JP2796007B2 - Method of manufacturing ink jet printer head - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an on-demand type ink jet printer head.

[0002]

2. Description of the Related Art An ink jet printer head has an invention disclosed in Japanese Patent Application Laid-Open No. 2-150355. This will be described below with reference to FIG. 30 is a bottom sheet.
This bottom sheet 30 has a polarity in the direction of the arrow, and has a number of parallel grooves 31 and side walls 32 located on both sides of these grooves 31.
And a bottom surface 33. Then, the top sheet 35 is bonded to the top 34 of the side wall 32 with the adhesive layer 36, so that the top opening surfaces of the grooves 31 are closed. Metal electrodes 37 are formed on the inner surface of the side wall 32, which is both inner surfaces of each groove 31, by vapor deposition in a range of approximately half of the total height on the side of the top sheet 35.

That is, the bottom sheet 30 is held by a jig in a vacuum deposition apparatus, and a parallel beam of vapor-deposited metal atoms is directed toward the bottom sheet 30 at an angle of δ with respect to a side wall 32 as shown in FIG. Thereby, a metal film is deposited on a part of one surface of the side wall 32. continue,
With the bottom sheet 30 rotated 180 degrees in the horizontal direction in FIG. 8, a parallel beam of vapor-deposited metal atoms is guided to the bottom sheet 30 in the same manner as the operation described above. As a result, the metallized electrode 37 is formed in a substantially half area on the upper side of both side surfaces of the side wall 32.
Is deposited. At this time, the metal film deposited on the top 34 of the side wall 32 is removed in the next step.

A pressure chamber is formed by closing each groove 31 with a top sheet 35, a supply port connected to an ink supply section is provided at one end of these pressure chambers, and ink is supplied to the other end of the pressure chamber. By providing a discharge port for discharging, an ink jet printer head is completed.

In such an ink jet printer head, when voltages of opposite potentials are applied to the electrodes 37 of two adjacent side walls 32, respectively, the side walls 32 of this portion are applied.
Receives a potential in a direction orthogonal to the polarity of the bottom sheet 30 in the direction of the arrow, and causes shear strain as shown by a dotted line in FIG. As a result, the volume of the pressure chamber (groove 31) between the side walls 32 in which the shear strain has occurred sharply decreases, the pressure in the pressure chamber is increased, and the ink is ejected from the ejection port.

Next, the invention described in JP-A-63-247051 will be described. As shown in FIG. 9A, a flow path 42 is formed by being surrounded by a bottom wall 38, a hard wall 39, a top wall 40, and an actuator 41. An actuator 41 formed of piezoelectric ceramic and polarized in the Z-axis direction has a strip seal 43 at one end, which is in contact with a top wall 40, and a lower end is coupled to the bottom wall 38. Electrodes 44, 4 are provided on both sides of the actuator 41.
5 are formed. Further, a nozzle 46 is formed at the tip of the flow path 42. Therefore, when the ink is supplied from the ink supply unit to the flow channel 42 and an electric field is applied to the electrodes 44 and 45, the actuator 41 is distorted and the volume of the flow channel 42 is compressed as shown in FIG. Is ejected from the nozzle 46.

[0007]

Problems to be Solved by the Invention Japanese Patent Laid-Open No. 2-15035
The invention disclosed in Japanese Patent Publication No. 5 has the following four problems. The first problem is that the distortion amount (displacement amount) of the side wall 32 cannot be increased. That is, the side wall 32
Of the bottom sheet 30 by applying a voltage to a pair of electrodes 37 facing each other with the groove 31 interposed therebetween. In this case, the sidewall 32 is distorted. At this time, the sidewall 32 reduces the distortion of the upper portion (the portion where the electrode 37 is formed) in the lower portion (the electrode 37).
(The part where is not formed). Thereby, the lower part of the side wall 32 becomes a resistance when the upper part of the side wall 32 is distorted. Further, since the side walls 32 themselves are all formed of the same material (piezoelectric material) and have high rigidity, the side walls 3
No. 2 distortion cannot be increased. Thereby, the volume change amount of the pressure chamber is also reduced.

The second problem is that the method for forming the electrodes is complicated and the cost is high. First, the manufacturing cost increases because the electrode 37 is formed using an expensive vacuum evaporation apparatus. Further, in order to form the electrode 37 only on a part of the side wall 32 (substantially half of the depth of the groove 31), the side wall 32 is controlled at an angle of δ to emit a parallel beam of vapor-deposited metal atoms. Since the electrode 37 is formed on one surface of the side wall 32 and then the bottom sheet 30 is rotated by 180 degrees to emit a parallel beam again to form the electrode 37 on the other surface of the side wall 32, the manufacturing process is performed. Costs are even higher.

[0009] A third problem is that a uniform electric field cannot be applied to the bottom sheet 30 formed of the piezoelectric material. That is, since the piezoelectric material used as the material of the bottom sheet 30 is generally a fired member in which crystal grains are gathered, the ground surface formed to form the groove 31 is a roughened surface in which the crystal grains appear as they are. . On the other hand, when the metal is deposited by the vacuum deposition apparatus for forming the electrode 37, the metal is not deposited on a portion that does not face the deposited metal atom emission source. Therefore, metal is vapor-deposited only on the convex portion on the surface of the ground surface of the groove 31 and not on the concave portion, and this concave portion becomes a pinhole. For this reason, a uniform electric field cannot be applied to the bottom sheet 30.

A fourth problem is that the ground surface of the groove 31 is corroded by contact with the ink, so that it is necessary to form a protective film, but it is difficult to form the protective film. As described above, the bottom sheet 30 is formed of a fired member in which crystal grains are gathered, and a ground surface having irregularities generated when the grooves 31 are formed is corroded when coming into contact with ink. However, since the electrode 37 has a pinhole for the above-described reason, the function as a protective film cannot be expected.

Next, the invention described in JP-A-63-247051 will be described. The first problem is FIG.
As shown in (1), a strip seal 43 having a size corresponding to the cross-sectional shape of the actuator 41 must be fixed to one end of a large number of actuators 41, which requires a great number of man-hours.

The second problem is that the actuator 41, the bottom wall 38, and the hard wall 39 are in contact with the ink, and no measures are taken to prevent corrosion by the ink. The top wall 40 can be selected from a relatively wide range of material types that do not corrode, and the plate-shaped surface alone can be easily coated with a corrosion-resistant protective film. 41, the bottom wall 38, and the hard wall 39 are formed by cutting a groove (flow path 42) in an integral piezoelectric ceramic, and the electrode 45 is provided in the groove. As described above, the method of providing the electrode 45 only on a part of the surface in the groove made of the same material can be considered only to be the above-described method by vacuum evaporation or sputtering in consideration of the width of the groove. Has a pinhole. Further, the bottom wall 38 and the hard wall 39 have a structure in contact with the ink, and corrosion by the ink is expected. For this reason, it is conceivable to coat the inside of the groove with a protective film, but a general method such as a vacuum evaporation method or a sputtering method is that the coating film is formed only on the surface facing the evaporation source of the coating substance. Yes, actuator 41, bottom wall 3
8. It is impossible to form a protective film on the uneven cut surface of the hard wall 39.

[0013]

According to the present invention, a piezoelectric member polarized in the thickness direction is fixed to a lower layer made of a resin material.
A plurality of grooves extending from the surface of the piezoelectric member to the inside of the lower layer and a plurality of columns arranged on both sides of the grooves are formed, and a solvent of alcohol is used for the lower layer and the piezoelectric member. After performing a cleaning process, a catalyst application process for electroless plating is performed, and an electrode is formed on the surface of the column that becomes the inner surface of the groove by immersing the lower layer and the piezoelectric member in an electroless plating solution. A plurality of pressure chambers connected to an ink supply unit and an ink discharge unit, respectively, are formed by joining a top plate to the surface of the piezoelectric member and closing an opening surface of the groove.

[0014]

According to the present invention, a voltage is applied to the electrode formed on the surface of the column to distort the column, and the pressure in the pressure chamber is changed to cause ink to fly from the ink discharge section. Since the support can be formed by the support and the lower support made of a resin lower layer having a relatively small rigidity as compared with the piezoelectric member, the resistance of the lower support to the distortion of the upper support can be reduced. By increasing the amount of distortion of the entire column, the ejection characteristics of ink droplets can be improved.

Further, since the electrodes are formed by electroless plating, a uniform electrode without pinholes is formed on the surface of the piezoelectric member having irregularities, and therefore, a uniform electric field is applied to the piezoelectric member. In addition, since the piezoelectric member can be isolated from the ink by the electrode, corrosion of the piezoelectric member can be prevented. Furthermore, since the electrode forming method by electroless plating is a chemical treatment, a large amount of treatment can be performed at a time, thereby reducing the manufacturing cost.

Further, by performing washing and hydrophilizing treatment with an alcoholic solvent before the electroless plating step, the solvent can be easily removed from the fine grooves after the treatment, and therefore, the adhesion of the electroless plating can be improved. In addition, since the inner surface of the groove of the piezoelectric member has an uneven surface, an anchor effect can be obtained at the time of electroless plating, and therefore, peeling of the electrode can be prevented.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIGS. First, the configuration of the ink jet printer head will be described in order of the manufacturing process with reference to FIGS.
As shown in FIG. 1A, a resin-based adhesive mainly composed of an epoxy resin having a high adhesive strength is applied to a substrate 1 formed of aluminum or glass having high rigidity and low thermal deformation. The piezoelectric member 2 polarized in the thickness direction is brought into contact with the adhesive, and the adhesive is cured, so that the substrate 1, the lower layer 15 made of the adhesive, and the piezoelectric member 2
Are joined in a three-layer structure. As the adhesive used as the lower layer 15, a general structural adhesive is used, but a defoaming process is performed to avoid mixing of air bubbles. Also, the piezoelectric member 2
The curing temperature of the adhesive is 130 ° C to prevent polarization deterioration of
It is desired that: In this example, an adhesive having a product name of 2651 manufactured by Grace Japan Co., Ltd. was used.

Subsequently, as shown in FIG. 1B, a large number of grooves 3 reaching from the surface of the piezoelectric member 2 to the inside of the lower layer 15 are ground in parallel at predetermined intervals. Prior to this, the bottom surface of the substrate 1 is cut with reference to the surface of the piezoelectric member 2 to make the sum of the thicknesses of the substrate 1, the lower layer 15 and the piezoelectric member 2 constant, and the rigid and warped substrate 1 is cut. By fixing to the bed of the machine and determining the grinding feed amount based on this bed, the depth of each groove 3 can be made constant. Of course, the same object can be achieved even if the grinding feed amount is determined based on the upper surface of the piezoelectric member 2 without performing the pre-processing of the groove processing. In this process, columns 4 located on both sides of the groove 3 are also formed. These columns 4 are formed by the upper column 4 a formed by the piezoelectric member 2 and the lower layer 15 having low rigidity.
And a lower support 4b. In the present embodiment, the width of the groove 3 was 86 μm, the arrangement pitch of the grooves 3 was 169 μm, the depth of the groove 3 was 375 μm, and the thickness of the piezoelectric member 2 was 240 μm. As a tool used for cutting the groove 3, a diamond wheel of a dicing saw that cuts a wafer when an IC substrate is formed is used. In the present embodiment, NBCZ1080 or 10
90 2 inch blades at 30000r. p. m. The grinding was performed by rotating at a rotation speed of.

Next, cleaning, catalyzing, and accelerating processes are performed as pretreatment before forming electrodes by electroless plating. The cleaning is performed for the purpose of activating the plating surface and hydrophilizing the catalyst liquid and the plating liquid so as to easily enter the groove 3. In this embodiment, the cleaning is performed using an ethanol liquid. Was. The catalizing treatment includes palladium chloride, stannous chloride,
It is immersed in a catalyst solution made of concentrated hydrochloric acid or the like to adsorb a complex of Pd and Sn on the surface of the groove 3. When the catalizing process is performed, a complex of Pd and Sn is adsorbed on the surface of each of the upper support 4a and the lower support 4b on the groove 3 side.
The complexed compound b has a larger amount of tin than the complexed material of the upper support 4a. Subsequently, an accelerating process is performed. This treatment is performed by immersing in a liquid such as hydrochloric acid, removing tin from the adsorbed complex by the catalizing treatment,
This is a process performed for the purpose of leaving only d. When this treatment is performed, the complex adsorbed on the upper support 4a becomes metallized Pd, and the complex adsorbed on the surface of the lower support 4b on the groove 3 side has a large amount of tin adsorbed thereon, so that tin is sufficient. Remains unremoved. If the above-mentioned catalyzing treatment and accelerating treatment are performed with the relative speed between the object to be plated and the treatment liquid being 0.2 m / s or more, the pretreatment in the narrow groove 3 can be performed well, and plating without spots can be achieved. It is formed. In the present example, the method was performed by a method without performing the surface roughening process which is usually performed as a pretreatment for plating. The reason is that the cleaning method using no surfactant is used in the cleaning process, so that no surfactant remains on the surface of the groove 3 and the surface of the piezoelectric member is rough even without performing the surface roughening process. This is because the adhesion of the plating is sufficient and the surface roughening step is not required.

Next, a mask is applied to the surface of the piezoelectric member 2 except for the wiring pattern forming portion. In this method, as shown in FIG. 1C, a dry film 5 is attached to the surface of the piezoelectric member 2. Further, as shown in FIG. 2A, a resist mask 6 is placed thereon, and exposure and development are performed. As a result, as shown in FIG. 2B, a resist film 7 of a dry film is formed on the surface of the piezoelectric member 2 except for the wiring pattern forming portion and the upper portion of the groove 3. And
The metallized Pd exists on the wiring pattern forming portion of the piezoelectric member 2 and the surface of the upper support 4a on the groove 3 side, and the lower support 4
A state in which a complex of Pd and Sn exists on the surface on the side of the bk groove 3 is obtained.

Next, the substrate subjected to the above treatment is immersed in a plating solution to perform electroless plating. The plating solution is formed of a main component composed of a metal salt and a reducing agent, and auxiliary components composed of a pH adjuster, a buffer, a complexing agent, an accelerator, a stabilizer, a modifier, and the like. When an object to be plated including the substrate 1, the lower layer 15, and the piezoelectric member 2 is immersed in the plating solution, plating is generated using the metalized Pb as a catalyst nucleus, and no plating is generated in other portions. That is, plating can be generated only on the surface of the upper pillar 4a on the groove 3 side and the surface of the piezoelectric member 2 where the metallized Pb is adsorbed. In FIG. 3A, 8 is an electrode, 9 is a wiring pattern, and these are formed by electroless plating. In this embodiment, when the surface of the piezoelectric member 2 having irregularities formed of particles of 2 to 4 μm was plated using a nickel-phosphorus-based low-temperature plating solution as the plating solution, the plating was performed without pinholes. 1 to 2μ thick
m uniform nickel plating film was produced.

Next, as shown in FIG. 3B, the resist film 7 stuck on the surface of the piezoelectric member 2 is peeled off, and then, as shown in FIG. A nozzle plate 12 having a large number of ink ejection ports 11 formed as ink ejection portions communicating with the tips of the grooves 3 is fixed to the side surfaces of the substrate 1, the piezoelectric member 2, and the top plate 10. Then, an ink supply pipe 13 for supplying ink from an ink supply unit (not shown) to each groove 3 is attached to the top plate 10, thereby completing the ink jet printer head. At this time, as shown in FIG. 4, the groove 3 is closed by the top plate 10, and the pressure chamber 14 is formed.

A case where ink is ejected from the pressure chamber 14 at the center in FIG. Each of the pressure chambers 14 is supplied with ink from the ink supply pipe 13 shown in FIG. Here, a voltage A is applied between the electrode 8 of the central pressure chamber 14 and the electrode 8 of the pressure chamber 14 adjacent to the left side via the wiring pattern 9, and is adjacent to the electrode 8 of the central pressure chamber 14 on the right side. A voltage B is applied between the pressure chamber 14 and the electrode 8. The polarities of the voltages A and B are opposite, and an electric field is applied to the upper support 4a in a direction orthogonal to the polarization direction indicated by the arrow. As a result, the left column 4 of the central pressure chamber 14 is distorted to the left, and the right column 4 is distorted to the right, so that the volume of the central pressure chamber 14 increases and the volume of the pressure chambers 14 on both sides decreases.

FIG. 5 shows the relationship between the state of application of the voltages A and B and the time. Since the voltages A and B are gradually increased during a certain period a, the left and right pressure chambers 14 having reduced volumes are used. The ink does not fly from the ink ejection port 11. The inner pressure of the central pressure chamber 14 is reduced due to an increase in the volume, the meniscus of the ink discharge port 11 is slightly retracted, and the ink is sucked from the ink supply unit communicating therewith. At the time point of FIG. 5B, a voltage opposite to the above is rapidly applied to the electrode 8, so that the left support 4 of the central pressure chamber 14 is distorted to the right, the right support 4 is distorted to the left, Of the pressure chamber 14 rapidly decreases. Thus, the ink ejection port 1 of the central pressure chamber 14
Ink is jetted from 1. The voltage at this time is applied for a certain period of time as shown by c in FIG. 5, during which the tail of the flying ink droplet is not separated from the ink ejection port 11. When the voltage application to the electrode 8 is suddenly cut off at the time point d in FIG. 5, the internal pressure of the central pressure chamber 14 drops sharply because the distorted strut 4 returns to the original posture, and therefore the ink ejection port 11 Is sucked inward, and the tail of the flying ink droplet is separated. At the moment when the power supply to the electrode 8 is cut off, the internal pressure of the pressure chambers 14 on the left and right sides of the central pressure chamber 14 increases, but does not reach a pressure at which the ink is ejected from the ink discharge port 11.

As described above, the column 4 is
The lower part (the lower support 4b) is formed of the lower layer 15 having a lower rigidity than the piezoelectric member 2, so that the lower part (the upper support 4a) is formed by the piezoelectric member 2 having high rigidity. The resistance of the lower support 4b against the distortion generated in the upper support 4a of the second support 2 is small, and therefore, the amount of distortion of the support 4 is increased and the ejection characteristics of the ink droplets are improved.

When the electrode 8 is formed on the inner surface of the groove 3 by electroless plating, a cleaning treatment is generally performed using a surfactant before the electroless plating step. Since a surfactant that cannot be completely removed adheres to the inner surface, the degree of adhesion of the plating deteriorates, and the electrode 8 is easily peeled. If a treatment such as surface roughening treatment or sensitizing treatment with a strong acid is performed after the cleaning step to increase the acidity, the surfactant in the groove 3 can be removed, but in this case, the piezoelectric member 2 is deteriorated. And the adhesive strength between the upper support 4a and the lower support 4b is reduced, and the two are separated from each other.

However, according to the present invention, by performing washing and hydrophilizing treatment with an alcohol solvent before the electroless plating step, the solvent can be easily removed from the fine grooves 3 after the treatment, In addition, the adhesion of the electroless plating can be improved. Further, since the inner surface of the groove 3 of the piezoelectric member 2 forms an uneven surface, an anchor effect can be obtained during electroless plating, and therefore, the separation of the electrode 8 can be prevented.

The present invention is not limited to the above embodiment. This will be described with some examples. First, the cleaning step using ethanol has been described in the above embodiment, but the solvent used in the cleaning step is not limited to ethanol, and the piezoelectric member 2 and the lower layer 1 are not limited to ethanol.
Any alcohol may be used as long as it activates and hydrophilizes the groove 3 composed of 5.

The electroless plating is not limited to nickel. In particular, when using an ink that causes corrosion of nickel, it is desirable to specify gold as the electroless plating. Alternatively, the electrode 8 may be formed by electroless plating using an inexpensive metal, and a metal having corrosion resistance may be plated thereon.

Further, the case where the electrode 8 is formed only on the inner surface of the groove 3 of the piezoelectric member 2 has been described. However, the electrode 8 may be formed on the inner surface of the groove 3 of the lower layer 15. That is, a synthetic resin having a property that the ratio of tin of the complexed Pd / Sn adsorbed when the catalizing treatment is performed in the electroless plating process is smaller than that when the piezoelectric member 2 is subjected to the catalizing treatment. To form the lower layer 15 or lengthen the time of the accelerating process, and the complex adsorbed on the lower layer 15 is
By setting d, the electrode 8 is formed on the entire inner surface of the groove 3. In this case, as described in the embodiment, if the groove 3 is ground using a diamond wheel, the inner surface of the groove 3 of the lower layer 15 also becomes a surface having an appropriate roughness, and the adhesion strength of the plating object is increased. Becomes possible. Thus, groove 3
When the electrode 8 is formed on the entire inner surface of the lower layer 15, the lower column 4 b has a disadvantage that the rigidity of the lower support 4 b is increased as compared with the case where the electrode 8 is formed only on the inner surface of the groove 3 of the piezoelectric member 2. This has the effect of preventing the ink from contacting and preventing corrosion of the lower layer 15.

Further, in the above-described embodiment, an example in which the catalyst processing and the accelerating processing are performed as the catalyst application step has been described.
The catalyst may be applied by an activating process. However, in this case, the electrode 8 cannot be provided only on the piezoelectric member 2, and is limited to the electrode provided on the entire inner surface of the groove 3.

Further, in the above embodiment, as shown in FIG. 4, the substrate 1, the lower layer 15, the piezoelectric member 2, the top plate 10
Are bonded in four layers to form an ink jet printer head, but as shown in FIG. 6, the lower layer 16 and the top plate 10 of the piezoelectric member 2 may be bonded in three layers to form an ink jet printer head. This lower layer 16 is the same as the lower layer 15 in the above embodiment, and the other structure is the same as that of the above embodiment. In this case, the number of parts can be reduced.

Further, in the above-described embodiment, a voltage application method as shown in FIG. 2 is employed as a method of supplying current to the ink jet printer head in order to stabilize flying droplets. May be adopted.

[0034]

According to the present invention, a piezoelectric member polarized in the thickness direction is fixed to a lower layer made of a resin material, and a plurality of grooves extending from the surface of the piezoelectric member to the inside of the lower layer and these grooves are provided. Forming a plurality of columns disposed on both sides of the lower layer, performing a cleaning process on the lower layer and the piezoelectric member using a solvent of alcohol, and then performing a catalyst application process for electroless plating, An electrode is formed on the surface of the support, which is the inner surface of the groove, by immersing the piezoelectric member in an electroless plating solution, and a top plate is joined to the surface of the piezoelectric member to close the opening surface of the groove. As a result, a plurality of pressure chambers respectively connected to the ink supply unit and the ink ejection unit are formed, so that a voltage is applied to the electrode formed on the surface of the support to distort the support and change the pressure in the pressure chamber. Let the ink However, since the struts can be formed by the upper struts made of a piezoelectric member and the lower struts made of a resin lower layer, which is considerably less rigid than the piezoelectric members, the lower struts can be formed with respect to the distortion of the upper struts. The resistance of the struts can be reduced, thus
By increasing the amount of distortion of the entire column, the ejection characteristics of ink droplets can be improved. In addition, since the electrodes are formed by electroless plating, a uniform electrode without pinholes is formed on the surface of the piezoelectric member having irregularities.
Since a uniform electric field can be applied to the piezoelectric member and the piezoelectric member can be separated from the ink by the electrodes, corrosion of the piezoelectric member can be prevented. Furthermore, since the electrode forming method by electroless plating is a chemical treatment, a large amount of treatment can be performed at a time, thereby reducing the manufacturing cost. Furthermore, by performing washing and hydrophilization treatment with an alcohol solvent before the electroless plating step, the solvent can be easily removed from the fine grooves after the treatment, and therefore, the adhesion of the electroless plating can be obtained. In addition, since the inner surface of the groove of the piezoelectric member has an uneven surface, an anchor effect can be obtained at the time of electroless plating, and therefore, there is an effect that separation of the electrode can be prevented.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a process of forming an ink jet printer head according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating a process of forming an ink jet printer head.

FIG. 3 is a perspective view illustrating a process of forming an ink jet printer head.

FIG. 4 is a vertical sectional front view of the inkjet printer head.

FIG. 5 is a timing chart showing a voltage applied to an electrode.

FIG. 6 is a longitudinal sectional front view showing a modification.

FIG. 7 is a vertical sectional front view showing a conventional example.

FIG. 8 is a front view showing a method of forming an electrode.

FIG. 9 is a vertical sectional front view showing another conventional example.

[Explanation of symbols]

 2 Piezoelectric member 3 Groove 4 Prop 8 Electrode 10 Top plate 11 Ink ejection unit 14 Pressure chamber 15, 16 Lower layer

Continuation of front page (72) Inventor Toshihiro Tsukamoto 985 Hodozawa, Gotemba-shi, Shizuoka Toshiba EMI Co., Ltd. (56) References JP-A-3-82377 (JP, A) (58) Fields investigated (Int.Cl) . ^6, DB name) B41J 2/16 B41J 2/045 B41J 2/055 C23C 18/20

Claims (1)

(57) [Claims] 1. A piezoelectric member polarized in a thickness direction is fixed to a lower layer made of a resin material, and a plurality of grooves extending from the surface of the piezoelectric member to the inside of the lower layer are arranged on both sides of the grooves. Formed a plurality of pillars, performing a cleaning process on the lower layer and the piezoelectric member using a solvent of alcohol, and then performing a catalyst application process for electroless plating, thereby forming the lower layer and the piezoelectric member. An electrode is formed on the surface of the column, which is the inner surface of the groove, by dipping the electrode in an electroless plating solution, and a top plate is joined to the surface of the piezoelectric member to close the opening surface of the groove. A method of manufacturing an ink jet printer head, wherein a plurality of pressure chambers connected to a supply unit and an ink discharge unit are formed.