのノズル11の動作制御につ
いて詳述すると、ノズル11交換時に上記検出回路14によ
りノズル11を考慮したヘッド12の実高さを検出する。そ
して、この検出した値と予め設定した基準値（ノズル11
を考慮したヘッド12の基準高さ）とを比較演算して、両
者の偏差量を算出する。その後、予め設定されたヘッド
12の動作点での高さ（電子部品吸着高さ・電子部品位置
決め高さ・電子部品装着高さ）から上記偏差量を差引い
て、ヘッド12の実動作量を算出する。そして、この算出
された実動作量を基にヘッド12を駆動制御することによ
り常時一定の高さでの動作が実現できる。The operation control of the nozzle 11 when executing the above operation will be described in detail. When the nozzle 11 is replaced, the detection circuit 14 detects the actual height of the head 12 considering the nozzle 11. Then, the detected value is compared with a preset reference value (nozzle 11).
Is compared with the reference height of the head 12 in consideration of the above, and a deviation amount between them is calculated. After that, the preset head
The actual movement amount of the head 12 is calculated by subtracting the above-mentioned deviation amount from the height at the 12 operation points (electronic component suction height, electronic component positioning height, electronic component mounting height). Then, by controlling the drive of the head 12 based on the calculated actual operation amount, an operation at a constant height can be always realized.
また上述の実施例においては、ヘッド12を基準高さHS
と上昇限HLとの間で移動させ、このヘッド12の移動中に
て、透過形センサ18の出力が、ヘッド12を検出している
「ON」から検出しなくなる「OFF」になった時点を用い
てヘッド12の実高さを検出するようにしているため、ヘ
ッド12の検出センサとしては、実施例に記載されたよう
な検出領域の比較的狭い簡易なもので充分達成できる。In the above-described embodiment, the head 12 is set at the reference height H S
When the moving between the ascent limit H L, at During the movement of the head 12, the output of the transmission type sensor 18, becomes no longer detected from the "ON" which detects the head 12 "OFF" and Is used to detect the actual height of the head 12, so that a simple sensor having a relatively narrow detection area as described in the embodiment can be sufficiently achieved as the detection sensor of the head 12.
［発明の効果］ 以上述べたように、本発明によれば、簡易な構成にも
かかわらず、ノズルの変化によるヘッドの動作点での高
さ変化を補正し、常時一定の高さでヘッドを動作させる
ことができるので、ヘッドの各動作点での不良動作、例
えば、電子部品の吸着ミス、位置決めミスや装着ミスを
大幅に低減でき、電子部品の装着率が著しく向上すると
いった極めて有用な効果を奏する。[Effects of the Invention] As described above, according to the present invention, despite a simple configuration, a change in height at the operating point of the head due to a change in nozzle is corrected, and the head is constantly kept at a constant height. Since it can be operated, it is possible to greatly reduce defective operation at each operation point of the head, for example, a suction error, a positioning error and a mounting error of an electronic component, and a very useful effect that a mounting rate of the electronic component is remarkably improved. To play.
第１図は、本発明の一実施例を示す概要構成図、第２図
及び第３図は、第１図に示した一実施例の高さ制御を示
す概要図、第４図乃至第６図は、従来の電子部品実装装
置を示す概要図である。 10……電子部品,11……ノズル， 12……ヘッド,13……設定回路， 14……検出回路,15……演算回路， 16……制御回路,17……パルスカウンタ， 18……透過形センサFIG. 1 is a schematic configuration diagram showing an embodiment of the present invention, FIGS. 2 and 3 are schematic diagrams showing height control of the embodiment shown in FIG. 1, and FIGS. FIG. 1 is a schematic diagram showing a conventional electronic component mounting apparatus. 10 ... Electronic parts, 11 ... Nozzle, 12 ... Head, 13 ... Setting circuit, 14 ... Detection circuit, 15 ... Operation circuit, 16 ... Control circuit, 17 ... Pulse counter, 18 ... Transmission Shape sensor
Claims (1)
段を有する電子部品実装装置において、前記吸着手段の
基準高さを設定する設定手段と、前記吸着手段の移動経
路にこの吸着手段の検出センサを有し、この検出センサ
の検出領域内と検出領域外との間にて前記吸着手段を移
動させたときのその移動中における前記検出センサの出
力値の変化に基づいて前記吸着手段の実高さを検出する
検出手段と、前記設定手段からのデータと前記検出手段
からのデータとを基に前記吸着手段の高さ偏差量を算出
する演算手段と、この演算手段からの偏差量を基に前記
吸着手段の動作量を制御する制御手段とを具備したこと
を特徴とする電子部品実装装置。An electronic component mounting apparatus having detachable suction means for sucking and holding an electronic component, a setting means for setting a reference height of the suction means, and detection of the suction means on a moving path of the suction means. A sensor, and based on a change in the output value of the detection sensor during the movement of the suction device when the suction device is moved between the inside of the detection area and the outside of the detection region of the detection sensor, Detecting means for detecting the height; calculating means for calculating the height deviation amount of the suction means based on the data from the setting means and data from the detecting means; and calculating the height deviation amount from the calculating means. An electronic component mounting apparatus, further comprising control means for controlling an operation amount of the suction means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2275378A JP2799062B2 (en) | 1990-10-16 | 1990-10-16 | Electronic component mounting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2275378A JP2799062B2 (en) | 1990-10-16 | 1990-10-16 | Electronic component mounting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04152600A JPH04152600A (en) | 1992-05-26 |
| JP2799062B2 true JP2799062B2 (en) | 1998-09-17 |
Family
ID=17554653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2275378A Expired - Fee Related JP2799062B2 (en) | 1990-10-16 | 1990-10-16 | Electronic component mounting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2799062B2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63186499A (en) * | 1987-01-29 | 1988-08-02 | 株式会社日立製作所 | Automatic correction of wear of attraction nozzle in electronic parts mounter |
| JPH0682956B2 (en) * | 1988-10-21 | 1994-10-19 | 三洋電機株式会社 | Parts mounting device |
| JP2814661B2 (en) * | 1990-03-07 | 1998-10-27 | 松下電器産業株式会社 | Electronic component mounting apparatus and electronic component mounting method |
-
1990
- 1990-10-16 JP JP2275378A patent/JP2799062B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04152600A (en) | 1992-05-26 |
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