JP2786135B2 - Cutting mold - Google Patents

Cutting mold

Info

Publication number
JP2786135B2
JP2786135B2 JP7266938A JP26693895A JP2786135B2 JP 2786135 B2 JP2786135 B2 JP 2786135B2 JP 7266938 A JP7266938 A JP 7266938A JP 26693895 A JP26693895 A JP 26693895A JP 2786135 B2 JP2786135 B2 JP 2786135B2
Authority
JP
Japan
Prior art keywords
cutting
lead
hole
die
outer body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP7266938A
Other languages
Japanese (ja)
Other versions
JPH09116071A (en
Inventor
雅章 江藤
篤史 平島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP7266938A priority Critical patent/JP2786135B2/en
Publication of JPH09116071A publication Critical patent/JPH09116071A/en
Application granted granted Critical
Publication of JP2786135B2 publication Critical patent/JP2786135B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Punching Or Piercing (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ICのチップを樹
脂封止してなる樹脂外郭体より派生する板状部材の一部
を切断する切断金型に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting die for cutting a part of a plate-like member derived from a resin shell formed by sealing an IC chip with a resin.

【0002】[0002]

【従来の技術】図4は従来の切断金型の一例を示す分解
斜視図、図5は図4の切断金型の断面図である。従来、
この種の切断金型は、図4および図5に示すように、I
Cの樹脂外郭体17と樹脂外郭体の周囲から伸びる複数
のリード部材をもつリードフレーム17aが一方向から
送られ載置されるとともに樹脂外郭体17が挿入される
穴15aとリード部材のそれぞれが対応し穴15aの周
囲から派生するスリット状の切断穴14aとを有する切
断ダイ15とホルダ16とでなる下型と、切断穴14a
に挿入されリード部材を切断するパンチ13の複数を保
持するパンチプレート12とホルダ11とでなる上型と
を備えている。
2. Description of the Related Art FIG. 4 is an exploded perspective view showing an example of a conventional cutting die, and FIG. 5 is a sectional view of the cutting die shown in FIG. Conventionally,
As shown in FIGS. 4 and 5, this type of cutting die has
A lead frame 17a having a resin outer shell 17 of C and a plurality of lead members extending from the periphery of the resin outer shell is sent and placed from one direction, and each of the lead 15a and the hole 15a into which the resin outer shell 17 is inserted is formed. A lower die including a holder 16 and a cutting die 15 having a corresponding slit-shaped cutting hole 14a derived from the periphery of the corresponding hole 15a;
And a top plate formed of a holder 11 and a punch plate 12 for holding a plurality of punches 13 inserted into the punch member and cutting the lead member.

【0003】また、型締めの際にパンチ13が切断穴1
4aに精密に嵌合されるようにパンチ14aを案内しリ
ード部材を押圧するストリッパ14と、上型と下型とを
案内するガイドポストが備えられている。
[0003] Further, when the mold is clamped, the punch 13 is inserted into the cut hole 1.
A stripper 14 that guides the punch 14a and presses the lead member so that the punch 14a is precisely fitted to the 4a, and a guide post that guides the upper die and the lower die are provided.

【0004】この切断金型により、リードフレーム17
aのリード部材の一部であるタイバーを切離してリード
フレーム17aよりICとして抽出するには、まず、リ
ードフレーム17aを送り込み、下型の切断ダイ15の
穴15aに樹脂外郭体17を入れリード部材をそれぞれ
対応するタイバーを切断する切断穴14aに位置決す
る。しかる後、型締めし、リード部材を切断し、切断さ
れたリードフレーム17aのリード部材の一つであるタ
イバーなどから切離されたICは穴15aから下側のシ
ュータを経て収納箱に収納される。
[0004] With this cutting die, the lead frame 17
In order to separate the tie bar which is a part of the lead member of FIG. 1a and extract it as an IC from the lead frame 17a, first, the lead frame 17a is fed, the resin outer body 17 is inserted into the hole 15a of the lower cutting die 15, and the lead member is inserted. Are positioned in the cutting holes 14a for cutting the corresponding tie bars. Thereafter, the mold is clamped, the lead member is cut, and the cut IC, which is cut off from a tie bar, which is one of the lead members of the lead frame 17a, is stored in the storage box through the lower shooter from the hole 15a. You.

【0005】このように、リードフレーム17aに搭載
された樹脂外郭体17をこの切断金型で切離すことでI
Cの仕上げ工程を完了していた。
[0005] As described above, the resin outer body 17 mounted on the lead frame 17a is cut off by the cutting die so that I
The finishing process of C was completed.

【0006】[0006]

【発明が解決しようとする課題】図6は課題を説明する
ための図4の切断金型の断面図である。しかしながら、
上述した従来の切断金型では、図6に示すように、前工
程である樹脂封止工程で付着する樹脂残りである異物1
8がリード部材に付着したまま送られ、異物18が付着
した状態でパンチ13が降され、パンチ13が折れたり
あるいは切断ダイを破損させる問題が多々発生した。
FIG. 6 is a sectional view of the cutting die of FIG. 4 for explaining the problem. However,
In the above-described conventional cutting die, as shown in FIG. 6, foreign matter 1 which is a resin residue adhered in a resin sealing step which is a previous step.
The punch 8 is sent with the foreign matter 18 attached to the lead member, and the punch 13 is lowered with the foreign matter 18 attached thereto, and the punch 13 is often broken or the cutting die is damaged.

【0007】また、パンチ13が破損しないまでもパン
チ13の刃先が劣化し切味が悪くなりたり、リード部材
に切残しを付けたまま送られるのでジャミングを起した
りする。特に、この種の金型は自動化されており、しか
も内部を観察することが出来ないこともあって、事故が
発見されずに切断動作が進み、ICの仕上げ不良を多く
発生させ多大な損出を出すことになる。
In addition, even if the punch 13 is not damaged, the cutting edge of the punch 13 is deteriorated and the sharpness is deteriorated, or the lead member is fed with an uncut portion, causing jamming. In particular, this type of mold is automated, and because it is not possible to observe the inside, the cutting operation proceeds without an accident being discovered, and a large number of IC finishing defects occur, causing a great loss. Will be issued.

【0008】このような異物18を除去するために、金
型の入口にエア噴射ノズルを設け、異物18を吹き飛ば
すことを試みたが、リード部材に異物18が付着する力
が強く吹き飛ばすことができなかった。
In order to remove such foreign matter 18, an air injection nozzle was provided at the entrance of the mold to attempt to blow off the foreign matter 18. However, the force for attaching the foreign matter 18 to the lead member can be blown off strongly. Did not.

【0009】従って、本発明の目的は、異物の付着の有
無を確認できる切断金型を提供することである。
Accordingly, an object of the present invention is to provide a cutting die capable of confirming the presence or absence of foreign matter.

【0010】[0010]

【課題を解決するための手段】本発明の特徴は、ICの
樹脂外郭体と該樹脂外郭体の周囲から伸びる複数のリー
ド部材をもつ板状のリードフレームが一方向から送られ
載置されるとともに前記樹脂外郭体が挿入される第1の
穴を有しかつ前記リード部材のそれぞれに対応し前記第
1の穴の周囲から派生するスリット状の切断穴が形成さ
れる下型と、前記切断穴に挿入され前記リード部材を切
断するパンチを具備する上型とを備える切断金型におい
て、前記下型の面から前記一方向に延長され前記リード
部材が載置される面をもつとともに前記リードフレーム
が前記第1の穴に送られる前段の位置に前記樹脂外郭体
が挿入される第2の穴を有するステージと、このステー
ジに載置される前記樹脂外郭体の四隅の前記リード部材
と先端を接触させ前記上型の上面より他端が突出し得る
ように前記上型に組込まれる四本の棒状部材と、四本の
前記棒状部材のいずれかの前記他端が他より突出してい
ることを検知するセンサとを備える切断金型である。
A feature of the present invention is that a plate-shaped lead frame having a resin outer body of an IC and a plurality of lead members extending from the periphery of the resin outer body is sent and placed in one direction. A lower die having a first hole into which the resin outer body is inserted, and a slit-shaped cutting hole corresponding to each of the lead members and derived from the periphery of the first hole; An upper die having a punch inserted into a hole and cutting the lead member, the cutting die having a surface extended in the one direction from the surface of the lower die and on which the lead member is placed, and A stage having a second hole into which the resin shell is inserted at a position before the frame is sent to the first hole, and the lead members and tips at four corners of the resin shell mounted on the stage; Contact Four bar-shaped members of which the other end from the upper surface of the serial upper mold is incorporated in the upper die so as to protrude, one of the other ends of four of said rod-like member protrude from the other
And a sensor for detecting that the cutting is performed.

【0011】また、前記センサは、前記棒状部材の該他
端に光を投射する発光部とこの発光部からの前記光を受
光する受光部とを備えることが望ましい。
The sensor includes a light emitting unit for projecting light to the other end of the rod-shaped member and receiving the light from the light emitting unit.
It is desirable to have a light receiving unit that emits light.

【0012】[0012]

【発明の実施の形態】次に本発明について図面を参照し
て説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

【0013】図1は本発明の一実施の形態を示す切断金
型の分解斜視図である。この切断金型は、図1に示すよ
うに、下型の切断ダイ9の面から延長されリードフレー
ムのリード部材を載置する面をもつとともに樹脂外郭体
が挿入される穴8aを有する検出ステージ1と、この検
出ステージ1に載置されるリード部材と先端を接触し他
端を上型のホルダ8に摺動可能に保持される複数のピン
4と、これらピン4のいずれかの他端が他より突出して
いることを検知するセンサ2とを設けたことである。そ
れ以外のホルダ10およびストリッパ7ならびに切断ダ
イ9とパンチ6などは従来と同じように備えられてい
る。
FIG. 1 is an exploded perspective view of a cutting die showing one embodiment of the present invention. As shown in FIG. 1, this cutting die has a surface on which the lead member of the lead frame is placed, extending from the surface of the lower die 9, and having a hole 8a into which the resin shell is inserted. 1, a plurality of pins 4, the tips of which contact the lead member mounted on the detection stage 1 and whose other ends are slidably held by an upper holder 8, and the other end of any of these pins 4 Is provided with a sensor 2 for detecting that is protruded from the other. Other than that, the holder 10 and the stripper 7, and the cutting die 9 and the punch 6 are provided in the same manner as in the prior art.

【0014】また、ピン4は穴8aの四隅の面と接触す
るように4本設けられている。このことは、リード部材
に付着する異物の殆どは樹脂封止金型におけるゲートの
樹脂残りであるからである。その外の位置にあるリード
部材には樹脂ばりは付着せず、付着したとしても運搬途
中で圧縮空気を吹き付けるだけで簡単に除去できるから
である。従って、リード部材に付着する異物は、ゲート
に対応する位置、すなわち、樹脂外郭体の四隅にあるリ
ード部材(吊りピンと呼ばれている)である。この四隅
に異物が有るか無いかを確認すれば良い。
The four pins 4 are provided so as to contact the four corners of the hole 8a. This is because most of the foreign matter adhering to the lead member is resin residue of the gate in the resin sealing mold. This is because the resin burrs do not adhere to the lead members located at positions other than the above, and even if they adhere, they can be easily removed only by blowing compressed air during transportation. Therefore, the foreign matter adhering to the lead member is at the position corresponding to the gate, that is, the lead member (called a suspension pin) at the four corners of the resin outer body. What is necessary is just to confirm whether or not there is a foreign substance in these four corners.

【0015】この四隅のリード部材に異物の有無を検出
する機構は、バネ3の反発力に抗してピン4がホルダ8
より突出するか否かで異物の有無を判定している。すな
わち、ホルダ8の上面に沿って光を投射するセンサ2の
発光部と、投光された光を入光し電流に変換するセンサ
2の受光部とを光軸を合せて配置し、4本のピン4のい
ずれかがホルダ8より突出したら、光を遮断するので異
物の有りを判定することである。なお、図面には、セン
サ2の投光部と受光部とが相対して配置してあるが、全
てのピン4が同一光軸になるように光を曲げるための反
射ミラーが設けられている。言い換れば、単純な機構で
済むという利点がある。
The mechanism for detecting the presence or absence of foreign matter on the lead members at the four corners is such that the pin 4 is attached to the holder 8 against the repulsive force of the spring 3.
The presence or absence of a foreign object is determined based on whether or not the protrusion is more prominent. That is, the light-emitting portion of the sensor 2 that projects light along the upper surface of the holder 8 and the light-receiving portion of the sensor 2 that receives the emitted light and converts it into current are arranged with their optical axes aligned, and four If any of the pins 4 protrudes from the holder 8, the light is blocked, so that the presence of foreign matter is determined. In the drawing, the light projecting portion and the light receiving portion of the sensor 2 are disposed facing each other, but a reflecting mirror for bending light so that all the pins 4 have the same optical axis is provided. . In other words, there is an advantage that a simple mechanism is sufficient.

【0016】図2は図1の切断金型の型開きの状態を示
す断面図、図3は図1の切断金型の型締めの状態を示す
断面図である。次に、本発明の実施の形態における切断
金型の動作について図2と図3を参照して説明する。ま
ず、図2に示すように、上型のホルダ8と下型のホルダ
10を開き、図示していないリードフレームをストリッ
パ7と検出ステージ1との間に挿入する。
FIG. 2 is a cross-sectional view showing a state where the cutting die of FIG. 1 is opened, and FIG. 3 is a cross-sectional view showing a state where the cutting die of FIG. 1 is closed. Next, the operation of the cutting die according to the embodiment of the present invention will be described with reference to FIGS. First, as shown in FIG. 2, the upper die holder 8 and the lower die holder 10 are opened, and a lead frame (not shown) is inserted between the stripper 7 and the detection stage 1.

【0017】次に、図3に示すように、型締めしたと
き、検出ステージ1上に異物18がある場合、リードフ
レーム17aが異物18の上に乗るためにピン4がホル
ダ8の上面の基準高さより突出することで、センサ2か
らの光軸13における光がさえぎられ、受光部に入光が
無くなり、その結果、電流が流れなくなりインターロッ
ク回路の保持リレーがオープンになり、シーケンス動作
が進まなくなると同時に警報ランプが点灯する。
Next, as shown in FIG. 3, when foreign matter 18 is present on the detection stage 1 when the mold is clamped, the pin 4 is positioned on the upper surface of the holder 8 so that the lead frame 17 a rides on the foreign matter 18. By protruding from the height, light on the optical axis 13 from the sensor 2 is blocked, and no light enters the light receiving portion. As a result, current does not flow, the holding relay of the interlock circuit is opened, and the sequence operation proceeds. At the same time, the alarm lamp lights up.

【0018】このように、切断する直前に検出ステージ
1で異物18の有無を確認でき、以後の切断動作でパン
チや切断ダイの破損が皆無となった。
As described above, the presence or absence of the foreign matter 18 can be confirmed by the detection stage 1 immediately before the cutting, and the punch and the cutting die are not damaged in the subsequent cutting operation.

【0019】[0019]

【発明の効果】以上説明したように本発明は、切断する
前に送られるリードフレームのリード部材に付着する異
物をリード部材を介してその先端を接触する棒部材と、
棒部材が異物を介して接触するときに多端が上に突出す
る状態を検知するセンサとを設けることによって、事前
に異物の付着の有りまたは無しを確認できるので、パン
チの破損やそれに伴なう不良品の発生など無く極めて安
定してリード部材を切断できるという効果がある。
As described above, according to the present invention, there is provided a rod member for contacting the tip of a lead member of a lead frame, which is sent before cutting, via a lead member.
By providing a sensor for detecting a state in which the multi-end protrudes upward when the rod member comes in contact with the foreign matter, the presence or absence of the foreign matter can be checked in advance. There is an effect that the lead member can be cut very stably without occurrence of defective products.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施の形態を示す切断金型の分解斜
視図である。
FIG. 1 is an exploded perspective view of a cutting mold according to an embodiment of the present invention.

【図2】図1の切断金型の型開きの状態を示す断面図で
ある。
FIG. 2 is a sectional view showing a state in which the cutting die of FIG. 1 is opened.

【図3】図1の切断金型の型締めの状態を示す断面図で
ある。
FIG. 3 is a cross-sectional view showing a state in which the cutting die of FIG. 1 is clamped.

【図4】従来の切断金型の一例を示す分解斜視図であ
る。
FIG. 4 is an exploded perspective view showing an example of a conventional cutting die.

【図5】図4の切断金型の断面図である。FIG. 5 is a sectional view of the cutting die of FIG. 4;

【図6】課題を説明するための図4の切断金型の断面図
である。
6 is a cross-sectional view of the cutting die of FIG. 4 for explaining a problem.

【符号の説明】[Explanation of symbols]

1 検出ステージ 2 センサ 3 スプリング 4 ピン 5,12 パンチプレート 6,13 パンチ 7,14 ストリッパ 8,10,11,16 ホルダ 8a,15a 穴 9,15 切断ダイ 13 光軸 14a 切断穴 17 樹脂外郭体 17a リードフレーム 18 異物 Reference Signs List 1 detection stage 2 sensor 3 spring 4 pin 5,12 punch plate 6,13 punch 7,14 stripper 8,10,11,16 holder 8a, 15a hole 9,15 cutting die 13 optical axis 14a cutting hole 17 resin outer body 17a Lead frame 18 Foreign matter

フロントページの続き (56)参考文献 特開 昭62−106654(JP,A) 特開 平4−192553(JP,A) 特開 平4−284925(JP,A) 特開 平4−132247(JP,A) 実開 平4−74450(JP,U) (58)調査した分野(Int.Cl.6,DB名) H01L 23/50 B21D 28/00Continuation of the front page (56) References JP-A-62-106654 (JP, A) JP-A-4-192553 (JP, A) JP-A-4-284925 (JP, A) JP-A-4-132247 (JP) , A) Hikaru 4-74450 (JP, U) (58) Fields investigated (Int. Cl. 6 , DB name) H01L 23/50 B21D 28/00

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 ICの樹脂外郭体と該樹脂外郭体の周囲
から伸びる複数のリード部材をもつ板状のリードフレー
ムが一方向から送られ載置されるとともに前記樹脂外郭
体が挿入される第1の穴を有しかつ前記リード部材のそ
れぞれに対応し前記第1の穴の周囲から派生するスリッ
ト状の切断穴が形成される下型と、前記切断穴に挿入さ
れ前記リード部材を切断するパンチを具備する上型とを
備える切断金型において、前記下型の面から前記一方向
に延長され前記リード部材が載置される面をもつととも
に前記リードフレームが前記第1の穴に送られる前段の
位置に前記樹脂外郭体が挿入される第2の穴を有するス
テージと、このステージに載置される前記樹脂外郭体の
四隅の前記リード部材と先端を接触させ前記上型の上面
より他端が突出し得るように前記上型に組込まれる四本
の棒状部材と、四本の前記棒状部材のいずれかの前記他
端が他より突出していることを検知するセンサとを備え
ることを特徴とする切断金型。
A plate-like lead frame having a resin outer body of an IC and a plurality of lead members extending from a periphery of the resin outer body is sent and placed from one direction, and the resin outer body is inserted. A lower die having one hole and forming a slit-shaped cutting hole corresponding to each of the lead members and derived from the periphery of the first hole; and cutting the lead member inserted into the cutting hole. In a cutting die having an upper die having a punch, the cutting die has a surface extended in the one direction from the surface of the lower die and on which the lead member is placed, and the lead frame is sent to the first hole. A stage having a second hole into which the resin outer body is inserted at a previous stage, and contacting the leading ends of the lead members at the four corners of the resin outer body mounted on the stage with other ends from the upper surface of the upper die. The ends can protrude Four rod-shaped members to be incorporated into the upper die as described above, and the other of any of the four rod-shaped members
A sensor for detecting that the end is protruding from the other .
【請求項2】 前記センサは、前記棒状部材の該他端に
光を投射する発光部とこの発光部からの前記光を受光す
受光部とを備えることを特徴とする請求項1記載の切
断金型。
2. The sensor according to claim 1, wherein the sensor is configured to project light onto the other end of the rod-shaped member, and receive the light from the light-emitting unit .
Claim 1 cutting die, wherein further comprising a light receiving unit that.
JP7266938A 1995-10-16 1995-10-16 Cutting mold Expired - Lifetime JP2786135B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7266938A JP2786135B2 (en) 1995-10-16 1995-10-16 Cutting mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7266938A JP2786135B2 (en) 1995-10-16 1995-10-16 Cutting mold

Publications (2)

Publication Number Publication Date
JPH09116071A JPH09116071A (en) 1997-05-02
JP2786135B2 true JP2786135B2 (en) 1998-08-13

Family

ID=17437779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7266938A Expired - Lifetime JP2786135B2 (en) 1995-10-16 1995-10-16 Cutting mold

Country Status (1)

Country Link
JP (1) JP2786135B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111069398B (en) * 2019-12-31 2021-06-22 江苏新岳建材有限公司 Cold extruding and cutting device for light steel keel
CN112045333A (en) * 2020-08-24 2020-12-08 湖南中南智能工业技术有限公司 Temporary storage rack for automatic production of mixing drum and mixing drum welding production line

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62106654A (en) * 1985-11-05 1987-05-18 Mitsubishi Electric Corp Damage detection equipment of tie bar cut punch
JP2527573Y2 (en) * 1990-11-07 1997-03-05 山形日本電気株式会社 Tie bar cutting mold for semiconductor device

Also Published As

Publication number Publication date
JPH09116071A (en) 1997-05-02

Similar Documents

Publication Publication Date Title
US4533043A (en) Integrated circuit package magazine and receptacle
JP2786135B2 (en) Cutting mold
EP0632496B1 (en) Method of packaging electronic circuit components and packaged circuit arrangement
US20100044066A1 (en) Electrical connection parts
EP0580410A2 (en) Reusable fixture for carrier tape
JPH03165974A (en) Non-contact-type cutting head and non-contact-type cutting method using said head
JP2000033637A (en) Mold
JPH0722555A (en) Lead frame structure for semiconductor device and method of cutting
JPH1145644A (en) Electric equipment
JP3156938B2 (en) Cold slag removal equipment
JPH06320496A (en) Method for dividing circuit substrate and mold therefor
JP2786983B2 (en) Ejection device for punching waste in paper cutting machine
US20200251364A1 (en) SOT Deform Lead-retract Removal Track
JP2714556B2 (en) Circuit board dividing mold driving method and circuit board dividing apparatus
KR900007433Y1 (en) Products emitting equipment for press
JP2001179378A (en) Automatic multiple coiling machine
JPH11256392A (en) Plating device
JP3126854B2 (en) Mounting method of mounting circuit and mounting circuit
JPS63199447A (en) Lead for semiconductor device
JP2936768B2 (en) Semiconductor processing equipment
JPS62106654A (en) Damage detection equipment of tie bar cut punch
JPH03159140A (en) Deburring device
KR970000968B1 (en) Transfer device of semiconductor package
JP2596267B2 (en) Diaphragm cutting device
KR100255059B1 (en) Contact point structure

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19980421