JP2761146B2 - Band sealing device in large bundle binding machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a large bundle binding machine for forming a large bundle by binding a small bundle group of a predetermined number of bundles previously bundled into small bundles with a wide tape to form a cross. In particular, the present invention relates to a banding device that winds and binds a tape around a small bundle group having a predetermined number of bundles.

[0002]

2. Description of the Related Art Conventionally, various types of large bundle tying machines of this kind have been known. Regarding a mechanism for double-wrapping a tape around a small bundle, see, for example, JP-A-60-158020 and JP-A-2-15820. As shown in JP-A-180114, a small bundle group loaded on a horizontally rotatable mounting plate is horizontally rotated while holding the leading end of the tape, so that the tape is double-wrapped around the small bundle group. It was something that could be done.

[0003]

However, when winding the tape around the small bundle group, it is necessary to hold the small bundle group in an aligned state. Considering that it is necessary to tighten the small bundle group when rewinding the wound tape, etc., the mechanism for holding these small bundle groups and the tightening mechanism are horizontally rotatably supported together with the mounting plate, or It is necessary to have a mechanism that does not affect the mechanism for holding the small bundle group and the mechanism for tightening even if the mounting plate is horizontally rotated, and in any case, as shown in the above-mentioned publication, These mechanical parts tend to be complicated and large.

Therefore, when winding the tape around the small bundle group, the present applicant holds the small bundle group without rotating the tape bundle, and makes the tape clamp holding the leading end of the tape two turns around the small bundle group. It has a compact banding mechanism that feeds and winds a tape approximately equal to the amount of movement of the tape clamp, wraps and tightens the tape while compressing the small bundle group, and then bonds it by bonding and cutting. Large bundle binding machine was developed.

In such a large bundle bundling machine, after the bundling operation into the small bundle group, the leading end of the tape is clamped between the small bundle group and the already-bound tape to move around the small bundle group. Therefore, there is provided a tape clipping-out mechanism for pulling out the tape clip, after the binding operation, upward along the small bundle group and the contact surface of the tape.

[0006] However, when the tape clip is pulled upward along the contact surface of the small bundle group and the tied tape, a part of the small bundle that comes into contact with the tape clip due to the frictional resistance due to the contact. It could be lifted upwards with the eyes, which created the risk of creating a large bundle of irregularities. In addition, since such a large bundle is irregular, if the degree of the irregularity is large, the wound tape may come off the small bundle group, or the tape may be torn due to the irregularity, and the tape may be easily broken. Had occurred.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems. When a tape is wrapped around a small bundle group and bound, the tape clip is pulled out from between the small bundle group and the bundled tape. An object of the present invention is to provide a band-sealing device that prevents a small bundle group from shifting with a tape clip.

[0008]

In order to solve the above problems, in the first invention, a small bundle group is held in a substantially rectangular parallelepiped shape with a predetermined number of bundles stacked with the thickness direction being horizontal. At the same time, a small bundle group holding mechanism capable of holding the held small bundle group so as to be further compressible in the thickness direction thereof, and a tape clamp capable of clamping the leading end of the tape,
A tape nipping moving mechanism for horizontally moving the tape nipping along a substantially rectangular shape larger than the horizontal outer periphery of the small bundle group held in a substantially rectangular parallelepiped shape by the small bundle holding mechanism; When the tape clamped state of the tape is released, the leading end of the tape is supplied to the opened tape clamp, and after the leading end of the tape is clamped by the tape clamp, the tape is reduced by the horizontal movement of the tape clamp. When the tape is wound around the bundle in the horizontal direction, the tape is supplied in conjunction with the movement of the tape clamp, and after the tape is wound around the bundle, the small bundle is held down by the small bundle group holding mechanism. A tape supply mechanism that rewinds the wound tape and tightens the small bundles with tape while compressing in the direction, and cuts the tape while thermally bonding it when tightening the small bundles with tape. After the tape is cut by the tape bonding and cutting mechanism and the tape is cut by the tape bonding and cutting mechanism, the tape clip remaining between the small bundle and the tied tape is pulled upward along the contact surface between the small bundle and the tape. A large bundle tying machine comprising a extracting mechanism, wherein the tape
The tape clip has been tied to the small bundle group by the clip removal mechanism
Before being removed from between the tapes, the small bundle group holding mechanism
, The compressed state of the small bundle group is released, and the small bundle group and the tape
Control means for opening operation so that there is a gap between the pinch
Is further provided.

In the second invention, the small bundle group holding is further performed.
It is provided in the mechanism and comes into surface contact with the group of
It is characterized by having a frictional resistor that generates resistance .

[0010]

According to the first aspect of the present invention, the small bundle group held by the small bundle group holding mechanism in a substantially rectangular parallelepiped shape is a small rectangular bundle which is held in a substantially rectangular parallelepiped shape with the tape clipping the tape end. Since the tape is moved by the tape nipping movement mechanism along a substantially square shape larger than the outer circumference of the bundle, the tape can be easily wound twice around the small bundle. When the tape is wound around the small bundle group, the tape supply mechanism supplies the tape in conjunction with the movement of the tape nipping, so that the tape nipping, the tape nipping moving mechanism, and the tape itself are impossible. The tape can be wound around the small bundle group in a stable state without load. When the tape winding operation is completed, the small bundle group is compressed by the small bundle group holding mechanism, the tape supply mechanism is reversed, the tape is rewound, and the small bundle group is tightened. Is activated, the tape is bonded and cut, and the binding operation is completed. When the bundling operation is completed, the tape clamp remaining between the small bundle group and the bound tape is pulled upward along the contact surface between the small bundle group and the tape by the tape sandwiching and extracting mechanism. Here, the tape is inserted by the tape
Before it is removed from between the small bundles and the tied tape,
The compressed state of the small bundle group is released by the small bundle group holding mechanism, and
There is a gap between the small bundle and the tape clip
To reduce frictional resistance between the small bundle and the tape clip
Or disappears, and only the tape clip is
It is pulled out higher than the gap between them. By performing this operation in the longitudinal direction and the lateral direction of the small bundle group, a large bundle is completed.

According to the second invention, the small bundle group holding machine is provided.
In the structure, frictional resistance is generated by surface contact with the small bundles loaded
Is provided, which ensures that
Only the tape clip is between the small bundle and the tied tape
It is pulled upward.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments shown in the drawings. FIG. 1 is an external view schematically showing the appearance of a large bundle binding machine to which the present invention is applied, and the front part (left front side) of the body 1.
The lower part of the body 1 has an appearance in which a binding portion 3 containing a mechanism for binding the small bundle group is formed at the rear (right rear side) of the body 1. Between the loading unit 2 and the binding unit 3, a small bundle group having a predetermined number of bundles (usually 10 bundles) is arranged such that the longitudinal direction or the transverse direction is horizontal and the thickness direction of each small bundle is A small bundle group holding mechanism 10 loaded in a state of being oriented in the longitudinal direction of the body 1 is provided so as to be movable by a small bundle group moving mechanism 20 (see FIG. 5). In addition, between the loading unit 2 and the binding unit 3 of the body 1, the opening 4 of the binding unit 3 is usually closed so as to partition between the loading unit 2 and the binding unit 3. A shutter 5 that opens the opening 4 of the binding unit 3 by moving the mechanism 10 is provided.

FIG. 2 is a mechanism diagram schematically showing the internal mechanism of the large bundle binding machine. The internal mechanism will be described below. The small bundle group holding mechanism 10 into which a small bundle group having a predetermined number of bundles is loaded.
Is formed in a box shape with an open top, and four side wall members are a front wall of the body 1 and are moved by the small bundle group moving mechanism 20;
, And is attached to the moving wall 11 so as to be able to approach and separate from the moving wall 11, and a spring member (not shown)
The holding wall 12 urged in the direction to narrow the space between the small bundle group holding mechanism 10 and the holding wall 12 in a direction orthogonal to the moving direction of the small bundle group holding mechanism 10, and is supported integrally with the moving wall 11. The reference wall 13 is supported so as to face the reference wall 13, is attached to the reference wall 13 so as to be able to approach and separate from the reference wall 13, and is separated from the reference wall 13 by a spring member (not shown). The restriction wall 14 is urged in the narrowing direction. Note that a sheet-like frictional resistor 12 ′ (see FIG. 8) is adhered to the surface of the holding wall 12, and the frictional resistor 1, which is held between the moving wall 11 and the holding wall 12.
The small bundle in contact with 2 'will be given a frictional resistance based on the contact pressure.

When the small bundle group holding mechanism 10 is located in the loading portion 2, the holding wall 12 and the regulating wall 14 open the space between the opposing moving wall 11 and the reference wall 13 to reduce the size. In addition to facilitating loading and unloading of the bundle group, when the small bundle group holding mechanism 10 is located on the binding portion 3 side, the opposing moving wall 11 and reference wall 13 are closed, and the moving wall 11 is clamped. The small bundle group is sandwiched in the thickness direction between the small bundle group and the wall 12, and the position of the small bundle group in the longitudinal direction can be regulated between the reference wall 13 and the regulating wall.

The small bundle group holding mechanism 10 located on the side of the binding unit 3 is further moved by the small bundle group moving mechanism 20 to the body 1.
In this case, the movement of the holding wall 12 is restricted by a restricting member (not shown), and only the moving wall 11 attempts to move to the rear of the body 1. By doing so, the small bundle group can be further compressed in the thickness direction between the moving wall 11 and the holding wall 12. Further, the bottom member 15 of the small bundle group holding mechanism 10 is formed with a concave portion 16 having a central portion in the direction perpendicular to the moving direction lowered one step below, and a higher step portion 17 on both sides thereof. A small bundle group whose longitudinal direction is horizontal is loaded into both step portions 17 and 17, and a small bundle group whose longitudinal direction is vertical is loaded into the concave portion 16. It is structured to be held.

The shutter 5 is supported by a hinge (not shown) provided on the lower side thereof so as to be tiltable in the direction of the binding portion 3 and is normally erected by a spring member (not shown) to be bound. It is supported so as to close the opening 4 of the part 3. When the small bundle group holding mechanism 10 moves in the direction of the binding portion 3, the holding wall 12 of the small bundle group holding mechanism 10 causes the shutter 5 to fall down against a spring member (not shown). In addition, the shutter 5 that was defeated
Even when the small bundle group holding mechanism 10 is moved into the binding portion 3,
Since the small bundle group holding mechanism 10 is configured to come into contact with the bottom member 15, the small bundle group holding mechanism 10 is maintained in an inclined state. As described above, the opening 4 of the binding unit 3 is closed by standing up by a spring member (not shown).

Next, the binding mechanism of the binding unit 3 will be described. The binding mechanism mainly includes a tape clip 30 for clamping the leading end of the tape, a tape clip moving mechanism 40 for moving the tape clip 30 around the small bundle group, and a tape clip moving mechanism 40. The tape feed mechanism 50 feeds the tape in conjunction with the tape feeder or rewinds the tape alone, and the tape adhesive cutting mechanism 60 cuts the tape wound on the small bundle while adhering. .

First, a description will be given of the tape nipping moving mechanism 40. The tape nipping moving mechanism 40 is arranged so as to surround the small bundle group holding mechanism 10 above the rectangular small bundle group holding mechanism 10 moved to the binding portion 3 side. The four sprocket members 41 that rotate horizontally are arranged in two upper and lower stages
A chain member 42 is wound around each of the upper and lower two-stage sprocket members 41.
A tape sandwiching support member 43 is attached to the shaft, and one set of sprocket members 41 at four corners is connected to a motor (not shown).
As shown in FIG. 2, the tape holding support member 43 is configured to move counterclockwise through the chain member 42 by being driven to rotate counterclockwise as shown in FIG.

Further, two slide shafts 44 are attached to the lower surface of the tape holding support member 43 so that their axial directions are perpendicular to each other. Is supported such that it can move in the vertical direction, and the slide member 45 is normally positioned at the lower end of the slide shaft 44 by its own weight or a spring member 46 (see FIG. 8). Therefore, in this state, when the tape holding member 43 is guided and moved by the chain member 42, the tape holding member 30 supported thereunder is moved to the small bundle group held by the small bundle group holding mechanism 10. Will move around.

Next, the tape clip 30 will be described. The tape clip 30 is a plate member 31 having a vertical surface.
And two rod-like members 32 extending in the vertical direction and supported so as to be able to freely contact and separate from the plate member 31 (see FIGS. 7 and 8).
And a spring member (not shown) for pressing the rod-shaped member 32 against the plate member 31. Tape clip 3
As shown in FIG. 2, the initial position of the support member 43 for supporting the tape T is at the rear and center of the machine body 1, and at this initial position, the leading end of the tape T is supplied to the tape holder 30. In some cases, the holding state between the plate member 31 and the rod-shaped member 32 is released by the tape holding mechanism 70 (see FIG. 5) and the tape member 31 is released. When the leading end of the tape T is supplied, the tape holding mechanism 70 (see FIG. 5) is completed, and the leading end of the tape T is clamped between the opened plate member 31 and the bar-shaped member 32.

When the tape T, which will be described later, is wound, fastened, and bonded and the binding operation is completed, the tape clip 30 remaining between the small bundle group and the tape T is bound in the initial state. In this position, the slide member 45 is lifted up along the slide shaft 44 by the tape holding / pulling-out mechanism 80 (see FIG. 8) so that the tape T is pulled out from between the bundled small bundle and the tape T. It is configured. Here, FIG. 8 is a partial side view of the mechanism diagram shown in FIG. That is, as shown in FIG.
1, a pinion 83 fixed to an output shaft 82 having a rotation axis in the horizontal direction, a rack 84 which is engaged with the pinion 83 and is movable in the vertical direction, and is provided at a lower end of the rack 84; It is constituted by one end of the slide member 45 and a locking member 85 which can be freely engaged and disengaged. Therefore, when the extraction motor 81 operates, the pinion 83 fixed to the output shaft 82 rotates, and the rack 84 engaged with the pinion 83 rises. Then, as the rack 84 rises, the locking member 85 at the lower end of the rack 84 engages with the slide member 45 and raises it.
0 is extracted from between the small bundle group and the tape T.
The tape clip 30 which has been pulled upward is moved by the pulling motor 81 when the bundle of small bundles is moved to the loading unit 2 by the small bundle group holding mechanism 10. It is configured to descend to the lower end of the slide shaft 44 by its own weight or a spring member 46 together with 45.

On the other hand, a tape supply mechanism 50 capable of supplying and winding the tape T is provided at a position behind the initial position of the tape clip 30 and outside the plane square where the chain member 42 is wound. Is provided. That is, the tape supply mechanism 50 is composed of a number of tape supply rollers 51. When the clamped state of the tape clamp 30 is released, the leading end of the tape T is guided to the opened tape clamp 30 by a guide member (see FIG. (Not shown), and the leading end of the tape T is
When the tape T is wound around the small bundle group in the horizontal direction by the horizontal movement of the tape clamp 30 in the counterclockwise direction after the tape T is clamped, the tape T is interlocked with the movement of the tape clamp 30. After the tape T is wound around the small bundle group, while the small bundle group is compressed in the thickness direction between the moving wall 11 and the holding wall 12 of the small bundle group holding mechanism 10, Is controlled so that the wound tape T is rewound and the small bundle group is fastened by the tape T. Here, supplying the tape T in conjunction with the movement of the tape clamp 30 means that the moving amount of the tape clamp 30 and the supply amount of the tape T by the tape supply mechanism 50 are substantially equal. An extra load is not applied to the tape T or the tape clip 30 by the movement of the tape 30.

Further, at a position behind the initial position of the tape clamp 30 and at a position closer to the moving direction of the tape clamp 30 than the tape supply mechanism 50, a tape T for tightening the compressed small bundle is provided. Is provided with a tape bonding and cutting mechanism 60 for cutting while thermally bonding. In other words, the tape bonding and cutting mechanism 60 operates the heater member 6 in a state where the tape T is double-wrapped around the compressed small bundle and the tape clip 30 is located at the initial position.
1 moves while being pressed against the plate member 21 of the tape clamp 30, thereby causing the plate member 2 of the tape clamp 30 to move.
The tape T located between the heater member 61 and the heater member 61 is thermally bonded. Further, with the thermal bonding operation of the heater member 61, a cutter member 62 is provided from behind the heater member 61 (see FIG. 7). Is projected to cut the tape T stretched between the tape clip 30 and the tape supply mechanism 50.

When the tape T is wound, tightened, and bonded and cut as described above, and the binding operation is completed, as described above, the tape clamps remaining between the bound small bundle group and the tape T are used. The small bundle 30 is removed from between the small bundle group bound by the tape clamping / pulling-out mechanism 80 and the tape T, and the small bundle group that has been bound is moved to the loading unit 2 by the small bundle group holding mechanism 10, and the machine body 1 can be taken out.

FIG. 3 shows a state diagram (A) before a small bundle group B having a predetermined number of bundles is bound with its longitudinal direction being horizontal, and a state diagram (B) after being bound by a tape T. It is shown. FIG. 4 is a state diagram (A) before the small bundle group B, which is bound as shown in FIG. Figure (B)
As shown in FIG. 4B, a small bundle group B is bound into a cross by a tape T to form a large bundle. As is clear from the above description, the large bundle is created by the two binding operations of the binding mechanism described above, and the small bundle group B bound as shown in FIG. When the small bundle group holding mechanism 10 is located at the loading section 2 in the front part of the body 1, the small bundle group holding mechanism 10 is manually reloaded so that its short side direction is horizontal.

FIG. 5 is a control block diagram showing a control mechanism of the large bundle binding machine. In the drawing, the small bundle group moving mechanism 20, the tape nipping moving mechanism 40, the tape feeding mechanism 5
0, tape bonding / cutting mechanism 60, tape holding / opening mechanism 7
0, the tape clipping / pulling-out mechanism 80 has already been described and will not be described here.

The operating means 90 includes a power switch (not shown) for turning on or off the power to the large bundle binding machine, and loading a predetermined number of small bundle groups B into the small bundle group holding mechanism 10 of the loading section 2. A start switch (not shown) for starting the binding operation and a stop switch (not shown) forcibly stopping the binding operation in the event of an abnormal situation are provided.

The small bundle group thickness amount detecting means 100 detects the thickness amount of the small bundle group B having a predetermined number of bundles held by the small bundle group holding mechanism 10, and the detected thickness amount is represented by specific numerical data. Alternatively, the data can be output as classified data such as "thickness", "medium thickness", and "small thickness" which are classified into three stages from specific numerical data.

The specific means of the small bundle group thickness amount detecting means 100 is not limited to any particular method, but the following method is considered as an example. First, as a first method, by directly detecting the thickness of the small bundle group B held by the small bundle group holding mechanism 10, the small bundle group B is disposed at an appropriate position between the loading unit 2 and the binding unit 3; Small bundle group holding mechanism 1
0, that is, the direction in which the reference wall 13 and the regulating wall 14 face each other, and the small bundle group holding mechanism 1
The thickness is detected by light-emitting means and light-receiving means (both not shown) arranged so as to sandwich 0. In this case, if the optical means is a photosensor having only one optical axis, the thickness of the small bundle group B is detected based on the time when the small bundle group B passes through the optical axis of the photosensor. On the other hand, this optical means is used for the small bundle group B
If the line sensor has many detection elements in the thickness direction of the line sensor, the thickness of the small bundle group B is detected based on the number of the detection elements in the light-shielded state. Even when the bundle group B has moved to the binding portion 3, the thickness amount can be detected.

As a second method, the thickness of the small bundle group B held by the small bundle group holding mechanism 10 is indirectly detected. Of the small bundle group holding mechanism 10 and the holding wall 1
2 is detected, and based on the result, the small bundle group B is detected.
Is to detect the amount of thickness. That is, based on the time from detection of the holding wall 12 on the moving direction side of the small bundle group holding mechanism 10 to detection of the opposing moving wall 11,
This is to detect the thickness of the small bundle group B held during that time. In this case, it is possible to employ the optical means or a separate mechanical means. In the method of detecting the thickness amount of the small bundle group B based on the moving time, the moving speed changes due to the influence of the voltage fluctuation, and the moving time changes accordingly. However, such an effect can be avoided by a known method in advance, and in any case, such a change does not exceed the embodiment of the small bundle group thickness amount detecting means 100.

The control means 110 controls the small bundle group holding mechanism 1
0, small bundle group moving mechanism 20, tape nipping moving mechanism 40, tape supply mechanism 50, tape bonding and cutting mechanism 60, tape nipping opening mechanism 70, tape nipping and extracting mechanism 80, operating means 90, small bundle group thickness It is electrically connected to the detecting means 100 and controls these operations, and is constituted by a microprocessor or the like. In the present invention, the control means 110 controls the operation according to the flowchart shown in FIG.

Hereinafter, the operation of the banding device will be described with reference to an external view shown in FIG. 1, a mechanism diagram shown in FIG. 2, a control block diagram shown in FIG. 5, a flowchart shown in FIG. 6, an operation explanatory diagram shown in FIG. Explanation will be made based on the partial side view shown in FIG.

<Step 1> As shown in FIG. 3A, a small bundle group B having a predetermined number of bundles has its thickness direction and its longitudinal direction horizontal, and its thickness direction is After being loaded on the steps 17 of the small bundle group holding mechanism 10 as a whole in a substantially rectangular parallelepiped shape in a state where the longitudinal direction and the longitudinal direction are superposed on the horizontal direction of the body 1, the operating means 9
The 0 start switch is operated. <Step 2> The small bundle group holding mechanism 10 is moved by the small bundle group moving mechanism 20 from the loading section 2 at the front of the body 1 to the binding section 3 at the rear of the body 1. Along with this movement, the space between the moving wall 11 and the holding wall 12 and the space between the reference wall 13 and the regulating wall 14 which were open when the small bundle group B was loaded are actuated by a spring member (not shown). The small bundle group B is clamped between the moving wall 11 and the clamping wall 12, and the longitudinal direction of the small bundle group B is adjusted by the regulating wall 14 to the reference wall 13.
Will be pressed and aligned. At this time, the distance between the moving wall 11 and the holding wall 12, that is, the thickness of the small bundle group B is determined by the state of the paper quality of the small bundle group B sandwiched therebetween. In the case of a new note, it may be about 90 mm, while in the case of a high circulation banknote (distribution ticket), it may reach a maximum of about 150 mm.

<Step 3> During or after the movement of the small bundle group holding mechanism 10 from the loading unit 2 at the front of the fuselage 1 to the binding unit 3 at the rear of the fuselage 1, the small bundle group thickness detecting means 100 Thus, the thickness amount of the small bundle group B is detected.

<Step 4> When the small bundle group B has been moved to the binding portion 3 at the rear of the machine body 1, first, the tape clamping release mechanism 7
0 is activated and the plate member 31 and the rod-shaped member 3 of the tape clamp 30 are operated.
2 is released, and then the tape supply mechanism 5 is released.
0 operates to supply the leading end of the tape T between the plate member 31 and the rod-shaped member 32 of the tape clamp 30 in the opened state,
When the leading end of the tape T is supplied, the tape supply mechanism 50
Is stopped, and the operation of the tape clamp release mechanism 70 is stopped, so that the tape T is clamped between the plate member 31 and the rod-shaped member 32 of the tape clamp 30. <Step 5> Subsequently, the tape nipping moving mechanism 40 and the tape supplying mechanism 50 operate in conjunction with each other, and the tape nipping 30 which clamps the leading end of the tape T in conjunction with the supply of the tape T makes the small bundle group B. Is moved in a plane square shape around (see FIG. 7A). At this time, the amount of movement of the tape clamp 30 by the tape clamp moving mechanism 40 and the amount of supply of the tape T by the tape supply mechanism 50 are each equivalent to one round of the movement path of the tape clamp 30. When the movement is performed, the operations of the tape nipping moving mechanism 40 and the tape supply mechanism 50 stop (see the tape nipping 30 in FIG. 7B).

<Step 6> Thereafter, the tape T sent out one round around the small bundle group B (see the solid line in FIG. 7B)
A predetermined amount of tape T is rewound by temporarily reversing the operation of the tape supply mechanism 50. In this case, the amount of rewinding of the tape T by the tape supply mechanism 50 is determined based on the thickness of the small bundle group B detected by the small bundle group thickness amount detection means 100, and the small bundle group B In the case of a new ticket having a small thickness, the gap between the tape T and the small bundle group B becomes large, so that the rewinding amount is increased. Since the gap between the small bundle group B and the tape T is controlled to reduce the amount of rewinding, the slack between the small bundle group B and the tape T is reduced in any case. This prevents the tape T from falling down and prevents the tape T from being bound when the tape T is displaced (see the dashed line in FIG. 7B).

<Step 7> As in step 5,
Again, the tape nipping moving mechanism 40 and the tape supply mechanism 50 are operated in conjunction with each other, and the tape nipping 30 holding the leading end of the tape T is interlocked with the supply of the tape T so that a flat square around the small bundle group B is formed. The tape T is finally wound twice around the small bundle group B (FIG. 7C).
reference). <Step 8> As in step 6, the tape T wound around the small bundle group B for two turns is then temporarily rotated in reverse to operate the tape supply mechanism 50 to detect the small bundle group thickness amount. A predetermined amount of tape T is rewound based on the thickness of the small bundle group B detected by the means 100.

<Step 9> When the double winding of the tape T around the small bundle group B and the temporary rewinding operation of a predetermined amount are completed, the small bundle group holding mechanism 10 is further moved by the small bundle group moving mechanism 20 to the rear of the machine body 1. Group B by being driven to the side.
Is compressed in its thickness direction, and at the same time, the tape supply mechanism 5
0 continues to rotate in the reverse direction, so that the compressed small bundle group B
Are tightened by the tape T (FIG. 7).
(D)). <Step 10> In this state, the tape bonding / cutting mechanism 60 further starts to operate, and the heater member 61 moves while being pressed against the plate member 31 of the tape clip 30 located at the initial position. , Tape clip 30
The tape T positioned between the plate member 31 and the heater member 61 is thermally bonded. Further, with the thermal bonding operation of the heater member 61, the heater member 6 is heated.
When the cutter member 62 protrudes from the rear (upper in FIG. 7D) of the tape holder 30 and the tape supply mechanism 5
This is for cutting the tape T stretched between 0 and 0 (see FIG. 7D).

<Step 11> Tape adhesive cutting mechanism 60
When the adhesive cutting operation of the tape T is completed, the tape clip 30 remains between the tied small bundle group B and the tape T. Therefore, before the tape clip 30 is removed from between the small bundle group B and the tied tape T by the tape clamp extraction mechanism 80, the small bundle group holding mechanism 10 is moved by the small bundle group moving mechanism 20 to the front side of the machine body 1. To release the compressed state of the small bundle group B, and the small bundle group B and the tape
(A small bundle group B indicated by a two-dot chain line in FIG. 8)
And the gap between the tape clip 30). As a result, the frictional resistance between the small bundle group B and the tape clip 30 is reduced or eliminated.

<Step 12> With the frictional resistance between the small bundle group B and the tape clamp 30 thus reduced or eliminated, the tape clamp 30 is moved between the small bundle group B and the tape T. The tape clipping and extracting mechanism 80 for extracting from the tape is operated. That is, when the extraction motor 81 operates,
The pinion 83 fixed to the output shaft 82 rotates, and the rack 84 engaged with the pinion 83 rises. And
As the rack 84 rises, the locking member 85 at the lower end of the rack 84 engages with the slide member 45 and lifts it, thereby pulling out the tape clamp 30 from between the small bundle group B and the tape T. is there. Note that the tape clamp 30 that has been pulled upward is bound by the bundled small bundle group B in the next step 13.
In the above, when the small bundle group holding mechanism 10 moves to the loading section 2, the operation of the extraction motor 81 is completed, whereby the slide member 45 and its own weight or the spring member 4
6 lowers to the lower end of the slide shaft 44. When the tape clamp 30 is removed from between the small bundle group B and the tape T, the clamping wall 12 of the small bundle group holding mechanism 10 comes into surface contact with the small bundle group B to be loaded, thereby causing frictional resistance. Is provided, so that only the tape clip 30 is pulled out above the space between the small bundle group B and the tied tape T, and the small bundle group B becomes uneven. Never.

<Step 13> In the reverse operation of the step 2, the small bundle group holding mechanism 10 causes the small bundle group moving mechanism 20 to move the small bundle group holding mechanism 10 from the binding section 3 at the rear of the body 1 to the loading section 2 at the front of the body 1. Moved. Along with this movement, the gap between the moving wall 11 and the clamping wall 12 and the gap between the reference wall 13 and the regulating wall 14 which were in the clamped state when the small bundle group B was bound are opened against the action of the spring member. Then, a series of binding operations ends (<Step 14>).

In this way, a small bundle group B having a predetermined number of bundles
With the thickness direction and the longitudinal direction set to be horizontal and bound by a tape T as shown in FIG.
As shown in FIG. 4 (A), the small bundle group B has its thickness direction and its short side direction horizontal, and its thickness direction is the front-back direction of the body 1 and the short side direction is the body 1 After being reloaded into the concave portion 16 of the small bundle group holding mechanism 10 in such a state as to be in the left-right direction, the start switch of the operating means 90 is operated, and thereafter, the same operations as those in steps 2 to 14 are repeated. As a result, as shown in FIG. 4B, a large bundle is created.

In this embodiment, the small bundle group B is loaded into the small bundle group holding mechanism 10 in the loading section 2 at the front of the body 1, and the small bundle group holding mechanism 10 is moved by the small bundle group moving mechanism 20. After being moved to the binding portion 3 at the rear of the body 1, the binding is performed. However, the present invention is not limited to such a configuration, and the small bundle group can be directly loaded into the small bundle group holding mechanism of the binding portion. The small bundle group moving mechanism can be omitted. However, in the case of such a modification, the small bundle group holding mechanism and the small bundle group compression function performed by the cooperative action of the small bundle group moving mechanism of the present embodiment, And it is necessary to have an opening function to create a gap.

[0044]

According to the present invention, the small bundle group held by the small bundle group holding mechanism in a substantially rectangular parallelepiped shape is a small bundle that is held in a substantially rectangular parallelepiped shape with the tape clipping the tape end. Since the tape is moved by the tape nipping movement mechanism along a substantially square shape larger than the outer periphery of the bundle, there is an effect that the tape can be easily double wound around the small bundle. When the tape is wound around the small bundle group, the tape supply mechanism supplies the tape in conjunction with the movement of the tape nipping, so that the tape nipping, the tape nipping moving mechanism, and the tape itself are impossible. There is an effect that the tape can be wound around the small bundle group in a stable state without applying a load. Furthermore, when the binding operation is completed, the tape sandwiching and extracting mechanism
Although it will be sandwiched tape remaining between the small bundles group and bundling already tape is pulled upwardly along the contact surface of the small bundle group and tape, the small tape scissors by the tape sandwiched extraction mechanism
Before removing from the bundle and the tape that has been bound,
The compressed state of the small bundle group is released by the group holding
There is a gap between the bundle and the tape clip
Therefore, the frictional resistance between the small bundle and the tape clip decreases or
The tape that has disappeared and has been bound only to the small bundle
This has the effect of being able to be pulled out higher than between Sa
In addition, the small bundle group holding mechanism has an interview with the small bundle group to be loaded.
There is a frictional resistor that generates frictional resistance when touched.
As a result, only the tape clip has been bound to the small bundle group.
This has the effect that it can be pulled out higher than between the tape.
You.

[Brief description of the drawings]

FIG. 1 is an external view schematically showing the external appearance of a large bundle binding machine to which the present invention is applied.

FIG. 2 is a mechanism diagram schematically showing an internal mechanism of the large bundle binding machine.

FIGS. 3A and 3B are a state diagram (A) before a small bundle group B having a predetermined number of bundles is bound with its longitudinal direction being horizontal, and a state diagram (B) after being bound by a tape T. FIGS.

FIG. 4A is a state diagram before the small bundle group B, which is bound as shown in FIG. 3B, is set in a horizontal direction, and FIG. B).

FIG. 5 is a control block diagram illustrating a control mechanism of the large bundle binding machine.

6 is a flowchart executed by the control unit 110. FIG.

FIGS. 7A to 7D are operation explanatory diagrams when operating according to the flowchart.

FIG. 8 is a partial side view of the mechanism diagram shown in FIG. 2;

[Explanation of symbols]

 B Small bundle group T Tape 1 Body 2 Loading unit 3 Binding unit 4 Opening 5 Shutter 10 Small bundle group holding mechanism 11 Moving wall 12 Holding wall 12 'Friction resistor 13 Reference wall 14 Restriction wall 15 Bottom member 16 Recess 17 Step 20 Small bundle group moving mechanism 30 Tape clamp 31 Plate member 32 Bar member 40 Tape clamp moving mechanism 41 Sprocket member 42 Chain member 43 Tape clamp support member 44 Slide shaft 45 Slide member 46 Spring member 50 Tape supply mechanism 51 Tape supply roller Reference Signs List 60 Tape bonding / cutting mechanism 61 Heater member 62 Cutter member 70 Tape holding / opening mechanism 80 Tape holding / extracting mechanism 81 Extracting motor 82 Output shaft 83 Pinion 84 Rack 85 Locking member 90 Operating means 100 Small bundle group thickness detecting means 110 Control means

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁶ , DB name) B65B 13/00-13/34 B65B 27/00-27/12

Claims (2)

(57) [Claims] 1. A group of small bundles is held in a substantially rectangular parallelepiped shape with a predetermined number of bundles stacked with the thickness direction being horizontal, and the held small bundles are further compressively held in the thickness direction. A small bundle group holding mechanism that can hold the tape tip, and a tape bundle that can hold the leading end of the tape; and a small bundle group held in a substantially rectangular parallelepiped shape by the small bundle group holding mechanism. A tape nip moving mechanism for horizontally moving the tape nip along a large, substantially square shape; and supplying the leading end of the tape to the opened tape nip when the tape nip is released. At the same time, after the tape tip is clamped by the tape clamp,
When the tape is wound around the small bundle group in the horizontal direction by the horizontal movement of the tape clamp, the tape is supplied in conjunction with the movement of the tape clamp, while the tape is wound around the small bundle group, A tape supply mechanism that unwinds the wound tape and tightens the small bundle with tape while compressing the small bundle in the thickness direction by the bundle holding mechanism, and heat-bonds the tape when tightening the small bundle with tape. And a tape bonding and cutting mechanism that cuts while performing tape bonding and cutting with this tape bonding and cutting mechanism.
A large bundle bundling machine comprising a tape bundling and pulling mechanism for pulling out a tape bundling between a small bunch group and a bundled tape upward along a contact surface of the small bundling group and the tape. Small bundles of tape sandwiched by the extraction mechanism
Before being removed from between the tapes
For the group holding mechanism, release the compressed state of the small bundle
Opening operation so that there is a gap between the group and the tape clip
Banding device in a large bundle tying machine further comprising control means . 2. A small bundle group holding mechanism provided in the small bundle group holding mechanism.
To generate frictional resistance due to surface contact with loaded small bundles
2. The band sealing device in a large bundle binding machine according to claim 1, further comprising a frictional resistor .