JP2755381B2 - Solid state protection - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a protection device for use at a telephone central office or elsewhere, and more particularly to a solid state protection device. BACKGROUND OF THE INVENTION It is well known to protect communications equipment located at telephone central offices or other locations from sneak (leakage) currents and voltage surges. Conventional protection devices include a carbon block and a gas line. However, it has been pointed out that these conventional protection devices have a wide voltage fluctuation level and a large variation in surge rise time. In addition, the life of the carbon block is limited. Gas pipes and carbon blocks protect both the tip and ring conductors, but not both in a balanced manner. The problems associated with gas pipes and carbon blocks have been solved by using solid state equipment. The solid state protector responds instantaneously to all surges and has a long life, so protect both the tip and the ring in a balanced manner when high voltage is applied to both the tip and the ring. Can be. One example of a circuit that provides protection in a balanced state is U.S. Pat.
No. 408,248. An example of a circuit of the solid-state type protection device was released on October 4, 1983 by ArmM.
This is disclosed in U.S. Pat. No. 4,408,248 to Bluray et al. One example of a circuit for a solid state protector is disclosed in U.S. Pat. No. 4,322,767 issued to M. L. Hammamshi et al. On March 20, 1982. It would be practical if the solid-state protector was made to fit into a space approximately the same size as the space occupied by a pair of conventional carbon blocks or gas pipes. Will. SUMMARY OF THE INVENTION In accordance with the illustrated embodiment of the present invention, a telephone line having a chip conductor and a ring conductor is inserted into a telephone line and provided at a telephone central office or other location. A solid state protection device is disclosed that is used to protect an existing device from abnormal currents (spurious currents) and abnormal voltages. The protection device comprises a current unit, a voltage unit and a pair of springs assembled in the body. The novelty of the present invention comprises a solid state device that instantaneously responds to abnormal voltage surges applied to the tip conductor, the ring conductor, or the telephone line extending within the tip conductor and the ring conductor. In a single voltage unit. When the voltage surge exceeds a predetermined threshold, the voltage device operates and grounds the telephone line, so that abnormal voltages bypass the telephone device located at the central office. More specifically, the voltage device is a self-triggered surge suppressor (silicon controlled) mounted in a solid disk package sandwiched between two metal plates housed in a recess formed in the body. (A single chip combining a commutator and a Zener diode). The body has a plurality of pillars that project from the body and mate with indentations provided in the cover. A surge suppressor, two metal plates and six commutator diodes are located in the body. After the cover is mounted on the torso, the column is inserted while applying heat, so that the column is combined with the cover. According to a preferred embodiment of the present invention, the barrel and cover are made of a suitable strong polymer material. Each of the three metal spring clips holds a pair of diodes within a recess formed on opposite sides of the body, so that the diodes are in direct contact with the metal plate. Each end clip has an arm,
The arm extends to the top of the body to contact the spring and grips the top. The ground spring clip holds the third pair of diodes in contact with the metal plate in a central position. This spring clip is gripped by the two arms of the grounding unit. The ground unit is clamped between the two halves of the base unit. The bottom surface of each spring clip is provided with a projection, which is seated on the upper flange of the sleeve. The sleeve is made hollow and surrounds the line pin,
The sleeve is axially aligned with the line pin and is connected to the line pin by a suitable solder having a predetermined melting point. Each of the line pins is held in a hearth of one of two halves of a base made of a suitable insulating material. A coil of insulated conductive wire surrounds the sleeve. One end of the coil is welded to the upper flange of the sleeve and the other end is welded to the central station pin. Each of the central office pins, like the line pins, is securely housed in one of the two halves of the insulator base. When an abnormal voltage surge appears on the telephone line, a current based on said voltage flows through the circuit pins on the sleeve, the projections of the spring clip and the diode to the metal plate. Diodes are used in pairs to handle both positive and negative voltages. When the surge voltage exceeds a predetermined threshold, i.e., 260 volts in a typical embodiment, the surge suppressor conducts a surge current to the second metal plate in contact with the surge suppressor. Begin,
Accordingly, a surge current is conducted to the diode in contact with the second metal plate. Surge current flows through the arm of this diode ground unit to the ground spring clip. Thanks to such an electrical path, abnormal voltages are immediately grounded, so that sensitive devices can be protected. This safe condition lasts for a few seconds. When the abnormal voltage disappears, the solid state protection device returns to a normal use state. For added safety, as the high voltage continues to flow, the solid state module will begin thermal overload operation. The heat generated by the surge suppressor, metal plate and diode travels through the spring clip and protrusion to the sleeve. The heat melts the solder and releases the sleeve from the connection with the circuit pins. The force of the spring, in the preferred embodiment, approximately one pound, acts on the voltage device and immediately forces the loose sleeve down and down, thereby providing a ground plate provided on the base unit. Contact with. Thanks to the feature that the voltage device is configured in a unique geometry, the sleeve is released in a substantially controlled manner and comes into contact with the ground potential, which reduces the cost of the central office equipment due to surge voltages. Damage can be prevented. As a result of the use of the spring clip projections, the voltage device can be prevented from pivoting smoothly and rebounding against the sides of the body structure. further,
For various pivot angles, the projections provide a constant thermal path. Thanks to the function of such protrusions,
The voltage device can be activated when the sleeve is released from its connection with the circuit pin. Hereinafter, the present invention will be described in detail with reference to the accompanying drawings illustrating embodiments of the present invention. Referring now to FIGS. 1, 2, 3, and 4, the communication device is protected from abnormal sneak currents and voltages appearing in circuits interconnecting the customer equipment with the central office. A solid-state protector used for this purpose is shown. The protective device comprises a body unit 10 made of a plastic material, which is disclosed in detail in U.S. Pat. No. 4,434,449 issued to Lari Daville Dateske on February 28, 1984. A handle 12 is provided for use during insertion into or removal from the protector block as described. Protection device base 14 made of plastic insulation
The base 14 has a left half 16 and a right half
Has 18. The two halves 16 and 18 are arranged substantially mirror image of each other. Each of the two halves 16 and 18 has a built-in mechanism to protect the communications device from abnormal sneak currents flowing through the line's tip and ring conductor paths, respectively. A grounding unit 20, which allows abnormal current (or abnormal voltage) to escape from the communication device to ground, is sandwiched between the two halves. The left half 16 of the base 14 has circuit pins 22 and
One of the circuit leads extending from the customer equipment terminates at the circuit pin. Now, referring to FIG. 1 through FIG.
Referring to the figure, as shown, the upper portion of the circuit pin 22 is surrounded by an inner surface of a spool or sleeve 24 centered in the axial direction with the circuit pin 22 to form a solder 25 having a predetermined melting point. It is fixed to the sleeve 24 by a soluble material such as this. The sleeve 24 has an upper flange 26 and a lower flange 28. A coil of insulated wire 30 is wound around the outer surface of sleeve 24. coil
One end of 30 is welded to the underside of sleeve 24, while
The other end of the coil 30 is welded to the upper end 32 of the central station pin 34. These pins 22 and 34 are made of a copper alloy that is first plated with palladium and then gold. The sleeve 24 is made of a highly conductive material. The coil 30 is a wire made of a brilliant alloy of nichrome covered with a nylon insulation. Normally, current flows between the customer device and the central office device via the circuit pin 22, the solder 25, the spool 26, the coil 30, and the central office pin 34. If an abnormally large current flows in the circuit, the coil 30
The solder 25 is melted by the heat generated in the above, and the connection between the sleeve 24 and the circuit pin 22 is released. As will be described in detail below, the sleeve 24 is depressed down and contacts the plate 36 of the grounding unit 20. Similarly, referring to FIGS. 1 through 4, circuit pins 38, sleeves 40, coils 42, central office pins 46,
Current flows through the other conductor of the customer line through the right half 18 of the base 14 through the central office unit. When an abnormal current flows through the line, the heat generated by the current flowing through the coil 42 melts the solder of the sleeve 40 connected to the circuit pin 38 by soldering, and the sleeve 40
Moves away from circuit pin 38. After a while, the sleeve 40
It contacts the ground plate 36 as described in detail below. The grounding unit 20 comprises a spring having a front arm 48 and a rear arm 50 formed from a heat-treated copper plate. The two arms have two functions. That is, (1) these arms hold the surge voltage protector 52 in place, and (2) these arms provide a path for grounding the surge voltage. Two arms 48
And 50 are connected by a center plate 54 welded to the ground plate 36. The ground plate 36 is fixed to the ground pin 56. The grounding unit 20 is located on the left half of the base 14.
Fixed between 16 and right half 18. Referring again to FIG. 4, a depression 58 is provided, into which the protrusion 60 of the ground plate 36 is fitted.
36 is prevented from freely moving in either direction and coming into contact with the conductive material of the left half 16 or the right half 18 of the base 14. The left half 16 and the right half 18 of the base 14 are respectively
The tongues 62 and 64 are provided to engage the indentations 70 and 72 of the body 10 and to securely hold the components of the protective device. The rear of the left half 16 and the right half 18 likewise have tongues 66 and 68, with corresponding recesses formed in the main unit 10 (not shown).
It has been fitted properly. A voltage device 52, described in greater detail below, is mounted in the arms 48 and 50 of the grounding unit 50 to provide protection against abnormal voltage surges flowing into the telephone line. This single device is used to protect both the chip conductor and the ring conductor. In conventional devices, separate voltage protection measures are taken for the chip conductor and the ring conductor. See, for example, the Datesky patent above. A metal spring 74 made of a highly conductive material such as a solderable phosphor bronze plate is attached to the left side 76 of the voltage device 52.
It is provided on. The neck 78 of the cap 80 is inserted into the spring 74. The top surface 82 of the cap 80 is in contact with the upper inner surface 84 of the main body 10. The spring 74 is housed in the guide 85 so as not to move. Similarly, the spring 86 is
Is provided on the right side 88. The neck 90 of the cap 92 is inserted into the spring 86. The upper surface 94 of the cap 92 is the main body
It is in direct contact with the upper inner surface 96 of 10. The spring 86 is housed in the guide 87 to prevent the spring 86 from shifting. Caps 80 and 91 are made from Shinyo and are solder-finished and finished. Holes 98 and 100 drilled in the top of the body are offset from the center so that the top surfaces 82 and 94 of the caps 80 and 92 can be accessed to test the line connection. I have. The conductive path on one side is
, Spring 74, metal clip 102 of voltage device 52, sleeve 24, and circuit pin 22. A similar path is formed for the other half. This inventive concept of providing a hole so that it can be accessed for performing a test is disclosed in U.S. Pat. No. 4,394,620, issued to A. R. Montalto et al. On July 19, 1983. When assembling the grounding unit, use
92 are inserted into springs 74 and 86, respectively, and guide body 10
The tops 82 and 94 of the cap are
It directly contacts the inner surfaces 84 and 96 of the body 10 just below 98 and 100. Thereafter, the voltage device 52 is inserted and the tops of the spring clips 102 and 104 contact the springs 74 and 86, respectively. The function of these spring clips will be described in detail below. Next, the base 14 is inserted into the main body 10, and the upper flange 26 of the sleeve 24 and the upper flange of the sleeve 40 are connected to the projections 106 and 1 provided on the bottom surfaces of the spring clips 102 and 104.
Contact directly with 08. When the base 14 is pushed upwards, the voltage device 52 compresses the springs 74 and 86 and causes the tongue 62 to move 68
The recesses fit into the recesses 70 and 72 of the main body 10 properly. Now, referring to FIG. 6 and FIG. 7, FIG.
The body of the voltage device 52 shown up to the figure is illustrated. The body consists of bases 110 and 112 made of an insulating material. The base 110 has a central recess 114 that houses a surge suppressor made from a single chip with a silicon controlled rectifier and a zener diode. The chip is sandwiched between two metal discs, one of which is smaller in diameter than the other. The surge suppressor 116 is responsive as made, but according to the procedures disclosed by the aforementioned patent to R.M.
It works by using two rectifier diodes 126, 128, 130, 132, 134 and 136. Thanks to the control function of these diodes, the current of the surge suppressor always flows with the same polarity. Surge suppressors generate heat at either polarity of the alternating current cycle, i.e., both the positive and negative portions of the alternating current cycle. The surge suppressor 116 has a dent 122
And two metal plates 118 that fit within 124
And held in place by 120. The metal plates 118 and 120 are made of an electrically conductive copper material having excellent heat conductivity. These plates are
The heat generated from the surge suppressor 116 is distributed to a plurality of diodes described later. The ability to dissipate heat is important when considering sustained high voltage leakage. In order to prevent the base 110 from being damaged, the plate 1 can be easily inserted into the base 110 and can be easily removed from the base 110.
Both ends of 18 and 120 are rounded. Holes 115 and 117 formed through the cover 112 accommodate columns 111 and 113 projecting from the base 110. The cover 112 is connected to the base 110 by inserting the columns 111 and 113 while heating. Six diodes 126 through 136 fit into recesses 138 through 148 formed on both sides of base 110. In the manufacture of these diodes, two plates of different diameters sandwich each diode. Since the above operations are mixed, some diodes have a cathode adjacent to the other large-diameter disk, and other diodes have an anode adjacent to the large-diameter disk. . In the example shown in FIG. 7, a diode is selected in which the larger anode disk is adjacent to one of the smaller disks. The diode, oriented so that the anodes point in the same direction, is made of hardened phosphor bronze, and in the recesses provided on both sides of the base 110 by spring clips 102, 104 and 150 which are soldered accordingly. Is held in place. The spring clip 104 is provided with the recesses 138 and 1 of the base 110.
The diodes 126 and 136 are fixed in 48. Spring clip 10
The top end 152 of 4 is bent inward and fits over the right top of the base 110 to grip the top surface. A spring 86 is seated directly on the top end 152 of the spring clip 104. Further, during assembly, the material near the neck connecting the top end 152 of the spring clip 104 to the rest has been removed to prevent the diode 136 from slipping out of the recess 148. Referring now to FIGS. 12, 13, and 14, the manner in which the spring clip is inserted onto the base is illustrated. The spring clip 104 has a projection 108 on the bottom surface. The protrusion 108 is formed to contact the upper flange 40 of the sleeve 40 with a constant surface area at all pivot positions of the voltage device 52. Similarly, the protrusion 106 of the spring clip 102 and the sleeve
The contact surface area between the top flange 26 of the
Is constant at all pivoting positions. For this reason, it is necessary to prevent the spring clips 102 or 104 from tangling with the upper flange of each sleeve or the inside of the main unit 10. In addition, the shape of the protrusions on the spring clips 102 and 104 is such that the maximum amount of heat is always transmitted, so that the spring 74 lowers the sleeve and the protrusions on the spring clips 102 and 104 and the sleeves 24 and 40 It is designed at a pivot point so that an arm can be prevented from being generated between the upper flange and the upper flange. Referring to FIG. 8, the tip 161 and ring 163 of the telephone line, the tip 165 and the ring 167 of the central office.
Solid state protector 160 connected between
The circuit diagram of FIG. The solid state protection device includes a voltage device 52, which includes a surge suppressor 116 and diodes 126 through 136.
The operation of such a circuit is described in U.S. Pat. No. 4,408,248 issued on Oct. 4, 1983 to Raymond M. Barreli et al.
It will not need to be repeated as it is disclosed. Referring to FIG. 9, the circuit of FIG. 8 has been readjusted to show how the solid state components are actually mounted on the torso of FIGS. 7, 10, and 11. ing. As shown, a recess 170 is shown in FIG. 10 to accommodate the inwardly bent end of the ground spring clip 174. The end 172 of the ground spring clip 174 is the base 110
End 172 is located below the top surface 176 of the
There is no contact with the springs 74 and 86 shown. Ground spring clip 174 holds diodes 128 and 134 in recesses recessed in the sides of the base. Grounding unit
The twenty arms 48 and 50 respectively grip the arms 178 and 180 of the ground spring clip 174 and hold the voltage device 52 in place. Further, referring to FIG. 10, with the spring clip 102 removed and the diode 132 exposed, the voltage
2 is shown by a back view. End of spring clip 104
152 is located on the top surface of the base 110. The end 172 of the ground spring clip 174 is housed in the recess 170 below the surface 176 of the base 110. Referring to FIG. 11, the voltage device 52 is shown in a front view with the spring clip 104 removed and the diode 126 exposed. As can be seen from FIGS. 10 and 11, the spring clip 10
2, 104, and 174 have convex inner surfaces 101, 105, 107, 109, 175, and 177 formed by stamping. These convex surfaces, while holding the diode,
It serves to hold the diode in a recess formed in base 110. Referring to FIG. 15, there is shown a solid state protection device shown in FIG.
The solid-state protection device is shown after the sleeve 24 has been released and the sleeve 24 has been grounded.
In this case, it is assumed that a positive abnormal voltage has appeared on the line.
This voltage flows from the circuit pin to the surge suppressor 116 through the flange 26, the protrusion 106, the spring clip 102, the diode 126, and the plate 118. When this abnormal voltage exceeds 260 volts (or another predetermined level), the surge suppressor starts conducting and a current based on the abnormal voltage is generated by the surge suppressor 116.
And plate 120, diode 134 and ground spring clip 174
Through the grounding unit and safely exit the protection device through the grounding pin 56. If the fault persists, the heat generated by the diodes 126 and 134 and the surge suppressor 116 is transferred to the flange 26 of the circuit pin 22. Heat is generated by the current flowing through the solid state element,
The soluble material melts, thereby releasing the sleeve 24. The force transmitted from the spring 74 acts, and the voltage device 52 strongly pushes down the sleeve 24 downward, and the grounding unit
It contacts the 20 ground plates 36. A similar operation occurs when a negative abnormal voltage appears on the line.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cutaway perspective view of a solid-state protection device according to an embodiment of the present invention, and FIG. 2 is a view of the solid-state protection device shown in FIG. FIG. 3 is an exploded perspective view, FIG. 3 is a cross-sectional front view of the solid-state protection device, FIG. 4 is a cross-sectional rear view of the solid-state protection device, FIG. FIG. 6 is an exploded perspective view of a body housing solid state electrical components for protection from abnormal voltage, and FIG. 7 is shown in FIG. 6 with some of the solid state components partially cut away. FIGS. 8 and 9 are exploded perspective views of the torso portion shown in FIGS. 8 and 9, and FIG.
The figure shows a rear perspective view and a front perspective view of a partially assembled torso, and FIGS. 12, 13 and 14 are cross-sectional views illustrating a method of assembling a solid-state device into the torso. Figure, No.
FIG. 15 is a cross-sectional view of the protection device showing a state after an operation according to an abnormal current or an abnormal voltage. 10 ... unit body, 12 ... handle, 14 ... base,
16: Left half, 18: Right half, 20: Grounding unit, 22: Circuit pin, 24: Sleeve, 25: Solder,
26 ... upper flange, 28 ... lower flange, 30 ... wire, 34 ... central office pin, 36 ... grounding unit plate, 38 ... circuit pin, 40 ... sleeve, 42 ... coil
46 Central pin, 48 Front arm, 50 Rear arm, 52 Voltage device, 54 Central plate, 56 Ground pin, 58 recess, 60 Ground plate protrusion , 62,
64, 66, 68 ... Tongue, 70, 72 ... Dent of body, 74, 86
... spring, 76 ... left side of the voltage device, 78, 90 ... neck of the cap, 80, 92 ... cap, 82, 94 ... top face of the cap, 84, 96 ... top inner face of the main body, 85, 87 …… Guidance, 88…
… Left side of the voltage device, 98, 100… holes, 102, 104, 150…
Spring clip, 106, 108 ... Projection, 110 ... Base, 11
1, 113 ... pillar, 112 ... cover, 114 ... central dent, 115, 117 ... hole, 116 ... surge suppressor, 118, 120
…… Metal plates, 122, 124 …… Dents, 126, 128,
130, 132, 134, 136 ... commutator diode, 138, 140,
142, 144, 146, 148 ... dent, 152 ... top end of spring clip, 160 ... solid state protector, 161,
165… tip conductor, 163, 167… ring conductor, 170…
Dent, 172 ... inwardly bent end of spring clip, 174 ... ground clip, 176 ... top of base.

   ────────────────────────────────────────────────── ─── Continuation of front page                   (56) References JP-A-53-61039 (JP, A)                 JP-A-47-21639 (JP, A)                 Shokai Sho 56-26888 (JP, U)

Claims (1)

(57) [Claims] A grounding body (20), and first and second current responsive devices (24, 4) for sensing an excess current increase and releasing the excess current increase to the grounding body (20).
0), and a single surge voltage protection device (52) extending between the first and second current response devices (24, 40) for conducting a voltage surge to the grounding body (20). In the electric protection device, the surge voltage protection device is supported on the first and second current response devices, and the surge voltage protection device is connected to the first and second current response devices (24, 40). Means for pressing the surge voltage protector to make electrical contact with the
6), wherein the surge voltage protection device is configured to pivot in response to the operation of one of the first and second current response devices, and the surge voltage protection device is connected to both the current response devices in the pivoted position. An electrical protection device characterized in that the voltage protection device continues to function even if one of the electrical response devices is grounded by maintaining electrical contact. 2. The surge voltage protection device (52) includes a surge suppressor (116) therein, first and second conductive plates (118, 120) sandwiching the surge suppressor, and first and second conductive plates (118, 120) located on both sides of the plate. 2. The electrical protection device according to claim 1, further comprising a dielectric container (110, 112) containing the second diode (128, 134). 3. The surge voltage protection device (52) includes a conductive spring clip (174) having first and second arms (178,180), the first and second arms (178,180) being respectively the first and second arms. Electrically connected to the diodes (128,134) and pressing them into electrical contact with said first and second plates (118,120), said plates (118,120) being connected to said surge suppressor (116);
3. The electrical protection device according to claim 2, wherein the electrical protection device is in electrical contact with the device.