JP2770627B2 - Method of laminating printed wiring board - Google Patents
Method of laminating printed wiring boardInfo
- Publication number
- JP2770627B2 JP2770627B2 JP3337863A JP33786391A JP2770627B2 JP 2770627 B2 JP2770627 B2 JP 2770627B2 JP 3337863 A JP3337863 A JP 3337863A JP 33786391 A JP33786391 A JP 33786391A JP 2770627 B2 JP2770627 B2 JP 2770627B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- polymer
- vinyl compound
- xylylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Laminated Bodies (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は二つの固体基材を接着す
る方法に関し、特に電子部品を実装するプリント配線基
板の積層方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for bonding two solid substrates, and more particularly to a method for laminating a printed wiring board on which electronic components are mounted.
【０００２】[0002]
【従来の技術】科学技術の進歩に伴う電子機器の高速
化、高集積化に対応して回路の高周波化が進み、同時に
積層基板の利用も増大している。従来、積層プリント配
線基板は硬化が完了していないエポキシ樹脂を主な成分
とする銅張積層板とプリプレグを交互に積層し、加圧、
昇温して製造されていた。ところで、一般に、高周波数
域では基板材料の誘電率に依存して誘電損失および信号
伝播遅延時間が決まり、誘電率の低いプリント配線基板
が誘電損失、信号伝播遅延時間共に小さく高周波回路基
板に適していることが知られている。このため、従来の
プリント配線基板樹脂であるエポキシ樹脂よりも誘電率
の低い高分子材料を使用した低誘電率積層プリント配線
基板が求められている。これまでにビスマレイミドとト
リアジンの２成分を基本成分とする重合体が開発され、
銅張積層板およびプリプレグとして検討されている。ま
た、誘電率が２以下のフッ素樹脂を使用したプリント配
線基板も開発されている。一方、T．Mates 等によるMat
er．Res．Soc．Symp．Proc．誌，1990年，167 巻，123
頁には、可溶性の前駆体から製造したポリ（ｐ−フェニ
レンビニレン）が低誘電率であり、耐熱性にも優れてい
ることが提示されている。2. Description of the Related Art In accordance with the advancement of science and technology, the frequency of circuits has been increased in response to the increase in speed and integration of electronic devices, and at the same time, the use of laminated substrates has been increasing. Conventionally, a laminated printed wiring board alternately laminates copper-clad laminates and prepregs whose main component is epoxy resin that has not been cured,
It was manufactured at elevated temperatures. By the way, in general, in a high frequency region, a dielectric loss and a signal propagation delay time are determined depending on a dielectric constant of a substrate material, and a printed wiring board having a low dielectric constant has a small dielectric loss and a small signal propagation delay time, and is suitable for a high-frequency circuit board. Is known to be. Therefore, there is a demand for a low-permittivity laminated printed wiring board using a polymer material having a lower dielectric constant than an epoxy resin which is a conventional printed wiring board resin. So far, a polymer containing two components, bismaleimide and triazine, has been developed.
Considered as copper-clad laminates and prepregs. Also, a printed wiring board using a fluororesin having a dielectric constant of 2 or less has been developed. On the other hand, T. Mat by Mates etc.
er. Res. Soc. Symp. Proc. Magazine, 1990, Volume 167, 123
The page states that poly (p-phenylenevinylene) produced from a soluble precursor has a low dielectric constant and excellent heat resistance.
【０００３】[0003]
【発明が解決しようとする課題】上述のビスマレイミド
とトリアジンの２成分を基本成分とする重合体は、誘電
率が３．５であり、従来のエポキシ樹脂に比べると小さ
いものの、高周波回路基板材料として使用するには不十
分である。一方、フッ素樹脂を使用したプリント配線基
板では、プリプレグとして誘電率の大きなエポキシ樹脂
を使用する必要があり、積層基板全体としての誘電率は
あまり小さくならない。また、フッ素樹脂は加工性並び
に耐熱性に問題がある。さらにポリ（ｐ−フェニレンビ
ニレン）は低誘電率で耐熱性にも優れているが、積層す
る方法が開発されていない。従って、誘電率の低い材料
による積層プリント配線基板が誘電損失、信号伝播遅延
時間共に小さく高周波回路基板に有利に使用できること
が期待されているものの、未だそれを達成するためのプ
リント配線基板の積層方法は開発されていないのが現状
であった。本発明の目的は、前記の問題点を解消して、
良好な高周波特性を有する積層プリント配線基板を製造
するためのプリント配線基板の積層方法を提供すること
にある。The above-mentioned polymer containing two components, bismaleimide and triazine, as basic components has a dielectric constant of 3.5, which is smaller than that of a conventional epoxy resin, but is high-frequency circuit board material. Not enough to use as. On the other hand, in the case of a printed wiring board using a fluororesin, it is necessary to use an epoxy resin having a large dielectric constant as a prepreg, and the dielectric constant of the entire laminated substrate does not become too small. Further, fluororesins have problems in workability and heat resistance. Furthermore, poly (p-phenylenevinylene) has a low dielectric constant and excellent heat resistance, but no lamination method has been developed. Therefore, although it is expected that a laminated printed wiring board made of a material having a low dielectric constant has a small dielectric loss and a small signal propagation delay time and can be advantageously used for a high-frequency circuit board, a method of laminating a printed wiring board to achieve the same is still expected. Has not been developed yet. An object of the present invention is to solve the above problems,
It is an object of the present invention to provide a method for laminating printed wiring boards for manufacturing a laminated printed wiring board having good high-frequency characteristics.
【０００４】本発明は、第１のプリント配線基板に、ｐ
−キシリレン−ビス（ジエチルスルホニウム塩）の重合
体と多官能ビニル化合物を含む組成物、次いで第２のプ
リント配線基板を順次積層し、その後前記ｐ−キシリレ
ン−ビス（ジエチルスルホニウム塩）の重合体と多官能
ビニル化合物を含む組成物が両方のプリント配線基板に
接触するように押圧し、加熱して前記重合体のビニル基
の一部が多官能ビニル化合物を介して架橋したポリ（ｐ
−フェニレンビニレン）とすることを特徴とするプリン
ト配線基板の積層方法である。According to the present invention, a first printed wiring board is provided with p
A composition comprising a polymer of -xylylene-bis (diethylsulfonium salt) and a polyfunctional vinyl compound, and then a second printed wiring board are sequentially laminated, and thereafter, a polymer of p-xylylene-bis (diethylsulfonium salt) is formed. The composition containing the polyfunctional vinyl compound is pressed so as to come into contact with both printed wiring boards, and heated to form a poly (p) in which some of the vinyl groups of the polymer are cross-linked via the polyfunctional vinyl compound.
-Phenylene vinylene).
【０００５】本発明で用いられるｐ−キシリレン−ビス
（ジエチルスルホニウム塩）とは、ｐ−キシリレン−ビ
ス（ジエチルスルホニウムブロマイド）、ｐ−キシリレ
ン−ビス（ジエチルスルホニウムクロリド）等であり、
その重合体とは例えば以下の一般式で表すことができ
る。The p-xylylene-bis (diethylsulfonium salt) used in the present invention includes p-xylylene-bis (diethylsulfonium bromide), p-xylylene-bis (diethylsulfonium chloride) and the like.
The polymer can be represented, for example, by the following general formula.
【化１】 本発明において多官能ビニル化合物とは、例えば１，４
−ブタンジオ−ルアクリレ―ト、１，６−ヘキサンジオ
−ルアクリレ―ト、ペンタエリスリト−ルトリアクリレ
―ト、トリメチロ−ルプロパントリアクリレ―ト、アル
キル変性ジペンタエリスリト−ルアクリレ―ト、２−プ
ロペノイックアシッド（２−（１，１−ジメチル−２−
（（１−オキソ−２−プロペニル）オキシ）エチル）−
５−エチル−１，３−ジオキサン−５−イル）メチルエ
ステル、ジビニルベンゼン、１，２，４−ベンゼントリ
カルボン酸トリアリル、テレフタル酸ジアリル、ヘキサ
ヒドロフタル酸ジアリル、トリアクリルホルマ―ル、ト
リアリルシアヌレ―ト、トリメタアリルイソシアヌレ―
ト等の分子内に２またはそれ以上のビニル基を有するも
のをいう。Embedded image In the present invention, the polyfunctional vinyl compound is, for example, 1,4.
-Butanediol acrylate, 1,6-hexanediol acrylate, pentaerythritol triacrylate, trimethylolpropane triacrylate, alkyl-modified dipentaerythritol acrylate, 2-propeno Ic acid (2- (1,1-dimethyl-2-
((1-oxo-2-propenyl) oxy) ethyl)-
5-ethyl-1,3-dioxan-5-yl) methyl ester, divinylbenzene, triallyl 1,2,4-benzenetricarboxylate, diallyl terephthalate, diallyl hexahydrophthalate, triacrylformal, triallylcia Nurate, trimetaallyl isocyanurate
And those having two or more vinyl groups in the molecule.
【０００６】本発明のｐ−キシリレン−ビス（ジエチル
スルホニウム塩）の重合体と多官能ビニル化合物を含む
組成物は、ｐ−キシリレン−ビス（ジエチルスルホニウ
ム塩）の重合体と上記多官能ビニル化合物を混合し、シ
ート状に成形したものである。ｐ−キシリレン−ビス
（ジエチルスルホニウム塩）の重合体と多官能ビニル化
合物の混合方法は特に限定されず、例えばｐ−キシリレ
ン−ビス（ジエチルスルホニウム塩）の重合体の水溶液
に前記の多官能ビニル化合物を溶解または分散、懸濁さ
せる方法で行われる。本発明のｐ−キシリレン−ビス
（ジエチルスルホニウム塩）の重合体と多官能ビニル化
合物を含む組成物は、８０℃以上に加熱することによっ
てポリマーのスルホニウム塩側鎖の脱離反応が進行し、
ポリ（ｐ−フェニレンビニレン）となるが、同時に多官
能ビニル化合物とポリマーのジエチルスルホニウム塩あ
るいは重合体のビニル基の一部が反応し架橋する。本発
明ではｐ−キシリレン−ビス（ジエチルスルホニウム
塩）の重合体と多官能ビニル化合物を含む組成物からな
るシートの強度、弾性率等を制御するために一定時間加
熱し、上記反応を部分的に進行させて使用する。The composition of the present invention containing a polymer of p-xylylene-bis (diethylsulfonium salt) and a polyfunctional vinyl compound comprises a polymer of p-xylylene-bis (diethylsulfonium salt) and the above polyfunctional vinyl compound. They are mixed and formed into a sheet. The method of mixing the polymer of p-xylylene-bis (diethylsulfonium salt) and the polyfunctional vinyl compound is not particularly limited. For example, the polyfunctional vinyl compound is added to an aqueous solution of the polymer of p-xylylene-bis (diethylsulfonium salt). Is dissolved, dispersed or suspended. The composition containing the polymer of p-xylylene-bis (diethylsulfonium salt) and the polyfunctional vinyl compound of the present invention is heated to 80 ° C. or more, whereby the elimination reaction of the sulfonium salt side chain of the polymer proceeds,
Poly (p-phenylenevinylene) is formed, and at the same time, a polyfunctional vinyl compound reacts with a part of the polymer's diethylsulfonium salt or a part of the vinyl group of the polymer to crosslink. In the present invention, a sheet made of a composition containing a polymer of p-xylylene-bis (diethylsulfonium salt) and a polyfunctional vinyl compound is heated for a certain period of time in order to control the strength, elastic modulus, and the like, and the above reaction is partially performed. Use it to progress.
【０００７】本発明のｐ−キシリレン−ビス（ジエチル
スルホニウム塩）の重合体と多官能ビニル化合物を含む
組成物は主にシ―ト状で利用されるが、その成形方法は
特に限定されず、例えば上記組成物の溶液をキャストあ
るいはスピンコ―トしたり、押し出し成形して行われ
る。このとき、従来の積層プリント配線基板に用いられ
るプリプレグと同様に、ガラスクロスに含浸させること
もできる。本発明のプリント配線基板の積層方法では、
第１のプリント配線基板および第２のプリント配線基板
の種類は特に限定されず、従来公知のプリント配線基
板、および本発明で述べたｐ−キシリレン−ビス（ジエ
チルスルホニウム塩）の重合体と多官能ビニル化合物を
含む組成物で構成されたプリント配線基板等が利用でき
る。The composition of the present invention containing a polymer of p-xylylene-bis (diethylsulfonium salt) and a polyfunctional vinyl compound is mainly used in the form of a sheet, but the molding method is not particularly limited. For example, the solution is cast, spin-coated, or extruded from a solution of the above composition. At this time, the glass cloth can be impregnated similarly to the prepreg used for the conventional laminated printed wiring board. In the method for laminating a printed wiring board of the present invention,
The types of the first printed wiring board and the second printed wiring board are not particularly limited, and a conventionally known printed wiring board, and a polymer of p-xylylene-bis (diethylsulfonium salt) described in the present invention and polyfunctionality A printed wiring board made of a composition containing a vinyl compound can be used.
【０００８】本発明ではｐ−キシリレン−ビス（ジエチ
ルスルホニウム塩）の重合体と多官能ビニル化合物を含
む組成物を従来のプリプレグと同様に使用して積層プリ
ント配線基板を製造することができる。すなわち、ｐ−
キシリレン−ビス（ジエチルスルホニウム塩）の重合体
と多官能ビニル化合物を含む組成物とプリント基板を交
互に積層し、所定の圧力で密着させながら加熱する。加
熱によりｐ−キシリレン−ビス（ジエチルスルホニウム
塩）の重合体は脱離反応を起こし、ハロゲン化水素およ
びジエチルスルフィドを発生して、ポリ（ｐ−フェニレ
ンビニレン）および多官能ビニル化合物を介して一部の
スルホニウム塩が架橋したポリ（ｐ−フェニレンビニレ
ン）となる。このため、加熱後の誘電率はポリ（ｐ−フ
ェニレンビニレン）に比べ更に低く、耐熱性も向上す
る。また、積層した後に架橋するのでプリント配線基板
との接着性も良好である。加熱温度および加熱時間は特
に限定されないが、上記反応の容易さから反応温度８０
℃〜３５０℃、反応時間１分以上が好ましい。In the present invention, a laminated printed wiring board can be manufactured by using a composition containing a polymer of p-xylylene-bis (diethylsulfonium salt) and a polyfunctional vinyl compound in the same manner as a conventional prepreg. That is, p-
A composition containing a polymer of xylylene-bis (diethylsulfonium salt) and a polyfunctional vinyl compound and a printed board are alternately laminated, and heated while being brought into close contact with a predetermined pressure. Upon heating, the polymer of p-xylylene-bis (diethylsulfonium salt) undergoes an elimination reaction, generating hydrogen halide and diethylsulfide, and partially via poly (p-phenylenevinylene) and a polyfunctional vinyl compound. of
The poly (p-phenylenevinylene) is obtained by crosslinking the sulfonium salt . Therefore, the dielectric constant after heating is lower than that of poly (p-phenylenevinylene), and the heat resistance is improved. In addition, since crosslinking is performed after lamination, adhesion to a printed wiring board is also good. The heating temperature and the heating time are not particularly limited.
C. to 350.degree. C. and a reaction time of 1 minute or more are preferred.
【０００９】本発明においては加熱後の架橋密度は、ｐ
−キシリレン−ビス（ジエチルスルホニウム塩）の重合
体に対する多官能ビニル化合物の添加量で制御できる。
本発明においては架橋密度は特に限定されないが、架橋
点の増大に伴って、誘電率が低下し、耐熱性も向上す
る。積層プリント配線基板のドリル加工等の作業性を架
橋点の数で制御することもできる。本発明では、反応に
よって発生するハロゲン化水素およびジエチルスルフィ
ドは加熱中に気体として放散するので、積層プリント配
線基板中にはほとんど残留しない。In the present invention, the crosslink density after heating is p
Xylylene-bis (diethylsulfonium salt) can be controlled by the amount of the polyfunctional vinyl compound added to the polymer.
In the present invention, the crosslinking density is not particularly limited, but as the crosslinking point increases, the dielectric constant decreases, and the heat resistance also improves. Workability such as drilling of the laminated printed wiring board can also be controlled by the number of crosslinking points. In the present invention, since hydrogen halide and diethyl sulfide generated by the reaction are released as a gas during heating, they hardly remain in the laminated printed wiring board.
【００１０】[0010]
【作用】本発明のプリント配線基板の積層方法で用いら
れるｐ−キシリレン−ビス（ジエチルスルホニウム塩）
の重合体と多官能ビニル化合物を含む組成物を加熱して
得られるビニル基の一部が多官能ビニル化合物を介して
架橋したポリ（ｐ−フェニレンビニレン）は、誘電率が
低く、従って積層プリント配線基板の誘電率も低くでき
るため、誘電損失、信号伝播遅延時間共に小さな高周波
回路基板の製造に有利に使用できる。The p-xylylene-bis (diethylsulfonium salt) used in the method for laminating printed wiring boards of the present invention.
Poly (p-phenylenevinylene) obtained by heating a composition containing a polymer of the formula (1) and a polyfunctional vinyl compound and having a part of vinyl groups cross-linked through the polyfunctional vinyl compound has a low dielectric constant, and accordingly has a low dielectric constant. Since the dielectric constant of the wiring board can be reduced, it can be advantageously used for manufacturing a high-frequency circuit board having a small dielectric loss and a small signal propagation delay time.
【００１１】[0011]
【実施例】以下、本発明の実施例について具体的に説明
するが、本発明はこれら実施例に限定されるものではな
い。 実施例１ ｐ−キシリレン−ビス（ジエチルスルホニウムブロミ
ド）の重合体の１０％水溶液５０ｇに多官能ビニル化合
物であるジビニルベンゼン０．０２ｇを添加し、攪拌し
て当該多官能ビニル化合物が分散したｐ−キシリレン−
ビス（ジエチルスルホニウムブロミド）水溶液を得た。
この水溶液をガラス製シャ―レに展開し、６０℃で２４
時間乾燥し、膜厚１００μｍの淡黄色のキャストフィル
ムを得た。このフィルムを２枚のガラスクロス含浸エポ
キシ樹脂板で挟み、２００℃で３０分間熱処理したとこ
ろ、積層フィルムが得られた。このフィルムの１ＭＨｚ
で測定した誘電率は４．１であり、従来のガラスクロス
含浸エポキシ樹脂よりなるプリプレグで積層したものよ
り低誘電率で高周波回路用積層プリント配線基板として
は良好な性質を有するものであった。EXAMPLES Examples of the present invention will be specifically described below, but the present invention is not limited to these examples. Example 1 To 50 g of a 10% aqueous solution of a polymer of p-xylylene-bis (diethylsulfonium bromide) was added 0.02 g of divinylbenzene which is a polyfunctional vinyl compound, and the mixture was stirred to disperse the polyfunctional vinyl compound. Xylylene-
An aqueous bis (diethylsulfonium bromide) solution was obtained.
This aqueous solution is spread on a glass dish and kept at 60 ° C. for 24 hours.
After drying for a time, a light yellow cast film having a thickness of 100 μm was obtained. This film was sandwiched between two glass cloth impregnated epoxy resin plates and heat-treated at 200 ° C. for 30 minutes to obtain a laminated film. 1MHz of this film
Was 4.1, which was lower than that of a conventional prepreg made of glass cloth-impregnated epoxy resin, and had good properties as a laminated printed wiring board for high-frequency circuits.
【００１２】実施例２ 実施例１のキャストフィルムを２枚のポリ（ｐ−フェニ
レンビニレン）シ―トで挟み、２００℃で３０分間熱処
理したところ、積層フィルムが得られた。このフィルム
の１ＭＨｚで測定した誘電率は２．１であり、低誘電率
で高周波回路用積層プリント配線基板としては良好な性
質を有するものであった。Example 2 The cast film of Example 1 was sandwiched between two sheets of poly (p-phenylene vinylene) and heat-treated at 200 ° C. for 30 minutes to obtain a laminated film. The dielectric constant of this film measured at 1 MHz was 2.1, which was low and had good properties as a laminated printed wiring board for high-frequency circuits.
【００１３】実施例３ 実施例１のキャストフィルムを２枚のガラスクロスを含
浸したビスマレイミドとトリアジンを成分とする樹脂板
で挟み、２００℃で３０分間熱処理したところ、積層フ
ィルムが得られた。このフィルムの１ＭＨｚで測定した
誘電率は３．６であり、ビスマレイミドとトリアジンを
成分とする樹脂よりなるプリプレグで積層したものより
低誘電率で高周波回路用積層プリント配線基板としては
良好な性質を有するものであった。Example 3 The cast film of Example 1 was sandwiched between two resin plates containing bismaleimide and triazine impregnated with glass cloth and heat-treated at 200 ° C. for 30 minutes to obtain a laminated film. The dielectric constant of this film measured at 1 MHz is 3.6, which is lower than that of a prepreg made of a resin containing bismaleimide and triazine, and has good properties as a laminated printed wiring board for high frequency circuits. Had.
【００１４】実施例４ 実施例１のキャストフィルムを２枚のガラスクロス含浸
フッ素樹脂板で挟み、２００℃で３０分間熱処理したと
ころ、積層フィルムが得られた。このフィルムの１ＭＨ
ｚで測定した誘電率は２．１であり、従来のポリイミド
含浸エポキシ樹脂よりなるプリプレグで積層したものよ
り低誘電率で高周波回路用積層プリント配線基板として
は良好な性質を有するものであった。Example 4 The cast film of Example 1 was sandwiched between two glass cloth impregnated fluororesin plates and heat-treated at 200 ° C. for 30 minutes to obtain a laminated film. 1 MH of this film
The dielectric constant measured in z was 2.1, which was lower than that of a conventional prepreg made of a polyimide-impregnated epoxy resin and had good properties as a laminated printed wiring board for high-frequency circuits.
【００１５】実施例５ 実施例１のジビニルベンゼンに代えてペンタエリスリト
−ルトリアクリレ―トを使う以外は実施例１と同様の方
法で当該多官能ビニル化合物が分散したｐ−キシリレン
−ビス（ジエチルスルホニウムブロミド）の重合体の水
溶液を作製し、実施例１の方法でキャストフィルムを得
た。このフィルムを２枚のガラスクロス含浸エポキシ樹
脂板で挟み、２００℃で３０分間熱処理したところ、積
層フィルムが得られた。このフィルムの１ＭＨｚで測定
した誘電率は４．０であり、従来のガラスクロス含浸エ
ポキシ樹脂よりなるプリプレグで積層したものより低誘
電率で高周波回路用積層プリント配線基板としては良好
な性質を有するものであった。Example 5 p-xylylene-bis (diethylsulfonium) in which the polyfunctional vinyl compound was dispersed in the same manner as in Example 1 except that pentaerythritol triacrylate was used instead of divinylbenzene in Example 1. An aqueous solution of a polymer of bromide) was prepared, and a cast film was obtained by the method of Example 1. This film was sandwiched between two glass cloth impregnated epoxy resin plates and heat-treated at 200 ° C. for 30 minutes to obtain a laminated film. The dielectric constant of this film measured at 1 MHz is 4.0, which is lower than that of a conventional prepreg made of glass cloth impregnated epoxy resin and has good properties as a laminated printed wiring board for high frequency circuits. Met.
【００１６】実施例６ 実施例１のジビニルベンゼンに代えてトリアクリルホル
マ―ルを使う以外は実施例１と同様の方法で当該多官能
ビニル化合物が分散したｐ−キシリレン−ビス（ジエチ
ルスルホニウムブロミド）の重合体の水溶液を作製し、
実施例１の方法でキャストフィルムを得た。このフィル
ムを２枚のガラスクロス含浸エポキシ樹脂板で挟み、２
００℃で３０分間熱処理したところ、積層フィルムが得
られた。このフィルムの１ＭＨｚで測定した誘電率は
４．２であり、従来のガラスクロス含浸エポキシ樹脂よ
りなるプリプレグで積層したものより低誘電率で高周波
回路用積層プリント配線基板としては良好な性質を有す
るものであった。Example 6 p-xylylene-bis (diethylsulfonium bromide) in which the polyfunctional vinyl compound is dispersed in the same manner as in Example 1 except that triacrylformal is used in place of divinylbenzene in Example 1. An aqueous solution of the polymer of
A cast film was obtained by the method of Example 1. This film is sandwiched between two glass cloth impregnated epoxy resin plates.
After heat treatment at 00 ° C. for 30 minutes, a laminated film was obtained. The dielectric constant of this film measured at 1 MHz is 4.2, which is lower than that of a conventional prepreg made of glass cloth impregnated epoxy resin and has good properties as a laminated printed wiring board for high frequency circuits. Met.
【００１７】[0017]
【発明の効果】以上説明したように、本発明によれば高
周波回路用プリント配線基板として良好な特性を有する
低誘電率の積層プリント配線基板の簡便なる積層方法を
提供でき、その効果は大である。As described above, according to the present invention, it is possible to provide a simple laminating method of a low dielectric constant multilayer printed wiring board having good characteristics as a printed wiring board for a high frequency circuit, and the effect is large. is there.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０５Ｋ 3/38 Ｈ０５Ｋ 3/38 Ａ (72)発明者 徐 新非 東京都港区芝５丁目７番１号 日本電気 株式会社内 (56)参考文献 特開 昭50−15059（ＪＰ，Ａ) 特開 昭50−133780（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 3/46 B29D 9/00 B32B 7/10 C08F 12/30 H05K 3/38────────────────────────────────────────────────── ─── Continued on the front page (51) Int.Cl. 6 Identification code FI H05K 3/38 H05K 3/38 A (72) Inventor Xu Shinnon 5-7-1 Shiba, Minato-ku, Tokyo NEC Corporation (56) References JP-A-50-15059 (JP, A) JP-A-50-133780 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) H05K 3/46 B29D 9 / 00 B32B 7/10 C08F 12/30 H05K 3/38
Claims (1)
レン−ビス（ジエチルスルホニウム塩）の重合体と多官
能ビニル化合物を含む組成物、次いで第２のプリント配
線基板を順次積層し、その後前記ｐ−キシリレン−ビス
（ジエチルスルホニウム塩）の重合体と多官能ビニル化
合物を含む組成物が両方のプリント配線基板に接触する
ように押圧し、加熱して前記重合体のビニル基の一部が
多官能ビニル化合物を介して架橋したポリ（ｐ−フェニ
レンビニレン）とすることを特徴とするプリント配線基
板の積層方法。1. A composition containing a polymer of p-xylylene-bis (diethylsulfonium salt) and a polyfunctional vinyl compound, and then a second printed wiring board are sequentially laminated on a first printed wiring board. A composition containing a polymer of p-xylylene-bis (diethylsulfonium salt) and a polyfunctional vinyl compound is pressed so as to come into contact with both printed wiring boards, and heated to reduce a portion of the vinyl groups of the polymer. A method for laminating a printed wiring board, comprising a poly (p-phenylenevinylene) crosslinked via a functional vinyl compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3337863A JP2770627B2 (en) | 1991-11-28 | 1991-11-28 | Method of laminating printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3337863A JP2770627B2 (en) | 1991-11-28 | 1991-11-28 | Method of laminating printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05152756A JPH05152756A (en) | 1993-06-18 |
| JP2770627B2 true JP2770627B2 (en) | 1998-07-02 |
Family
ID=18312697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3337863A Expired - Fee Related JP2770627B2 (en) | 1991-11-28 | 1991-11-28 | Method of laminating printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2770627B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3840387A (en) * | 1973-05-01 | 1974-10-08 | Union Carbide Corp | Masking process by thermal repelling of coating |
| JPS50133780A (en) * | 1974-04-08 | 1975-10-23 |
-
1991
- 1991-11-28 JP JP3337863A patent/JP2770627B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05152756A (en) | 1993-06-18 |
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