JP2765089B2 - Clothes dryer - Google Patents

Clothes dryer

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Publication number
JP2765089B2
JP2765089B2 JP1228530A JP22853089A JP2765089B2 JP 2765089 B2 JP2765089 B2 JP 2765089B2 JP 1228530 A JP1228530 A JP 1228530A JP 22853089 A JP22853089 A JP 22853089A JP 2765089 B2 JP2765089 B2 JP 2765089B2
Authority
JP
Japan
Prior art keywords
semiconductor
heater
heat
drum
semiconductor heater
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1228530A
Other languages
Japanese (ja)
Other versions
JPH0392195A (en
Inventor
正光 三原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1228530A priority Critical patent/JP2765089B2/en
Publication of JPH0392195A publication Critical patent/JPH0392195A/en
Application granted granted Critical
Publication of JP2765089B2 publication Critical patent/JP2765089B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】 産業上の利用分野 本発明は、正の温度抵抗特性を有する正特性サーミス
タ素子と放熱フィンを利用した半導体ヒータ及び、その
半導体ヒータを用いた衣類乾燥機に関するものである。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor heater using a positive temperature coefficient thermistor element having a positive temperature resistance characteristic and a radiating fin, and a clothes dryer using the semiconductor heater. .

従来の技術 従来、この種半導体ヒータの構成を第7図に示す。図
において1は半導体発熱素子で、直列的に複数連結させ
ている。2は電極板、3は放熱フィン,4は端子板で、電
極板2と放熱フィン3と端子板4とはアルミニウムより
構成され、各々を一体的にろう付けしている。これら電
極板2,放熱フィン3,端子板4を一体的にした放熱体5に
て、半導体発熱素子1を導電挟持している。
2. Description of the Related Art FIG. 7 shows a configuration of a conventional semiconductor heater. In the figure, reference numeral 1 denotes a semiconductor heating element, which is connected in plurality in series. Reference numeral 2 denotes an electrode plate, 3 denotes a radiation fin, and 4 denotes a terminal plate. The electrode plate 2, the radiation fin 3, and the terminal plate 4 are made of aluminum, and they are integrally brazed. The semiconductor heating element 1 is conductively sandwiched by a radiator 5 in which the electrode plate 2, the radiation fins 3, and the terminal plate 4 are integrated.

そしてこのような構成の半導体ヒータを複数個並列に
接続することによって所定の発熱量を得ていた。
By connecting a plurality of semiconductor heaters having such a configuration in parallel, a predetermined amount of heat has been obtained.

発明が解決しようとする課題 しかしながら、この構成では高発熱量を得るには非常
に不具合を生じていた。送風を半導体素子1と放熱体5
に供給するにも、A×B面積に限界があり、送風量の増
大する手段が必要で、送風装置の騒音が発生したり、効
率の悪い半導体ヒータとなっていた。また、波形状の放
熱フィン3は一般に板厚0.25mm程度,波形高さは10mm程
度,波形幅は15mm程度で、所定の発熱量を得ていたが、
送風量を増大するか、半導体発熱素子1の数を増すかし
ないと、高発熱量は得られないため、送風供給装置の羅
音増大または装置の規模大、さらには半導体発熱素子1
のコストアップとなっていた。
Problems to be Solved by the Invention However, in this configuration, there has been a serious problem in obtaining a high calorific value. The air is blown by the semiconductor element 1 and the radiator 5
However, there is a limit in the area of A × B, and a means for increasing the amount of air blow is required, so that the blower generates noise and the semiconductor heater is inefficient. The wave-shaped heat radiation fins 3 are generally about 0.25 mm in thickness, about 10 mm in height, and about 15 mm in width.
Unless the amount of blown air is increased or the number of semiconductor heat generating elements 1 is increased, a high heat generated cannot be obtained.
Cost had risen.

このような従来の半導体ヒータでは、高発熱量が得ら
れないため、衣類乾燥機において乾燥時間短縮ができな
かったり、送風量を減少させて所定の発熱量を得ること
による低騒音化が図れなかった。
In such a conventional semiconductor heater, since a high heat value cannot be obtained, the drying time cannot be shortened in the clothes dryer, or noise reduction cannot be achieved by obtaining a predetermined heat value by reducing the blowing amount. Was.

本発明は上記課題を鑑み、高効率の高発熱量が得られ
る半導体ヒータを提供し、衣類乾燥機での乾燥時間短縮
あるいは、送風量減少による低騒音化を図り、熱に弱い
衣類の熱変色も防止させるものである。
SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a semiconductor heater capable of obtaining a high calorific value with high efficiency, shortening a drying time in a clothes dryer or reducing noise by reducing an amount of air blow, and heat discoloration of heat-sensitive clothes. Is also prevented.

課題を解決するための手段 上記目的を達成するために、アルミニウムよりなる波
形状のアルミフィンの両側に平板状のアルミ薄板をろう
付けして放熱体を形成し、この放熱体の平板状部分に半
導体発熱素子を接着し、前記放熱体を半導体発熱素子の
両面に一対固着させたものを一ヶの半導体ヒータのユニ
ットとして、この半導体ヒータのユニットをドラム前壁
を回転支持するドラム前板の円周凹部内に複数個収容す
るとともに、これら半導体ヒータのユニットを配したド
ラム前板には熱風口をドラムの下部に臨むように配し、
前記複数の半導体ヒータは前記ドラム前板の円周凹部内
に直列に配され、ヒータの「強」、「弱」切換え時の
「弱」側の半導体ヒータのユニットを「強」側の半導体
ヒータのユニットより上方位置に配したものである。
Means for Solving the Problems In order to achieve the above object, a flat aluminum thin plate is brazed on both sides of a corrugated aluminum fin made of aluminum to form a radiator, and a radiator is formed on the flat portion of the radiator. A semiconductor heating element is adhered, and a pair of the heat radiator is fixed to both surfaces of the semiconductor heating element as a single semiconductor heater unit, and this semiconductor heater unit is a circle of a drum front plate that rotatably supports a drum front wall. While accommodating plural units in the peripheral recess, a hot air port is arranged on the drum front plate where these semiconductor heater units are arranged so as to face the lower part of the drum,
The plurality of semiconductor heaters are arranged in series in a circumferential concave portion of the drum front plate, and the unit of the semiconductor heater on the “weak” side when switching between “strong” and “weak” of the heater is changed to the semiconductor heater on the “strong” side. Are arranged above the unit.

作用 本発明では、半導体ヒータのユニットをドラム前壁を
回転支持するドラム前板の円周凹部内に複数個収容する
とともに、これら半導体ヒータのユニットを配したドラ
ム前板には熱風口をドラムの下部に臨むように配し、前
記複数の半導体ヒータは前記ドラム前板の円周凹部内に
直列に配され、ヒータの「強」、「弱」切換え時の
「弱」側の半導体ヒータのユニットを「強」側の半導体
ヒータのユニットより上方位置に配しているので、
「弱」使用時の熱に弱い少量の衣類の乾燥時において、
熱に弱い衣類が一時停止などによりドラムの底部側にた
まっても、半導体ヒータユニットから高温輻射熱による
熱影響を防止できる。また、記放熱体を半導体発熱素子
の両面に一対固着させたものを一ヶの半導体ヒータのユ
ニットとしているので、放熱体の放熱性能を高めること
ができ、従来と同じ発熱量を得る場合、半導体発熱素子
の数を減らすことができ、コストダウンが図れる。ま
た、半導体発熱素子を従来と同じ数で組み込んだ場合、
送風ファン回転数を下げることが可能となり、低騒音化
が図れる。
In the present invention, a plurality of semiconductor heater units are accommodated in a circumferential recess of the drum front plate that rotatably supports the drum front wall, and a hot air port is provided on the drum front plate on which the semiconductor heater units are arranged. A plurality of semiconductor heaters are arranged so as to face a lower portion, and the plurality of semiconductor heaters are arranged in series in a circumferential concave portion of the drum front plate, and a unit of a semiconductor heater on a “weak” side when the heater is switched between “strong” and “weak” Is located above the semiconductor heater unit on the "strong" side,
When drying a small amount of clothing that is sensitive to heat when using "weak",
Even if the heat-sensitive clothing accumulates on the bottom side of the drum due to a temporary stop or the like, it is possible to prevent the semiconductor heater unit from affecting the heat due to the high-temperature radiant heat. In addition, since the heat radiator is fixedly attached to both sides of the semiconductor heat generating element as a single semiconductor heater unit, the heat radiating performance of the heat radiator can be improved. The number of heating elements can be reduced, and cost can be reduced. In addition, when the same number of semiconductor heating elements are incorporated as before,
The number of rotations of the blower fan can be reduced, and noise can be reduced.

実 施 例 以下、本発明の一実施例を添付図面にもとづいて説明
する。第1図において、衣類乾燥機の外枠6内に回転自
在にドラム7を支持し、ドラム7の後部には熱交換機能
と送風機能を備えた熱交換型送風器8を設けている。す
なわち、熱交換型送風器8は乾燥用空気aと冷却用空気
bの送風を行うと共に両面に両空気を流し両空気間で熱
交換を行う。9は熱交換型送風器8とドラム7とを回転
駆動するモータ、10は熱交換した後の乾燥空気を加熱す
る半導体ヒータ11を収設したヒータケースであり、熱交
換型送風器8を収納したファンケース12とダクト13を介
し連結されている。運転中、乾燥用空気aはヒータケー
ス10内の半導体ヒータ11を通過し、熱風としてドラム7
内に送り込まれる。半導体ヒータ11はドラム7の前壁部
を形成し回転支持するドラム前板16の円周内凹部17内に
2つのユニットとして直列的に分割して配している。16
aはドラム前板に設けた熱風口である。
Embodiment An embodiment of the present invention will be described below with reference to the accompanying drawings. In FIG. 1, a drum 7 is rotatably supported in an outer frame 6 of a clothes dryer, and a heat exchange type blower 8 having a heat exchange function and a blowing function is provided at the rear of the drum 7. In other words, the heat exchange type blower 8 blows the drying air a and the cooling air b, flows both airs on both sides, and performs heat exchange between the two airs. Reference numeral 9 denotes a motor for driving the heat exchange type blower 8 and the drum 7 to rotate. Reference numeral 10 denotes a heater case in which a semiconductor heater 11 for heating dry air after heat exchange is housed, and houses the heat exchange type blower 8. It is connected to the fan case 12 via a duct 13. During operation, the drying air “a” passes through the semiconductor heater 11 in the heater case 10 and becomes a hot air in the drum 7.
Sent inside. The semiconductor heater 11 is divided into two units in series in a circumferential recess 17 of a drum front plate 16 which forms the front wall of the drum 7 and supports the drum. 16
a is a hot air port provided on the drum front plate.

前記半導体ヒータ11は第2図,第3図に示すように、
アルミニウムよりなる波形状のアルミフィン12の両側に
平板状のアルミ薄板12aをろう付して放熱体14を形成し
ている。前記平板状部分に複数よりなる半導体発熱素子
15の両面を接着するように固着し、通電挟持し、少なく
とも放熱体14は、複数の半導体発熱素子15の両面の一対
に固着させたものを1ケのユニットとし外側のアルミ薄
板12a側にそれぞれ端子18を固着し、電源印加させるよ
うにしている。
The semiconductor heater 11 is, as shown in FIGS.
A radiator 14 is formed by brazing a flat aluminum thin plate 12a to both sides of a corrugated aluminum fin 12 made of aluminum. A plurality of semiconductor heating elements formed on the flat plate portion
The two surfaces of the semiconductor heat-generating element 15 are fixed to a pair of both surfaces of a plurality of semiconductor heat-generating elements 15 to form one unit, and each of the heat-radiating elements 14 is provided on the outer aluminum thin plate 12a side. The terminal 18 is fixed and power is applied.

アルミフィン12の板厚tと、波形状の山高さhとの関
係はt≧0.022hとし、かつ山高さh≒サーミスタ素子の
幅Wとしている。
The relationship between the thickness t of the aluminum fins 12 and the peak height h of the wave shape is t ≧ 0.022 h, and the peak height h ≒ the width W of the thermistor element.

第4図において、アルミフィン12の板厚とフィン1枚
当りの伝熱量を示し、実験値の平均値を示している
(尚、計算値も同水準であるため省く)。ここでアルミ
フィン12の高さh=10の場合、板厚が0.25mm位より伝熱
量は飽和(このポイントをxとする)し、高さh=15で
は0.33mm位より伝熱量は飽和(このポイントをyとす
る)し、それ以上の板厚アップは無効に近くなり、高効
率的使用範囲はh=15時は0.33mm付近が最適設定とな
る。xからyポイントへの伝熱量の向上は約30%とな
り、第5図でも示すようにフィン高さ15mmが最も高率的
な伝熱量となる。尚、この条件において、アルミフィン
12の山ピッチは2.2mmを一定条件として求めた。
In FIG. 4, the plate thickness of the aluminum fins 12 and the amount of heat transfer per fin are shown, and the average value of the experimental values is shown (note that the calculated values are also at the same level and are omitted). Here, when the height h of the aluminum fins 12 is h = 10, the amount of heat transfer is saturated when the plate thickness is about 0.25 mm (this point is x), and when the height h = 15, the amount of heat transfer is saturated from about 0.33 mm ( This point is assumed to be y), and any further increase in the thickness becomes almost ineffective, and the optimum setting for the highly efficient use range is around 0.33 mm at h = 15. The amount of heat transfer from the x point to the y point is improved by about 30%. As shown in FIG. 5, the fin height of 15 mm is the highest rate of heat transfer. In this condition, aluminum fins
Twelve peak pitches were determined under a constant condition of 2.2 mm.

したがって、本発明によれば、伝熱量を従来より約30
%向上させる構成として、コストは半導体発熱素子数を
減少させアルミフィンの使用量も最少限に抑さえること
ができ大幅なコストダウンが図れ、また、半導体発熱素
子数を増さなくても、高効率な発熱量が得られる。
Therefore, according to the present invention, the amount of heat transfer is
The cost can be reduced by reducing the number of semiconductor heating elements and minimizing the amount of aluminum fins used, thereby achieving a significant cost reduction. In addition, the cost can be increased without increasing the number of semiconductor heating elements. An efficient calorific value is obtained.

すなわち、総合的に高効率な半導体ヒータとして、山
高さh=15mmとし、アルミフィン板厚t0.33mm以上、か
つh≒半導体発熱素子の幅Wとしたものである。よって
t≧0.022h,h≒半導体発熱素子の幅Wとし、相似形にも
適用するものである。
That is, as a semiconductor heater with high efficiency overall, the peak height h is 15 mm, the thickness of the aluminum fin plate is t0.33 mm or more, and h ≒ the width W of the semiconductor heating element. Therefore, t ≧ 0.022h, h ≒ the width W of the semiconductor heating element, and the present invention is applied to a similar shape.

第6図において、衣類乾燥機に用いた実施例の詳細を
示し、半導体ヒータ11のユニットをドラム7の前壁を回
転支持するドラム前板16の円周内凹部17内に複数ユニッ
トとして略直列的に分割して配している。
In FIG. 6, the details of the embodiment used for the clothes dryer are shown, and the units of the semiconductor heater 11 are substantially connected in series as a plurality of units in the concave portion 17 in the circumference of the drum front plate 16 which rotatably supports the front wall of the drum 7. It is divided and arranged.

この半導体ヒータ11を用いた衣類乾燥機において、半
導体発熱素子1を略直列的に配することにより、ドラム
前板16の円周内凹部17内に複数ユニットとして省スペー
スに収設可能とし、熱風吹き出しの開口面積を拡大し、
ゆったりした温風をドラム7庫内に供給することがで
き、高発熱量が可能となるため、乾燥時間短縮が図れ
る。また、逆に高発熱量が可能なため、熱交換型送風器
8の回転数を減少させることができ、低騒音化が図れ
る。
In the clothes dryer using the semiconductor heater 11, the semiconductor heating elements 1 are arranged substantially in series, so that a plurality of units can be housed in the space inside the concave portion 17 of the drum front plate 16 in a space-saving manner. Expand the opening area of the balloon,
Slow warm air can be supplied to the inside of the drum 7 and a large amount of heat can be generated, so that the drying time can be reduced. On the other hand, since a large amount of heat can be generated, the number of revolutions of the heat exchange type blower 8 can be reduced, and noise can be reduced.

ヒータの「強」,「弱」切換え時の「弱」側をドラム
前板16の上方位置zに配することにより、「弱」使用時
にランジェリー等の熱に弱い少量の乾燥において、一時
停止時などに、被乾燥物はドラム下部に落下したままに
なるため、ヒータの高温輻射熱の影響を受けることな
く、熱による変色等を未然に防止することができる。
By disposing the "weak" side of the heater at the time of switching between "strong" and "weak" at the position z above the drum front plate 16, it is possible to temporarily stop the drying in a small amount which is weak to heat such as lingerie when using the "weak". For example, since the object to be dried is left at the lower portion of the drum, discoloration or the like due to heat can be prevented without being affected by the high-temperature radiation heat of the heater.

発明の効果 以上の実施例から明らかなように、本発明によれば半
導体発熱素子を少なくして効率の良い半導体ヒータを提
供し、安価な構成で製造可能な高効率半導体ヒータを得
ることができ、衣類乾燥機での乾燥時間短縮や、送風量
減少化が可能となり低騒音化が図れることができ、さら
にはヒータ「弱」使用時において、熱を弱いランジェリ
ー類の少量乾燥時等、高温輻射熱による変色等を未然に
防止できる。
As is clear from the above embodiments, according to the present invention, an efficient semiconductor heater can be provided by reducing the number of semiconductor heating elements, and a highly efficient semiconductor heater that can be manufactured with an inexpensive configuration can be obtained. In addition, it is possible to reduce the drying time in the clothes dryer and the amount of air blow, thus reducing noise. In addition, when using the "weak" heater, the heat is radiated at a high temperature, such as when drying a small amount of lingerie with weak heat. Discoloration and the like due to the above can be prevented.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明の実施例における衣類乾燥機の縦断面
図、第2図は同実施例の半導体ヒータの外観斜視図、第
3図は同要部の半導体ヒータの拡大図、第4図はアルミ
フィン板厚と伝熱量を示すグラフ、第5図はフィン高さ
と伝熱量を示すグラフ、第6図は半導体ヒータとドラム
前板との組込みを示す斜視図、第7図は従来の半導体ヒ
ータの外観斜視図である。 6……乾燥機の外枠、7……ドラム、8……熱交換型送
風器、10……ヒータケース、11……半導体ヒータ、12…
…アルミフィン、12a……アルミ薄板、14……放熱体、1
5……半導体発熱素子、16……ドラム前板、17……ドラ
ム前板の円周内凹部。
FIG. 1 is a longitudinal sectional view of a clothes dryer in an embodiment of the present invention, FIG. 2 is an external perspective view of a semiconductor heater of the embodiment, FIG. 3 is an enlarged view of the semiconductor heater of the main part, and FIG. Is a graph showing the thickness of the aluminum fins and the amount of heat transfer, FIG. 5 is a graph showing the fin height and the amount of heat transfer, FIG. 6 is a perspective view showing the incorporation of the semiconductor heater and the front plate of the drum, and FIG. It is an external appearance perspective view of a heater. 6 ... dryer outer frame, 7 ... drum, 8 ... heat exchange blower, 10 ... heater case, 11 ... semiconductor heater, 12 ...
… Aluminum fin, 12a …… Aluminum thin plate, 14 …… Heat radiator, 1
5: semiconductor heating element, 16: drum front plate, 17: recess in the circumference of the drum front plate.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】アルミニウムよりなる波形状のアルミフィ
ンの両側に平板状のアルミ薄板をろう付けして放熱体を
形成し、この放熱体の平板状部分に半導体発熱素子を接
着し、前記放熱体を半導体発熱素子の両面に一対固着さ
せたものを一ヶの半導体ヒータのユニットとし、この半
導体ヒータのユニットをドラム前壁を回転支持するドラ
ム前板の円周凹部内に複数個収容するとともに、これら
半導体ヒータのユニットを配したドラム前板には熱風口
をドラムの下部に臨むように配し、前記複数の半導体ヒ
ータは前記ドラム前板の円周凹部内に直列に配され、ヒ
ータの「強」、「弱」切換え時の「弱」側の半導体ヒー
タのユニットを「強」側を半導体ヒータのユニットより
上方位置に配した衣類乾燥機。
1. A radiator is formed by brazing a flat aluminum thin plate on both sides of a corrugated aluminum fin made of aluminum to form a radiator, and a semiconductor heating element is bonded to the flat portion of the radiator. A pair of semiconductor heater elements fixed to both sides of the semiconductor heating element to form a single semiconductor heater unit, and a plurality of such semiconductor heater units are accommodated in a circumferential recess of a drum front plate that rotatably supports the drum front wall, A hot air port is arranged on the drum front plate on which these semiconductor heater units are arranged so as to face the lower portion of the drum, and the plurality of semiconductor heaters are arranged in series in a circumferential concave portion of the drum front plate, and the heater “ A clothes dryer in which the semiconductor heater unit on the "weak" side when switching between "strong" and "weak" is arranged above the "strong" side of the semiconductor heater unit.
JP1228530A 1989-09-04 1989-09-04 Clothes dryer Expired - Fee Related JP2765089B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1228530A JP2765089B2 (en) 1989-09-04 1989-09-04 Clothes dryer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1228530A JP2765089B2 (en) 1989-09-04 1989-09-04 Clothes dryer

Publications (2)

Publication Number Publication Date
JPH0392195A JPH0392195A (en) 1991-04-17
JP2765089B2 true JP2765089B2 (en) 1998-06-11

Family

ID=16877854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1228530A Expired - Fee Related JP2765089B2 (en) 1989-09-04 1989-09-04 Clothes dryer

Country Status (1)

Country Link
JP (1) JP2765089B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101025199B1 (en) * 2008-05-13 2011-03-31 주식회사 아모그린텍 Heating Unit for Drying Laundry Using Heater Assembly
WO2010057342A1 (en) * 2008-11-20 2010-05-27 Tsou Penchuang Novel heating device
CN106988104A (en) * 2017-05-12 2017-07-28 南京航空航天大学 Thermoelectric heat pump dehumidifying drying system and clothes-drying method
CN115884588B (en) * 2023-01-16 2023-04-25 长城电源技术有限公司 Method for forming switching power supply converter and switching power supply converter formed by same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58105799A (en) * 1981-12-18 1983-06-23 松下電器産業株式会社 Heat generator of garment dryer
JPS59156399A (en) * 1983-02-28 1984-09-05 松下電器産業株式会社 Drying control apparatus
JPS6447391U (en) * 1987-09-18 1989-03-23

Also Published As

Publication number Publication date
JPH0392195A (en) 1991-04-17

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