JP2768398B2 - Method and apparatus for aligning crystal orientation when cutting single crystal material - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for aligning a crystal orientation at the time of cutting a single crystal material, and more particularly, to a method of cutting a semiconductor ingot with a wire saw so that the cut surface has a predetermined crystal orientation. The present invention relates to a method and an apparatus for aligning a crystal orientation when cutting a single crystal material.

[0002]

2. Description of the Related Art When a single crystal material, for example, a semiconductor ingot is cut by a cutting device, it is necessary to align the crystal orientation so that the cut surface has a predetermined crystal orientation, and then cut. As a conventional method for aligning the crystal orientation at the time of cutting a single crystal material, there is a method disclosed in JP-A-3-10760. In this method, each wire saw is provided with a gonio angle measuring meter and a gonio angle setting device, and the semiconductor ingot is supported by the gonio angle setting device based on the crystal orientation result of the semiconductor ingot directly measured with the gonio angle measuring meter mounted. This is a method of adjusting the inclination of the push-up table to be performed. Or,
Outside the wire saw provided with the gonio angle measuring meter and the gonio angle setting device, a measuring device provided with a gonio angle measuring meter and a gonio angle setting device is separately provided, and the gonio angle setting device of the measuring device and the gonio angle of the wire saw are provided. This is a method of connecting a setting device online and outputting the operating conditions of the gonio angle setting device obtained by this measuring device to a gonio angle setting device of a wire saw.

[0003] Another method is to use an optical system (microscope) or the like to match the reference of the single crystal material with the reference of the cutting device, and then add the crystal orientation information of the single crystal material measured in advance. There is a method of inclining the single crystal material by a predetermined angle based on this.

[0004]

However, the method disclosed in JP-A-3-10760 has a drawback that the cost of the apparatus is high since a goniometer measuring meter is mounted on each wire saw. Also, a method of providing a gonio angle measuring meter and a measuring device having a gonio angle setting device outside the wire saw also requires the gonio angle setting device to be provided in the measuring device, so that the device price becomes expensive. On the other hand, the method using the optical system has a disadvantage that it takes time to match the standard of the single crystal material with the standard of the cutting device, and the working efficiency is deteriorated.

The present invention has been made in view of such circumstances, and a method of aligning a crystal orientation at the time of cutting a single crystal material, which can improve the work efficiency of aligning the crystal orientation of a single crystal material at an inexpensive apparatus price. And an apparatus therefor.

[0006]

According to the present invention, in order to achieve the above object, when a rod-shaped single crystal material is cut into a wafer by a wire row of a wire saw, the cut surface has a predetermined crystal orientation. In a single crystal material cutting orientation alignment device that aligns single crystal material
A work bonding block having each vertical reference plane and the wire saw are provided separately, and the single crystal material is aligned with the work bonding block, and a reference such as an orientation flat formed on the single crystal material is adjusted to a predetermined position. In the state, the center axis of the single crystal material and the horizontal
An adhesive jig for positioning and bonding so that each vertical reference surface is parallel to the other, and is provided on a cutting feed table of the wire saw, and is formed in a cutting feed direction of the cutting feed table and a traveling direction of the wire row. It has horizontal and vertical reference planes perpendicular to the cutting plane, and aligns the reference plane of the work bonding block with the reference plane to position and mount the work bonding block so that the central axis of the single crystal material is aligned. A mounting jig perpendicular to the cutting plane, and the center axis is cut based on a shift amount data of a crystal orientation based on a center axis of the single crystal material measured in advance outside the wire saw. A tilting mechanism for tilting the single crystal material so as to have a predetermined tilt with respect to the plane.

[0007]

According to the present invention, first, using a bonding jig provided separately from a wire saw, a rod-shaped single crystal material is attached to a work bonding block, and the central axis of the single crystal material and the horizontal / vertical direction of the work bonding block. Positioning and bonding are performed so that the respective reference planes are parallel to each other. Next, the work bonding block is provided on a cutting and feeding table of a wire saw, and each of horizontal and vertical references perpendicular to a cutting plane formed by the cutting and feeding direction of the cutting and feeding table and the running direction of the wire row. It is positioned and mounted on a mounting jig having a surface. Thereby, the central axis of the single crystal material is automatically orthogonal to the cutting plane. Next, based on the deviation information of the crystal orientation based on the central axis of the single crystal material, which has been measured in advance outside the wire saw, so that the central axis has a predetermined inclination with respect to the cutting plane. The single crystal material is tilted by a tilting mechanism. That is, using a simple member and a jig such as a work bonding block, an adhesive jig, and a mounting jig, the central axis of the single crystal material is set to a predetermined angle (in this case, an orthogonal relationship) with the cutting plane. The center axis is set at a predetermined inclination (cut plane of the cut single crystal material) with respect to the cutting plane based on crystal misalignment information of the crystal orientation with respect to the center axis measured in advance. So that the single crystal material is inclined with respect to the cutting plane so that the inclination becomes a predetermined crystal orientation).

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the method and apparatus for aligning the crystal orientation at the time of cutting a single crystal material according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows a wire saw 1 to which the method for aligning crystal orientation at the time of cutting a single crystal material according to the present invention is applied.
0 is a perspective view in which the mounting jig 12 of the present invention is incorporated in the cutting feed table 22. FIG. 2 and FIG.
It is the side view and front view of the bonding jig 14 of this invention. Also,
6 and 7 are a side view and a front view of the mounting jig 12 of the present invention.

Before describing the bonding jig 14 and the mounting jig 12, a cutting mechanism of the wire saw 10 will be described. As shown in FIG. 1, a wire 16 unwound from one of the reels (not shown) has a plurality of grooved rollers 18,
18 are sequentially wound around to form a wire row 20,
It is wound on the other reel (not shown). Further, a cutting feed table 22 is provided above the wire row 20, and a slide member 24 of the cutting feed table 22
Are slidably supported by a pair of parallel guide rails 28 vertically arranged via a plurality of linear bearings 26. The nut member 30 fixed to the slide member 24 is screwed into a lead screw 32 provided along the guide rail 28, and the lead screw 32 is rotated by a forward / reverse rotatable motor 34. Therefore, when the lead screw 32 is rotated by the motor 34, the cutting feed table 22 moves in the vertical direction (ZZ direction in the figure).

A mounting jig 12 is supported below the slide member 24. The mounting jig 12 is cut by a tilting mechanism for tilting the mounting jig 12 and the bonding jig 14. A clamping mechanism for positioning and mounting a work bonding block 42 to which a semiconductor ingot 38 (single crystal material) as a member is bonded via a slice base 40. Further, the tilting mechanism section horizontally swings a tilting column 36 slidably supported on a hemispherical sliding surface 39 of a tilting base 37 by a tilting device built in the tilting column 36 (see FIG. 1). It is configured to swing vertically (in the direction AA) and to swing vertically (in the direction B-B in the figure).

When cutting the semiconductor ingot 38 with the wire saw 10 described above, the cutting feed table 22 is moved in the cutting feed direction (Z-Z wire row direction in the figure), and the semiconductor ingot 38 is The processing liquid is supplied to the wire array 20 while being pressed against the wire array 20 traveling at a high speed in the traveling direction (XX direction in the figure).
Thus, the semiconductor ingot 38 is cut into a number of thin wafers by the lapping action of the working fluid supplied to the wire row 20.

Next, the bonding jig 14 of the present invention provided separately from the wire saw 10 will be described with reference to FIGS. The semiconductor ingot 38 has an orientation flat 3 in the longitudinal direction of the surface of the semiconductor ingot 38 so that the crystal orientation can be understood when the wafer becomes a wafer.
8A or notch 38B is formed (see FIG. 4). As shown in FIGS. 2 and 3, on the base 44, a V block 48 (receiving base) having a V-shaped groove 46 formed in the longitudinal direction is fixed. At the bottom of the groove 46 of the V block 48, an orientation flat piece 50 is horizontally disposed along the groove 46. Further, through holes are formed at both ends in the longitudinal direction of the orientation flat piece 50, and a notch pin 52 having a sharp tip is penetrated through the through hole movably. The base end of the notch pin 52 is supported by a fixed base 54, and a plurality of compression springs 56 are disposed between the fixed base 54 and the base 44. Thus, when the tip of the notch pin 52 is pushed, the tip of the notch pin 52 protruding from the orientation flat piece 50 is hidden by the through hole. In the case of the semiconductor ingot 38 on which the orientation flat 38A is formed, the position of the orientation flat 38A is determined by the orientation flat piece 50, and in the case of the semiconductor ingot 38 on which the notch 38B is formed, the notch 38A is formed. The position of the notch 38A is determined by projecting the tip of the pin 52 for use.

A vertical support 58 is fixed to the base 44, and a pair of guide rails 60, 60 parallel to the support 58 are vertically arranged. A support member 64 is slidably supported on the guide rail 60 via a plurality of linear bearings 62, 62..., And the upper and lower ends of the nut member 66 fixed to the support member 64 Bearings 58A, 58 provided in 58
A lead screw 68 rotatably supported by B is screwed. A handle 70 is provided at the upper end of the lead screw 68. Thus, when the handle 70 is rotated, the support member 64 moves up and down along the guide rail 60.

The main body of the support member 64 is an upper plate 64.
A, a back plate 64B, both side plates 64C and 64C, and is formed in a hollow square shape with an open front surface (arrow 72 side in FIG. 2) and a bottom surface (see FIG. 3). Also, both side plates 64C, 64
C is formed in a state where the L-shape faces each other, and the L-shaped horizontal portion 6 is formed.
A horizontal reference plane 74 is formed in 4D. Also, abutting pieces 78, 78 are provided at both ends of the back plate 64B surface in the support member 64, respectively, to form a vertical reference.
Further, through holes are formed at both ends of the upper plate 64A, and female screws are cut into the through holes, and bolts 76, 76 are screwed into the through holes. Thus, when the bolt 76 is rotated, the amount of protrusion of the tip of the bolt 76 that projects into the support member 64 changes.

Next, the method of using the adhesive member 14 will be described. The semiconductor ingot 38 is placed laterally along the groove 46 of the V-block 48, and the notch 38B of the semiconductor ingot 38 is positioned by the notch pin 52. (In this case, a semiconductor ingot with a notch is used). At this time, the support member 64 is positioned above enough to place the semiconductor ingot 38 on the V block 48. On the other hand, a rectangular parallelepiped upper block 42A having horizontal and vertical reference surfaces 41, 43
And a work bonding block 42 including a lower block 42B having a rectangular parallelepiped shape slightly smaller than the upper block 42A.
(See FIG. 5) from the front of the support member 64.
And hang over the horizontal portions 64D of both side plates 64C, 64C. Then, with the vertical reference surface 43 of the work bonding block 42 abutting against the abutting piece 78, the work bonding block 42 is pushed downward by the bolt 76, and the horizontal reference surface 41 of the work bonding block 42 is moved to both side plates 64C and 64.
It is fixed in a state where it abuts against the horizontal reference surface 74 of C. As a result, a parallel relationship is formed between the central axis 38A of the semiconductor ingot 38 and each of the reference surfaces 41 and 43 of the work bonding block 42. Next, the support member 64 is connected to the semiconductor ingot 3.
8, the work bonding block 42 is bonded to the semiconductor ingot 38 with the adhesive 80 via the slice base 40. At this time, the work bonding block 42 can also be used as the slice base 40 without using the slice base 40. In this bonding operation, if a gap is formed between the work bonding block 42 and the slice base 40, the gap is filled with the adhesive 80. Thereby, the central axis 38A of the semiconductor ingot 38 and the reference surfaces 41 and 43 of the work bonding block 42 can be bonded via the slice base 40 in a state where a parallel relationship is formed.

Next, the mounting jig 12 of the present invention provided on the cutting and feeding table 22 of the wire saw 10 will be described with reference to FIGS. As shown in FIGS. 6 and 7, the mounting jig 12 includes a clamp mechanism 82 and a tilting mechanism (not shown). Clamp mechanism 82
Consists of an upper plate 82A, a back plate 82B, and both side plates 82C and 82C, like the support member 64 of the bonding jig 14 described above.
It is formed in a hollow square shape with an open front surface (arrow 83 side in FIG. 6) and a bottom surface (see FIG. 7). Also, both side plates 82C,
82C is formed with the L-shape facing each other, and a horizontal reference surface 84 is formed on the L-shaped horizontal portion 82D. A vertical reference surface 8 is provided on the back plate 82B surface in the clamp mechanism 82.
6 are formed. In addition, a first clamp cylinder 104 for positioning and clamping the vertical reference surface 43 of the work bonding block 42 against the vertical reference surface 86 of the clamp mechanism 82 is provided at the center of the upper plate 82A.
On both end sides of the upper plate 82A, second clamp cylinders 106, 106 for positioning and clamping the horizontal reference surface 41 of the work bonding block 42 against the horizontal reference surface 84 of the clamp mechanism 82 are provided. Also, the cylinder rods 104A, 106A of the clamp cylinders 104, 106
A extends and contracts into the clamp mechanism 82 through a through hole formed in the upper plate 82A. Open ends 81 and 85 of air flow paths 87 and 88 are formed on a horizontal reference plane 84 and a vertical reference plane 86 formed in the clamp mechanism 82. The first air passage 78 connected to the open end 81 of the horizontal reference surface 84 is provided between the upper and lower plates 82C, 82C.
2A, and communicates with a first connection member 90 fixed outside one side plate 82C, and a first air pipe 92 connected to the first connection member 90 is connected to a first pressure gauge 9.
It is connected to 4. Further, a first air hose 96 branched from the middle of the first air pipe 92 is connected to a compressor (not shown). On the other hand, the open end 85 of the vertical reference plane 86
Is formed in the back plate 82B, communicates with the second connecting member 98 fixed outside the upper plate 82A, and is connected to the second connecting member 98. Is connected to a second pressure gauge 102.
A second air hose 105 branched from the middle of the second air pipe 98 is connected to the compressor. Then, the air from the compressor is released from the open ends 81, 85.
So that it always blows out from. As a result, when the open ends 81 and 85 are shut off, the pressure in the air flow passages 87 and 88 increases, and the increase in the pressure is detected by the pressure gauges 94 and 102. , 43 are reference surfaces 84, 86 of the clamp mechanism 82.
A seating confirmation sensor for confirming that the user has been properly seated can be formed.

Next, a method of using the mounting jig 12 will be described.
Is inserted from the front of the clamp mechanism 82, and is placed over the horizontal portions 82D of the side plates 82C. Next, the first clamp cylinder 104 is operated to extend the cylinder rod 104A, and pushes the slope of the contact member 42C fixed on the upper center portion of the work bonding block 42. As a result, the work bonding block 42 is moved in the direction of the back plate 82B of the clamp mechanism 82, and the vertical reference surface 43 of the work bonding block 42 is moved.
Abuts against the vertical reference plane 86 of the clamp mechanism 82.
Subsequently, the second clamp cylinder 106 is operated to extend the cylinder rod 106 </ b> A, and the horizontal reference surface 41 of the work bonding block 42 abuts against the horizontal reference surface 84 of the clamp mechanism 82. In this state, the first and second clamp cylinders 104 and 106 are locked and clamped so that the work bonding block 42 does not move. At this time,
Horizontal reference plane 84 and vertical reference plane 8 of clamp mechanism 82
6 is provided with a seating confirmation sensor, it is possible to surely confirm whether or not the reference surfaces of the work bonding block 42 and the clamping mechanism 82 are correctly butted together.

Next, the method of aligning the crystal orientation at the time of cutting a single crystal material according to the present invention will be described. First, wire saw 1
The semiconductor ingot 38 is attached to the work adhesive block 42 by using an adhesive jig 14 provided separately from the orientation flat or notch formed on the semiconductor ingot 38 and the orientation flat piece 50 or the notch pin 52 is used.
Then, the center axis 38A of the semiconductor ingot 38 and the horizontal and vertical reference surfaces 41 and 43 of the work bonding block 42 are positioned and bonded via the slice base 40 so as to be parallel to each other. Next, the work bonding block 42 is mounted on the cutting feed table 22 of the wire saw 10 and has horizontal and vertical reference planes 84 and 86 orthogonal to a cutting plane (ZX plane in FIG. 1). The jig 12 is positioned and mounted on the clamp mechanism 82.
Thereby, the central axis 38A of the semiconductor ingot 38 is automatically orthogonal to the cutting plane. Next, the central axis 38A of the semiconductor ingot 38 measured in advance outside the wire saw 10 (for example, measured with a goniometer).
The mounting jig 12 is tilted by the tilting mechanism so that the central axis 38A of the semiconductor ingot 38 has a predetermined tilt with respect to the cutting plane based on the information on the amount of deviation of the crystal orientation with reference to the above. As a result, the semiconductor ingot 38 is inclined at a predetermined angle with respect to the cutting plane, so that the crystal orientation can be adjusted so that the cut surface of the semiconductor ingot 38 has a predetermined crystal orientation.

As described above, in the method and apparatus for aligning the crystal orientation when cutting a single crystal material according to the present invention, simple members and jigs such as the work bonding block 42, the bonding jig 14, and the mounting jig 12 are used. The center axis 38A of the semiconductor ingot 38 is at a predetermined angle to the cutting plane (in this case, orthogonal relationship).
The center axis 38A can be set easily and quickly so that the center axis 38A has a predetermined inclination (cutting) with respect to the cutting plane based on the information of the amount of deviation of the crystal orientation based on the center axis 38A measured in advance. The semiconductor ingot 38 can be tilted with respect to the cutting plane so that the cut surface of the semiconductor ingot 38 has a predetermined crystal orientation). It is possible to improve the operation efficiency of aligning the crystal orientation of the single crystal material at a relatively low device price.

The clamp mechanism 82 built in the mounting jig 12 is connected to the first and second cylinder clamps 10.
Since the work bonding block 42 can be automatically clamped by the steps 4 and 106, the work in the dirty processing chamber can be reduced as much as possible, so that the burden on the operator can be reduced. Although the details of the tilting mechanism are omitted, the tilting mechanism is controlled by numerical control, so that accurate and stable control can be performed without any individual difference in control accuracy between workers. In addition, since the crystal orientation can be adjusted in a shorter time as compared with a method using a conventional optical system, the operation time can be reduced.

In this embodiment, the method of aligning the crystal orientation at the time of cutting a single crystal material according to the present invention has been described as an example in which the method is applied to a wire saw type slicing machine. It can also be applied to machines. Further, in the present embodiment, as shown in FIG. 1, the cutting feed direction is set to the ZZ direction, and the running direction of the wire row is set to the XX direction. It is also possible to arrange the device so as to cut the semiconductor ingot in the running direction in the Z-Z direction, that is, in the transverse direction to the vertical wire row. Also, when the work bonding block is mounted on the mounting jig, the center axis of the semiconductor ingot is set to be orthogonal to the cutting plane, but this is the most appropriate example. The center axis of the ingot may be set at a predetermined angle. Further, the tilting mechanism is built in the mounting jig, but the mounting jig may be tilted from outside the mounting jig.

[0022]

As described above, according to the method and apparatus for aligning the crystal orientation at the time of cutting a single crystal material according to the present invention,
The center axis of the single crystal material can be easily and quickly set to be perpendicular to the cutting plane using simple members and jigs such as a work bonding block, an adhesive jig, and a mounting jig. The single crystal material can be tilted with respect to the cutting plane so that the center axis has a predetermined inclination with respect to the cutting plane based on the deviation amount information of the crystal orientation based on the center axis. Compared with the conventional method for aligning the crystal orientation at the time of cutting the single crystal material, it is possible to improve the operation efficiency of aligning the crystal orientation of the single crystal material at a lower price for the apparatus.

[Brief description of the drawings]

FIG. 1 is a perspective view of a wire saw to which a method for aligning a crystal orientation at the time of cutting a single crystal material according to the present invention is applied, in which a mounting jig of the present invention is incorporated in a cutting feed table.

FIG. 2 is a side view of the bonding jig according to the present invention, with a part cut away.

FIG. 3 is a front view of the bonding jig according to the present invention.

FIG. 4 is a perspective view showing an orientation flat or notch formed in the semiconductor ingot.

FIG. 5 is a perspective view showing a work bonding block according to the present invention.

FIG. 6 is a side view showing a partial cross section of the mounting jig according to the present invention.

FIG. 7 is a front view showing a partial cross section of the mounting jig according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Wire saw 12 ... Mounting jig 14 ... Adhesive jig 16 ... Wire 18 ... Groove roller 20 ... Wire row 22 ... Cutting feed table 36 ... Tiltable support mechanism 38 ... Semiconductor ingot 38A ... Center axis of semiconductor ingot 40 ... Slice base 41 ... Horizontal reference plane of work bonding block 42 ... Work bonding block 43 ... Vertical reference plane of work bonding block 48 ... V block 50 ... Orientation piece 52 ... Notch pin 64 ... Support member 76 ... Bolt 78 ... Protrusion Contact piece 80 ... Adhesive 81,85 ... Open end of air flow path 82 ... Clamp mechanism 84 ... Horizontal reference plane of clamp mechanism 86 ... Vertical reference plane of clamp mechanism 87,88 ... Air flow paths 94,102 ... Pressure gauge 104, 106 ... clamp cylinder

Claims (6)

(57) [Claims] 1. A single crystal material for cutting a single crystal material, wherein when the single crystal material in a rod shape is cut into a wafer by a cutting device, the crystal orientation of the single crystal material is adjusted so that the cut surface has a predetermined crystal orientation. In the orientation alignment method, first, outside of the cutting apparatus, the center of the single crystal material is aligned with a work bonding block with a reference such as an orientation flat formed on the single crystal material at a predetermined position. An axis and the horizontal and vertical reference surfaces of the work bonding block are positioned and bonded so as to be parallel to each other. Next, the work bonding block has horizontal and vertical reference surfaces orthogonal to a cutting plane. On the mounting jig of the cutting device, it is positioned and mounted so that the respective reference surfaces of the work bonding block and the mounting jig are aligned with each other, and the central axis of the single crystal material is aligned with the cutting plane. Then, the center axis is predetermined with respect to the cutting plane based on the shift amount information of the crystal orientation based on the center axis of the single crystal material measured outside the cutting apparatus in advance. A method for aligning crystal orientation when cutting a single crystal material, characterized in that the single crystal material is tilted so as to have a tilt of. 2. When cutting a single-crystal material, the rod-shaped single-crystal material is cut into a wafer by a wire row of a wire saw, and the crystal orientation of the single-crystal material is adjusted so that the cut surface has a predetermined crystal orientation. In the crystal orientation alignment device, a work bonding block having horizontal and vertical reference planes, and the single crystal material is provided separately from the wire saw, and the single crystal material is formed on the work bonding block on the single crystal material. A bonding jig for positioning and bonding the central axis of the single crystal material and the horizontal and vertical reference surfaces of the work bonding block in parallel with a reference such as an orientation flat at a predetermined position; Is provided on the cutting feed table, and is orthogonal to a cutting plane formed by the cutting feed direction of the cutting feed table and the traveling direction of the wire row. It has flat and vertical reference surfaces, and aligns the reference surface of the work bonding block with the reference surface to position and mount the work bonding block so that the central axis of the single crystal material is orthogonal to the cutting plane. A mounting jig to be moved, and a predetermined inclination of the central axis with respect to the cutting plane based on deviation information of the crystal orientation with respect to the central axis of the single crystal material measured in advance outside the wire saw. And a tilting mechanism for tilting the single crystal material so as to obtain a crystal orientation alignment device for cutting a single crystal material. 3. The bonding jig has a receiving table for positioning and placing the single crystal material in a horizontal and horizontal direction, and has a horizontal and vertical reference surface provided above the receiving table. 3. A single crystal material according to claim 2, comprising: a support member for positioning and supporting a horizontal and vertical reference surface of said work bonding block on a surface thereof; and a vertical movement mechanism for vertically moving said support member. Crystal orientation alignment device for cutting. 4. The mounting jig includes: a mounting jig main body having horizontal and vertical reference planes perpendicular to the cutting plane; and a vertical section of the work bonding block mounted in the mounting jig main body. First clamping means for abutting a reference surface against a vertical reference surface of the mounting jig body to perform positioning clamp; and positioning clamp by abutting a horizontal reference surface of the work bonding block to a horizontal reference surface of the mounting jig body. Second
3. The apparatus according to claim 2, further comprising: a clamping means. 5. A sensor for confirming that each reference surface of said work bonding block is seated on each reference surface of said mounting jig is provided on each reference surface of said mounting jig. 5. The crystal orientation aligning apparatus according to claim 2, wherein the single crystal material is cut. 6. The single crystal material cutting device according to claim 2, wherein said mounting jig is provided on said cutting feed table so as to be tiltable, and has a built-in tilt mechanism for tilting said mounting jig. Crystal orientation aligner.